M317071 八、新型說明： 【新型所屬之技術領域】 本創作「晶圓之貼膜裁切機」’涉及一種應用於晶圓（ wafer)後段製程，特別指一種將膠膜DAF(die attach film) 擴張後裁切並黏貼至晶圓與框架背面之自動化機台。 【先前技術】 習知晶圓（waf er )於後段製程中，特別是在進行切割 (wafer saw)與劈裂（breaking)等製程前，需先將整卷的膠 膜DAF(die attach film)黏貼至晶圓與框架背面當作接著 劑，以利後續製程。 以往廠商進行上述製程時所用的機具，通常都需要由國 外進口類似的機台以完成相關製程，該等機台多僅具單一功 能，導致擴張黏貼與裁切需要購置不同的機台，增加成本， 再者，國外進口機台的價格高昂，造成廠商需支付相當高價 的成本。 有鑑於此’創作人基於自身之專t知識與長期以來之研 發經驗，遂特以研創成本案，期能藉本案之提出，俾改進現 有缺點，以期發展出一種可滿足業界需要，且臻致完善、理 想與實用的機具。 【新型内容】 本創作「晶圓之貼膜裁切機」’其主要目的在於：提供 -種應用於晶圓後段製程之機台，其可將整卷的膠膜切判出 適當大小’並擴張黏貼枢架上’再進一部黏貼至晶圓背面， M317071 以利後續製程的進行。· 切機為達上述目的’本案具體内容為：一種「晶圓之貼 =」’主要由一外箱構成其外部，於外箱内設有一延伸至 相夕之座體，本創作主要之内部機構則設置於該座體上，其 中’於該座體之中央適當處頂部設置有一框架體。 - _本創作「晶圓之貼膜裁切機」主要更包含有：一 兀ώ料單疋、-上貼合裁切機構與一下貼合裁切機構等 。其中該進料單元與出料單元，係為—種滾筒裝置，設置於 框架體之左、右兩侧，而於框架體與進料單元之間，設置有 兩滾輪，於框架體與㈣單元之間，亦設置有兩滾輪，該進 料早兀與出料單元可用以輸送膠膜。至於上貼合裁切機構， 懸置固定於框架體下方且能上下運動；而下貼合裁切機構， 設置於框架體與上貼合㈣機構的下方，下貼合裁切機構可 供晶圓與框架置放用’上貼合裁切機構可相對於下貼合裁切 機構進行上、下運動，如此’上貼合裁切機構下移時可將膠 膜下壓樓張後並初步黏貼於晶圓與框架頂面，接著進行裁切 。另於下貼合裁切機構之底部則設有兩滑軌，該滑軌固定於 座體上，滑執可提供下貼合裁切機構之内外滑移用。 前述上貼合裁切機構約略包括有：一固定板、一上外琿 體、-内環體、-充氣單元、一進料支架與一出料支架。該 固定板，其上部設有若干活動桿，該活動桿與框架體連結組 合；一上外環體，設於固定板下方，並有若干連接桿與固定 板組合；一内環體設有若干活動桿與固定板連結，設於固定 板下方、上外環體内部，且内環體之外圍另設有一刀片環與 固定板連結；一充氣單元，設置於内環體内部；一進料支架 與一出料支架’其設置於外環體之兩側。 M317071 前述下貼合裁切機構約略包含有··兩滑軌、一底板、一 下外環體與一置料盤；其中，兩滑轨，其設置於座體之上， 而滑軌之上方則組合有一底板；一底板，架設於滑轨上方， 而底板之上則設置有一下外環體與一置料盤；一下外環體， 為一裝設於底板上之中空環體；一置料盤，其設置於底板上 、下外環體内部’且該置料盤之高度略低於下外環體，於置 ' 料盤之上方設置有若干吸盤，而置料盤之中央則設置有一晶 • 圓盤’其中，晶圓盤上具有若干吸風孔。 _ 本創作於實施時，先將框架與晶圓置於置料盤上，而置 料盤與底板會藉著滑軌移入上貼合裁切機構之正下方；另外 ，待貼合裁切之膠膜係裝設於進料單元上，該膠膜會通過滾 輪、進料支架、出料支架、滾輪，最後會捲至出料單元上。 當下貼合裁切機構與進、出料單元作動時，上貼合裁切機構 將會向下移動，上外環體先會下壓並撐張膠膜，接著令上方 的上外:裒體與下方的下外環體密合，以區隔出膠膜之適當區 域’接著’上貼合裁切機構上之固定板會再次向下移動且在 參此下移過备凡成膠模的擴張，使内環體下降至與置料盤靠近 ：令膠膜黏貼於晶圓與框架頂面，同時間内環體外圍的刀 片％下降可將膠膜切斷’最後，内環體内之充氣單元會充氣 膨脹，以令膠膜被緊密貼合於晶圓上而完成。 【實施方式】 如下： 兹謹就本創作「晶圓之貼模裁切機」其結構组成，及所 能土生的功效，配合圖式，舉一本案之較佳實施例詳細說明 切機」，其 首請參閱第—圖所示，纟案「晶圓之點膜裁 7 M317071 機口本體1外部為一外箱1丨所構成，而機台本體1之中間 適當處設有一呈水平狀之座體12，該座體12係由外箱η 内部延伸至外部，形成一工作檯面。 清參閱第二圖與第三圖所示，本創作之内部機構主要設 置於座體12上，該座體12上懸設有一框架體13。本創作 更包含有—進料單元2' —出料單元3、一上貼合裁切機構5 • 與一下貼合裁切機構6等。 ， 前述進料單元2與出料單元3係架設於座體12上之框 _ 帛體13兩旁，而於進料單元2與框架體13之間設置有兩滾 輪41 ’於出料單元3與框架體ι3之間亦設有兩滾輪u。 如述上貼合裁切機構5，其藉由若干活動桿5 01固定於 框架體13上，上貼合裁切機構5可被圖中未示的習知動力 凌置（例如氣壓缸或油壓缸）連動而於框架體1 3上方上下位 移’該上貼合裁切機構5之兩側分別連結有一進料支架Η 與一出料支架52。 、 。前述下貼合裁切機構6,裝置於上貼合裁切機構5與框 鲁架體13之下方，而該下貼合裁切機構6之底部包含有兩滑 • 執62，該滑軌62固定於座體12上。 , _立請配合第四圖所示，係為上貼合裁切機構5之底視立體 不意圖，該上貼合裁切機構5主要由一固定板5〇、一上外環 體53、一内環體54、一充氣單元55、一進料支架51與一出 料支架52所組成。該固定板5〇,直立裝設有若干活動桿5〇ι ’活動桿5〇1下部係經由固定板5〇與上外環體”與内環體 54連接，外5衣體53，其藉由若干連接桿531與固定板5〇 組合，且連接桿531外套設有彈簀532; 一内環體54，其藉 由若干連接桿531與固^板5G組合，且連接桿541外套設 M317071 有彈簧532，設置於上外環體53之内部，於内環體54之外 圍則設有一圈刀片環541，内環體54之底面高度略高於上外 環體53 ; —充氣單元55，設置於内環體54之内部，其為一 軟貝材料，可視需求進^亍充、’/¾氣動作；*—進料支架51與 一出料支架52，設置於外環體53兩側。 請參閱第五圖所示，本創作之下貼合裁切機構6，主要 ， 包含有兩滑軌62、一底板61、一下外環體63、一置料盤64 , ;其中，滑執6 2上設置有底板61，底板61可於滑軌6 2上 參 做往復運動；一下外環體63，其為一環狀體，設置於底板 61上；一置料盤64,設於下外環體63之内部，其高度略低 於下外環體63’且其上設有若干吸盤641，而於置料盤64 之中央另設有一較小之晶圓盤642，且於晶圓盤642之上設 有若干吸風孔643,該吸風孔643之内部係與吸風裝置（圖中 未示）連結，用於將材料吸附其上。 前述框架7,即如第六圖所示者。再如第七圖所示，本 創作於實際運作時，下貼合裁切機構6係為外移狀，先將一 • 框架7與一晶圓8擺置於置料盤64内，使框架7藉由吸盤 641 (請參考第五圖）固定於置料盤64上’而晶圓8則置於晶 . 圓盤642上利用吸風孔643吸附定位，接著令底板61帶動 T外環體63與置料盤64藉滑軌62移入上貼合裁切機構5 之正下方。 如第八圖所示，待切割之膠膜9係固定於進料單元2上 ，並經過兩滾輪4丨夹堡，再通過進料支架51，穿過上貼入 裁切機構5與下貼合裁切機構6之間，再經過出料支架52 、兩滾輪41，最後由出料單元3骑 、 早疋0將使用過後之殘餘膠膜9 捲收。 M317071 如第九圖與第十圖所示，當下貼合裁切機構6與膠膜g 都達到適當定位後，上貼合裁切機構5將會向下移動，首先 ，令上外環體53將膠膜9向下壓，接著上外環體53將與下 外環體63接合，以區隔出適當區域的膠膜9，緊跟著内产 54將再次的向下位移且同時在此下移過程完成膠膜的擴張 ，並與置料盤64貼合，以令膠膜9被黏貼於框架7盥曰 •六日日圓8 頂面，值此同時，刀片環5 41將接續降低，以便將膠膜g、、八 著置料盤64外圍切斷。 > 為避免膠膜9黏貼晶圓8不夠緊密或有氣泡残存甚至参 脫，再請參閱第十一圖所示，當膠膜9被裁切後，上貼合裁 切機構5内之充氣單元55便會開始充氣，使充滿氣體之充 氣單元55形成一軟質球體，以便從晶圓8中心點開始接觸 ，漸次以同心圓方式往外壓迫膠膜9緊密貼合於晶圓8頂面 〇 再請參閱第十二圖所示，本案主要是為了將適當大小的 膠膜91黏貼於框架7與晶圓8頂面，貼合完成之狀態如十 I 三圖所示。 又請參閱第十四圖與第十五圖，本創作之出料單元3係 由-環體32與一軸桿31組合而成，並有一傳動帶313設置 於軸柃31上，其中，該環體32上穿設有若干螺孔321，各 螺孔321内配置有鋼珠322與彈簧323，並藉螺絲螺鎖 於螺孔321端緣’另外，軸桿31上包含有一與傳動帶313 組合之;冓槽31卜以及另_溝槽312，該溝槽M2係用以與 %體32、、且σ ’且上述之鋼珠322之尺寸恰好可與溝槽川 :合。此結構特殊之出料單元3主要目的是：當機台操作一 &夺間後使用後之膠膜卷92將會改變整體直徑（越來越大 10 M317071 卷）’由於本案之進料覃 動機構^ ^ " 料單元3係利用同一個傳 動機構贡動，如此將會 W傳 因此，特別設置該特殊之=卷t緣運作切線速度不-， 川“ 々出枓早疋3,其鋼珠322可被 323㈣而施力於溝槽312，常態 以令軸桿31轉動收料，透動f 313連動溝槽川 體32與軸桿31同步連 鋼珠322可使環 . 但當膠膜卷92因直徑改變轉祙 、交日、，其力量大過於彈f 323彈頂鋼珠似之力量， 鋼珠322無法緊迫於溝槽312，形成環體32與軸桿η間 滑，以使膠膜卷92自動調整轉速至適當。 *綜上所述，本案「晶圓之貼膜裁切機」，其技術内 王付合新型專利之取得要件。本案在產業上確實得以利用， Μ請前未曾見於刊物或公開使用，且非為公眾所知悉之技 術再者，本案有效解決先前技術中長期存在的問題並達成 :關使用者與消費者長期的需求，得佐證本新型並非能輕易 ^成。本案富具專利法規定之r產業利用性」、「新穎性」與 「進步性」等要件，爰依法提請專利，懇請鈞局詳查，並 4ι早為准予專利之審定，以保護申請人之智慧財產權，俾勵 創新。 本新型雖藉由前述實施例來描述，但仍可變化其形態與 、’、田節，於不脫離本新型之精神而達成，並由熟悉此項技藝之 人士可了解。前述本案之較佳實施例，僅係藉本案原理可以 具體實施的方式之一，但並不以此為限制，應依後附之申請 專利範圍所界定為準。 【圖式簡單說明】 第一圖··係為本創作之立體外觀圖。 M317071M317071 VIII. New description: [New technical field] The creation of "wafer film cutting machine" refers to a process applied to the wafer back-end process, especially one that expands the film DAF (die attach film). After cutting and pasting onto the wafer and the automated machine on the back of the frame. [Prior Art] Conventional wafers (waf er) in the back-end process, especially before the process of wafer sawing and breaking, the first roll of film DAF (die attach film) must be pasted to The wafer and the back of the frame act as an adhesive for subsequent processing. In the past, the tools used by the manufacturers to carry out the above-mentioned processes usually required similar machines imported from abroad to complete the related processes. These machines only have a single function, which leads to the expansion of the pasting and cutting, the need to purchase different machines, and increase Cost, in addition, the high price of imported machines abroad, causing manufacturers to pay a very high cost. In view of this, the 'creator' based on his own knowledge and long-term research and development experience, the special research and development cost case, can use this case to improve the existing shortcomings, in order to develop a kind to meet the needs of the industry, and Perfect, ideal and practical tools. [New content] The main purpose of this creation "wafer film cutting machine" is to provide a machine for the wafer back-end process, which can cut the entire film of the film to an appropriate size and expand Adhere to the back of the wafer and stick it to the back of the wafer, M317071 to facilitate the subsequent process. · The cutting machine is used for the above purposes. The specific content of this case is as follows: A kind of "wafer sticking =" 'mainly consists of an outer box, and the outer box is provided with a seat extending to the side of the eve. The main interior of the creation The mechanism is disposed on the seat body, wherein 'the frame body is disposed at the top of the center of the seat body appropriately. - _ This film "wafer film cutting machine" mainly includes: a single sheet, a top-fit cutting mechanism and a next-fit cutting mechanism. The feeding unit and the discharging unit are a kind of roller device, which are arranged on the left and right sides of the frame body, and between the frame body and the feeding unit, two rollers are arranged on the frame body and the (four) unit. Between the two rollers is also provided, and the feeding and discharging unit can be used to transport the film. As for the upper fitting cutting mechanism, the suspension is fixed under the frame body and can move up and down; and the lower fitting cutting mechanism is disposed under the frame body and the upper (4) mechanism, and the lower fitting cutting mechanism is available for the crystal. The round and frame placement with the 'up-fitting cutting mechanism can move up and down with respect to the lower fitting cutting mechanism, so that when the upper cutting mechanism is moved down, the film can be pressed down and initially Adhered to the top surface of the wafer and the frame, and then cut. In addition, the bottom of the lower fitting cutting mechanism is provided with two sliding rails, and the sliding rail is fixed on the seat body, and the sliding handle can provide the inner and outer sliding of the lower fitting cutting mechanism. The above-mentioned upper fitting cutting mechanism roughly comprises: a fixing plate, an upper outer casing, an inner ring body, an inflation unit, a feeding bracket and a discharging bracket. The fixing plate has a plurality of movable rods on the upper part thereof, and the movable rod is coupled with the frame body; an upper outer ring body is disposed under the fixed plate, and a plurality of connecting rods are combined with the fixed plate; The movable rod is connected to the fixed plate, and is disposed under the fixed plate and inside the upper outer ring body, and a blade ring is further connected with the fixed plate at the outer periphery of the inner ring body; an inflatable unit is disposed inside the inner ring body; a feeding bracket And a discharge bracket 'which is disposed on both sides of the outer ring body. M317071 The foregoing lower fitting cutting mechanism roughly comprises two slide rails, a bottom plate, a lower outer ring body and a loading tray; wherein the two slide rails are arranged on the seat body, and the upper side of the slide rails a bottom plate is assembled; a bottom plate is arranged above the sliding rail, and a lower outer ring body and a receiving tray are arranged on the bottom plate; the outer outer ring body is a hollow ring body mounted on the bottom plate; The tray is disposed on the bottom plate and the inside of the lower outer ring body and the height of the receiving tray is slightly lower than the lower outer ring body, and a plurality of suction cups are arranged above the placing tray, and a central portion of the loading tray is disposed Crystal • Disc', where the wafer tray has a number of suction holes. _ In the implementation of this creation, the frame and the wafer are first placed on the loading tray, and the loading tray and the bottom plate are moved by the sliding rail directly under the matching cutting mechanism; in addition, the cutting is to be fitted The film is mounted on the feeding unit, and the film passes through the roller, the feeding bracket, the discharging bracket, the roller, and finally is wound onto the discharging unit. When the lower cutting mechanism and the feeding and discharging unit are actuated, the upper matching cutting mechanism will move downward, and the upper outer ring body will first press down and hold the film, and then the upper and the outer: the body Adhesion to the lower outer ring body below, to separate the appropriate area of the film, and then the fixing plate on the cutting mechanism will move downward again and move down through the mold. Expansion, the inner ring body is lowered to be close to the loading tray: the film is adhered to the top surface of the wafer and the frame, and the blade is lowered at the periphery of the ring body at the same time to cut the film. Finally, the inner ring body The inflator unit is inflated to complete the film so that it is snugly attached to the wafer. The following are the following: For the first part, please refer to the figure--picture, "The wafer is cut into 7 M317071. The outside of the machine body 1 is composed of an outer box 1丨, and the center of the machine body 1 is provided with a horizontal position. The seat body 12 is extended from the inside of the outer box η to the outside to form a work surface. As shown in the second and third figures, the internal mechanism of the present invention is mainly disposed on the base body 12, the seat A frame body 13 is suspended from the body 12. The present invention further includes a feeding unit 2' - a discharging unit 3, an upper matching cutting mechanism 5, a fitting cutting mechanism 6 and the like, and the foregoing feeding. The unit 2 and the discharge unit 3 are erected on the frame _ 13 13 on the base 12, and two rollers 41 ′ are disposed between the feeding unit 2 and the frame body 13 in the discharge unit 3 and the frame body ι3. There are also two rollers u. The self-adhesive cutting mechanism 5 is fixed to the frame by a plurality of movable rods 5 01. In the body 13, the upper fitting cutting mechanism 5 can be vertically displaced above and below the frame body 13 by a conventional power illuminating device (for example, a pneumatic cylinder or a hydraulic cylinder) not shown (the upper fitting cutting mechanism) A feeding bracket Η and a discharging bracket 52 are respectively connected to the two sides of the 5th. The lower fitting cutting mechanism 6 is disposed on the upper surface of the cutting mechanism 5 and the frame truss body 13, and the lower portion The bottom of the matching cutting mechanism 6 includes two sliding handles 62. The sliding rails 62 are fixed on the base 12. The _ stands in the fourth figure, which is the bottom view of the upper matching cutting mechanism 5. The upper fitting cutting mechanism 5 is mainly composed of a fixing plate 5〇, an upper outer ring body 53, an inner ring body 54, an inflating unit 55, a feeding bracket 51 and a discharging bracket 52. The fixing plate is 5 〇, and a plurality of movable rods 5 〇 1 'moving rods 5 〇 1 are connected to the inner ring body 54 via the fixing plate 5 〇 and the upper outer ring body 54 , and the outer 5 body 53 is connected. It is combined with the fixing plate 5 by a plurality of connecting rods 531, and the connecting rod 531 is provided with a magazine 532; an inner ring body 54 is provided by a plurality of connecting rods 531 and a fixing plate 5G. The connecting rod 541 is provided with a spring 532, and is disposed inside the upper outer ring body 53. A ring of the blade ring 541 is disposed on the outer periphery of the inner ring body 54. The bottom surface of the inner ring body 54 is slightly higher than the upper outer ring. The airing unit 55 is disposed inside the inner ring body 54 and is a soft shell material, which can be charged as needed, and the '/3⁄4 gas action; *—the feeding bracket 51 and a discharging bracket 52, It is disposed on both sides of the outer ring body 53. Please refer to the fifth figure. Under the present invention, the cutting mechanism 6 is mainly composed of two sliding rails 62, a bottom plate 61, a lower outer ring body 63, and a loading tray 64; wherein, the slipper 6 2 is provided with a bottom plate 61, which can be reciprocated on the slide rails 6 2; a lower outer ring body 63, which is an annular body, is disposed on the bottom plate 61; a storage tray 64 is disposed below The inside of the ring body 63 has a height slightly lower than the lower outer ring body 63' and has a plurality of suction cups 641 thereon, and a smaller wafer tray 642 is disposed in the center of the storage tray 64, and is disposed on the wafer tray. A plurality of air suction holes 643 are formed on the upper surface of the 642, and the inside of the air suction holes 643 is coupled to an air suction device (not shown) for adsorbing the material thereon. The aforementioned frame 7, that is, as shown in the sixth figure. As shown in the seventh figure, in the actual operation, the lower fitting cutting mechanism 6 is externally moved, and a frame 7 and a wafer 8 are first placed in the loading tray 64 to make the frame. 7 is fixed on the loading tray 64 by the suction cup 641 (please refer to the fifth figure) and the wafer 8 is placed on the crystal. The disc 642 is adsorbed and positioned by the suction hole 643, and then the bottom plate 61 is driven to the T outer ring body. 63 and the loading tray 64 are moved directly under the upper cutting mechanism 5 by the slide rail 62. As shown in the eighth figure, the film 9 to be cut is fixed on the feeding unit 2, and passes through two rollers 4, and then passes through the feeding bracket 51, and is pasted into the cutting mechanism 5 and attached. Between the cutting mechanism 6, the discharge bracket 52 and the two rollers 41 are passed through, and finally the residual adhesive film 9 is used after being taken up by the discharge unit 3 and early. M317071 As shown in the ninth and tenth diagrams, after the lower fitting cutting mechanism 6 and the film g are properly positioned, the upper fitting cutting mechanism 5 will move downward. First, the upper outer ring body 53 is made. The film 9 is pressed down, and then the upper outer ring 53 will be joined to the lower outer ring 63 to separate the film 9 of the appropriate area, followed by the inner product 54 to be displaced downward again and at the same time The downward movement process completes the expansion of the film and is adhered to the loading tray 64 so that the film 9 is adhered to the top surface of the frame 7盥曰6 yen, and at the same time, the blade ring 5 41 will be successively lowered. In order to cut off the periphery of the film g and the accommodating tray 64. > In order to prevent the adhesive film 9 from sticking to the wafer 8 to be insufficiently tight or to have bubbles remaining or even to be removed, please refer to the eleventh figure, and when the film 9 is cut, the inflating in the cutting mechanism 5 is applied. The unit 55 will begin to inflate, so that the gas-filled inflator unit 55 forms a soft sphere to contact from the center point of the wafer 8, and gradually presses the film 9 in a concentric manner to closely adhere to the top surface of the wafer 8 Please refer to the twelfth figure. The main purpose of this case is to adhere the appropriate size film 91 to the top surface of the frame 7 and the wafer 8. The state of the bonding is as shown in Fig. Referring to the fourteenth and fifteenth drawings, the discharge unit 3 of the present invention is composed of a ring body 32 and a shaft 31, and a transmission belt 313 is disposed on the shaft 31, wherein the ring body 32 is provided with a plurality of screw holes 321 , and the screw holes 321 are disposed with steel balls 322 and springs 323 , and are screwed to the end edges of the screw holes 321 . In addition, the shaft 31 includes a combination with the transmission belt 313 ; The groove 31 and the other groove 312 are used to match the % body 32, and σ ' and the steel ball 322 described above is just in size with the groove. The main purpose of this special structure of the discharge unit 3 is: when the machine is operated, the film roll 92 after use is changed to change the overall diameter (increasingly larger than 10 M317071 rolls) 'due to the feed of the case覃The moving mechanism ^ ^ " material unit 3 is utilised by the same transmission mechanism, so it will be transmitted, so the special setting of the special = volume t edge operation tangential speed is not -, Chuan "々出枓早疋3, its The steel ball 322 can be applied to the groove 312 by 323 (four), the normal state is to rotate the shaft 31 to receive the material, and the transmission f 313 interlocks the grooved body 32 with the shaft 31 to connect the steel ball 322 to the ring. But when the film roll 92 due to the change in diameter, turn to the day, the strength is much stronger than the force of the f 323 dome steel ball, the steel ball 322 can not be pressed against the groove 312, forming a ring body 32 and the shaft η slip, so that the film roll 92 Automatically adjust the speed to the appropriate. * In summary, the "wafer film cutting machine" in this case, the technical requirements of Wang Fuhe's new patent. The case was indeed used in the industry. If you have not seen the publication or public use before, and the technology is not known to the public, the case effectively solves the long-standing problems in the prior art and achieves: long-term user and consumer Demand, it is supported that this new model is not easy to make. The case is rich in the use of the industry, the "novelty" and the "progressiveness" as stipulated in the patent law. The patent is filed according to law, and the squad is required to examine it in detail, and the approval of the patent is granted as early as 4, to protect the applicant. Intellectual property rights encourage innovation. The present invention is described by the foregoing embodiments, but it can be modified by the spirit and scope of the present invention, and can be understood by those skilled in the art. The preferred embodiment of the present invention is only one of the modes that can be specifically implemented by the present principles, but is not limited thereto, and should be determined in accordance with the scope of the appended patent application. [Simple description of the diagram] The first picture is a three-dimensional appearance of the creation. M317071
第二圖 第三圖 第四圖 第五圖 第六圖 第七圖 第八圖 第九圖 第十圖 第十一 第十二 第十三 第十四 第十五 圖 圖 圖 圖 圖 係為本創作 係為本創作 係為本創作 係為本創作 係為本創作 係為本創作 係為本創作 係為本創作 係為本創作 係為本創 係為本創 係為本創 係為本創 係為本創 之内部機構立體圖。 之内部機構前視圖。 之上貼合裁切機構示意圖。 之下貼合裁切機構示意圖。 之框架示意圖。 之下貼合裁切機構動作狀態圖。 膠膜之配置路線示意圖。 之上貼合裁切機構動作狀態圖。 之上貼合裁切機構另一動作狀態圖 作之充氣單元動作狀態示意圖。 作之完成品分解圖。 作之完成品示意圖。 作之出料單元局部示意圖。 作之出料單元·局部機構分解圖。Second Figure Third Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Department of Creative Department-based Creative Department-based Creative Department-based Creative Department-based Creative Department-based Creative Department-based Creative Department-based Department of Creative Department-based Department A perspective view of the internal organization of the creation. Front view of the internal mechanism. A schematic diagram of the cutting mechanism is attached to the top. Underneath the schematic diagram of the cutting mechanism. Schematic diagram of the frame. Under the action mechanism diagram of the cutting mechanism. Schematic diagram of the configuration route of the film. The action state diagram of the cutting mechanism is attached to the top. The action state diagram of the inflating unit is performed on the other action state diagram of the cutting mechanism. The finished product exploded view. A schematic diagram of the finished product. A partial schematic diagram of the discharge unit. The discharge unit and the partial mechanism exploded view.
【主要元件符號說明 1機台本體 11外箱 12座體 13框架體 2進料單元 21轴桿 3出料單元 31轴桿 311溝槽 312溝槽 12 M317071 31 3傳動帶 32環體 321螺孔 322鋼珠 323彈簧 324螺絲 41滾輪 5上貼合裁切機構 & 5 0固定板 501活動桿 51進料支架 52出料支架 53上外環體 531連接桿 532彈簧 54内環體 | 541刀片環 5 5充氣單元 6下貼合裁切機構 61底板 62滑執 63下外環體 64置料盤 641吸盤 642晶圓盤 643吸風孔 13 M317071 7框架 8晶圓 9膠膜 91膠膜 92膠膜卷[Main component symbol description 1 machine body 11 outer case 12 seat body 13 frame body 2 feed unit 21 shaft 3 discharge unit 31 shaft 311 groove 312 groove 12 M317071 31 3 transmission belt 32 ring body 321 screw hole 322 Steel ball 323 spring 324 screw 41 roller 5 on the matching cutting mechanism & 50 fixed plate 501 movable rod 51 feeding bracket 52 discharge bracket 53 upper outer ring body 531 connecting rod 532 spring 54 inner ring body | 541 blade ring 5 5 Inflatable unit 6 under the cutting mechanism 61 bottom plate 62 slipper 63 lower outer ring body 64 storage tray 641 suction cup 642 wafer tray 643 suction hole 13 M317071 7 frame 8 wafer 9 film 91 film 92 film volume