CN102103987A - Film adhering method and device of wafer - Google Patents
Film adhering method and device of wafer Download PDFInfo
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- CN102103987A CN102103987A CN2010106039948A CN201010603994A CN102103987A CN 102103987 A CN102103987 A CN 102103987A CN 2010106039948 A CN2010106039948 A CN 2010106039948A CN 201010603994 A CN201010603994 A CN 201010603994A CN 102103987 A CN102103987 A CN 102103987A
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Abstract
The invention discloses a film adhering method of a wafer. The film adhering method of the wafer is characterized by comprising the following steps of: blowing a gas between the wafer and a table disc; supporting the wafer by utilizing the blown gas; and then adhering a film on the surface of the wafer. By using the film adhering method and device of the wafer, the non-contact film adhesion can be realized and the danger of front surface damage of the wafer can be reduced; in addition, because the wafer can be supported by utilizing the gas during the pressing of a roller wheel, the pressure of the roller wheel can be offset, and the roller wheel can not be easy to press the wafer to be broken or crushed, therefore when the film adhering method and device are used for carrying out the non-contact film adhesion, the minimum thickness of the wafer which can be adhered with the film is 50 micrometers and 200 micrometers far less than that of the water adhered with the film in the prior art.
Description
Technical field
The present invention relates to a kind of wafer method for adhering film and wafer film sticking apparatus.
Background technology
Usually with the wafer circuit face, the side of promptly finishing chip functions is called the front, and one side is the back side in addition.In the wafer fabrication processes, be various uses, often need paste thin film at crystal column surface.A kind of film is arranged at cutting crystal wafer time protection wafer, be called the cutting film, the cutting film pastes at wafer rear.The film that has is to shield in other operation.Need use framework during the wafer cutting, framework is the middle thin slice that through hole is set.Wafer is positioned at the framework through hole, and both stick on same the film.When cutting film, wafer and framework together need be attached on the cutting film for the wafer appropriateness.Framework and cutting film play the effect of protection wafer jointly, and the cutting film also can be called diaphragm.
The simplest cutting film pad pasting mode is: towards being placed down on the platform dish, positive upper surface with the platform dish fits tightly with wafer frontside.Framework is placed on the pedestal, and wafer is positioned at the through hole of framework.To cut film and be placed on wafer and frame upper surface, utilize the roller roll extrusion, will cut film and paste on wafer rear and framework.At this moment, wafer and framework all stick on the cutting film.The platform dish that uses in the method is a solid round platform or a cylinder.
But for the wafer of some specific function, require wafer frontside can not coil contact on the same stage during pad pasting, need to adopt contactless pad pasting.As the optics sensitive chip, the chip of employing bump process encapsulation etc. all requires to adopt contactless pad pasting.
For to avoid wafer to contact with the large tracts of land of platform dish, adopt the method and the device that reduce wafer and platform dish contact area to realize in the prior art, promptly dig out some grooves at platform dish middle part, though can solve some problems, still there is following shortcoming in it:
1, when thin wafer pad pasting, cause wafer to break easily.Firmly paste on wafer because need to use roller will cut film, the inevitable requirement roller applies certain pressure on the cutting film.This pressure can be passed on the wafer, and the wafer major part is unsettled being placed on the platform dish, and wafer will be bent downwardly when pushed by roller becomes arcuation.If wafer is thicker, because himself rigidity, can bear the pressure of roller and be unlikely to fracture easily, finish pad pasting smoothly.If wafer is thinner, its rigidity reduces, and also is easy to when being subjected to very little pressure be bent downwardly, and when degree of crook surpassed the tolerance range of wafer, wafer will break.Utilize method and apparatus pad pasting of the prior art, the minimum thickness of wafer is 200um; Thickness utilizes the existing apparatus pad pasting can cause wafer fragmentation rate to raise greatly during less than 200um.Because the chip that use in each field becomes thin more, traditional wafer method for adhering film and device just more and has become the bottleneck that hinders the wafer production technology development.
2, because wafer is stressed to recessed, and the cutting film pastes at upper surface, therefore forms air cavity easily between wafer and cutting film.After having pasted, the cutting film can with air seal between wafer and cutting film, form bubble.This does not allow to occur in film coating process.After forming bubble, the cutting film must be removed again and paste, not only can cause waste of raw materials, also can increase operation, reduce production efficiency.
3, the wafer of different-thickness, the pressure that can bear are also different.When using a cover film sticking apparatus, avoid roller to damage wafer by pressure as the wafer pad pasting of different-thickness, but or be to adjust roller applied pressure size, or be to adjust support force to wafer to offset the pressure of roller.But because the installation of roller and platform dish is all more fixing, the adjustment of roller pressure is difficulty very; And method of the prior art also can't adjust the support force to wafer, especially when platform dish and wafer contact area are smaller.
4, film sticking apparatus of the prior art can only be applicable to a kind of wafer of size, when being the wafer pad pasting of different size, needs to change the platform dish of corresponding size, has increased operating procedure, has reduced production efficiency.
In addition, method described above is not a contactless pad pasting truly.Wafer has taken place to contact with bracing or strutting arrangement, even contact area is less, will influence the quality of wafer, reduces the yields of chip.
Summary of the invention
The objective of the invention is in order to overcome deficiency of the prior art, a kind of wafer method for adhering film of avoiding wafer to contact with the platform dish is provided.
For realizing above purpose, the present invention is achieved through the following technical solutions:
The wafer method for adhering film is characterized in that, is blown into gas between wafer and platform dish, utilizes the Gas Support wafer that is blown into, then at the crystal column surface pad pasting.
Preferably, utilize pull of vacuum that crystal round fringes is absorbed and fixed on the platform dish.
Preferably, described gas passes the platform dish and blows between platform dish and the wafer.
Preferably, at first utilize the Gas Support that blows out from the platform dish to live wafer wafer and platform dish are maintained a certain distance, utilize pull of vacuum that crystal round fringes is fixed on the platform dish again; Utilization is blown to the Gas Support between wafer and the platform dish and is lived wafer, and film is covered crystal column surface, utilizes hold down gag to push film is firmly pasted at crystal column surface.
The big I of this distance is determined according to actual conditions, and wafer is not contacted with the platform dish, and the effect of pull of vacuum can be absorbed and fixed at crystal round fringes on the platform dish.
Preferably, described dish is identical with diameter wafer, and wafer is positioned on the platform dish upper surface.
Preferably, adopting the different platform dish of a plurality of diameters suit successively, is the wafer pad pasting of different size by the relative position of regulating each panel surface.
Another object of the present invention provides a kind of wafer film sticking apparatus, comprises first dish, it is characterized in that, described first dish is provided with a plurality of first pores and a plurality of second pore; First pore and compressed air source unit UNICOM, second pore and vacuum extractor UNICOM; Second pore is arranged on first pore outside make that vacuum extractor can be absorbed and fixed at crystal round fringes on first dish by second pore after, compressed air source unit can be by first pore with between the vertical wafer of gas and first dish.
Preferably, described first pore is provided with more than two circles, and the first above pore of two circles is provided with at interval; Each encloses first stoma number is more than two, along the circumferential direction arranges; Second pore is provided with more than two circles, and the second above pore of two circles is provided with at interval; Each encloses second stoma number is more than two, along the circumferential direction arranges.
Preferably, first dish is set with second dish outward; Second dish is provided with and identical first pore and second pore of distribution mode on first dish.
Preferably, first dish and second dish can be installed with relatively moving.
Preferably, described first dish and second dish are driven by separate lowering or hoisting gear respectively.
Preferably, also comprise pedestal, pedestal upper surface is provided with first groove, and first dish is installed in first groove movingly.
Preferably, also comprise first arrangement for adjusting height of the relative altitude of scalable first dish upper surface and pedestal upper surface, described first arrangement for adjusting height is connected with first dish.
Preferably, described first arrangement for adjusting height is a reciprocating drive unit.
Preferably, described first arrangement for adjusting height is a cylinder.
Preferably, described first dish upper surface is provided with second groove, and second dish is installed in second groove movingly.
Preferably, also comprise second arrangement for adjusting height of the relative altitude of scalable first dish upper surface and second dish upper surface, second arrangement for adjusting height is connected with second dish.
Preferably, described second arrangement for adjusting height is a reciprocating drive unit.
Preferably, described second arrangement for adjusting height comprises screw mandrel, and screw mandrel is rotatably installed on the pedestal, screw mandrel and inner thread sleeve threaded engagement, and inner thread sleeve is connected with second dish.
Preferably, described pedestal upper surface is provided with the 3rd groove, and second arrangement for adjusting height also comprises knob, knob is arranged in the 3rd groove, connecting rod one end is fixedlyed connected with knob, and connecting rod passes pedestal and is rotatably installed on the pedestal, and the connecting rod other end and screw mandrel are in transmission connection.
Preferably, described connecting rod and screw mandrel are in transmission connection by driving-belt.
Preferably, described pedestal below is equipped with fixed mount, and screw mandrel is installed in rotation on the fixed mount.
Preferably, described fixed mount is provided with third through-hole, and bearing is installed in the third through-hole, and screw mandrel matches with the inner ring of bearing screw mandrel is installed in rotation on the fixed mount.
Preferably, screw thread is equipped with stop nut on the described screw mandrel, and described stop nut is arranged in the third through-hole.
Compared with prior art, wafer method for adhering film among the present invention and wafer film sticking apparatus utilize the Gas Support wafer, and both the incorporeity device contacted with wafer, can realize contactless pad pasting truly for wafer provides support power again.When reality was used, wafer all can be cut into rectangle or square, and the marginal portion of wafer can not used.In the pad pasting process, the platform dish only contacts with wafer in the marginal portion.Therefore, only there is the marginal portion to contact the quality that can not influence wafer with the platform dish.The platform dish does not have any contact with the wafer frontside that needs to use, and just can not damage wafer frontside yet, has reduced to damage the risk of wafer frontside.Owing to when roller is pushed, can utilize the Gas Support wafer, can offset the pressure of roller with this, roller can not crush wafer or crush easily.Use the device pad pasting among the present invention, wafer minimum thickness that can pad pasting is 50um, far below the minimum thickness 200um that uses the prior art pad pasting.
When pad pasting, support because wafer below is strong, to push also and can therefore, not be not easy to form air cavity between cutting film and the wafer even be subjected to roller to recessed, after the cutting film pastes bubble can not appear yet, reduced the risk of pad pasting again, pad pasting efficient height.
Gas Support power size is regulated easily, therefore, when being the wafer pad pasting of different-thickness, can adjust the size of support force easily according to wafer thickness, saves the energy.The wafer that the present invention also is suitable for different size pastes the cutting film, when pasting the cutting film for the wafer of different size, need not to change the platform dish, only needs simple adjustment need can to select the platform dish that uses, for the wafer of different size pastes the cutting film.Adjust easy switching, quick, weak point consuming time, efficient height.Platform dish height-adjustable pastes its wafer that is fit to different size more easily, has widened the scope of application of platform dish, guarantees to paste effect and can reach requirement, thereby increase work efficiency.Wafer film sticking apparatus among the present invention both can be used for contactless pad pasting, also can be used for the contact pad pasting, had improved the versatility of device, helped reducing purchase cost.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention 1;
Fig. 2 is first dish vertical view among the embodiment 1;
Fig. 3 is first dish cutaway view of A-A direction indication among Fig. 2.
Fig. 4 is the structural representation of the embodiment of the invention 2.
Fig. 5 looks up structural representation for the wafer film sticking apparatus among the embodiment 2.
Fig. 6 is the wafer film sticking apparatus cutaway view among Fig. 5.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in detail:
Embodiment 1
As shown in Figure 1, the wafer film sticking apparatus comprises pedestal 1.The lower surface of pedestal 1 is equipped with four seat legs (there is shown two seat legs 121,122), is used for supporting base 1.The upper surface 11 of pedestal 1 is provided with the first groove (not shown), is used to hold first dish 2.
As shown in Figure 1, first dish 2 is circular.The upper surface 21 of first dish 2 is provided with multi-turn first pore 22, and its number of turns can be determined according to first dish 2 diameter.Every circle first pore 22 numbers are more than two, along the circumferential direction evenly distribute, and concrete number can be determined according to circumference.First pore 22 extends to lower surface from the upper surface of first dish 2.First pore 22 all with air compressor (not shown) UNICOM.The arranged outside of first pore 22 has two circles, second pore 23.Second pore 23 extends to lower surface from the upper surface 21 of first dish 2.Every circle second pore 23 along the circumferential direction evenly distributes, and concrete number can be determined according to circumference.Second pore 23 and vacuum generator (not shown) UNICOM.
Fig. 2 is first dish vertical view among the embodiment 1.Fig. 3 is first dish cutaway view of A-A direction indication among Fig. 2, and Fig. 3 only shows UNICOM's schematic diagram of part first pore and air compressor, and all first pores are identical with the mode of communicating of air compressor.UNICOM's mode of first pore and air compressor is identical with UNICOM's mode of second pore and vacuum generator.As Fig. 2, shown in Figure 3, first dish 2 comprises loam cake 24 and lower cover 25.Loam cake 24 is provided with a plurality of first pores 22, has only marked two among the figure.First pore 22 extends to lower surface from upper surface 21.Be provided with a plurality of air cavitys between loam cake 24 and the lower cover 25, each air cavity has only marked air cavity 221 along the circumferencial direction setting of first dish 2 among the figure.Two first pores 22 all extend to air cavity 221 and connect.Be arranged on the O type circle 241 and the O type circle 242 that is arranged on the air cavity inboard in air cavity 221 outsides,, can prevent gas leakage air cavity 221 both sides sealings.On lower cover 25 lower surfaces tracheae 222 is installed.Tracheae 222 1 ends and air cavity 221 UNICOMs, the other end and air compressor (not shown) UNICOM.Adopt same UNICOM's mode, first all pores and air compressor UNICOM, two circles, second pore 23 and vacuum generator UNICOM.
During actual the use, at first provide compressed air, blow out, again the wafer (not shown) is placed on the top of first dish 2 by first pore 22 by air compressor.The air that blows out from first pore 22 can support wafer, makes wafer and first dish 2 keep suitable distance.The vacuum generator running, pull of vacuum is adsorbed on crystal round fringes on first dish 2 by second pore 23, and crystal round fringes and first dish 2 edge fit tightly.Continuation is blown into air between wafer and first dish 2, blow to wafer and air between first dish 2 to have certain air pressure, can wafer be held for wafer provides the support force that makes progress below wafer.Film is covered the wafer upper surface, use roller on film, to roll and push film, make film closely be attached to the upper surface of wafer.During pad pasting, except that being attracted to first edge on the dish, all the other positions of wafer do not contact with first dish.Circular wafers need be cut into square or rectangular in use, and therefore, the edge of circular wafers can not used.Therefore, use the device among the present invention can realize contactless pad pasting, and the edge contact the quality that can't influence wafer with the platform dish.
Fig. 4 is the structural representation of the embodiment of the invention 2.As shown in Figure 4, the wafer film sticking apparatus comprises pedestal 1, and the lower surface of pedestal 1 is equipped with four seat legs, is used for supporting base 1.Only show two seat legs (121,122) among Fig. 4.
The upper surface 11 of pedestal 1 is provided with the first groove (not shown).First groove is used to hold first dish 2.The structure and the occupation mode of first dish 2 are identical with embodiment 1.First dish 2 size is suitable with 12 cun wafers.12 inches crystal round fringes can be absorbed and fixed on first dish 2 by second pore 23.Compressed air can coil between 2 with first by the wafer that first pore 22 is blown to 12 inches, is that 12 inches wafers provide support power.
The upper surface 21 of first dish 2 is provided with the second groove (not shown).Second groove is used to hold second dish 3.Second dish 3 is arranged in second groove movingly.It is 2 identical that among second dish 3 structure and occupation mode and the embodiment 1 first coiled.The diameter of second dish 3 is suitable with 8 inches wafer.8 inches crystal round fringes can be absorbed and fixed on second dish 3, and compressed air can be blown between wafer and second dish 3 supports 8 inches wafers.
Fig. 5 looks up structural representation for the wafer film sticking apparatus among the embodiment 2.As shown in Figure 5, pedestal 1 comprises cover plate 12 and base plate 13.Also comprise first transmission device 4.First transmission device 4 is used to transfer a driving force to second dish 3, moves up and down to drive second dish 3.Move up is to instigate second dish upper surface of 3 to be higher than the upper surface of first dish 2.Move down is to instigate second dish upper surface of 3 to return back to the position that the upper surface 21 with first dish 2 maintains an equal level in the position of the upper surface that is higher than first dish 2.
Fig. 6 is the wafer film sticking apparatus cutaway view among Fig. 5.As shown in Figure 6, the lower surface of cover plate 12 is equipped with four cylinders.Four cylinders evenly distribute along the circumferencial direction of first dish 2.Only show two cylinders (31,32) among the figure.The piston rod of each cylinder all is connected with first dish 2.Cylinder is used to drive first dish 2 and moves up or down.
First arrangement for adjusting height 4 comprises knob 41, connecting rod 42, first belt pulley 43, driving belt 44, second belt pulley 45, screw mandrel 46, bearing 47 and inner thread sleeve 48.Knob 41 is installed in an end of connecting rod 42, and is arranged on rotationally in the 3rd groove 13.Connecting rod 42 runs through cover plate 12 and base plate 13, and is installed in rotation on cover plate 12 and the base plate 13.The other end of connecting rod 42 is equipped with first belt pulley, 43, the first belt pulleys 43 and is positioned at base plate 13 belows.Driving belt 44 is sleeved on first belt pulley 43 and second belt pulley 45, and first belt pulley 43 and second belt pulley 45 are in transmission connection.Second belt pulley 45 is installed in an end of screw mandrel 46.Screw mandrel 46 passes base plate 13 and is installed in rotation on the base plate 13.Screw mandrel 46 only can rotate, and can't move up and down.Screw mandrel 46 other ends are connected with inner thread sleeve 49, inner thread sleeve 49 and screw mandrel 46 threaded engagement.Inner thread sleeve 49 is connected on second dish 3.Because screw mandrel 46 can't move up and down, in screw mandrel 46 rotary courses, will move up and down with the inner thread sleeve 49 of its threaded engagement.According to screw mandrel 46 rotation direction differences, inner thread sleeve 49 can move up or down.Can drive second dish 3 with this moves up and down.
Present embodiment both can be used for the contactless pad pasting of wafer of 12 inches and 8 inches, also can be used for 12 inches and 8 inches contact pad pastings.
In the time of need be for 12 inches contactless pad pastings of wafer, the upper surface of first dish 2 be fair with the upper surface of second dish 3.12 inches wafers are placed on the upper surface of 2 and second dishes 3 of first dish.Open the vacuum generator that is connected with second pore 23 of first dish 2, crystal round fringes can be adsorbed on first dish 2.At this moment, do not turn round with second dish 3 vacuum generator that are connected.Open air compressor that is connected with first pore 22 of first dish 2 and the air compressor that is connected with the pore of second dish 3, between first dish 1 upper surface, second dish 3 upper surfaces and wafer, be blown into compressed air, utilize compressed-air actuated pressure to provide support power, can prevent crushing wafer when roller is pushed wafer for wafer.
Adopt contactlessly when being 8 inches wafer pad pastings, then only use second dish 3 and need not to use first dish 2 to get final product.Using method is identical with said method.
First arrangement for adjusting height 4 and the cylinder is set, makes that the wafer film sticking apparatus among the present invention can also be used for the contact pad pasting, and can use the wafer pad pasting of a set of equipment as different size.Before not bringing into use, the upper surface of pedestal 1 11, the upper surface 21 of first dish 2 and the upper surface 31 of second dish 3 are positioned on the same horizontal plane.To be earlier that 8 inches wafers paste the cutting film, be again 12 inches wafers paste the cutting film be the example explanation.At first rotary knob 41, and the drivening rod 42 and first belt pulley 43 rotate.And then by driving belt 44 drive second belt pulleys 45 and screw mandrel 46 rotations.Screw mandrel 46 rotates second dish 3 of inner thread sleeve 49 promotions is moved up.With this height of adjusting the upper surface 31 of second dish 3, make it exceed 0.8mm than the upper surface 11 of pedestal 1 and the upper surface 21 of first dish 2.With a thickness is that the framework that is applicable to 8 cun wafers of 1.2mm is placed on the upper surface of pedestal 1 and first dish 2.With a thickness is that 8 cun wafers of 0.5mm are placed on second dish 3 upper surface 31.At this moment, the upper surface of 8 cun wafers exceeds 0.8+0.5-1.2=0.1mm than the upper surface of framework.Start and second vacuum generator that coils the pore UNICOM on 3, crystal round fringes is adsorbed on the upper surface of second dish 3.Film is covered on the upper surface of wafer and framework, use the pinch roller reciprocating motion to push film, film is tightly adhered on wafer and the framework, can finish pad pasting.
After being the pad pasting of 8 inches wafers, remove the wafer that pad pasting is finished.Starting cylinder moves upward first dish 2 of its promotion, stopped by second dish 3 and can't continue to move up until the bottom land of second groove, the upper surface 31 of the upper surface 21 of first dish 2 and second dish 3 is positioned at same horizontal plane at this moment, and both all exceed 0.8mm than the upper surface 11 of pedestal 1.With a thickness is that the framework that is applicable to 12 cun wafers of 1.2mm is placed on the upper surface of pedestal 1.With a thickness is that 12 cun wafers of 0.5mm are placed on 2 and second dishes 3 of first dish, and at this moment, the upper surface of 12 inches wafers exceeds 0.8+0.5-1.2=0.1mm than the upper surface of framework.The vacuum generator of startup and first pore, 22 UNICOMs is adsorbed on 2 and first on first dish with crystal round fringes and coils 3 upper surface.Film is covered on the upper surface of wafer and framework, use pinch roller reciprocating motion roll extrusion film, film is tightly adhered on wafer and the framework, can finish pad pasting.
In the present embodiment, use cylinder, can back and forth adjust the height of first dish easily, make it go for the wafer of multiple different-thickness as second arrangement for adjusting height.And the knob of first height adjuster among the present invention is positioned at the upper surface of pedestal, and the user need not to lean to one side, bend over to adjust the height of second dish, uses more convenient.
The present invention is provided with second groove on first dish, and second dish is arranged in second groove, and the upper surface of first dish and the surface of second dish are remained on first horizontal plane; Can adjust both positions again easily.Can be subjected to stopping and stopping at the position that its upper surface and second dish upper surface maintain an equal level automatically of second dish 3 in the process because first dish 2 moves up, therefore, second drive unit can adopt comparatively simply cylinder of structure.Second drive unit only needs back and forth to drive first dish and moves up and down and get final product, and need not the distance that second driving device controls moves.
Embodiment 3
The difference of present embodiment and embodiment 2 is, first dish 2 and cylinder are not set.Second dish 3 is arranged in first groove of pedestal 1, and the diameter of the size of first groove and second dish 3 adapts.All the other structures are identical with embodiment 2.
Present embodiment is only applicable to the wafer pad pasting into a kind of size, but both can adopt contactless pad pasting, also can adopt the contact pad pasting.
Embodiment among the present invention only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection range of the present invention.
Claims (24)
1. the wafer method for adhering film is characterized in that, is blown into gas between wafer and platform dish, utilizes the Gas Support wafer that is blown into, then at the crystal column surface pad pasting.
2. wafer method for adhering film according to claim 1 is characterized in that, utilizes pull of vacuum that crystal round fringes is absorbed and fixed on the platform dish.
3. wafer method for adhering film according to claim 1 is characterized in that, described gas passes the platform dish and blows between platform dish and the wafer.
4. wafer method for adhering film according to claim 1 is characterized in that, at first utilizes the Gas Support that blows out from the platform dish to live wafer wafer and platform dish are maintained a certain distance, and utilizes pull of vacuum that crystal round fringes is fixed on the platform dish again; Utilization is blown to the Gas Support between wafer and the platform dish and is lived wafer, and film is covered crystal column surface, utilizes hold down gag to push film is firmly pasted at crystal column surface.
5. wafer method for adhering film according to claim 1 is characterized in that, described dish is identical with diameter wafer, and wafer is positioned on the platform dish upper surface.
6. wafer method for adhering film according to claim 1 or 5 is characterized in that, adopts the different platform dish of a plurality of diameters suit successively, is the wafer pad pasting of different size by the relative position of regulating each panel surface.
7. the wafer film sticking apparatus comprises first dish, it is characterized in that, described first dish is provided with a plurality of first pores and a plurality of second pore; First pore and compressed air source unit UNICOM, second pore and vacuum extractor UNICOM; Second pore is arranged on first pore outside make that vacuum extractor can be absorbed and fixed at crystal round fringes on first dish by second pore after, compressed air source unit can be by first pore with between the vertical wafer of gas and first dish.
8. wafer film sticking apparatus according to claim 7 is characterized in that, described first pore is provided with more than two circles, and the first above pore of two circles is provided with at interval; Each encloses first stoma number is more than two, along the circumferential direction arranges; Second pore is provided with more than two circles, and the second above pore of two circles is provided with at interval; Each encloses second stoma number is more than two, along the circumferential direction arranges.
9. according to claim 7 or 8 described wafer film sticking apparatus, it is characterized in that first dish is set with second dish outward; Second dish is provided with and identical first pore and second pore of distribution mode on first dish.
10. wafer film sticking apparatus according to claim 9 is characterized in that, first dish and second dish can be installed with relatively moving.
11. wafer film sticking apparatus according to claim 10 is characterized in that, described first dish and second dish are driven by separate lowering or hoisting gear respectively.
12. wafer film sticking apparatus according to claim 7 is characterized in that, comprises that also pedestal, pedestal upper surface are provided with first groove, first dish is installed in first groove movingly.
13. wafer film sticking apparatus according to claim 12 is characterized in that, also comprises first arrangement for adjusting height of the relative altitude of scalable first dish upper surface and pedestal upper surface, described first arrangement for adjusting height is connected with first dish.
14. wafer film sticking apparatus according to claim 13 is characterized in that, described first arrangement for adjusting height is a reciprocating drive unit.
15. wafer film sticking apparatus according to claim 14 is characterized in that, described first arrangement for adjusting height is a cylinder.
16. wafer film sticking apparatus according to claim 12 is characterized in that, described first dish upper surface is provided with second groove, and second dish is installed in second groove movingly.
17. wafer film sticking apparatus according to claim 16 is characterized in that, also comprises second arrangement for adjusting height of the relative altitude of scalable first dish upper surface and second dish upper surface, second arrangement for adjusting height is connected with second dish.
18. wafer film sticking apparatus according to claim 17 is characterized in that, described second arrangement for adjusting height is a reciprocating drive unit.
19. wafer film sticking apparatus according to claim 18 is characterized in that, described second arrangement for adjusting height comprises screw mandrel, and screw mandrel is rotatably installed on the pedestal, screw mandrel and inner thread sleeve threaded engagement, and inner thread sleeve is connected with second dish.
20. wafer film sticking apparatus according to claim 19, it is characterized in that, described pedestal upper surface is provided with the 3rd groove, second arrangement for adjusting height also comprises knob, knob is arranged in the 3rd groove, connecting rod one end is fixedlyed connected with knob, and connecting rod passes pedestal and is rotatably installed on the pedestal, and the connecting rod other end and screw mandrel are in transmission connection.
21. wafer film sticking apparatus according to claim 20 is characterized in that described connecting rod and screw mandrel are in transmission connection by driving-belt.
22. wafer film sticking apparatus according to claim 21 is characterized in that, described pedestal below is equipped with fixed mount, and screw mandrel is installed in rotation on the fixed mount.
23. wafer film sticking apparatus according to claim 22 is characterized in that described fixed mount is provided with third through-hole, and bearing is installed in the third through-hole, screw mandrel matches with the inner ring of bearing screw mandrel is installed in rotation on the fixed mount.
24. wafer film sticking apparatus according to claim 23 is characterized in that screw thread is equipped with stop nut on the described screw mandrel, described stop nut is arranged in the third through-hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010603994 CN102103987B (en) | 2010-12-21 | 2010-12-21 | Film adhering method and device of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010603994 CN102103987B (en) | 2010-12-21 | 2010-12-21 | Film adhering method and device of wafer |
Publications (2)
| Publication Number | Publication Date |
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| CN102103987A true CN102103987A (en) | 2011-06-22 |
| CN102103987B CN102103987B (en) | 2013-01-23 |
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| CN 201010603994 Expired - Fee Related CN102103987B (en) | 2010-12-21 | 2010-12-21 | Film adhering method and device of wafer |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999770A (en) * | 2015-07-31 | 2015-10-28 | 东莞市上川自动化设备有限公司 | High-precision film pasting device and film piece position fine adjustment method thereof |
| CN107200301A (en) * | 2017-05-23 | 2017-09-26 | 中国科学院微电子研究所 | A kind of pad pasting alignment device of combination of MEMS wafer |
| CN110154373A (en) * | 2019-05-14 | 2019-08-23 | 苏州美图半导体技术有限公司 | Vacuum laminator |
| CN114132043A (en) * | 2021-12-09 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | Film sticking device |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
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| JPS63166243A (en) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | Tape sticking equipment for semiconductor wafer |
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| CN101499409A (en) * | 2008-10-17 | 2009-08-05 | 秦拓微电子技术(上海)有限公司 | Intelligent wafer laminator |
| CN102082078A (en) * | 2010-10-22 | 2011-06-01 | 上海技美电子科技有限公司 | Method and device suitable for laminating film for ultrathin wafer |
| JP6063943B2 (en) * | 2011-09-13 | 2017-01-18 | ゼネラル・エレクトリック・カンパニイ | Cation exchange materials made in aqueous media |
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| JPS63166243A (en) * | 1986-12-27 | 1988-07-09 | Mitsubishi Electric Corp | Tape sticking equipment for semiconductor wafer |
| JP2001118811A (en) * | 1999-10-15 | 2001-04-27 | Nitto Denko Corp | Device for applying adhesive tape to substrate |
| CN101036221A (en) * | 2004-10-14 | 2007-09-12 | 琳得科株式会社 | Non-contact type suction holding device |
| CN101499409A (en) * | 2008-10-17 | 2009-08-05 | 秦拓微电子技术(上海)有限公司 | Intelligent wafer laminator |
| CN102082078A (en) * | 2010-10-22 | 2011-06-01 | 上海技美电子科技有限公司 | Method and device suitable for laminating film for ultrathin wafer |
| JP6063943B2 (en) * | 2011-09-13 | 2017-01-18 | ゼネラル・エレクトリック・カンパニイ | Cation exchange materials made in aqueous media |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104999770A (en) * | 2015-07-31 | 2015-10-28 | 东莞市上川自动化设备有限公司 | High-precision film pasting device and film piece position fine adjustment method thereof |
| CN104999770B (en) * | 2015-07-31 | 2017-06-13 | 广东上川智能装备股份有限公司 | The film sticking apparatus and its diaphragm fine position method of a kind of high precision |
| CN107200301A (en) * | 2017-05-23 | 2017-09-26 | 中国科学院微电子研究所 | A kind of pad pasting alignment device of combination of MEMS wafer |
| CN107200301B (en) * | 2017-05-23 | 2019-02-12 | 中国科学院微电子研究所 | A kind of pad pasting alignment device of combination of MEMS wafer |
| CN110154373A (en) * | 2019-05-14 | 2019-08-23 | 苏州美图半导体技术有限公司 | Vacuum laminator |
| CN114132043A (en) * | 2021-12-09 | 2022-03-04 | 深圳市华星光电半导体显示技术有限公司 | Film sticking device |
| CN114505208A (en) * | 2022-04-19 | 2022-05-17 | 成都泰美克晶体技术有限公司 | Waxing machine for wafer |
| CN114505208B (en) * | 2022-04-19 | 2022-06-14 | 成都泰美克晶体技术有限公司 | Waxing machine for wafers |
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| CN102103987B (en) | 2013-01-23 |
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