CN107200301A - A kind of pad pasting alignment device of combination of MEMS wafer - Google Patents
A kind of pad pasting alignment device of combination of MEMS wafer Download PDFInfo
- Publication number
- CN107200301A CN107200301A CN201710369702.0A CN201710369702A CN107200301A CN 107200301 A CN107200301 A CN 107200301A CN 201710369702 A CN201710369702 A CN 201710369702A CN 107200301 A CN107200301 A CN 107200301A
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- CN
- China
- Prior art keywords
- support arm
- fixed
- sucker
- pad pasting
- elevating mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00865—Multistep processes for the separation of wafers into individual elements
Abstract
The present invention provides a kind of pad pasting alignment device of combination of MEMS wafer, including pedestal, film support fixed area, Swing Arm, sucker, elevating mechanism, the first position limiting structure and the second position limiting structure；Film support fixed area, is arranged at the side of pedestal；Swing Arm includes fix bar and support arm, and fix bar is fixed on the opposite side of pedestal, the axial direction for being axially perpendicular to fix bar of support arm, and one end of support arm and is rotatably connected by rotary shaft of fix bar in fix bar；Sucker is fixed on elevating mechanism, and the lifting direction of elevating mechanism is perpendicular to the axial direction of support arm, and elevating mechanism is rotatably connected in the other end of support arm, and rotary shaft is perpendicular to plane where pedestal.Realize the accuracy of film and wafer aligned, it is to avoid manually operate the damage caused to chip.
Description
Technical field
Field, the pad pasting alignment device of more particularly to a kind of combination of MEMS wafer are manufactured the present invention relates to MEMS.
Background technology
MEMS (Micro Electro Mechanical System, MEMS) is to be based on semiconductor fabrication
Grow up, be by microcircuit and micromechanics on chip it is integrated.
Would generally be comprising the micro-structural such as passage, cantilever, film, chamber in MEMS, these micro-structurals are often to external world
Active force is very sensitive, when combination of MEMS wafer is cut, it is easy to cause the mechanical damage of micro-structural, cause the failure of MEMS.
It is that double-deck UV (Ultraviolet Rays) film, lower floor UV will be sticked on combination of MEMS wafer in a kind of cutting method
Film full wafer is attached to wafer surface, and upper strata UV films are patterned, that is, to be emptied, and it is MEMS area to empty part
Domain, remainder is the Cutting Road region of chip, so, that is, protects chip, and device area is avoided, it is to avoid
The mechanical stress that UV films absorption affinity is produced to device area during spread sheet, it is to avoid cause the mechanical damage of device.
, it is necessary to carry out the cutting of UV films in this cutting method, the region of cutting will be aligned with device area on chip,
And in order to avoid the damage of device on chip, it usually needs carry out pad pasting after UV films are cut with wafer aligned again, and it is existing
Film sticking equipment in, be all that whole film is attached on chip, the alignment without carrying out film and chip, existing film sticking apparatus can not
Realize the pad pasting operation for needing to be aligned.It can only be aligned at present by having been manually done pad pasting, efficiency is low and chip can be caused artificially
Injury.
The content of the invention
It is contemplated that one of at least solving the above problems there is provided a kind of pad pasting alignment device of combination of MEMS wafer, film is realized
With the alignment of chip.
To achieve the above object, the present invention has following technical scheme：
The pad pasting alignment device of combination of MEMS wafer, it is characterised in that including pedestal, film support fixed area, Swing Arm, sucker, liter
Descending mechanism, the first position limiting structure and the second position limiting structure；Wherein,
Film support fixed area, is arranged at the side of pedestal；
Swing Arm includes fix bar and support arm, fix bar is fixed on the opposite side of pedestal, and support arm is axially perpendicular to
The axial direction of fix bar, and one end of support arm is rotatably connected in fix bar by rotary shaft of fix bar；
Sucker is fixed on elevating mechanism, and the lifting direction of elevating mechanism is perpendicular to the axial direction of support arm, elevating mechanism rotation
Turn to be connected to the other end of support arm, rotary shaft is perpendicular to plane where pedestal；
Support arm can drive sucker to rotate on film support fixed area so that sucker and film support fixed area centering, and branch
Brace is fixed under the effect of the first position limiting structure with fix bar；Elevating mechanism is after driving sucker to rotate to alignment position, the
The effect of two position limiting structures is lower to be fixed.
Alternatively, film support is to be provided with wafer alignment marks, steel ring to set jagged on steel ring, steel ring, the film support
Fixed area is sunk area corresponding with steel ring on pedestal, projection corresponding with breach is provided with sunk area, for steel
The fixation of circle.
Alternatively, the wafer alignment marks are wafer aligned side or chip gap.
Alternatively, the support arm is telescopic arms, in addition to the 3rd position limiting structure, support arm can stretch to adjust suction
Disk and film support fixed area centering, support arm regular length under the effect of the 3rd position limiting structure after in.
Alternatively, the Negative pressure supply device of the sucker provides adjustable negative pressure.
Alternatively, the elevating mechanism is elevating lever, and the sucker includes fixed plate and suction nozzle, and the fixed plate is nested
And be fixed on the elevating lever, the suction nozzle is fixed on the fixed plate, and the suction nozzle is set along the substantially symmetrical about its central axis of elevating lever
Put.
The embodiments of the invention provide a kind of pad pasting alignment device of combination of MEMS wafer, it can be used for needing film and wafer aligned
Combination of MEMS wafer pad pasting in, be arranged at after film support fixed area, moved sucker by the film support for posting film by Swing Arm
To on film support fixed area so that sucker and film support fixed area centering, the rotation for driving sucker is rotated by elevating mechanism, so that
The device region of chip on sucker can be enabled to be aligned with the pad pasting device pattern area in film support, so as to realize film and chip
The accuracy of alignment, it is to avoid manually operate the damage caused to chip.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work, can also basis
These accompanying drawings obtain other accompanying drawings.
Fig. 1 shows the side view of the pad pasting alignment device of combination of MEMS wafer according to embodiments of the present invention；
Fig. 2 shows the top view of the pad pasting alignment device of combination of MEMS wafer according to embodiments of the present invention；
Fig. 3 shows the use state stereogram of the pad pasting alignment device of combination of MEMS wafer according to embodiments of the present invention.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, below in conjunction with the accompanying drawings to the present invention
Embodiment be described in detail.
Many details are elaborated in the following description to facilitate a thorough understanding of the present invention, still the present invention can be with
It is different from other manner described here using other to implement, those skilled in the art can be without prejudice to intension of the present invention
In the case of do similar popularization, therefore the present invention is not limited by following public specific embodiment.
The side of the pad pasting alignment device of the combination of MEMS wafer of the embodiment of the present invention is respectively illustrated with reference to Fig. 1-3, Fig. 1 and Fig. 2
View and top view, Fig. 3 show the use state stereogram of the pad pasting alignment device of the combination of MEMS wafer of the embodiment of the present invention,
In Fig. 3, film support is placed with film support fixed area, chip has been adsorbed with sucker.
In embodiments of the present invention, film support is to have branch in the collet for carrying the UV films pasted on chip, film support
Area and film area are supportted, film area is exposed, will pasted on chip.According to different settings, film support can be different shape
Shape and material, in order to compatible with existing film sticking apparatus, film support is steel ring 200, and steel ring 200 carries UV films, its hollow area
Corresponding to paste UV films on chip, as shown in figure 3, being provided with wafer alignment marks 202 on steel ring 200, on steel ring 200 also
Set jagged 204.Wafer alignment marks 202 are used to be aligned with the direction of chip in pad pasting, different sizes and supplier's
The alignment mark of chip is different, normally, alignment side or gap (notch) that wafer alignment marks can be for chip, phase
Ying Di, is also provided with wafer alignment marks 202 on steel ring 200, so, after pad pasting, the patterning to carry out film, then passes through
Wafer alignment marks 202 carry out the alignment of pattern.Breach on steel ring 200 is to be used to play fixation when being positioned on alignment device
The effect of steel ring 200.
In embodiments of the present invention, film support fixed area 12 is arranged at the side of pedestal 10, for fixing film support 200, according to
The structure of different film supports 200, can set the film support fixed area 12 of different structure, and corresponding to the film support 200 of steel ring, film support is consolidated
It can be the sunk area being arranged on pedestal to determine area 12, and the shape of sunk area is consistent with steel ring 200, for by steel ring
It is positioned in sunk area, in addition, projection 14 is additionally provided with sunk area, the breach 204 on the position and steel ring of projection 14
Position correspondence, so, be positioned over by steel ring 200 after sunk area, projection 14 blocks breach 204, so that by steel ring 200
It is fixed.
In the opposite side of pedestal 10, Swing Arm is provided with, Swing Arm includes fix bar 20 and support arm 30, and fix bar 20 is consolidated
Due on pedestal, one end of support arm 30 is rotatably connected in fix bar 20, and support arm 30 is axially perpendicular to fix bar 20
Axially, so, support arm 30 can be caused to be rotated with fix bar 20 for rotary shaft, fix bar 20 can be fixed by fixed support
In on pedestal 10.
Sucker 50 is fixed with elevating mechanism 40, elevating mechanism 40 is rotatably connected on the other end of support arm 30, rotated
Axle plane where the pedestal, elevating mechanism spinning, meanwhile, the lifting direction of elevating mechanism 40 is perpendicular to support arm 30
Axially, so, elevating mechanism 40 can drive sucker 50 to move up and down and rotary motion, can cause during rotation on chip
Pattern is aligned with the pattern of the film in film support, and when being provided with wafer alignment marks 202 in film support 200, can be passed through
Rotate chip 300 so that the alignment mark on chip is aligned with the wafer alignment marks 202 in film support 200, realizes pair of pad pasting
It is accurate.Elevating mechanism is fixed after driving sucker to rotate to alignment position under (not shown) effect of a position limiting structure.
Sucker provides negative pressure by the way that Negative pressure supply device is (not shown), and the negative pressure can be adjustable negative pressure, to carry
For different size of negative pressure.
In the particular embodiment, elevating mechanism 40 is elevating lever, and sucker 50 includes fixed plate 52 and suction nozzle 54, fixed plate
52 nestings are simultaneously fixed on elevating lever 40, and fixed plate 52 and the fixation of elevating lever 40 can be realized by interference fit, and then, will
Suction nozzle 54 is fixed in fixed plate 52, in a specific embodiment, and the tracheae of suction nozzle 54 passes through fixed plate 52, solid by nut
Determine tracheae, and then realize the fixation of suction nozzle.Suction nozzle 54 is multiple, substantially symmetrical about its central axis setting of the suction nozzle 54 along elevating lever 40, to protect
Demonstrate,prove being uniformly distributed for suction nozzle, it is to be understood that suction nozzle 54 is in approximately the same plane, to ensure that chip is uniform, smooth
It is adsorbed.
Support arm 30 drives sucker 50 to rotate to the region of drawing chip and to the region on film support fixed area 12,
In some embodiments, by that support arm can be set into fixed length after calculating, support arm 30 rotate to film support fixed area 12 it
On, enable to sucker 50 and the centering of film support fixed area 12, the center representative of film support fixed area 12 center of UV films, sucker
The center representative center of chip, by the way that support arm is set into suitable fixed length, it is possible to achieve the centering of chip and UV films.
After centering, support arm is fixed in the presence of a position limiting structure (not shown) with fix bar, so that not further around fix bar
Rotation.
And in order to improve the accuracy of compatibility and adjustment, support arm can be used to telescopic arm, can be along level
Direction is stretched, with more accurate adjustment sucker 50 and the centering of film support fixed area 12, meanwhile, it is spacing by one after in
Structure (not shown) fixes the length of support arm 30, is no longer stretched.
The pad pasting alignment device of the embodiment of the present invention, can be used for needing the pad pasting of film and the combination of MEMS wafer of wafer aligned
In, it is arranged at after film support fixed area, sucker is moved on film support fixed area by the film support for posting film by Swing Arm,
So that sucker and film support fixed area centering, the rotation for driving sucker are rotated by elevating mechanism, so that on sucker
The device region of chip can be aligned with the pad pasting device pattern area in film support, so as to realize the accuracy of film and wafer aligned, be kept away
The damage that manpower-free's operation is caused to chip.
The structure to the pad pasting alignment device of combination of MEMS wafer of the present invention is described in detail above, in order to preferably manage
Technical scheme is solved, the process that the device is used will be described.
With reference to shown in Fig. 3, placed on film support fixed area 12 and steel ring 200 is fixed on steel ring 200, steel ring 200
On set and will be directed at the UV films pasted on chip, the step of setting UV films can other pad pasting equipment
Upper to complete, the UV films posted are the figuratum film layers of tool, it is necessary to be aligned with the device area of chip.Pivotal support arm 30 is arrived
Wafer area, elevating mechanism 40 falls sucker 50, and sucker 50, which has been adsorbed, treats pad pasting chip 300, by pivotal support arm 30, drives
Sucker 50 is reached above film support fixed area, is adjusted the anglec of rotation of support arm 30, or the further length of adjustment support arm 30, is made
Sucker 50 and the centering of film support fixed area 12 are obtained, now, support arm 30 is fixed.Then, the anglec of rotation of elevating mechanism 40 is adjusted,
So that the pattern of chip is aligned with the pattern of UV films, reference during alignment can be adopted in various manners, in a preferred embodiment, be adopted
It is aligned with the alignment mark on chip with the alignment mark on steel ring, the rotation position of elevating mechanism is fixed after alignment, is put
Lower wafer, so as to realize that the accurate contraposition of chip and UV films is pasted, whole process touches chip without hand, it is to avoid to the artificial of chip
Injury, while improving the accuracy and efficiency pasted.
Described above is only the preferred embodiment of the present invention, although the present invention is disclosed as above, so with preferred embodiment
And it is not limited to the present invention.Any those skilled in the art, are not departing from technical solution of the present invention ambit
Under, many possible variations and modification are all made to technical solution of the present invention using the methods and techniques content of the disclosure above,
Or it is revised as the equivalent embodiment of equivalent variations.Therefore, every content without departing from technical solution of the present invention, according to the present invention's
Technical spirit still falls within the technology of the present invention side to any simple modification, equivalent variation and modification made for any of the above embodiments
In the range of case protection.
Claims (6)
1. a kind of pad pasting alignment device of combination of MEMS wafer, it is characterised in that including pedestal, film support fixed area, Swing Arm, sucker,
Elevating mechanism, the first position limiting structure and the second position limiting structure；Wherein,
Film support fixed area, is arranged at the side of pedestal；
Swing Arm includes fix bar and support arm, fix bar is fixed on the opposite side of pedestal, and support arm is axially perpendicular to fixation
The axial direction of bar, and one end of support arm is rotatably connected in fix bar by rotary shaft of fix bar；
Sucker is fixed on elevating mechanism, and the lifting direction of elevating mechanism is perpendicular to the axial direction of support arm, and elevating mechanism rotation connects
The other end of support arm is connected to, rotary shaft is perpendicular to plane where pedestal；
Support arm can drive sucker to rotate on film support fixed area so that sucker and film support fixed area centering, and support arm
Fixed under the effect of the first position limiting structure with fix bar；Elevating mechanism is after driving sucker to rotate to alignment position, in the second limit
Bit architecture effect is lower to be fixed.
2. pad pasting alignment device according to claim 1, it is characterised in that film support is to be provided with chip on steel ring, steel ring
Set jagged on alignment mark, steel ring, the film support fixed area is sunk area corresponding with steel ring, sunk area on pedestal
In be provided with projection corresponding with breach, for the fixation of steel ring.
3. pad pasting alignment device according to claim 2, it is characterised in that the wafer alignment marks are wafer aligned side
Or chip gap.
4. pad pasting alignment device according to claim 1, it is characterised in that the support arm is telescopic arms, in addition to
3rd position limiting structure, support arm can stretch to adjust sucker and film support fixed area centering, and support arm is after in the 3rd limit
The lower regular length of bit architecture effect.
5. pad pasting alignment device according to claim 1, it is characterised in that the Negative pressure supply device of the sucker is provided can
Adjust negative pressure.
6. pad pasting alignment device according to claim 1, it is characterised in that the elevating mechanism is elevating lever, the suction
Disk includes fixed plate and suction nozzle, and the fixed plate is nested and is fixed on the elevating lever, and the suction nozzle is fixed on described solid
Fixed board, substantially symmetrical about its central axis setting of the suction nozzle along elevating lever.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369702.0A CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710369702.0A CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107200301A true CN107200301A (en) | 2017-09-26 |
| CN107200301B CN107200301B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710369702.0A Active CN107200301B (en) | 2017-05-23 | 2017-05-23 | A kind of pad pasting alignment device of combination of MEMS wafer |
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| TWM317071U (en) * | 2007-02-15 | 2007-08-11 | Full Shiny Automation Entpr Co | Wafer film adhering and cutting device |
| TW201112343A (en) * | 2009-09-30 | 2011-04-01 | C Sun Mfg Ltd | Film cutting device of wafer film laminator |
| CN102103987A (en) * | 2010-12-21 | 2011-06-22 | 上海技美电子科技有限公司 | Film adhering method and device of wafer |
| CN104409384A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Wafer laminating device |
| CN104709503A (en) * | 2015-03-27 | 2015-06-17 | 广东韦达尔科技有限公司 | Efficient and accurate film sticking mechanism |
| WO2015166363A1 (en) * | 2014-04-30 | 2015-11-05 | 株式会社半導体エネルギー研究所 | Wiping device, and laminate fabricating device |
| CN105047589A (en) * | 2015-07-08 | 2015-11-11 | 浙江中纳晶微电子科技有限公司 | Wafer bonding and de-bonding device |
| CN206148409U (en) * | 2016-11-03 | 2017-05-03 | 上海纪元微科电子有限公司 | Manual formula chipset pad pasting device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9499771B2 (en) * | 2012-09-28 | 2016-11-22 | Union Carbide Chemicals & Plastics Technology Llc | Fabric and surface care formulations containing tertiary amino modified cellulose derivatives |
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2017
- 2017-05-23 CN CN201710369702.0A patent/CN107200301B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6396907A (en) * | 1986-10-13 | 1988-04-27 | Ryoji Wakabayashi | Automatic punching machine for protective film at semiconductor wafer |
| TWM317071U (en) * | 2007-02-15 | 2007-08-11 | Full Shiny Automation Entpr Co | Wafer film adhering and cutting device |
| TW201112343A (en) * | 2009-09-30 | 2011-04-01 | C Sun Mfg Ltd | Film cutting device of wafer film laminator |
| CN102103987A (en) * | 2010-12-21 | 2011-06-22 | 上海技美电子科技有限公司 | Film adhering method and device of wafer |
| WO2015166363A1 (en) * | 2014-04-30 | 2015-11-05 | 株式会社半導体エネルギー研究所 | Wiping device, and laminate fabricating device |
| CN104409384A (en) * | 2014-10-20 | 2015-03-11 | 上海技美电子科技有限公司 | Wafer laminating device |
| CN104709503A (en) * | 2015-03-27 | 2015-06-17 | 广东韦达尔科技有限公司 | Efficient and accurate film sticking mechanism |
| CN105047589A (en) * | 2015-07-08 | 2015-11-11 | 浙江中纳晶微电子科技有限公司 | Wafer bonding and de-bonding device |
| CN206148409U (en) * | 2016-11-03 | 2017-05-03 | 上海纪元微科电子有限公司 | Manual formula chipset pad pasting device |
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| Publication number | Publication date |
|---|---|
| CN107200301B (en) | 2019-02-12 |
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