TWI373832B - Display and method for manufacturing the same - Google Patents

Description

1373832

TW4309PA IX. Description of the Invention: • Technical Field of the Invention The present invention relates to a display, particularly to a structure between a structure and a display panel, and a method of manufacturing the same. [Prior Art] Because of its thinness, shortness, and low radiation, flat panel displays have been widely used. Taking the liquid crystal display which is currently widely used as an example, as shown in Fig. 1A, Fig. 1A is a top view of a conventional liquid crystal display. The liquid crystal display 1 includes a liquid crystal display panel 丨1, a structure 1221, and a circuit board 131 and 132. The structure 12 122 is a tape carrier package (Tcp). The liquid crystal display panel u includes a lower substrate 111 and an upper substrate 11Q, and a liquid crystal layer (not shown) is interposed between the upper and lower substrates 111 and 11 , and the t substrate U1 has a plurality of wires mo connected to an active array (not shown) and The package 121, the structure #12, 122, respectively, connects the wires U10'1110' to the circuit boards 131 and 132. Next, please refer to FIG. 1B. FIG. 1B is a liquid crystal display of the first eight-figure diagram. As shown in Fig. 1B, the lower substrate ill includes a wire mo and a line terminal 1111 connected to the wire 111A. The component 121 is electrically and directly connected to the line terminal 1111 by the anisotropic conductive paste 14. The structure 121 has a plurality of conductive lines (not shown), and the driving wafer 15 is disposed on the structure 121. The circuit board 131 is connected to the structure 121. 5

1373832 * . TW4309PA With the above structure, the driving voltage or signal voltage can be supplied to the liquid crystal display panel 11 by the boards 131 and 132, so that the image can be displayed. Referring again to FIG. 1A and FIG. 1B, the plurality of wires 1110 are exposed in the exposed region 10. Therefore, during manufacture or use, the wires 1110 are easily shielded from oxidation or damage due to the fact that they are not shielded, so that the wires are subjected to oxidation. The damage or failure affects the display quality of the liquid crystal display 1, and even worse, the liquid crystal display 1 cannot be displayed normally. SUMMARY OF THE INVENTION The present invention provides a flat panel display having a protective layer over the conductors that substantially shields the conductors, wherein the protective layer does not cover the components. The present invention provides a flat panel display in which the wires of the flat panel display are less susceptible to damage and oxidation. SUMMARY OF THE INVENTION The present invention provides a method of making a display that utilizes a thermal compression process to form a protective layer that substantially shields the wire, wherein the protective layer does not cover the structure. SUMMARY OF THE INVENTION The present invention provides a method of making a display that utilizes a hot press process to simplify the overall process. SUMMARY OF THE INVENTION The present invention provides a method of fabricating a display by forming a protective layer on a conductor of a flat panel display using a thermal compression process. It is an object of the present invention to utilize a method of manufacturing a display provided by an embodiment of the present invention to simplify the overall process. 6

1373832 -. TW4309PA The object of the present invention is to accomplish the overall crimping process using a single indenter using the method of manufacturing a display provided by an embodiment of the present invention. SUMMARY OF THE INVENTION The object of the present invention is to provide a method of manufacturing a display provided by an embodiment of the present invention, which utilizes two indenters to complete the overall crimping process. SUMMARY OF THE INVENTION The object of the present invention is to accomplish the overall crimping process using three indenters using the method of manufacturing a display provided by embodiments of the present invention. In an embodiment of the invention, the display includes a display panel including at least one wire and at least one line terminal connected to the wire; a component; a conductive member located between the component and the line terminal, such that The structure is electrically connected to the line terminal; and a protective layer substantially shields the wire, wherein the protective layer does not cover the structure. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment] The detailed members of the display of the present invention and the method for manufacturing the same are not described in detail in the following description. For the first embodiment, please refer to FIGS. 2A and 2B, and FIG. 2A is the present invention. 1A is a cross-sectional view of a first embodiment of the present invention in which a flat panel display of the flat panel display of FIG. 2A is drawn along a section line. 7

1373832 • The TW4309PA flat panel display 2 includes a display panel 21, which is exemplified by an organic light emitting diode display panel, a plasma display panel, a liquid crystal panel, or a microelectromechanical display panel. In the present embodiment, the display panel 21 is an organic light-emitting diode display panel as an example. The display panel 21 has an organic light emitting diode array substrate 211, and the upper cover 210 is disposed above the organic light emitting diode array substrate 211. The upper cover 210 and the organic light emitting diode array substrate 211 are sealed by a sealant (not shown). . The organic light emitting diode array substrate 211 includes a substrate 2110, an organic light emitting diode array (not shown), at least one wire 2112, and at least one line terminal 2111 connected to the wire 2112. The component 221 is electrically connected to the line terminal 2111 by the conductive member 24. The component 221 is exemplified by a tape carrier package (TCP), a Tape Automated Bonding (TAB), a Chip on Film (COF) or a wafer on a glass ( Chip on Glass, COG) and more. The conductive member 24 is exemplified by an anisotropic conductive film (ACF) or silver. The structure 221 is electrically connected to the circuit board 231. The manner of connection may be made by using a conductive adhesive or direct soldering, which is not limited in this embodiment. The circuit board 231 is exemplified by a printed circuit board or a flexible circuit board. It is important to note that the protective layer 240 generally shields the wires 2112, and the protective layer 240 can selectively cover or not cover the component 221, depending on the design or fabrication requirements. 5毫米至0. 1毫米。 The thickness of the protective layer 240 is about 0.04 mm to 0. 3 mm, but also depending on the design requirements, from about 0.1 mm to 0.3 mm or 0. 04 mm to 0.1 mm. The protective layer 240 is exemplified by an anisotropic conductive film (ACF), non-conductive particles 8 1373832

• TW4309PA (nonconductive paste, nonconductive film, NCP, NCF), silicone (siiicone) or TlJFFY glue. Since the wire 2112 is shielded by the protective layer 240, the probability of damage or oxidation of the wire 2112 during processing or use is greatly reduced, so that the life of the display 2 is greatly improved and the development quality is more stable. The second embodiment φ μ refers to the 2A and 2C drawings at the same time, and the embodiment is substantially the same as the first embodiment, except that the protective layer 24 is an extension of the conductive member 24, so the protective layer 240 and the conductive member 24 is the same material and can be selectively completed in the same process step. The protective layer 240 and the conductive member 24 are exemplified by an anisotropic conductive adhesive (anis〇tr〇pic ccmductive fi im , acf) or silver paste. The conductive member 24 can selectively cover or not cover the member 221, depending on the design or fabrication requirements. The thickness of the protective layer 240 (or the conductive member 24) is about 0. 04 mm to 〇. 3 mm, but it can also be determined by the design requirements, about 〇. j 鲁 mm to 0.3 mm or 〇. 〇 4 mm To millimeters. This embodiment is preferable to the first embodiment in that the protection layer 240 of the first embodiment is omitted, so that the process and structure are simpler. The manufacturing method of the first embodiment and the second embodiment can be referred to the following embodiments, and those skilled in the art can understand the manufacturing methods of the first embodiment and the second embodiment by using the manufacturing method described in the subsequent embodiments. . For the third embodiment, please refer to FIG. 3 and FIG. 4A to FIG. 4D. FIG. 3 is an example of the 9 1373832 TW4309PA wafer 35 of the present invention being disposed on the structure 321 . The structure 321 is exemplified by a roll carrier package ( Tape carrier package (TCP), Tape Automated Bonding (TAB), Chip 〇n Film (COF) or wafer on glass (Chip 〇n Glass, c〇G), etc. The circuit board 331 is exemplified by a printed circuit board or a flexible circuit board. Next, a first indenter 361 is provided and the first indenter 361 is used to pre-press the member 321 corresponding to the conductive member 34, whereby the conductive member 34 is connected to the line terminal 3111 and the structure. 321. The pressure provided by the first pressure head 361 is exemplified as 5 kg/cm 2 to 1 〇 kg/cm 2 or as (10) 2 to 5 kg/cm 2 ' the operating temperature is 40 ° C to 80 ° C or 60 ° C to 80. (:, the operation time is 0.1 second to 1 second or leap seconds to 〇 2 seconds. The operating parameters of the first indenter can be selectively adjusted depending on the settings and instrument settings, and are not limited. Then, please refer to section 4B The protective layer 340 is provided on the wire 3112. The protective layer 340 is exemplified by an anisotropic conductive film (ACF), a non-conductive particle paste (n〇nc〇nductive _ paste, nonconductive film). , NCp, NCF), silicone (siHc〇ne) or TUFFY glue, again using the first indenter% corresponding to the wire 3il2 to pressurize the protective layer 340, this is another preload, in this step, the first The pressure provided by the indenter 361 is approximately /(10)2 to cis(10)2 or 啦/(10)2, 8 kg/cm, and the operating temperature is 4 (TC to 80 ΐ or 60 ° C to 80 t: operation time is 1 second to 5 seconds) Or i seconds to 2 seconds, wherein the operating parameters of the first indenter 361 are selectively adjustable depending on the preparation and instrument settings, and are not limited. A buffer film may be selectively disposed between the first indenter 361 and the protective layer. 3611 'The buffer film 3611 is exemplified by a release film. 1373832

TW4309PA Next, as shown in FIG. 4C, the protective layer 34 is gradually horizontally extended to substantially cover the wire 3112, and the first indenter 361 is again used, the conductive member 34 and the wire 3112 are attached to the component 321 and The protective layer is pressurized by 'this is a positive pressure, and the first indenter 361 exemplifies the pressure provided in this step as 10 Icg/C "m2 to 50 kg/cm2 or 40 kg/cm2 to 50 kg/cm, operation. The temperature is 15 〇. 〇 to 22 〇 it or 18 〇 it to 2 (9). 〇, the operating time is 5 seconds to 1Q seconds or 1 second to $ seconds. • After the positive pressure is completed, as shown in Fig. 4D, the liquid crystal display 3 is completed. The thickness of the protective layer 340 is about 毫米4 mm to 〇3 mm, but it can also be determined according to design requirements. Imm to 〇3 mm or 〇 mm to 0.1 mm. Fourth Embodiment Figs. 5A to 5D are views showing a corresponding process of a fourth embodiment of the liquid crystal display of the present invention. • Similar to the third embodiment, as in Figs. 4A to 4B, the present embodiment utilizes the first pressure pad 461 to correspond to the conductive member 44 to press the protective member 421 in advance and corresponding to the wire 4112. The difference from the third embodiment is that the second indenter 4 (10) different from the first indenter 同时 simultaneously presses the conductive member 44 and the wire 4112 to pressurize the component 421 and the protective layer 440. The pressure, the second indenter is exemplified by the pressure provided in this step from 1 Gkg/em2 to the dish g/em2 or the touch of _2 to 5 〇kg/cm2, and the operating temperature is 15 〇 to 22 (rc or 18 〇. 〇 To 2 〇 (Γ (:, operation time is 5 seconds to 10 seconds or 1 second to 5 seconds) as shown in Figure 5C. 1373832

After the TW4309PA is completed, as shown in FIG. 5D, the liquid crystal display 4 is completed. The liquid crystal display 4 includes a substrate 4110, a wire 4112, a line terminal 4111, a first substrate 410, a conductive member 44, a driving wafer 45, and a circuit. The board 43 is provided with the protective layer 440, and its component arrangement relationship is the same as that of the third embodiment, and details are not described herein again. Fifth Embodiment FIGS. 6A to 6D are cross-sectional views showing a corresponding process of a fifth embodiment of the liquid crystal display of the present invention. Similar to the third embodiment, as in Fig. 4A, the present embodiment utilizes the first indenter 561 to pre-stress the member 521 with the conductive member 54. Next, as shown in FIG. 6B, a protective layer 540 is provided on the wire 5112. The protective layer 540 is exemplified by an anisotropic conductive film (ACF), a nonconductive paste (nonconductive paste, nonconductive fi lm). , NCP, NCF, Si 1 icone spring or TUFFY glue, providing a second indenter 562, corresponding to the wire 5112 pressurizing the protective layer 540, this is another preload, in this step, The second indenter 562 provides a pressure of about lkg/cm 2 to 10 kg/cm 2 or 6 kg/cm 2 to 8 kg/cm 2 , an operating temperature of 40 ° C to 80 ° C or 60 ° C to 80 ° C, and an operation time of 1 Seconds to 5 seconds or 1 second to 2 seconds. A buffer film 5611 may be selectively disposed between the second indenter 562 and the protective layer 540, and the buffer film 5611 is exemplified by a release film. Next, as shown in Fig. 6C, the protective layer 540 is gradually horizontally extended to substantially cover the wire 5112, and then the third indenter 563 is provided, using the third indenter 13 1373832.

TW4309PA ' 563 simultaneously corresponds to the conductive member 54 and the wire 5112 pressurizes the component 521 ′ and the protective layer 540, which is a positive pressure, and the third pressure head 563 exemplifies the pressure provided in this step to 10 kg/cm 2 . 50 kg/cm2 or 40 kg/cm2 to 50 kg/cm2, operating temperature is 150 ° C to 220 ° C or 180 ° C to 200 ° C, and the operation time is 5 seconds to 10 seconds or 1 second to 5 seconds. The buffer film 5611 is provided in the same manner as in the third embodiment, and can be selectively used. The operating parameters of the first indenter 561, the second indenter 562, and the third indenter 563 can be selectively adjusted depending on the instrument and the instrument settings, and are not limited. The singularity of the protective layer 540 is about 0. 04 mm to 0.3 mm, but it can also be visually determined according to the design requirements, about 0.10, as shown in Fig. 6D. Mm to 0.3 mm or 0.04 mm to 0.1 mm. Sixth Embodiment FIGS. 7A to 7C are cross-sectional views showing a corresponding process of a sixth embodiment of the liquid crystal display of the present invention. Referring to FIG. 7A, a display panel 61 is provided. The display panel 61 includes at least one wire 6112 and at least one line terminal 6111 connected to the wire 6112. Next, a conductive member 64 is provided on the line terminal 6111. The conductive member 64 is exemplified as An anisotropic conductive film (ACF) or a silver paste, which differs from the third embodiment in that the conductive member 64 is more than the conductive member 34; a member 621 is provided over the conductive member. The package 621 can include a driving chip 65 and can be selectively electrically connected to a circuit board 631. The driving wafer 65 can be located on the substrate 6110 instead of 14

1373832 I TW4309PA The structure 621 is not limited by design, and this embodiment is used. The wafer 65 is located on the structure 621 as an example. The structure 621 is exemplified by a tape carrier package (TCP), and the tape is automatically fixed (τ).

Automated Bonding 'TAB), wafer Cn COF or wafer 〇n Glass, COG, etc., and circuit 631 is exemplified by a printed circuit board or a flexible circuit board. Next, a first indenter 661 is provided and the member 621 is pre-pressurized by the first pressing pair of conductive members 64, thereby connecting the line terminal 6111 and the fracturing member 2 to 80t or 1〇. kgW 'operating temperature or one. .2 seconds 2 to 8th factory... Time to purchase Instrument settings and optional 2 661 (4) parameters are made and conductive parts 64 are integrally covered :: as shown in Figure ’-' 6112. Line ^6111 and at least part of the wire

Then, refer to the 7B corresponding conductive member 64, and again use the first-indenter 661 and the conductive member 64 to pressurize, which is the wire 6112 for the structure 621 and the use of the other-indenter to make the process of course visible. Requirement In this step, 361 exemplifies a positive pressure in this step with an indenter. The pressure of the first-indenter or 40 kg/cm2 to 5 〇kg/c^ is 10 kg/cm2 to 50 kg/cm2 t: to 2 〇〇 °c, the operation time is still, the temperature is known as 150 ° C to 220 °C or 180 This positive pressure, the conductive member 64 is ^ seconds to 10 seconds or 1 second to 5 seconds. The conductive member 64 has a thickness of about 〇 4 mm to 〇 3 15 1373832 by uniformly or unevenly covering the wire 6112 on the wire 6112.

TW4309PA mm, but depending on material requirements, it is approximately 0.1 mm to 0.3 mm or 0.04 mm to 0.13⁄4 m. The difference from the third real-time is that the protection of the present invention is directly formed by the conductive member 64. The step of providing at least one pressing step and providing the layer 340 can be made simpler than the third embodiment. After the positive pressure is completed, as shown in Fig. 7C, the liquid crystal display 6 is completed, and the liquid crystal display 6 includes the substrate 611 〇, the wire 6112, and the line terminal.

6m, the first substrate 610, the conductive member 64, the driving wafer 65, and the circuit board 631. Referring to the present embodiment, the method of simultaneously forming the protective layer by the conductive member 64 can use two indenters and three indenters respectively according to the fourth embodiment and the fifth embodiment. In addition, the indenters are different (four) replaceable or The manner in which the person skilled in the art can maintain the use can be understood in accordance with the embodiments of the present invention and is not limited. The present invention is mainly directed to providing a display and a method of manufacturing the same. The wire of the display is covered by the protective member and protected, so that the probability of the wire being damaged or oxidized during the process or use is greatly reduced. As a result, the life of the display is greatly improved and the image quality is more stable. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 16 ^/3832

TW4309PA [Simple description of the diagram] ^ lA know the top view of the liquid crystal display; IB ® is the liquid crystal display of the 1A diagram along the [, the cross-sectional view of the liquid crystal display; ^ is the top view of the flat panel display of the present invention, · 2B is a cross-sectional view of the flat display of FIG. 2A along the cross-sectional line, and the cross-sectional view of the first embodiment of the present invention is shown in FIG. 2C; the 2C® is a flat display of FIG. 2A along the section line (10), 1 is a top view of a second embodiment of the present invention; FIG. 3 is a top view of the liquid crystal display of the present invention; FIGS. 4A to 4D are liquid crystal displays of the 帛3 diagram taken along a section line -I' The liquid crystal display is a cross-sectional view of a third embodiment of the present invention; the fourth embodiment of the display is 5A to 5D, which is a cross-sectional view of a corresponding process of the liquid crystal according to the present invention; _ 6A to 6D are the present invention FIG. 7A to FIG. 7C are cross-sectional views showing corresponding processes of the liquid crystal display of the present invention. 〇 n Shi

Claims (1)

Γ373832 Modified on May 03, 2011, revised page 2012/5/3_la Shen Fu &amp; Amendment in July of the following year J曰 Amendment. X. Patent application scope: ^-:-- 1. A display, including: a display panel The device includes at least one wire and at least one line terminal connected to the wire; a component; a conductive member located between the component and the line terminal, such that the component is electrically connected to the line terminal; and a protection a layer extending from the conductive member toward the wire and substantially shielding the wire* wherein the protective layer does not cover the structure. The protective layer is the same material as the conductive member. 2. The display of claim 1, further comprising a circuit board connected to the structure. 3. The display of claim 2, wherein the circuit board comprises a printed circuit board or a flexible circuit board. 4. The display of claim 1, wherein the display panel further comprises a driver chip coupled to the line terminal. 5. The display of claim 1, further comprising a driving wafer on the structure. 6. The display of claim 1, wherein the material of the protective layer comprises an anisotropic conductive film (ACF). 5毫米至0. 3毫米。 The thickness of the thickness of the protective layer is about 0. 04 mm to 0.3 mm. 8. The display of claim 1, wherein the conductive member package 19 097105016 1013167515-0 1373832 is on May 03, 2010, and is replaced by a hundred j 2012/5/3_la application &amp; Anisotropic conductive film (ACF) or silver glue. 9. The display of claim 1, wherein the display panel is a liquid crystal display panel, an organic light emitting diode display panel, a plasma display panel or a microelectromechanical display panel. 10. A display comprising: ', a panel, comprising at least a wire and at least one line terminal connected to the wire; a component; a component 'between the component and the line terminal 'Making the structure electrically connected to the line terminal; and initially, the basin H layer/extending from the conductive member toward the wire and substantially shielding the guide, the four layers of material including the anisotropic conductive adhesive (aniSQtr〇pic ^ civefUm 'ACF), the protective layer is in contact with the material of the conductive member. A method of manufacturing a display, comprising: a low-end end plate' side display panel comprising at least a wire and at least a line terminal connected to the wire Providing a conductive member on the tracer on the conductive member; and pressing the member f to pressurize and use the first indenter to pressurize the conductive member pair 4 member, thereby a protective member, wherein one of the wires is connected to the line terminal and the shielding wire is shielded from the wire and the electrical component is extended toward the guiding body and is substantially ', and the protective layer is the same as the 097105016 1013167515-0 20 101 Revised May 3 replacement sheet 101 years May 3 amended to replace Page 2012/5 / 3_la complex Shen &amp; correction pieces of the same material and are formed simultaneously. The first method of the second aspect of the patent application is as follows: a cow that pressurizes the member according to the conductive member: the first pressure protection layer is used on the wire. After /%, it is also included to provide the 13. The pressure of the protective layer is applied to the protective layer as indicated in item 12 of the patent application. The invention further comprises the use of the square indenter as described in claim 13 of the patent application, wherein the corresponding conductive member and the conductor further comprise re-pressurization using a plurality of layers. And the method of claim 12, wherein the second step further comprises providing a first position and the second indenter corresponding to the wire to pressurize the protective layer. The second application, the scope of the patent, is described in the following section, wherein the pressure of the second indenter is about lkg/cm2 to 10kg/cm2. The method of claim 15, wherein the second indenter is supplied with a pressure of about 6 kg/cm 2 to 8 kg/cm 2 . The method of claim 15, wherein the second indenter is known as a temperature of 4 (TC to 8 (TC. 19. The method of claim 15, wherein the second indenter The operating temperature is from 6 〇 ec to 80. The method of claim 15, wherein the operation time of the second indenter is from 1 second to 5 seconds. The method of claim 15, wherein the operation time of the second indenter is from leap seconds to 2 seconds. 22. The method of claim 15, further comprising providing a positive 097105016 1013167515-0 21 1373832 _: Modified on May 3, 2011, the replacement page 2012/5/3_la application &amp; correction of the pressure head simultaneously corresponds to the conductive member and the wire to pressurize the structure and the protection. 23. As claimed in the eleventh article The method further includes providing a positive pressure ram while simultaneously responsive to the conductive member and the wire to pressurize the structure and the protective layer. 24. The method of claim 23, further comprising utilizing the method The first indenter is pressed against the protective layer by the wire. The method of claim 23, after the step of pressing the first indenter to press the conductive member to the member, further comprising providing the protective layer on the wire. 26. The method of the present invention, further comprising: applying a pressure to the protective layer by the first indenter. 27. The method of claim 23, wherein the positive pressure head provides a pressure of 10 kg. The method of claim 23, wherein the positive pressure head provides a pressure of 40 kg/cm 2 to 50 kg/cm 2 . The method of the present invention, wherein the operating temperature of the positive pressure head is from 150 ° C to 220 ° C. The method of claim 23, wherein the operating temperature of the positive pressure head is 180 ° The method of claim 23, wherein the operation time of the positive pressure head is 5 seconds to 10 seconds. 32. The method according to claim 23, The operation time of the positive pressure head is 1 second to 5 seconds. 22 097105016 1013167515-0 丄川832 10 05 05 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 2012 The method of claim 11, wherein the protective layer has a thickness of about 0.04 millimeters, and the method of claim 11, wherein the conductive member comprises an anisotropy. Anisotropic conductive film (ACF). The method of claim 11, wherein the material of the protective layer comprises an anisotropic conductive film (ACF). 307. The method of claim 11, wherein the first indenter provides a force of from 5 kg/cm2 to 10 kg/cm2. 38. The method of claim 11, wherein the first indenter operates at a temperature of from 4 °C to 80 °C. The method of claim 11, wherein the operating temperature of the first indenter is 60. (: to 80. (: 40.) The method as described in claim U. The operation time of the first indenter is from 0.1 second to 1 second. 41. The method of claim n, wherein the operation time of the first indenter is 0.2 seconds. 097105010 1013167515-0 23