CN107200301B - A kind of pad pasting alignment device of combination of MEMS wafer - Google Patents
A kind of pad pasting alignment device of combination of MEMS wafer Download PDFInfo
- Publication number
- CN107200301B CN107200301B CN201710369702.0A CN201710369702A CN107200301B CN 107200301 B CN107200301 B CN 107200301B CN 201710369702 A CN201710369702 A CN 201710369702A CN 107200301 B CN107200301 B CN 107200301B
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- fixed
- support arm
- sucker
- film
- pad pasting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
Abstract
The present invention provides a kind of pad pasting alignment device of combination of MEMS wafer, including pedestal, film support fixed area, Swing Arm, sucker, elevating mechanism, the first position limiting structure and the second position limiting structure；Film support fixed area, is set to the side of pedestal；Swing Arm includes fixed link and support arm, and fixed link is fixed on the other side of pedestal, the axial direction for being axially perpendicular to fixed link of support arm, and one end of support arm and is connected in fixed link by rotary shaft rotation of fixed link；Sucker is fixed on elevating mechanism, and elevating mechanism goes up and down direction perpendicular to the axial direction of support arm, and elevating mechanism rotates the other end for being connected to support arm, and rotary shaft is perpendicular to plane where pedestal.The accuracy for realizing film and wafer aligned, avoids manual operation damage caused by chip.
Description
Technical field
The present invention relates to MEMS manufacturing field, in particular to the pad pasting alignment device of a kind of combination of MEMS wafer.
Background technique
MEMS (Micro Electro MechanicalSystem, MEMS) is sent out based on semiconductor processing technology
What exhibition was got up, be to integrate microcircuit and micromechanics on chip.
Would generally be comprising micro-structures such as channel, cantilever, film, chambers in MEMS device, these micro-structures are often to the external world
Active force is very sensitive, in combination of MEMS wafer cutting, it is easy to which the mechanical damage for leading to micro-structure leads to the failure of MEMS device.
It is that the double-deck UV (Ultraviolet Rays) film, lower layer UV will be sticked on combination of MEMS wafer in a kind of cutting method
Film full wafer is attached to wafer surface, and upper layer UV film is patterned, that is, to be emptied, and emptying part is MEMS device area
Domain, remainder are the Cutting Road region of chip, in this way, protecting chip, and are avoided, are avoided to device area
The mechanical stress that UV film adsorption capacity generates device area when spread sheet avoids the mechanical damage of device.
In this cutting method, needing to carry out the cutting of UV film, the region of cutting will be aligned with device area on chip,
And in order to avoid the damage of device on chip, it usually needs pad pasting will be carried out with wafer aligned again after the cutting of UV film, and it is existing
Film sticking equipment in, be all that whole film is attached on chip, without carrying out the alignment of film and chip, existing film sticking apparatus can not
Realize the pad pasting operation for needing to be aligned.Low efficiency and chip can only be will cause artificially by having been manually done pad pasting alignment at present
Injury.
Summary of the invention
The present invention is directed to one of at least solve the above problems, a kind of pad pasting alignment device of combination of MEMS wafer is provided, realizes film
With the alignment of chip.
To achieve the above object, the present invention has following technical solution:
The pad pasting alignment device of combination of MEMS wafer, which is characterized in that including pedestal, film support fixed area, Swing Arm, sucker, liter
Descending mechanism, the first position limiting structure and the second position limiting structure；Wherein,
Film support fixed area, is set to the side of pedestal；
Swing Arm includes fixed link and support arm, and fixed link is fixed on the other side of pedestal, and support arm is axially perpendicular to
The axial direction of fixed link, and one end of support arm is connected in fixed link by rotary shaft rotation of fixed link；
Sucker is fixed on elevating mechanism, axial direction of the lifting direction of elevating mechanism perpendicular to support arm, elevating mechanism rotation
Turn the other end for being connected to support arm, rotary shaft is perpendicular to plane where pedestal；
Support arm is able to drive sucker and rotates on film support fixed area, so that sucker and the fixed area centering of film support, and prop up
Brace is fixed under the effect of the first position limiting structure with fixed link；Elevating mechanism is after driving sucker to rotate to alignment position, the
The effect of two position limiting structures is lower to be fixed.
Optionally, film support is steel ring, is provided with wafer alignment marks on steel ring, jagged, the film support is arranged on steel ring
Fixed area is sunk area corresponding with steel ring on pedestal, is provided with protrusion corresponding with notch in sunk area, to be used for steel
The fixation of circle.
Optionally, the wafer alignment marks are wafer aligned side or chip gap.
Optionally, the support arm is telescopic arms, further includes third position limiting structure, and support arm can stretch to adjust and inhale
Disk and the fixed area centering of film support, support arm regular length under the effect of third position limiting structure after in.
Optionally, the Negative pressure supply device of the sucker provides adjustable negative pressure.
Optionally, the elevating mechanism is elevating lever, and the sucker includes fixed plate and suction nozzle, and the fixed plate is nested
And be fixed on the elevating lever, the suction nozzle is fixed on the fixed plate, and the suction nozzle is set along the substantially symmetrical about its central axis of elevating lever
It sets.
The embodiment of the invention provides a kind of pad pasting alignment devices of combination of MEMS wafer, can be used for needing film and wafer aligned
Combination of MEMS wafer pad pasting in, it is by Swing Arm that sucker is mobile after the film support for posting film is set to film support fixed area
To on film support fixed area, so that sucker and the fixed area centering of film support, the rotation for driving sucker is rotated by elevating mechanism, thus
The device region of chip on sucker can be enabled to be aligned with the pad pasting device pattern area in film support, to realize film and chip
The accuracy of alignment avoids manual operation damage caused by chip.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows the side view of the pad pasting alignment device of combination of MEMS wafer according to an embodiment of the present invention；
Fig. 2 shows the top views of the pad pasting alignment device of combination of MEMS wafer according to an embodiment of the present invention；
Fig. 3 shows the use state perspective view of the pad pasting alignment device of combination of MEMS wafer according to an embodiment of the present invention.
Specific embodiment
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, but the present invention can be with
Implemented using other than the one described here other way, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by the specific embodiments disclosed below.
The side of the pad pasting alignment device of the combination of MEMS wafer of the embodiment of the present invention is respectively illustrated with reference to Fig. 1-3, Fig. 1 and Fig. 2
View and top view, Fig. 3 show the use state perspective view of the pad pasting alignment device of the combination of MEMS wafer of the embodiment of the present invention,
In Fig. 3, it is placed with film support in film support fixed area, chip has been adsorbed on sucker.
In embodiments of the present invention, film support is to have branch in film support for carrying the collet for pasting the film of the UV on chip
Support area and film area, film area are exposed, will paste on chip.According to different settings, film support can be different shape
Shape and material, in order to compatible with existing film sticking apparatus, film support is steel ring 200, and steel ring 200 carries UV film, hollow area
Corresponding to paste UV film on chip, as shown in figure 3, being provided with wafer alignment marks on steel ring 200, also set on steel ring 200
It is equipped with notch.Wafer alignment marks in pad pasting with the direction of chip for being aligned, pair of the chip of different sizes and supplier
Fiducial mark note is different, and normally, wafer alignment marks can be alignment side or the gap (notch) of chip, correspondingly, in steel
Wafer alignment marks are also provided on circle 200, in this way, to carry out the patterning of film, then passing through wafer alignment marks after pad pasting
Carry out the alignment of pattern.Notch on steel ring 200 plays the role of fixed steelring 200 when being for being placed on alignment device.
In embodiments of the present invention, film support fixed area 12 is set to the side of pedestal 10, for fixing film support 200, according to
The film support fixed area 12 of different structure can be set in the structure of different film supports 200, and corresponding to the film support 200 of steel ring, film support is solid
Determining area 12 can be the sunk area being set on pedestal, and the shape of sunk area is consistent with steel ring 200, to be used for steel ring
It is placed in sunk area, in addition, protrusion 14 is additionally provided in sunk area, the position of the notch on the position and steel ring of protrusion 14
Correspondence is set, in this way, protrusion 14 blocks notch after steel ring 200 is placed in sunk area, so that steel ring 200 is fixed.
In the other side of pedestal 10, it is provided with Swing Arm, Swing Arm includes fixed link 20 and support arm 30, and fixed link 20 is solid
Due on pedestal, one end rotation of support arm 30 is connected in fixed link 20, and support arm 30 is axially perpendicular to fixed link 20
Axial, in this way, can make support arm 30 with fixed link 20 for rotary shaft rotation, fixed link 20 can be fixed by fixed bracket
In on pedestal 10.
Sucker 50 is fixed on elevating mechanism 40, the rotation of elevating mechanism 40 is connected on the other end of support arm 30, rotates
Axis is perpendicular to plane where pedestal, elevating mechanism spinning, meanwhile, the lifting direction of elevating mechanism 40 is perpendicular to support arm 30
Axial, in this way, elevating mechanism 40 can drive sucker 50 to move up and down and rotary motion, when rotation, can make on chip
Pattern is aligned with the pattern of the film in film support, and when being provided with wafer alignment marks in film support 200, rotation can be passed through
Chip 300 realizes the alignment of pad pasting so that the alignment mark on chip is aligned with the wafer alignment marks in film support 200.Lifting
Mechanism is after driving sucker to rotate to alignment position, in the lower fixation of a position limiting structure (not shown go out) effect.
Sucker provides negative pressure by Negative pressure supply device (not shown go out), which can be adjustable negative pressure, to mention
For different size of negative pressure.
In the particular embodiment, elevating mechanism 40 is elevating lever, and sucker 50 includes fixed plate 52 and suction nozzle 54, fixed plate
52 nestings are simultaneously fixed on elevating lever 40, and the fixation of fixed plate 52 and elevating lever 40 can be realized by interference fit, in turn, will
Suction nozzle 54 is fixed in fixed plate 52, and in a specific embodiment, the tracheae of suction nozzle 54 passes through fixed plate 52, solid by nut
Determine tracheae, and then realizes the fixation of suction nozzle.Suction nozzle 54 be it is multiple, suction nozzle 54 along elevating lever 40 setting substantially symmetrical about its central axis, with protect
Card suction nozzle is uniformly distributed, it is to be understood that suction nozzle 54 is in the same plane, to guarantee that chip is uniform, smooth
It is adsorbed.
Support arm 30 drives sucker 50 to rotate to the region for drawing chip and to the region on film support fixed area 12,
In some embodiments, by calculate after can set fixed length for support arm, support arm 30 rotate to film support fixed area 12 it
On, enable to sucker 50 and 12 centering of film support fixed area, the center representative of film support fixed area 12 center of UV film, sucker
By setting suitable fixed length for support arm the centering of chip Yu UV film may be implemented in the center representative center of chip.?
After centering, support arm is fixed under the action of a position limiting structure (not shown go out) with fixed link, thus not further around fixed link
Rotation.
And in order to improve the accuracy of compatibility and adjustment, support arm can be used to telescopic arm, it can be along level
Direction is flexible, with more accurate adjustment sucker 50 and 12 centering of film support fixed area, meanwhile, after in, pass through a limit
Structure (not shown go out) fixes the length of support arm 30, no longer stretches.
The pad pasting alignment device of the embodiment of the present invention, can be used for needing the pad pasting of the combination of MEMS wafer of film and wafer aligned
In, after the film support for posting film is set to film support fixed area, sucker is moved on film support fixed area by Swing Arm,
So that sucker and the fixed area centering of film support, the rotation for driving sucker are rotated by elevating mechanism, so that on sucker
The device region of chip can be aligned with the pad pasting device pattern area in film support, to realize the accuracy of film and wafer aligned, be kept away
Manpower-free's operation is damaged caused by chip.
The structure of the pad pasting alignment device of combination of MEMS wafer of the present invention is described in detail above, in order to preferably manage
Solve technical solution of the present invention, by the device carry out using process be described.
Steel ring 200 is fixed on steel ring 200 refering to what is shown in Fig. 3, having placed on film support fixed area 12, steel ring 200
On set and will be directed at the UV film pasted on chip, the step of setting UV film, can be in the equipment of other pad pasting
Upper completion, the UV film posted are the figuratum film layers of tool, need to be aligned with the device area of chip.Pivotal support arm 30 arrives
Wafer area, elevating mechanism 40 fall sucker 50, and sucker 50 has been adsorbed to pad pasting chip 300, by pivotal support arm 30, driven
Sucker 50 reaches above film support fixed area, adjusts the rotation angle of support arm 30, or the further length of adjustment support arm 30, makes
Sucker 50 and 12 centering of film support fixed area are obtained, at this point, fixing support arm 30.Then, the rotation angle of elevating mechanism 40 is adjusted,
So that the pattern of chip is aligned with the pattern of UV film, reference when alignment can be adopted in various manners, in a preferred embodiment, be adopted
It is aligned with the alignment mark on chip with the alignment mark on steel ring, the rotation position of elevating mechanism is fixed after alignment, is put
Lower wafer, to realize that chip and the accurate contraposition of UV film are pasted, whole process touches chip without hand, avoids to the artificial of chip
Injury, while improving the accuracy and efficiency of stickup.
The above is only a preferred embodiment of the present invention, although the present invention has been disclosed in the preferred embodiments as above, so
And it is not intended to limit the invention.Anyone skilled in the art is not departing from technical solution of the present invention ambit
Under, many possible changes and modifications all are made to technical solution of the present invention using the methods and technical content of the disclosure above,
Or equivalent example modified to equivalent change.Therefore, anything that does not depart from the technical scheme of the invention, according to the present invention
Technical spirit any simple modification, equivalent variation and modification made to the above embodiment, still fall within the technology of the present invention side
In the range of case protection.
Claims (6)
1. a kind of pad pasting alignment device of combination of MEMS wafer, which is characterized in that including pedestal, film support fixed area, Swing Arm, sucker,
Elevating mechanism, the first position limiting structure and the second position limiting structure；Wherein,
Film support fixed area, is set to the side of pedestal；
Swing Arm includes fixed link and support arm, and fixed link is fixed on the other side of pedestal, and support arm is axially perpendicular to fixation
The axial direction of bar, and one end of support arm is connected in fixed link by rotary shaft rotation of fixed link；
Sucker is fixed on elevating mechanism, axial direction of the lifting direction of elevating mechanism perpendicular to support arm, elevating mechanism rotation company
It is connected to the other end of support arm, rotary shaft is perpendicular to plane where pedestal；
Support arm is able to drive sucker and rotates on film support fixed area, so that sucker and the fixed area centering of film support, and support arm
It is fixed under the effect of the first position limiting structure with fixed link；Elevating mechanism is after driving sucker to rotate to alignment position, in the second limit
Bit architecture effect is lower to be fixed.
2. pad pasting alignment device according to claim 1, which is characterized in that film support is steel ring, is provided with chip on steel ring
Alignment mark, is arranged on steel ring jagged, and the film support fixed area is sunk area corresponding with steel ring on pedestal, sunk area
In be provided with protrusion corresponding with notch, with the fixation for steel ring.
3. pad pasting alignment device according to claim 2, which is characterized in that the wafer alignment marks are wafer aligned side
Or chip gap.
4. pad pasting alignment device according to claim 1, which is characterized in that the support arm is telescopic arms, further includes
Third position limiting structure, support arm can stretch to adjust sucker and the fixed area centering of film support, and support arm limits after in third
Bit architecture acts on lower regular length.
5. pad pasting alignment device according to claim 1, which is characterized in that the Negative pressure supply device offer of the sucker can
Adjust negative pressure.
6. pad pasting alignment device according to claim 1, which is characterized in that the elevating mechanism is elevating lever, the suction
Disk includes fixed plate and suction nozzle, and the fixed plate is nested and is fixed on the elevating lever, and the suction nozzle is fixed on described solid
Fixed board, substantially symmetrical about its central axis setting of the suction nozzle along elevating lever.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369702.0A CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369702.0A CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
Publications (2)
| Publication Number | Publication Date |
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| CN107200301A CN107200301A (en) | 2017-09-26 |
| CN107200301B true CN107200301B (en) | 2019-02-12 |
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| CN201710369702.0A Active CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
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| JP6396907B2 (en) * | 2012-09-28 | 2018-09-26 | ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー | Dough and surface treatment composition containing tertiary amino-modified cellulose derivative |
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| JPS6396907A (en) * | 1986-10-13 | 1988-04-27 | Ryoji Wakabayashi | Automatic punching machine for protective film at semiconductor wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM317071U (en) * | 2007-02-15 | 2007-08-11 | Full Shiny Automation Entpr Co | Wafer film adhering and cutting device |
| TW201112343A (en) * | 2009-09-30 | 2011-04-01 | C Sun Mfg Ltd | Film cutting device of wafer film laminator |
| CN102103987A (en) * | 2010-12-21 | 2011-06-22 | 上海技美电子科技有限公司 | Film adhering method and device of wafer |
| JP6396907B2 (en) * | 2012-09-28 | 2018-09-26 | ユニオン カーバイド ケミカルズ アンド プラスティックス テクノロジー エルエルシー | Dough and surface treatment composition containing tertiary amino-modified cellulose derivative |
| WO2015166363A1 (en) * | 2014-04-30 | 2015-11-05 | 株式会社半導体エネルギー研究所 | Wiping device, and laminate fabricating device |
| CN104409384A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Wafer laminating device |
| CN104709503A (en) * | 2015-03-27 | 2015-06-17 | 广东韦达尔科技有限公司 | Efficient and accurate film sticking mechanism |
| CN105047589A (en) * | 2015-07-08 | 2015-11-11 | 浙江中纳晶微电子科技有限公司 | Wafer bonding and de-bonding device |
| CN206148409U (en) * | 2016-11-03 | 2017-05-03 | 上海纪元微科电子有限公司 | Manual formula chipset pad pasting device |
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| Publication number | Publication date |
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| CN107200301A (en) | 2017-09-26 |
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