CN107170699A - A kind of full-automatic chip stripping machine and its method of work - Google Patents
A kind of full-automatic chip stripping machine and its method of work Download PDFInfo
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- CN107170699A CN107170699A CN201710413041.7A CN201710413041A CN107170699A CN 107170699 A CN107170699 A CN 107170699A CN 201710413041 A CN201710413041 A CN 201710413041A CN 107170699 A CN107170699 A CN 107170699A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The invention discloses a kind of full-automatic chip stripping machine, including be arranged in identical platform slot type material box feed mechanism, scrape rim charge mechanism, scrape chip mechanism, receive blank panel mechanism and membranous disc multistation conveyance switching mechanism, the slot type material box feed mechanism, scrape rim charge mechanism, scrape chip mechanism and receive blank panel mechanism the homonymy that switching mechanism is transported in the membranous disc multistation is arranged side by side successively.The invention also discloses a kind of method of work of full-automatic chip stripping machine.Chip stripping machine of the invention full-automatic is applicable that area is big, thickness of thin chip stripping, can remove chip rim charge and peel off chip, it is to avoid chip is scraped off or damaged, and is effectively protected chip, drastically increases operating efficiency.
Description
Technical field
The present invention relates to a kind of stripping machine, more particularly to a kind of full-automatic chip stripping machine and its method of work.
Background technology
Radio frequency identification (Radio Frequency Identification, RFID) technology is to recognize mesh by radiofrequency signal
Mark object and the non-contact automatic identification technology for obtaining related data.Compared with bar codes technique, REID has
Waterproof, antimagnetic, high temperature resistant, service life length, the identification data on big, label can be encrypted, data storage capacity is bigger, deposit
Storage information be many advantages, such as can change, thus be one of following most promising information technology.
RFID tag sealed in unit is by substrate conveyor module, detection module, dispensing module, attachment module and hot-die
Block is constituted, wherein, the stripping off device in attachment module realizes chip from the stripping on wafer disk.
Stripping off device is divided into vacuum stripping in the way of chip is peeled off and jack-up is peeled off.Thimble peels off design and motion planning
It is unreasonable be likely to result in chip direct fragmentation failure, directly affect the qualification rate of product.Such as Patent No.
201310165723.2, chip, Patent No. are peeled off in a kind of entitled invention of the safe stripping off device of IC chip using thimble
201310716769.9, a kind of entitled invention of many thimble chip peeling apparatus peels off chip, this two pieces using many thimbles
Thimble in patent produces concentrated stress effect to chip, and larger for area, the chip of thinner thickness, chip easily occurs broken
Split, damage chip.Number of patent application is 201510127933.1, entitled stripping off device and utilization device stripping chip package
The method of body surface cover layer, is to peel off chip by setting vacuum slot head in stripping off device, for large area, thickness of thin
Chip to peel off its operating efficiency relatively low, it is impossible to realization is widely used.
Therefore, it is necessary to which providing a kind of can realize that area is big, thickness of thin chip is peeled off, operating efficiency is high and can keep away
Exempt from the full-automatic chip stripping machine and its method of work of stripping process chips damage.
The content of the invention
In order to solve the above-mentioned technical problem, the invention provides a kind of full-automatic chip stripping machine, including it is arranged at same
Slot type material box feed mechanism on platform, rim charge mechanism is scraped, chip mechanism is scraped, receives blank panel mechanism and the conveyance upset of membranous disc multistation
Mechanism, the slot type material box feed mechanism, scrapes rim charge mechanism, scrapes chip mechanism and receives blank panel mechanism and be arranged side by side successively in described
Membranous disc multistation transports the homonymy of switching mechanism, wherein,
The slot type material box feed mechanism is used for slot type material box in upper material position, treats material position, working position and go out between material position
Transmitted,
It is described to scrape the rim charge that rim charge mechanism is used to removing and collecting chip circumference,
It is described scrape chip mechanism be used for peel off simultaneously chip on collection membrane,
The receipts blank panel mechanism is used to reclaim empty membranous disc,
The membranous disc multistation conveyance switching mechanism is used to membranous disc entering disk station, rim charge removing station, chip stripping
Conveyance upset is carried out between station and receipts blank panel station.
Further, the slot type material box feed mechanism includes slot type material box feeding positioning component, slot type material box conveyance group
Part, slot type material box loading and unloading handgrip, membranous disc release component, membranous disc crawl discharge component and reclaim slot type material box conveyer belt,
The slot type material box feeding positioning component, slot type material box conveyance component and membranous disc are released component and are arranged side by side successively,
The slot type material box feeding positioning component is arranged on above the recovery slot type material box conveyer belt, and the membranous disc releases component and institute
Membranous disc crawl discharge component cooperation is stated to release membranous disc from slot type material box.
Further, the rim charge mechanism of scraping includes scraping rim charge platform assembly, scraping rim charge component, and the rim charge component of scraping is
Two, rim charge component is scraped described in two and is arranged on the adjacent both sides for scraping rim charge platform assembly,
The rim charge component of scraping is including scraper holder assembly, portable plate, followup cam, the scraper holder assembly and described servo-actuated
Cam is arranged on the portable plate.
Preferably, the scraper holder assembly includes blade, blade bearing, catch, fixed seat, inductor installation sheet, limit position
Sensor is put, the blade is arranged at below the blade bearing, and the inductor installation sheet is arranged in the fixed seat, described
Limit position sensor is fixedly installed in the inductor installation sheet.
Further, the chip mechanism of scraping includes scraping chip platform component, scraping chip assembly and mobile platform component, institute
State and scrape chip platform component and the chip assembly of scraping is arranged on the mobile platform component,
The chip assembly of scraping includes lift cylinder, portable plate, upper blade, lower coating blade component, supporting plate and balancing weight, institute
State lift cylinder and the upper blade is arranged on the portable plate, the balancing weight is arranged in the supporting plate.
Preferably, the lower coating blade component includes bearing, roller bearing and lower coating blade, and the roller bearing is fixed by the bearing and set
Put on tool rest.
Further, the receipts blank panel mechanism includes being provided with opposite type sensor, lifting support on bedplate, the bedplate
Linear bearing, motor, timing belt, leading screw and limit sensors are provided with below plate and guide rod, the bedplate, described pair is penetrated
Sensor and the guide rod are arranged on the lifting supporting plate surrounding.
Further, the membranous disc multistation conveyance switching mechanism takes hand component, the second conveyance upset including the first conveyance
Take hand component and double X-axis motion platforms, first conveyance take hand component, the second conveyance upset take hand component respectively with institute
Double X-axis motion platforms are stated to connect and be arranged on described pair of X-axis motion platform homonymy,
First conveyance takes hand component to include vacuum cup and Z axis mobile platform,
The second conveyance upset takes hand component to include cylinder, clamping jaw,
Described pair of X-axis motion platform includes mobile platform, line slide rail, photoelectric sensor, and the mobile platform is arranged on
On the line slide rail, the photoelectric sensor is arranged in the line slide rail.
Further, it is described second conveyance upset take hand component include lift cylinder, linear bearing, guide rod, rotary cylinder,
Main folder pawl, the lift cylinder is arranged on bottom plate, and the guide rod is fixedly connected by the linear bearing with bottom plate, the rotation
Rotaring cylinder is connected with the main folder pawl by bearing.
A kind of method of work of full-automatic chip stripping machine, comprises the following steps：
S1, the slot type material box for filling membranous disc is placed on slot type material box feeding positioning component,
Slot type material box is moved to working position by S2, slot type material box conveyance component,
S3, slot type material box loading and unloading handgrip and membranous disc are released component and coordinated membranous disc from slot type material box release, and membranous disc is whole
After release, reclaim slot type material box conveyer belt and reclaim empty slot type material box,
After membranous disc is moved in discharging track by S4, membranous disc crawl discharge component, the first conveyance takes hand component to move membranous disc
Move rim charge and remove station, scrape rim charge mechanism and rim charge on film is swept and collected,
S5, the second conveyance upset take hand component that membranous disc turns clockwise 180 °, and membranous disc is moved into chip stripping work
Position, scrapes chip mechanism and chip on film is peeled off and collected,
S6, the second conveyance upset take hand component by 180 ° of membranous disc rotate counterclockwise, and membranous disc are moved into receipts blank panel station,
Receive blank panel mechanism and reclaim empty membranous disc.
Implement the present invention, have the advantages that：
(1) present invention full-automatic chip stripping machine scrapes chip mechanism, is applicable that area is big, thickness of thin chip is peeled off, logical
Crossing lower coating blade cooperation and tightening film peels off chip, it is to avoid chip is scraped off or damaged, and is effectively protected chip.
(2) the membranous disc multistation conveyance switching mechanism that the present invention is provided, the first conveyance takes hand component and second to transport upset
Take hand component and do not interfere with each other while working, realize membranous disc and entering disk station, rim charge removing station, chip stripping station and receiving empty
The automatic conveyance and upset of disk station, drastically increase operating efficiency.
(3) full-automatic chip stripping machine of the invention, three slot type material boxes for filling membranous disc can be stored simultaneously, dress is realized
The slot type material box automatic charging of membranous disc, submitting is reclaimed in working position membranous disc self-emptying and empty slot type material box automatically.
(4) what the present invention was provided scrapes rim charge mechanism, can effectively remove the rim charge of chip circumference on film, not damage core
Piece.
Brief description of the drawings
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with accompanying drawing
It is described in detail on step ground.
Fig. 1 is the overall structure diagram of the full-automatic chip stripping machine of the present invention；
Fig. 2 is slot type material box feed mechanism one embodiment structural representation of the present invention；
Fig. 3 is the corresponding station layout of slot type material box feed mechanism of the present invention；
Fig. 4 is slot type material box conveyance component one embodiment Structure explosion diagram of the present invention；
Fig. 5 is slot type material box loading and unloading handgrip one embodiment structural representation of the present invention；
Fig. 6 is that membranous disc of the present invention releases component one embodiment structural representation；
Fig. 7 is membranous disc crawl discharge component one embodiment structural representation of the present invention；
Fig. 8 is that the present invention reclaims slot type material box conveyer belt one embodiment structural representation；
Fig. 9 is that the present invention scrapes rim charge mechanism one embodiment structural representation；
Figure 10 is that the present invention scrapes rim charge platform assembly one embodiment structural representation；
Figure 11 is that the present invention scrapes rim charge component one embodiment structural representation；
Figure 12 is that the present invention scrapes rim charge component one embodiment Structure explosion diagram；
Figure 13 is scraper holder assembly one embodiment structural representation of the present invention；
Figure 14 is scraper holder assembly one embodiment Structure explosion diagram of the present invention；
Figure 15 is that the present invention scrapes chip mechanism one embodiment structural representation；
Figure 16 is that the present invention scrapes chip assembly one embodiment structural representation；
Figure 17 is that the present invention scrapes chip assembly one embodiment Structure explosion diagram；
Figure 18 is lower coating blade component one embodiment Structure explosion diagram of the present invention；
Figure 19 is the present inventionScrape chip conceptFigure；
Figure 20 is that the present invention receives blank panel mechanism one embodiment structural representation；
Figure 21 is membranous disc multistation conveyance switching mechanism one embodiment structural representation of the present invention；
Figure 22 is the corresponding station layout of membranous disc multistation conveyance switching mechanism of the present invention；
Figure 23 is that the conveyance of the present invention first takes hand component one embodiment structural representation；
Figure 24 is that the conveyance upset of the present invention second takes hand component one embodiment structural representation；
Figure 25 is that the conveyance upset of the present invention second takes hand component one embodiment Structure explosion diagram；
Figure 26 is double X-axis motion platform one embodiment structural representations of the invention.
In figure：100- slot type material box feed mechanisms, 110- slot type material box feeding positioning components, 120- slot type material box conveyance groups
Part, 121- holds up transfer module, 122- lift cylinders, 123- motors, 124- line slide rails, 125- timing belts, 130- slot type material
Case loading and unloading handgrip, 131- lifting motors, 132- screw mandrels, 133- mobile cylinders, 134- slot type material box supporting plates, 135- straight lines are slided
Rail, 140- membranous discs release component, 141- push rod motors, 142- push rods, 143- timing belts, 144- line slide rails, 145- bottoms
Seat, 150- membranous discs crawl discharge component, 151- tongs, 152- tong cylinders, 153- discharging tracks, 154- photoelectric sensors,
155- limited blocks, 156- motors, 157- timing belts, 158- line slide rails, 159- screw mandrels, 160- reclaims slot type material box transmission
Band, 161- discharging supporting plates, 162- photoelectric sensors, 163- motors, 164- belts, 165- bearings, 200- scrapes rim charge mechanism,
210- scrapes rim charge platform assembly, and 211- vacuum inhales supporting plate seat, and 212- vacuum inhales supporting plate, 213- photoelectric sensors, 214- blow heads,
215- followup cam tracks, 216- rim charge ribs, 217- rim charge ribs, 218- rim charge disposable boxes, 220- scrapes rim charge component, 221-
Scraper holder assembly, 222- portable plates, 2210- blades, 2211- one-level blade bearings, bis- grades of blade bearings of 2212-, 2213- catch,
2214- fixed seats, 2215- inductor installation sheets, 2216- limit position sensors, 2217- line slide rails, 2218- springs are oriented to
Bar, 2219- buffer springs, 223- followup cams, 224- gas blow pipes, 225- screw mandrels, 226- position sensors, 227- steppings electricity
Machine, 228- movement support plates, 300- scrapes chip mechanism, and 310- scrapes chip platform component, and 320- scrapes chip assembly, the total lifting airs of 321-
Cylinder, 322- portable plates, 323- upper blades, the lift cylinder of 324- lower coating blades first, 325- lower coating blade components, 3250- bearings,
3251- roller bearings, 3252- lower coating blades, the lift cylinder of 326- lower coating blades second, 327- supporting plates, 328- balancing weights, 330- movements are flat
Platform component, 400- receives blank panel mechanism, 401- opposite type sensors, 402- lifting supporting plates, 403- guide rods, 404- bedplates, 405-
Linear bearing, 406- motors, 407- timing belts, 408- leading screws, 409- limit sensors, 500- membranous discs multistation conveyance tipper
Structure, the conveyances of 510- first take hand component, 511- vacuum cups, 512- vacuum pressure switch, 513-Z axle mobile platforms, 520- the
Two conveyance upsets take hand component, and 521- lift cylinders, 522- linear bearings, 523- guide rods, 524- material folding cylinders, 525- straight lines are slided
Rail, 526- rotary cylinders, 527- main folder pawls, 528- sub-folder pawls, the double X-axis motion platforms of 530-, the motors of 531- first, 532-
First drive coordination band, the mobile platforms of 533- first, 534- line slide rails, 535- photoelectric sensors, the mobile platforms of 536- second,
The motors of 537- second, 538- the second drive coordination bands.
Embodiment
To make the object, technical solutions and advantages of the present invention clearer, the present invention is made into one below in conjunction with accompanying drawing
It is described in detail on step ground.
As shown in figure 1, the present invention is achieved like this, including the slot type material box feed mechanism being arranged in identical platform
100th, rim charge mechanism 200 is scraped, chip mechanism 300 is scraped, receives blank panel mechanism 400 and membranous disc multistation conveyance switching mechanism 500, it is described
Slot type material box feed mechanism 100, scrape rim charge mechanism 200, scrape chip mechanism 300 and receive blank panel mechanism 400 be arranged side by side successively in
The membranous disc multistation transports the homonymy of switching mechanism 500, wherein,
The slot type material box feed mechanism 100 be used for by slot type material box upper material position, treat material position, working position and go out material position it
Between transmitted,
It is described to scrape the rim charge that rim charge mechanism 200 is used to removing and collecting chip circumference,
It is described scrape chip mechanism 300 be used for peel off simultaneously chip on collection membrane,
The receipts blank panel mechanism 400 is used to reclaim empty membranous disc,
The membranous disc multistation conveyance switching mechanism 500 is used to membranous disc entering disk station, rim charge removing station, chip stripping
Conveyance upset is carried out between station and receipts blank panel station.
It is as follows in the specific implementation of each critical component involved in the present invention：
Wherein, the example structure of slot type material box feed mechanism 100 as shown in Figure 2 and Figure 3, slot type material box feed mechanism 100
Pushed away including slot type material box feeding positioning component 110, slot type material box conveyance component 120, slot type material box loading and unloading handgrip 130, membranous disc
Go out component 140, membranous disc crawl discharge component 150 and reclaim slot type material box conveyer belt 160, slot type material box feeding positioning component 110
It is arranged on the top of recovery slot type material box conveyer belt 160.
The example structure of slot type material box conveyance component 120 is as shown in figure 4, slot type material box conveyance component 120 includes holding up
Transfer module 121, lift cylinder 122, motor 123, line slide rail 124 and timing belt 125, lift cylinder 122 are arranged on picking-up
The lower section of transfer module 121 simultaneously controls picking-up transfer module 121 to lift.
The example structure of slot type material box loading and unloading handgrip 130 is as shown in figure 5, slot type material box loading and unloading handgrip 130 includes
Lifting motor 131, screw mandrel 132, mobile cylinder 133, slot type material box supporting plate 134 and line slide rail 135, lifting motor 131 are controlled
Slot type material box supporting plate 134 is slided up and down in line slide rail 135.
Membranous disc releases the example structure of component 140 as shown in fig. 6, membranous disc, which releases component 140, includes push rod motor
141st, push rod 142, timing belt 143, line slide rail 144 and base 145, push rod 142 are arranged on line slide rail 144, push rod 142
It can be slided on line slide rail 144.
The example structure of membranous disc crawl discharge component 150 is as shown in fig. 7, membranous disc crawl discharge component 150 includes tong
151st, tong cylinder 152, discharging track 153, photoelectric sensor 154, limited block 155, motor 156, timing belt 157, straight
Line slide rail 158 and screw mandrel 159, tong 151 are connected with tong cylinder 152, and the driving tong 151 of motor 156, which stretches out, to be withdrawn.
The example structure of slot type material box conveyer belt 160 is reclaimed as shown in figure 8, reclaiming slot type material box conveyer belt 160 includes
Discharge supporting plate 161, photoelectric sensor 162, motor 163, belt 164, bearing 165, and photoelectric sensor 162 is arranged on belt
On 164, reclaiming slot type material box conveyer belt 160 is used to reclaim empty slot type material box, when photoelectric sensor 162 senses slot type material box,
Empty slot type material box can not be put on recovery slot type material box conveyer belt 160 by slot type material box loading and unloading handgrip 130.
Wherein, the example structure of rim charge mechanism 200 is scraped as shown in figure 9, scraping rim charge mechanism 200 includes scraping rim charge platform group
Part 210, rim charge component 220 is scraped, it is two to scrape rim charge component 220, scrape rim charge component 220 and be arranged on for two and scrape rim charge platform assembly
210 adjacent both sides,
The example structure for scraping rim charge platform assembly 210 as shown in Figure 10, scrapes rim charge platform assembly 210 and inhales support including vacuum
Panel seat 211, vacuum inhale supporting plate 212, photoelectric sensor 213, blow head 214, followup cam track 215, rim charge rib 216, side
Expect rib 217 and rim charge disposable box 218；Vacuum is inhaled supporting plate 212 and is arranged on vacuum suction supporting plate seat 211, rim charge rib 216 and side
Material rib 217 is separately positioned on the other adjacent both sides for scraping rim charge platform assembly 210, and rim charge disposable box 218 is arranged on vacuum suction
The lower section of supporting plate seat 211,
The example structure of rim charge component 220 is scraped as shown in Figure 11, Figure 12, scraping rim charge component 220 includes scraper holder assembly
221st, portable plate 222, followup cam 223, gas blow pipe 224, screw mandrel 225, position sensor 226, stepper motor 227 and mobile load
Plate 228, scraper holder assembly 221 and followup cam 223 are arranged on portable plate 222, and the quantity of scraper holder assembly 221 is according on film
Chip is determined.
The example structure of scraper holder assembly 221 is as shown in Figure 13, Figure 14, and scraper holder assembly 221 includes blade 2210, one
Level blade bearing 2211, two grades of blade bearings 2212, catch 2213, fixed seat 2214, inductor installation sheet 2215, extreme position sensings
Device 2216, line slide rail 2217, spring conductor rod 2218 and buffer spring 2219, blade 2210 are arranged on two grades of blade bearings 2212
Lower section, inductor installation sheet 2215 is arranged in fixed seat 2214, and limit position sensor 2216 is fixedly installed on inductor peace
On load 2215, the distance of blade 2210 and film is 0.1mm.
Wherein, as shown in figure 15, scrape chip mechanism 300 includes scraping chip platform the example structure for scraping chip mechanism 300
Component 310, chip assembly 320 and mobile platform component 330 are scraped, scrape chip platform component 310 and scrape chip assembly 320 and be arranged on
On mobile platform component 330,
The example structure of chip assembly 320 is scraped as shown in Figure 16, Figure 17, scraping chip assembly 320 includes total lift cylinder
321st, portable plate 322, upper blade 323, the first lift cylinder of lower coating blade 324, lower coating blade component 325, the lifting air of lower coating blade second
Cylinder 326, supporting plate 327 and balancing weight 328, total lift cylinder 321 and upper blade 323 are arranged on portable plate 322, balancing weight
328 are arranged in supporting plate 327, and total the control upper blade 323 of lift cylinder 321 and lower coating blade component 325 are lifted simultaneously, lower coating blade
First lift cylinder 324 and the second lift cylinder of lower coating blade 326 control lower coating blade component 325 simultaneously, and upper blade 323 is pressed on film
Surface, its pressure size is controlled by balancing weight 328.
As shown in figure 18, lower coating blade component 325 includes bearing 3250, roller bearing to the example structure of lower coating blade component 325
3251 and lower coating blade 3252, roller bearing 3251 is fixedly installed on tool rest by bearing 3250, and lower coating blade 3252 is pressed in film lower surface.
Scrape chip concept as shown in figure 19, film is tightened by upper blade 323 and lower coating blade 3252 peels off chip.
The present invention is also optimized to receiving blank panel mechanism 400, receives example structure such as Figure 20 institutes of blank panel mechanism 400
Show, receiving blank panel mechanism 400 includes being provided with opposite type sensor 401, lifting supporting plate 402 on bedplate 404, bedplate 404 and lead
To bar 403, the lower section of bedplate 404 is provided with linear bearing 405, motor 406, timing belt 407, leading screw 408 and limit sensors
409, opposite type sensor 401 and guide rod 403 are arranged on the lifting surrounding of supporting plate 402.
Wherein, the example structure of membranous disc multistation conveyance switching mechanism 500 is as shown in Figure 21, Figure 22, membranous disc multistation
Conveyance switching mechanism 500 includes the first conveyance and takes the conveyance upset of hand component 510, second to take hand component 520 and double X-axis motion platforms
530, the first conveyance takes the conveyance upset of hand component 510, second to take hand component 520 to be connected and set with double X-axis motion platforms 530 respectively
Put in double homonymies of X-axis motion platform 530,
First conveyance takes the example structure of hand component 510 as shown in figure 23, and the first conveyance takes hand component 510 to include vacuum
Sucker 511, vacuum pressure switch 512 and Z axis mobile platform 513,
Second conveyance upset takes the example structure of hand component 520 as shown in Figure 24, Figure 25, and the second conveyance upset takes hand group
Part 520 include lift cylinder 521, linear bearing 522, guide rod 523, material folding cylinder 524, line slide rail 525, rotary cylinder 526,
Main folder pawl 527 and sub-folder pawl 528, the lift cylinder 521 are arranged on bottom plate, and the guide rod 523 passes through the linear bearing
522 are fixedly connected with bottom plate, and the rotary cylinder 526 is connected with the main folder pawl 527 by bearing.
As shown in figure 26, double X-axis motion platforms 530 include the first driving electricity to the example structure of double X-axis motion platforms 530
Machine 531, the first drive coordination band 532, the first mobile platform 533, line slide rail 534, the movement of photoelectric sensor 535, second are flat
Platform 536, the second motor 537 and the second drive coordination band 538, the first mobile platform 533 and the second mobile platform 536 are set
On line slide rail 534, photoelectric sensor 535 is arranged in line slide rail 534.
A kind of method of work of full-automatic chip stripping machine, comprises the following steps：
The slot type material box for filling membranous disc is placed on slot type material box feeding positioning component 110 by S1, operator, on slot type material box
Whether material positioning component 110 judges slot type material box in correct position, and it is adjusted is at correct position,
S2, slot type material box are in correct position, and the driving of motor 123 holds up transfer module 121 and slot type material box is moved into groove
The lower section of formula hopper feeding positioning component 110, lift cylinder 122 is by slot type material box jack-up and departs from slot type material box feeding positioning component
110, slot type material box is moved to by the driving picking-up transfer module 121 of motor 123 treats material position,
S3, mobile cylinder 133 drive slot type material box loading and unloading handgrip 130 to material position is treated, lifting motor 131 drives slot type
Slot type material box is held up and departs from picking-up transfer module 121 by hopper supporting plate 134, and mobile cylinder 133 drives slot type material box to work
Make position, the driving slot type material box of lifting motor 131 supporting plate 134 declines, and coordinates the driving push rod 142 of push rod motor 141 by membranous disc
It is pushed out to one by one from slot type material box into disk station, after membranous disc is all released, slot type material box loading and unloading handgrip 130 is by dead slot formula material
Case is put on recovery slot type material box conveyer belt 160, reclaims slot type material box conveyer belt 160 and slot type material box is moved into discharging supporting plate
On 161, operator takes slot type material box away,
S4, the conveyance of the first mobile platform 533 driving first take hand component 510 to entering above disk station, Z axis mobile platform
513 driving vacuum cups 511, which are moved down, to be held membranous disc and rises, and the conveyance of the first mobile platform 533 driving first takes hand component
510 remove above station to rim charge, and the driving vacuum cup 511 of Z axis mobile platform 513 is moved down is put into vacuum suction support by membranous disc
On plate 212, photoelectric sensor 213 senses membranous disc, and vacuum inhales supporting plate seat 211 and membranous disc positioning is inhaled into flat, and stepper motor 227 drives
Screw mandrel 225 declines scraper holder assembly 221 and drives blade 2210 to sweep rim charge, and gas blow pipe 224 coordinates with blow head 214,
Rim charge is blown into rim charge disposable box 218,
S5, lift cylinder 521 drive main folder pawl 527 and sub-folder pawl 528 to decline, with membranous disc at grade, material folding gas
Cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 clamps membranous disc, and lift cylinder 521 drives membranous disc to be picked up, the band of rotary cylinder 526
Dynamic main folder pawl 527 turns clockwise 180 °, and membranous disc and sub-folder pawl 528 turn clockwise 180 ° therewith, the band of the second mobile platform 536
Dynamic second conveyance upset takes hand component 520 to be peeled off to chip above station, and membranous disc is put into chip and peels off station by lift cylinder 521
On, material folding cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 unclamps membranous disc, and lift cylinder 521 drives main folder pawl 527 and sub-folder
Pawl 528 is risen, and membranous disc is put into and scraped on chip platform component 310, and the drive of mobile platform component 330 is scraped chip assembly 320 and moved
Above to membranous disc, total lift cylinder 321 drives upper blade 323 and lower coating blade component 325 to decline, the lift cylinder of lower coating blade first
324 and the second lift cylinder of lower coating blade 326 rise simultaneously and drive lower coating blade component 325 to rise, upper blade 323, lower coating blade component
325 are press respectively against the upper and lower surface of film, and upper blade 323 and lower coating blade component 325, which tighten film, peels off chip,
S6, lift cylinder 521 drive main folder pawl 527 and sub-folder pawl 528 to decline, with membranous disc at grade, material folding gas
Cylinder 524 drives main folder pawl 527 and sub-folder pawl 528 clamps membranous disc, and lift cylinder 521 drives membranous disc to be picked up, the band of rotary cylinder 526
Dynamic 180 ° of 527 rotate counterclockwise of main folder pawl, membranous disc and sub-folder pawl 528 180 ° of rotate counterclockwise therewith, the second mobile platform 536 drive
Dynamic second conveyance upset takes hand component 520 to receiving above blank panel station, and material folding cylinder 524 drives main folder pawl 527 and sub-folder pawl 528
Membranous disc is unclamped, lift cylinder 521 drives main folder pawl 527 and sub-folder pawl 528 to rise, membranous disc is placed on lifting supporting plate 402, works as film
When disk stacks rise and senses opposite type sensor 401, motor 406 drives leading screw 408 lifting supporting plate 402 is dropped to penetrating biography
Sensor 401 sense less than position, lifting supporting plate 402 is when dropping to close to bedplate 404, the prompting operation of limit sensors 409
Member takes membranous disc away.
Implement the present invention, have the advantages that：
(1) present invention full-automatic chip stripping machine scrapes chip mechanism, is applicable that area is big, thickness of thin chip is peeled off, logical
Crossing lower coating blade cooperation and tightening film peels off chip, it is to avoid chip is scraped off or damaged, and is effectively protected chip.
(2) the membranous disc multistation conveyance switching mechanism that the present invention is provided, the first conveyance takes hand component and second to transport upset
Take hand component and do not interfere with each other while working, realize membranous disc and entering disk station, rim charge removing station, chip stripping station and receiving empty
The automatic conveyance and upset of disk station, drastically increase operating efficiency.
(3) full-automatic chip stripping machine of the invention, three slot type material boxes for filling membranous disc can be stored simultaneously, dress is realized
The slot type material box automatic charging of membranous disc, submitting is reclaimed in working position membranous disc self-emptying and empty slot type material box automatically.
(4) what the present invention was provided scrapes rim charge mechanism, can effectively remove the rim charge of chip circumference on film, not damage core
Piece.
Described above is the preferred embodiment of the present invention, it should be noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (10)
1. a kind of full-automatic chip stripping machine, it is characterised in that including the slot type material box feed mechanism being arranged in identical platform
(100) rim charge mechanism (200), is scraped, chip mechanism (300) is scraped, receives blank panel mechanism (400) and membranous disc multistation conveyance switching mechanism
(500), the slot type material box feed mechanism (100), scrape rim charge mechanism (200), scrape chip mechanism (300) and receive blank panel mechanism
(400) homonymy that switching mechanism (500) is transported in the membranous disc multistation is arranged side by side successively, wherein,
The slot type material box feed mechanism (100) is used for slot type material box in upper material position, treats material position, working position and go out between material position
Transmitted,
It is described to scrape the rim charge that rim charge mechanism (200) is used to removing and collecting chip circumference,
It is described scrape chip mechanism (300) be used for peel off simultaneously chip on collection membrane,
The receipts blank panel mechanism (400) is used to reclaim empty membranous disc,
The membranous disc multistation conveyance switching mechanism (500) is used to membranous disc entering disk station, rim charge removing station, chip stripping
Conveyance upset is carried out between station and receipts blank panel station.
2. full-automatic chip stripping machine according to claim 1, it is characterised in that the slot type material box feed mechanism
(100) slot type material box feeding positioning component (110), slot type material box conveyance component (120), slot type material box loading and unloading handgrip are included
(130), membranous disc releases component (140), membranous disc crawl discharge component (150) and reclaims slot type material box conveyer belt (160),
The slot type material box feeding positioning component (110), slot type material box conveyance component (120) and membranous disc release component (140) according to
Secondary to be arranged side by side, the slot type material box feeding positioning component (110) is arranged on the recovery slot type material box conveyer belt (160)
Side, the membranous disc releases component (140) and releases membranous disc from slot type material box with membranous disc crawl discharge component (150) cooperation.
3. full-automatic chip stripping machine according to claim 1 or 2, it is characterised in that described to scrape rim charge mechanism (200) bag
Include and scrape rim charge platform assembly (210), scrape rim charge component (220), the rim charge component (220) of scraping is two, two scrapings
Material component (220) is arranged on the adjacent both sides for scraping rim charge platform assembly (210),
The rim charge component (220) of scraping includes scraper holder assembly (221), portable plate (222), followup cam (223), the scraper
Holder assembly (221) and the followup cam (223) are arranged on the portable plate (222).
4. full-automatic chip stripping machine according to claim 3, it is characterised in that the scraper holder assembly (221) includes
Blade (2210), blade bearing, catch (2213), fixed seat (2214), inductor installation sheet (2215), limit position sensor
(2216), the blade (2210) is arranged at below the blade bearing, and the inductor installation sheet (2215) is arranged on described solid
In reservation (2214), the limit position sensor (2216) is fixedly installed in the inductor installation sheet (2215).
5. the full-automatic chip stripping machine according to claim 1 or 4, it is characterised in that described to scrape chip mechanism (300) bag
Include and scrape chip platform component (310), scrape chip assembly (320) and mobile platform component (330), it is described to scrape chip platform component
(310) it is arranged on the chip assembly (320) of scraping on the mobile platform component (330),
It is described scrape chip assembly (320) including lift cylinder, portable plate (322), upper blade (323), lower coating blade component (325),
Supporting plate (327) and balancing weight (328), the lift cylinder and the upper blade (323) are arranged on the portable plate (322)
On, the balancing weight (328) is arranged in the supporting plate (327).
6. full-automatic chip stripping machine according to claim 5, it is characterised in that the lower coating blade component (325) includes
Bearing (3250), roller bearing (3251) and lower coating blade (3252), the roller bearing (3251) are fixedly installed by the bearing (3250)
On tool rest.
7. the full-automatic chip stripping machine according to claim 1 or 6, it is characterised in that receipts blank panel mechanism (400) bag
Include and opposite type sensor (401), lifting supporting plate (402) and guide rod are provided with bedplate (404), the bedplate (404)
(403) linear bearing (405), motor (406), timing belt (407), leading screw (408), are provided with below the bedplate (404)
With limit sensors (409), the opposite type sensor (401) and the guide rod (403) are arranged on the lifting supporting plate (402)
Surrounding.
8. full-automatic chip stripping machine according to claim 7, it is characterised in that the membranous disc multistation transports tipper
Structure (500) includes the first conveyance and takes hand component (510), the second conveyance upset to take hand component (520) and double X-axis motion platforms
(530), it is described first conveyance take hand component (510), it is described second conveyance upset take hand component (520) respectively with described pair of X-axis
Motion platform (530) connects and is arranged on described pair of X-axis motion platform (530) homonymy,
First conveyance takes hand component (510) to include vacuum cup (511) and Z axis mobile platform (513),
The second conveyance upset takes hand component (520) to include cylinder, clamping jaw,
Described pair of X-axis motion platform (530) includes mobile platform, line slide rail (534), photoelectric sensor (535), the movement
Platform is arranged on the line slide rail (534), and the photoelectric sensor (535) is arranged in the line slide rail (534).
9. full-automatic chip stripping machine according to claim 8, it is characterised in that the second conveyance upset takes hand component
(520) lift cylinder (521), linear bearing (522), guide rod (523), rotary cylinder (526), main folder pawl (527) are included, it is described
Lift cylinder (521) is arranged on bottom plate, and the guide rod (523) is fixedly connected by the linear bearing (522) with bottom plate, institute
Rotary cylinder (526) is stated to be connected by bearing with the main folder pawl (527).
10. a kind of method of work of full-automatic chip stripping machine, it is characterised in that comprise the following steps：
S1, the slot type material box for filling membranous disc is placed on slot type material box feeding positioning component (110),
Slot type material box is moved to working position by S2, slot type material box conveyance component (120),
S3, slot type material box loading and unloading handgrip (130) release component (140) cooperation with membranous disc and release membranous disc from slot type material box, film
After disk is all released, reclaim slot type material box conveyer belt (160) and reclaim empty slot type material box,
After membranous disc is moved in discharging track by S4, membranous disc crawl discharge component (150), the first conveyance takes hand component (510) will
Membranous disc is moved to rim charge and removes station, scrapes rim charge mechanism (200) and rim charge on film is swept and collected,
S5, the second conveyance upset take hand component (520) that membranous disc turns clockwise 180 °, and membranous disc is moved into chip stripping work
Position, scrapes chip mechanism (300) and chip on film is peeled off and collected,
S6, the second conveyance upset take hand component (520) by 180 ° of membranous disc rotate counterclockwise, and membranous disc are moved into receipts blank panel work
Position, receives blank panel mechanism (400) and reclaims empty membranous disc.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710413041.7A CN107170699B (en) | 2017-06-05 | 2017-06-05 | A kind of full-automatic chip stripping machine and its working method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710413041.7A CN107170699B (en) | 2017-06-05 | 2017-06-05 | A kind of full-automatic chip stripping machine and its working method |
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| CN107170699A true CN107170699A (en) | 2017-09-15 |
| CN107170699B CN107170699B (en) | 2019-07-16 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137129A (en) * | 2019-05-30 | 2019-08-16 | 湖州靖源信息技术有限公司 | A kind of coring piece machine |
| CN110339951A (en) * | 2019-06-28 | 2019-10-18 | 广东晶科电子股份有限公司 | A kind of centrifuge and its delivery system |
| CN111891731A (en) * | 2020-06-17 | 2020-11-06 | 无锡豪帮高科股份有限公司 | Integrated circuit intelligent manufacturing feeding device |
| CN116544151A (en) * | 2023-07-05 | 2023-08-04 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201285758Y (en) * | 2008-10-20 | 2009-08-05 | 格兰达技术（深圳）有限公司 | Combined baiting apparatus |
| CN201298545Y (en) * | 2008-10-17 | 2009-08-26 | 格兰达技术（深圳）有限公司 | Combined type feeding device of IC strip laser marking machine |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
| CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN106783677A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | A kind of slot type material box automatic charging equipment |
| CN106783676A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | Chip scrapes device on a kind of UV films |
-
2017
- 2017-06-05 CN CN201710413041.7A patent/CN107170699B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201298545Y (en) * | 2008-10-17 | 2009-08-26 | 格兰达技术（深圳）有限公司 | Combined type feeding device of IC strip laser marking machine |
| CN201285758Y (en) * | 2008-10-20 | 2009-08-05 | 格兰达技术（深圳）有限公司 | Combined baiting apparatus |
| CN201522998U (en) * | 2009-11-06 | 2010-07-07 | 华中科技大学 | Chip pickup and overturn device |
| CN103367208A (en) * | 2013-07-02 | 2013-10-23 | 华中科技大学 | Back bonding platform for superchip |
| CN105280536A (en) * | 2015-09-18 | 2016-01-27 | 爱立发自动化设备（上海）有限公司 | Automatic angle-switching taking and putting machine for chips |
| CN106783677A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | A kind of slot type material box automatic charging equipment |
| CN106783676A (en) * | 2016-12-08 | 2017-05-31 | 深圳格兰达智能装备股份有限公司 | Chip scrapes device on a kind of UV films |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110137129A (en) * | 2019-05-30 | 2019-08-16 | 湖州靖源信息技术有限公司 | A kind of coring piece machine |
| CN110137129B (en) * | 2019-05-30 | 2021-04-30 | 上海世禹精密机械有限公司 | Coring machine |
| CN110339951A (en) * | 2019-06-28 | 2019-10-18 | 广东晶科电子股份有限公司 | A kind of centrifuge and its delivery system |
| CN111891731A (en) * | 2020-06-17 | 2020-11-06 | 无锡豪帮高科股份有限公司 | Integrated circuit intelligent manufacturing feeding device |
| CN116544151A (en) * | 2023-07-05 | 2023-08-04 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
| CN116544151B (en) * | 2023-07-05 | 2023-09-19 | 砺铸智能设备(天津)有限公司 | Detection and packaging equipment for chip |
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| CN107170699B (en) | 2019-07-16 |
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