CN107170699B - A kind of full-automatic chip stripping machine and its working method - Google Patents
A kind of full-automatic chip stripping machine and its working method Download PDFInfo
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- CN107170699B CN107170699B CN201710413041.7A CN201710413041A CN107170699B CN 107170699 B CN107170699 B CN 107170699B CN 201710413041 A CN201710413041 A CN 201710413041A CN 107170699 B CN107170699 B CN 107170699B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The invention discloses a kind of full-automatic chip stripping machines, including be set in identical platform slot type material box feed mechanism, scrape rim charge mechanism, scrape chip mechanism, receive blank panel mechanism and membranous disc multistation conveying turnover mechanism, the slot type material box feed mechanism, scrape rim charge mechanism, scrape chip mechanism and receive blank panel mechanism be successively arranged side by side in the membranous disc multistation conveying turnover mechanism it is ipsilateral.The invention also discloses a kind of working methods of full-automatic chip stripping machine.The full-automatic chip stripping machine of the present invention is applicable in the chip removing that area is big, thickness is thin, can remove chip rim charge and remove chip, avoid chip from being scraped off or damage, be effectively protected chip, greatly improve working efficiency.
Description
Technical field
The present invention relates to a kind of stripping machine more particularly to a kind of full-automatic chip stripping machine and its working methods.
Background technique
Radio frequency identification (Radio Frequency Identification, RFID) technology is to identify mesh by radiofrequency signal
Mark object and the non-contact automatic identification technology for obtaining related data.Compared with bar codes technique, Radio Frequency Identification Technology has
Data can encrypt, storing data capacity is bigger greatly, on label for waterproof, antimagnetic, high temperature resistant, long service life, identification distance, deposit
Many advantages, such as storage information can be changed, thus be following most promising one of the information technology.
RFID tag sealed in unit is by substrate conveyor module, detection module, dispensing module, attachment module and hot-die
Block composition, wherein the stripping off device in attachment module realizes chip from the removing on wafer disk.
Stripping off device is divided into vacuum stripping in such a way that chip is removed and jacks up removing.Thimble removing design and motion planning
It is unreasonable be likely to result in chip direct fragmentation failure, directly affect the qualification rate of product.Such as Patent No.
201310165723.2, chip, Patent No. are removed in a kind of entitled invention of the safe stripping off device of IC chip using thimble
201310716769.9, a kind of entitled invention of more thimble chip peeling apparatus removes chip using more thimbles, this two pieces
Thimble in patent generates concentrated stress effect to chip, and larger for area, the chip of thinner thickness, chip is easy to happen broken
It splits, damages chip.Number of patent application is 201510127933.1, entitled stripping off device and utilization device removing chip package
The method of body surface cover layer is to remove chip by the way that vacuum slot head is arranged in stripping off device, thin for large area, thickness
Chip to remove its working efficiency lower, cannot achieve and be widely used.
A kind of it can be realized that the removing of area is big, thickness is thin chip, work efficiency is high and can keep away therefore, it is necessary to provide
Exempt from the full-automatic chip stripping machine and its working method of wafer damage in stripping process.
Summary of the invention
In order to solve the above-mentioned technical problems, the present invention provides a kind of full-automatic chip stripping machines, including are set to same
Slot type material box feed mechanism on platform scrapes rim charge mechanism, scrapes chip mechanism, receiving blank panel mechanism and the conveying overturning of membranous disc multistation
Mechanism, the slot type material box feed mechanism, scrape rim charge mechanism, scrape chip mechanism and receive blank panel mechanism be successively arranged side by side in described
Membranous disc multistation transports the ipsilateral of turnover mechanism, wherein
The slot type material box feed mechanism is used for slot type material box in upper material position, to material position, working position and out between material position
It is transmitted,
The rim charge mechanism of scraping is used to removing and collecting the rim charge around chip,
It is described scrape chip mechanism for remove simultaneously chip on collection membrane,
The receipts blank panel mechanism is used to recycle empty membranous disc,
The membranous disc multistation conveying turnover mechanism is used to membranous disc entering disk station, rim charge removing station, chip removing
Conveying overturning is carried out between station and receipts blank panel station.
Further, the slot type material box feed mechanism includes slot type material box feeding positioning component, slot type material box conveying group
Part, slot type material box loading and unloading handgrip, membranous disc release component, membranous disc crawl discharge component and recycling slot type material box conveyer belt,
The slot type material box feeding positioning component, slot type material box conveying component and membranous disc are released component and are successively arranged side by side,
The slot type material box feeding positioning component is arranged above the recycling slot type material box conveyer belt, and the membranous disc releases component and institute
Membranous disc crawl discharge component cooperation is stated to release membranous disc from slot type material box.
Further, the rim charge mechanism of scraping includes scraping rim charge platform assembly, scraping rim charge component, and the rim charge component of scraping is
Two, rim charge component is scraped described in two, the adjacent two sides for scraping rim charge platform assembly is set,
The rim charge component of scraping includes scraper holder assembly, movable plate, followup cam, the scraper holder assembly and described servo-actuated
Cam is arranged on the movable plate.
Preferably, the scraper holder assembly includes blade, blade bearing, baffle, fixing seat, inductor installation sheet, limit position
Sensor is set, the blade is set to below the blade bearing, and the inductor installation sheet setting is on the fixing seat, described
Limit position sensor is fixed in the inductor installation sheet.
Further, the chip mechanism of scraping includes scraping chip platform component, scraping chip assembly and mobile platform component, institute
State scrape chip platform component and it is described scrape chip assembly be arranged on the mobile platform component,
The chip assembly of scraping includes lifting cylinder, movable plate, upper blade, lower coating blade component, support plate and clump weight, institute
It states lifting cylinder and the upper blade is arranged on the movable plate, the clump weight is arranged in the support plate.
Preferably, the lower coating blade component includes bearing, roller bearing and lower coating blade, and the roller bearing is set by bearing fixation
It sets on tool apron.
Further, the receipts blank panel mechanism includes base plate, and opposite type sensor, lifting support are provided on the base plate
Plate and guide rod, the base plate lower section are provided with linear bearing, motor, synchronous belt, lead screw and limit sensors, and described pair is penetrated
Sensor and the guide rod are arranged in the lifting supporting plate surrounding.
Further, the membranous disc multistation conveying turnover mechanism includes that the first conveying takes hand component, the second conveying overturning
Take hand component and double X-axis motion platforms, first conveying take hand component, the second conveying overturning take hand component respectively with institute
State that double X-axis motion platforms connect and to be arranged in double X-axis motion platforms ipsilateral,
It includes vacuum chuck and Z axis mobile platform that first conveying, which takes hand component,
It includes cylinder, clamping jaw that the second conveying overturning, which takes hand component,
Double X-axis motion platforms include mobile platform, line slide rail, photoelectric sensor, and the mobile platform setting exists
On the line slide rail, the photoelectric sensor is arranged in the line slide rail.
Further, it is described second conveying overturning take hand component include lifting cylinder, linear bearing, guide rod, rotary cylinder,
Main folder pawl, the lifting cylinder are set on bottom plate, and the guide rod is fixedly connected by the linear bearing with bottom plate, the rotation
Rotaring cylinder is connect with the main folder pawl by bearing.
A kind of working method of full-automatic chip stripping machine, includes the following steps:
S1, the slot type material box for filling membranous disc is placed on slot type material box feeding positioning component,
Slot type material box is moved to working position by S2, slot type material box conveying component,
S3, slot type material box loading and unloading handgrip and membranous disc release component cooperation and release membranous disc from slot type material box, and membranous disc is whole
After release, recycling slot type material box conveyer belt recycles empty slot type material box,
After membranous disc is moved in discharging track by S4, membranous disc crawl discharge component, the first conveying takes hand component to move membranous disc
It moves rim charge and removes station, scrape rim charge mechanism and rim charge on film is swept and collected,
S5, the second conveying overturning take hand component that membranous disc is rotated clockwise 180 °, and membranous disc is moved to chip removing work
Position, scrapes chip mechanism and chip on film is removed and collected,
S6, the second conveying overturning take hand component that membranous disc is rotated to 180 ° counterclockwise, and membranous disc are moved to and receives blank panel station,
It receives blank panel mechanism and recycles empty membranous disc.
The invention has the following beneficial effects:
(1) the chip removing of the full-automatic chip stripping machine of the present invention scraped chip mechanism, be applicable in that area is big, thickness is thin, leads to
Crossing lower coating blade cooperation and tightening film removes chip, avoids chip from being scraped off or damage, is effectively protected chip.
(2) membranous disc multistation provided by the invention transports turnover mechanism, and the first conveying takes hand component and second to transport overturning
It takes hand component to work at the same time not interfereing with each other, realizes membranous disc and entering disk station, rim charge removes station, chip removes station and receiving sky
The automatic conveying and overturning of disk station, greatly improve working efficiency.
(3) full-automatic chip stripping machine of the invention, can store three slot type material boxes for filling membranous disc simultaneously, realize dress
The slot type material box automatic charging of membranous disc recycles submitting in working position membranous disc self-emptying and empty slot type material box automatically.
(4) provided by the invention to scrape rim charge mechanism, the rim charge on film around chip can be effectively removed, core is not damaged
Piece.
Detailed description of the invention
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with attached drawing
Step ground detailed description.
Fig. 1 is the overall structure diagram of full-automatic chip stripping machine of the invention；
Fig. 2 is slot type material box feed mechanism one embodiment structural schematic diagram of the present invention；
Fig. 3 is the corresponding station layout of slot type material box feed mechanism of the present invention；
Fig. 4 is slot type material box conveying component one embodiment Structure explosion diagram of the present invention；
Fig. 5 is slot type material box loading and unloading handgrip one embodiment structural schematic diagram of the present invention；
Fig. 6 is that membranous disc of the present invention releases component one embodiment structural schematic diagram；
Fig. 7 is membranous disc crawl discharge component one embodiment structural schematic diagram of the present invention；
Fig. 8 is present invention recycling slot type material box conveyer belt one embodiment structural schematic diagram；
Fig. 9 is that the present invention scrapes rim charge mechanism one embodiment structural schematic diagram；
Figure 10 is that the present invention scrapes rim charge platform assembly one embodiment structural schematic diagram；
Figure 11 is that the present invention scrapes rim charge component one embodiment structural schematic diagram；
Figure 12 is that the present invention scrapes rim charge component one embodiment Structure explosion diagram；
Figure 13 is scraper holder assembly one embodiment structural schematic diagram of the present invention；
Figure 14 is scraper holder assembly one embodiment Structure explosion diagram of the present invention；
Figure 15 is that the present invention scrapes chip mechanism one embodiment structural schematic diagram；
Figure 16 is that the present invention scrapes chip assembly one embodiment structural schematic diagram；
Figure 17 is that the present invention scrapes chip assembly one embodiment Structure explosion diagram；
Figure 18 is lower coating blade component one embodiment Structure explosion diagram of the present invention；
Figure 19 is the present inventionScrape chip conceptFigure；
Figure 20 is that the present invention receives blank panel mechanism one embodiment structural schematic diagram；
Figure 21 is membranous disc multistation conveying turnover mechanism one embodiment structural schematic diagram of the present invention；
Figure 22 is the corresponding station layout of membranous disc multistation conveying turnover mechanism of the present invention；
Figure 23 is that the first conveying of the present invention takes hand component one embodiment structural schematic diagram；
Figure 24 is that the present invention the second conveying overturning takes hand component one embodiment structural schematic diagram；
Figure 25 is that the present invention the second conveying overturning takes hand component one embodiment Structure explosion diagram；
Figure 26 is double X-axis motion platform one embodiment structural schematic diagrams of the invention.
In figure: 100- slot type material box feed mechanism, 110- slot type material box feeding positioning component, 120- slot type material box conveying group
Part, 121- hold up transfer module, 122- lifting cylinder, 123- motor, 124- line slide rail, 125- synchronous belt, 130- slot type material
Case loading and unloading handgrip, 131- lifting motor, 132- screw rod, 133- mobile cylinder, 134- slot type material box supporting plate, 135- straight line are sliding
Rail, 140- membranous disc release component, 141- push rod driving motor, 142- push rod, 143- synchronous belt, 144- line slide rail, the bottom 145-
Seat, 150- membranous disc crawl discharge component, 151- clamp hand, 152- clamp hand cylinder, 153- discharging track, 154- photoelectric sensor,
155- limited block, 156- driving motor, 157- synchronous belt, 158- line slide rail, 159- screw rod, 160- recycle slot type material box transmission
Band, 161- discharging supporting plate, 162- photoelectric sensor, 163- driving motor, 164- belt, 165- support, 200- scrape rim charge mechanism,
210- scrapes rim charge platform assembly, and 211- vacuum inhales supporting plate seat, and 212- vacuum inhales supporting plate, 213- photoelectric sensor, 214- blow head,
215- followup cam track, 216- rim charge rib, 217- rim charge rib, 218- rim charge collection box, 220- scrape rim charge component, 221-
Scraper holder assembly, 222- movable plate, 2210- blade, 2211- level-one blade bearing, 2212- second level blade bearing, 2213- baffle,
2214- fixing seat, 2215- inductor installation sheet, 2216- limit position sensor, 2217- line slide rail, 2218- spring guiding
Bar, 2219- buffer spring, 223- followup cam, 224- gas blow pipe, 225- screw rod, 226- position sensor, 227- stepping electricity
Machine, the mobile support plate of 228-, 300- scrape chip mechanism, and 310- scrapes chip platform component, and 320- scrapes chip assembly, the total lifting air of 321-
Cylinder, 322- movable plate, 323- upper blade, the first lifting cylinder of 324- lower coating blade, 325- lower coating blade component, 3250- bearing,
3251- roller bearing, 3252- lower coating blade, the second lifting cylinder of 326- lower coating blade, 327- support plate, 328- clump weight, 330- are mobile flat
Platform component, 400- receive blank panel mechanism, 401- opposite type sensor, 402- lifting supporting plate, 403- guide rod, 404- base plate, 405-
Linear bearing, 406- motor, 407- synchronous belt, 408- lead screw, 409- limit sensors, 500- membranous disc multistation transport tipper
Structure, the conveying of 510- first take hand component, 511- vacuum chuck, 512- vacuum pressure switch, 513-Z axis mobile platform, 520- the
Two conveyings, which are overturn, takes hand component, 521- lifting cylinder, 522- linear bearing, 523- guide rod, 524- material folding cylinder, and 525- straight line is sliding
Rail, 526- rotary cylinder, 527- main folder pawl, 528- sub-folder pawl, the bis- X-axis motion platforms of 530-, the first driving motor of 531-, 532-
First drive coordination band, 533- first movement platform, 534- line slide rail, 535- photoelectric sensor, the second mobile platform of 536-,
The second driving motor of 537-, 538- the second drive coordination band.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with attached drawing
Step ground detailed description.
As shown in Figure 1, the present invention is achieved like this, including the slot type material box feed mechanism being set in identical platform
100, rim charge mechanism 200 is scraped, chip mechanism 300 is scraped, receives blank panel mechanism 400 and membranous disc multistation conveying turnover mechanism 500, it is described
Slot type material box feed mechanism 100, scrape rim charge mechanism 200, scrape chip mechanism 300 and receive blank panel mechanism 400 be successively arranged side by side in
The membranous disc multistation transports the ipsilateral of turnover mechanism 500, wherein
The slot type material box feed mechanism 100 be used for by slot type material box upper material position, to material position, working position and out material position it
Between be transmitted,
The rim charge mechanism 200 of scraping is used to removing and collecting the rim charge around chip,
It is described scrape chip mechanism 300 for remove simultaneously chip on collection membrane,
The receipts blank panel mechanism 400 is used to recycle empty membranous disc,
The membranous disc multistation conveying turnover mechanism 500 is used to membranous disc entering disk station, rim charge removing station, chip stripping
Conveying overturning is carried out between station and receipts blank panel station.
It is as follows in the specific implementation of each critical component according to the present invention:
Wherein, the example structure of slot type material box feed mechanism 100 is as shown in Figure 2 and Figure 3, slot type material box feed mechanism 100
It is pushed away including slot type material box feeding positioning component 110, slot type material box conveying component 120, slot type material box loading and unloading handgrip 130, membranous disc
Component 140, membranous disc crawl discharge component 150 and recycling slot type material box conveyer belt 160 out, slot type material box feeding positioning component 110
Setting is above recycling slot type material box conveyer belt 160.
Slot type material box transports the example structure of component 120 as shown in figure 4, slot type material box conveying component 120 includes holding up
Transfer module 121, lifting cylinder 122, motor 123, line slide rail 124 and synchronous belt 125, the setting of lifting cylinder 122 are being held up
121 lower section of transfer module simultaneously controls the picking-up lifting of transfer module 121.
The example structure of slot type material box loading and unloading handgrip 130 is as shown in figure 5, slot type material box loading and unloading handgrip 130 includes
Lifting motor 131, screw rod 132, mobile cylinder 133, slot type material box supporting plate 134 and line slide rail 135, lifting motor 131 control
Slot type material box supporting plate 134 is slided up and down in line slide rail 135.
Membranous disc releases the example structure of component 140 as shown in fig. 6, it includes push rod driving motor that membranous disc, which releases component 140,
141, push rod 142, synchronous belt 143, line slide rail 144 and pedestal 145, push rod 142 are arranged on line slide rail 144, push rod 142
It can be slided on line slide rail 144.
Membranous disc grabs the example structure of discharge component 150 as shown in fig. 7, membranous disc crawl discharge component 150 includes clamp hand
151, clamp hand cylinder 152, discharging track 153, photoelectric sensor 154, limited block 155, driving motor 156, synchronous belt 157, straight
Line sliding rail 158 and screw rod 159, clamp hand 151 are connect with clamp hand cylinder 152, and driving motor 156 drives clamp hand 151 to stretch out and withdraws.
The example structure of slot type material box conveyer belt 160 is recycled as shown in figure 8, recycling slot type material box conveyer belt 160 includes
Discharge supporting plate 161, photoelectric sensor 162, driving motor 163, belt 164, support 165, and photoelectric sensor 162 is arranged in belt
On 164, recycling slot type material box conveyer belt 160 is for recycling empty slot type material box, when photoelectric sensor 162 senses slot type material box,
Empty slot type material box cannot be put on recycling slot type material box conveyer belt 160 by slot type material box loading and unloading handgrip 130.
Wherein, the example structure of rim charge mechanism 200 is scraped as shown in figure 9, scraping rim charge mechanism 200 includes scraping rim charge platform group
Part 210 scrapes rim charge component 220, and scraping rim charge component 220 is two, scrapes the setting of rim charge component 220 for two and is scraping rim charge platform assembly
210 adjacent two sides,
The example structure for scraping rim charge platform assembly 210 is as shown in Figure 10, and scraping rim charge platform assembly 210 includes that vacuum inhales support
Panel seat 211, vacuum inhale supporting plate 212, photoelectric sensor 213, blow head 214, followup cam track 215, rim charge rib 216, side
Expect rib 217 and rim charge collection box 218；Vacuum is inhaled the setting of supporting plate 212 and is inhaled on supporting plate seat 211 in vacuum, rim charge rib 216 and side
Material rib 217 is separately positioned on the other adjacent two sides for scraping rim charge platform assembly 210, and the setting of rim charge collection box 218 is inhaled in vacuum
211 lower section of supporting plate seat,
The example structure of rim charge component 220 is scraped as shown in Figure 11, Figure 12, scraping rim charge component 220 includes scraper holder assembly
221, movable plate 222, followup cam 223, gas blow pipe 224, screw rod 225, position sensor 226, stepper motor 227 and mobile load
Plate 228, scraper holder assembly 221 and followup cam 223 are arranged on movable plate 222, and the quantity of scraper holder assembly 221 is according on film
Chip determines.
As shown in figs. 13 and 14, scraper holder assembly 221 includes blade 2210, one to the example structure of scraper holder assembly 221
Grade blade bearing 2211, second level blade bearing 2212, baffle 2213, fixing seat 2214, inductor installation sheet 2215, extreme position sensing
Device 2216, line slide rail 2217, spring conductor rod 2218 and buffer spring 2219, blade 2210 are mounted on second level blade bearing 2212
Lower section, inductor installation sheet 2215 are arranged in fixing seat 2214, and limit position sensor 2216 is fixed at inductor peace
On load 2215, blade 2210 is 0.1mm at a distance from film.
Wherein, the example structure for scraping chip mechanism 300 is as shown in figure 15, and scraping chip mechanism 300 includes scraping chip platform
Component 310 scrapes chip assembly 320 and mobile platform component 330, scrapes chip platform component 310 and exists with the setting of chip assembly 320 is scraped
On mobile platform component 330,
The example structure of chip assembly 320 is scraped as shown in Figure 16, Figure 17, scraping chip assembly 320 includes total lifting cylinder
321, movable plate 322, upper blade 323, the first lifting cylinder of lower coating blade 324, lower coating blade component 325, the second lifting air of lower coating blade
Cylinder 326, support plate 327 and clump weight 328, total lifting cylinder 321 and upper blade 323 are arranged on movable plate 322, clump weight
328 are arranged in support plate 327, and total lifting cylinder 321 controls upper blade 323 and lower coating blade component 325 is gone up and down simultaneously, lower coating blade
First lifting cylinder 324 and the second lifting cylinder of lower coating blade 326 control lower coating blade component 325 simultaneously, and upper blade 323 is pressed on film
Surface, pressure size are controlled by clump weight 328.
The example structure of lower coating blade component 325 is as shown in figure 18, and lower coating blade component 325 includes bearing 3250, roller bearing
3251 and lower coating blade 3252, roller bearing 3251 is fixed on tool apron by bearing 3250, and lower coating blade 3252 is pressed in film lower surface.
It is as shown in figure 19 to scrape chip concept, and film is tightened by upper blade 323 and lower coating blade 3252 removes chip.
The present invention is also optimized receipts blank panel mechanism 400, receives example structure such as Figure 20 institute of blank panel mechanism 400
Show, receiving blank panel mechanism 400 includes base plate 404, is provided with opposite type sensor 401, lifting supporting plate 402 on base plate 404 and leads
To bar 403, linear bearing 405, motor 406, synchronous belt 407, lead screw 408 and limit sensors are provided with below base plate 404
409, opposite type sensor 401 and guide rod 403 are arranged in 402 surrounding of lifting supporting plate.
Wherein, the example structure of membranous disc multistation conveying turnover mechanism 500 is as shown in Figure 21, Figure 22, membranous disc multistation
Conveying turnover mechanism 500 includes that the first conveying takes the conveying overturning of hand component 510, second to take hand component 520 and double X-axis motion platforms
530, the first conveying takes the conveying overturning of hand component 510, second that hand component 520 is taken to connect and set with double X-axis motion platforms 530 respectively
Set it is ipsilateral in double X-axis motion platforms 530,
First conveying takes the example structure of hand component 510 as shown in figure 23, and it includes vacuum that the first conveying, which takes hand component 510,
Sucker 511, vacuum pressure switch 512 and Z axis mobile platform 513,
Second conveying overturning takes the example structure of hand component 520 as shown in Figure 24, Figure 25, and the second conveying overturning takes hand group
Part 520 include lifting cylinder 521, linear bearing 522, guide rod 523, material folding cylinder 524, line slide rail 525, rotary cylinder 526,
Main folder pawl 527 and sub-folder pawl 528, the lifting cylinder 521 are set on bottom plate, and the guide rod 523 passes through the linear bearing
522 are fixedly connected with bottom plate, and the rotary cylinder 526 is connect with the main folder pawl 527 by bearing.
The example structure of double X-axis motion platforms 530 is as shown in figure 26, and double X-axis motion platforms 530 include the first driving electricity
Machine 531, the first drive coordination band 532, first movement platform 533, line slide rail 534, photoelectric sensor 535, second are mobile flat
Platform 536, the second driving motor 537 and the second drive coordination band 538, first movement platform 533 and the setting of the second mobile platform 536
On line slide rail 534, photoelectric sensor 535 is arranged in line slide rail 534.
A kind of working method of full-automatic chip stripping machine, includes the following steps:
The slot type material box for filling membranous disc is placed on slot type material box feeding positioning component 110 by S1, operator, on slot type material box
Material positioning component 110 judges whether slot type material box is in correct position, and is adjusted to it and is at correct position,
S2, slot type material box are in correct position, and the driving of motor 123 holds up transfer module 121 and slot type material box is moved to slot
Slot type material box is jacked up and is detached from slot type material box feeding positioning component by 110 lower section of formula hopper feeding positioning component, lifting cylinder 122
110, the driving of motor 123 holds up transfer module 121 and slot type material box is moved to material position,
S3, mobile cylinder 133 drive slot type material box loading and unloading handgrip 130 to material position, and lifting motor 131 drives slot type
Slot type material box is held up and is detached from by hopper supporting plate 134 holds up transfer module 121, and mobile cylinder 133 drives slot type material box to work
Make position, lifting motor 131 drives slot type material box supporting plate 134 to decline, and cooperates 141 driving push rod 142 of push rod driving motor by membranous disc
It is pushed out to one by one from slot type material box into disk station, after membranous disc is all released, slot type material box loading and unloading handgrip 130 is by empty slot formula material
Case is put on recycling slot type material box conveyer belt 160, is recycled slot type material box conveyer belt 160 for slot type material box and is moved to discharging supporting plate
On 161, operator takes slot type material box away,
S4, first conveying of the driving of first movement platform 533 take hand component 510 to entering above disk station, Z axis mobile platform
513 driving vacuum chucks 511, which move down, to be sucked membranous disc and rises, and first conveying of the driving of first movement platform 533 takes hand component
510 remove above station to rim charge, and Z axis mobile platform 513 drives vacuum chuck 511 to move down and membranous disc is put into vacuum suction support
On plate 212, photoelectric sensor 213 senses membranous disc, and vacuum inhales supporting plate seat 211 and membranous disc positioning is inhaled to flat, the driving of stepper motor 227
Screw rod 225 declines scraper holder assembly 221 and blade 2210 is driven to sweep rim charge, and gas blow pipe 224 and blow head 214 cooperate,
Rim charge is blown into rim charge collection box 218,
S5, lifting cylinder 521 drive main folder pawl 527 and sub-folder pawl 528 to decline, in the same plane with membranous disc, material folding gas
Cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 clamps membranous disc, and lifting cylinder 521 drives membranous disc to be picked up, 526 band of rotary cylinder
Dynamic main folder pawl 527 rotates clockwise 180 °, and membranous disc and sub-folder pawl 528 rotate clockwise 180 ° therewith, 536 band of the second mobile platform
Dynamic second conveying overturning takes above hand component 520 to chip removing station, and membranous disc is put into chip removing station by lifting cylinder 521
On, material folding cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 unclamps membranous disc, and lifting cylinder 521 drives main folder pawl 527 and sub-folder
Pawl 528 rises, and membranous disc is put into and is scraped on chip platform component 310, and it is mobile that chip assembly 320 is scraped in the drive of mobile platform component 330
Above to membranous disc, total lifting cylinder 321 drives upper blade 323 and lower coating blade component 325 to decline, the first lifting cylinder of lower coating blade
324 and the second lifting cylinder of lower coating blade 326 simultaneously rise drive lower coating blade component 325 rise, upper blade 323, lower coating blade component
325 are pressed respectively against film upper and lower surfaces, and upper blade 323 and lower coating blade component 325, which tighten film, removes chip,
S6, lifting cylinder 521 drive main folder pawl 527 and sub-folder pawl 528 to decline, in the same plane with membranous disc, material folding gas
Cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 clamps membranous disc, and lifting cylinder 521 drives membranous disc to be picked up, 526 band of rotary cylinder
180 ° of rotation counterclockwise, the second mobile platform 536 drive therewith for dynamic 180 ° of the rotation counterclockwise of main folder pawl 527, membranous disc and sub-folder pawl 528
Dynamic second conveying overturning takes hand component 520 to receiving above blank panel station, and material folding cylinder 524 drives main folder pawl 527 and sub-folder pawl 528
Membranous disc is unclamped, lifting cylinder 521 drives main folder pawl 527 and sub-folder pawl 528 to rise, membranous disc is placed in lifting supporting plate 402, film is worked as
Disk, which stacks, to be increased when sensing opposite type sensor 401, and motor 406 drives lead screw 408 to drop to lifting supporting plate 402 to penetrating and passes
Sensor 401 induction less than position, when lifting supporting plate 402 drops to close to base plate 404, limit sensors 409 prompt operation
Member takes membranous disc away.
The invention has the following beneficial effects:
(1) the chip removing of the full-automatic chip stripping machine of the present invention scraped chip mechanism, be applicable in that area is big, thickness is thin, leads to
Crossing lower coating blade cooperation and tightening film removes chip, avoids chip from being scraped off or damage, is effectively protected chip.
(2) membranous disc multistation provided by the invention transports turnover mechanism, and the first conveying takes hand component and second to transport overturning
It takes hand component to work at the same time not interfereing with each other, realizes membranous disc and entering disk station, rim charge removes station, chip removes station and receiving sky
The automatic conveying and overturning of disk station, greatly improve working efficiency.
(3) full-automatic chip stripping machine of the invention, can store three slot type material boxes for filling membranous disc simultaneously, realize dress
The slot type material box automatic charging of membranous disc recycles submitting in working position membranous disc self-emptying and empty slot type material box automatically.
(4) provided by the invention to scrape rim charge mechanism, the rim charge on film around chip can be effectively removed, core is not damaged
Piece.
The above is a preferred embodiment of the present invention, it should be noted that for those skilled in the art
For, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of full-automatic chip stripping machine, which is characterized in that including the slot type material box feed mechanism being set in identical platform
(100), rim charge mechanism (200) is scraped, chip mechanism (300) is scraped, receives blank panel mechanism (400) and membranous disc multistation conveying turnover mechanism
(500), the slot type material box feed mechanism (100), scrape rim charge mechanism (200), scrape chip mechanism (300) and receive blank panel mechanism
(400) it is successively arranged side by side in the ipsilateral of membranous disc multistation conveying turnover mechanism (500), wherein
The slot type material box feed mechanism (100) is used for slot type material box in upper material position, to material position, working position and out between material position
It is transmitted,
Described scrape rim charge mechanism (200) are used to removing and collecting the rim charge around chip,
It is described scrape chip mechanism (300) for remove simultaneously chip on collection membrane,
The receipts blank panel mechanism (400) is used to recycle empty membranous disc,
Membranous disc multistation conveying turnover mechanism (500) is used to membranous disc entering disk station and rim charge is removed and carried out between station
It carries, and the membranous disc is removed station, chip removing station and receive to carry out transporting between blank panel station in the rim charge and is turned over
Turn.
2. full-automatic chip stripping machine according to claim 1, which is characterized in that the slot type material box feed mechanism
It (100) include slot type material box feeding positioning component (110), slot type material box conveying component (120), slot type material box loading and unloading handgrip
(130), membranous disc releases component (140), membranous disc crawl discharge component (150) and recycling slot type material box conveyer belt (160),
The slot type material box feeding positioning component (110), slot type material box conveying component (120) and membranous disc release component (140) according to
Secondary to be arranged side by side, the slot type material box feeding positioning component (110) is arranged on the recycling slot type material box conveyer belt (160)
Side, the membranous disc release component (140) and membranous disc crawl discharge component (150) cooperation and release membranous disc from slot type material box.
3. full-automatic chip stripping machine according to claim 1 or 2, which is characterized in that described to scrape rim charge mechanism (200) packet
It includes and scrapes rim charge platform assembly (210), scrapes rim charge component (220), described scrape rim charge component (220) are two, two scrapings
Expect that component (220) are arranged in the adjacent two sides for scraping rim charge platform assembly (210),
The rim charge component (220) of scraping includes scraper holder assembly (221), movable plate (222), followup cam (223), the scraper
Holder assembly (221) and the followup cam (223) are arranged on the movable plate (222).
4. full-automatic chip stripping machine according to claim 3, which is characterized in that the scraper holder assembly (221) includes
Blade (2210), blade bearing, baffle (2213), fixing seat (2214), inductor installation sheet (2215), limit position sensor
(2216), the blade (2210) is set to below the blade bearing, and the inductor installation sheet (2215) is arranged described solid
In reservation (2214), the limit position sensor (2216) is fixed on the inductor installation sheet (2215).
5. full-automatic chip stripping machine according to claim 1 or 4, which is characterized in that described to scrape chip mechanism (300) packet
It includes and scrapes chip platform component (310), scrape chip assembly (320) and mobile platform component (330), it is described to scrape chip platform component
(310) it is arranged on the mobile platform component (330) with described scrape chip assembly (320),
It is described scrape chip assembly (320) include lifting cylinder, movable plate (322), upper blade (323), lower coating blade component (325),
Support plate (327) and clump weight (328), the lifting cylinder and the upper blade (323) are arranged in the movable plate (322)
On, the clump weight (328) is arranged on the support plate (327).
6. full-automatic chip stripping machine according to claim 5, which is characterized in that the lower coating blade component (325) includes
Bearing (3250), roller bearing (3251) and lower coating blade (3252), the roller bearing (3251) are fixedly installed by the bearing (3250)
On tool apron.
7. full-automatic chip stripping machine according to claim 1 or 6, which is characterized in that receipts blank panel mechanism (400) packet
It includes base plate (404), opposite type sensor (401), lifting supporting plate (402) and guide rod is provided on the base plate (404)
(403), linear bearing (405), motor (406), synchronous belt (407), lead screw (408) are provided with below the base plate (404)
With limit sensors (409), the opposite type sensor (401) and the guide rod (403) are arranged in the lifting supporting plate (402)
Surrounding.
8. full-automatic chip stripping machine according to claim 7, which is characterized in that the membranous disc multistation transports tipper
Structure (500) includes that the first conveying takes hand component (510), the second conveying overturning to take hand component (520) and double X-axis motion platforms
(530), it is described first conveying take hand component (510), it is described second conveying overturning take hand component (520) respectively with double X-axis
Motion platform (530) connects and to be arranged in double X-axis motion platforms (530) ipsilateral,
It includes vacuum chuck (511) and Z axis mobile platform (513) that first conveying, which takes hand component (510),
It includes cylinder, clamping jaw that the second conveying overturning, which takes hand component (520),
Double X-axis motion platforms (530) include mobile platform, line slide rail (534), photoelectric sensor (535), the movement
Platform is arranged on the line slide rail (534), and photoelectric sensor (535) setting is in the line slide rail (534).
9. full-automatic chip stripping machine according to claim 8, which is characterized in that the second conveying overturning takes hand component
It (520) include lifting cylinder (521), linear bearing (522), guide rod (523), rotary cylinder (526), main folder pawl (527), it is described
Lifting cylinder (521) is set on bottom plate, and the guide rod (523) is fixedly connected by the linear bearing (522) with bottom plate, institute
It states rotary cylinder (526) and is connect with the main folder pawl (527) by bearing.
10. a kind of working method of full-automatic chip stripping machine, which comprises the steps of:
S1, the slot type material box for filling membranous disc is placed on slot type material box feeding positioning component (110),
Slot type material box is moved to working position by S2, slot type material box conveying component (120),
S3, slot type material box loading and unloading handgrip (130) and membranous disc release component (140) cooperation and release membranous disc from slot type material box, film
After disk is all released, empty slot type material box is recycled in recycling slot type material box conveyer belt (160),
After membranous disc is moved in discharging track by S4, membranous disc crawl discharge component (150), the first conveying takes hand component (510) will
Membranous disc is moved to rim charge and removes station, scrapes rim charge mechanism (200) and rim charge on film is swept and collected,
S5, the second conveying overturning take hand component (520) that membranous disc is rotated clockwise 180 °, and membranous disc is moved to chip removing work
Position, scrapes chip mechanism (300) and chip on film is removed and collected,
S6, the second conveying overturning take hand component (520) that membranous disc is rotated to 180 ° counterclockwise, and membranous disc are moved to and receives blank panel work
Position receives blank panel mechanism (400) and recycles empty membranous disc.
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| CN201710413041.7A CN107170699B (en) | 2017-06-05 | 2017-06-05 | A kind of full-automatic chip stripping machine and its working method |
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| CN201710413041.7A CN107170699B (en) | 2017-06-05 | 2017-06-05 | A kind of full-automatic chip stripping machine and its working method |
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| CN107170699B true CN107170699B (en) | 2019-07-16 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137129B (en) * | 2019-05-30 | 2021-04-30 | 上海世禹精密机械有限公司 | Coring machine |
| CN110339951A (en) * | 2019-06-28 | 2019-10-18 | 广东晶科电子股份有限公司 | A kind of centrifuge and its delivery system |
| CN212943836U (en) * | 2020-06-17 | 2021-04-13 | 无锡豪帮高科股份有限公司 | Integrated circuit intelligent manufacturing feeding device |
| CN116544151B (en) * | 2023-07-05 | 2023-09-19 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201285758Y (en) * | 2008-10-20 | 2009-08-05 | 格兰达技术（深圳）有限公司 | Combined baiting apparatus |
| CN201298545Y (en) * | 2008-10-17 | 2009-08-26 | 格兰达技术（深圳）有限公司 | Combined type feeding device of IC strip laser marking machine |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
| CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN106783677A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | A kind of slot type material box automatic charging equipment |
| CN106783676A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | Chip scrapes device on a kind of UV films |
-
2017
- 2017-06-05 CN CN201710413041.7A patent/CN107170699B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201298545Y (en) * | 2008-10-17 | 2009-08-26 | 格兰达技术（深圳）有限公司 | Combined type feeding device of IC strip laser marking machine |
| CN201285758Y (en) * | 2008-10-20 | 2009-08-05 | 格兰达技术（深圳）有限公司 | Combined baiting apparatus |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
| CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN106783677A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | A kind of slot type material box automatic charging equipment |
| CN106783676A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | Chip scrapes device on a kind of UV films |
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