Distributed type minisize data collecting system
Technical field
The present invention relates to Aero-Space test analysis, automotive safety test, Exploding test, Aerospace vehicle test field data
A kind of acquisition system, and in particular to distributed type minisize data collecting system.
Background technology
It is main in Aero-Space test analysis, automotive safety test, Exploding test, vibratory impulse test, Aerospace vehicle test
The running parameter and environmental data of each part of change system are obtained by data collecting system, performance and event for evaluation equipment
Barrier positioning provides foundation.By in equipment preparation, production and regular maintenance to vibration, impact, pressure, strain and temperature etc.
The collection and analysis of data, can provide directly perceived, accurate data for equipment Test with assessing.The reliability of data collecting system
It is the key factor that armament equipment tests success or failure.The current index that test is needed in current equipment Test is a lot, using many
Integrated test system instrument species that kind of instrument is built is various, volume is big, installs inconvenience, it is difficult to improve testing efficiency, with
Continuing to develop for electronic technology to sample towards miniaturization, high accuracy, height with increasingly mature, domestic data collecting system
Rate, Large Copacity, the direction fast development of networking.For the test of Large-Scale Equipment system, generally require more comprehensive, multi-faceted
Test data come system under test (SUT) accurately is described, it is therefore desirable to data acquisition channel quantity is extended.
The content of the invention
The present invention overcomes the shortcomings of that prior art is present, and technical problem to be solved is:A kind of distributed type minisize is provided
Data collecting system, to realize distributed data acquisition and the upload of multichannel.
In order to solve the above-mentioned technical problem, the technical solution adopted by the present invention is:A kind of distributed type minisize data acquisition system
System, including host computer, distributed capture array management module and multiple data acquisitions are stacked, the distributive array management module
It is connected with the host computer, multiple LI(link interface)s, multiple collection link difference is provided with the distributive array management module
It is connected by the LI(link interface) with the distributed capture array management module, each acquisition link route multiple numbers
According to collection stack be formed by connecting by cascade bus, it is same collection link in, each data acquisition stack cascade mode by with
It is set to daisy chain connected mode;Each data acquisition, which is stacked, includes control module and multiple sensor acquisition modules, institute
State after multiple sensor acquisition modules stack gradually connection and be connected with the control module, each sensor acquisition module includes many
The data acquisition channel of road independence, the sensor acquisition module is connected by M-LVDS communication bus with the control module;
2 cascade ports are provided with the control module, 2 cascades port is used for the control module and DBMS up and down
Collection is stacked or the connection of distributed capture array management module, and the control module is used for the multiple sensor acquisition module
Each data acquisition channel realize management, send control instruction, receive and gathered data, data storage and adopted to the sensor
Collect module for power supply.
The distributed capture array management module include communication interface modules, trigger manager, control command generator,
Data link selector, the multiple data sinks connected one to one with multiple LI(link interface)s, data cache controller, data
Cache module;Ethernet interface circuit, usb circuit are additionally provided with the distributed capture array management module and is touched
Send out interface circuit;The communication interface modules is connected by ethernet interface circuit or usb circuit with host computer, described logical
Letter interface module is connected with control command generator, data cache controller;The data link selector is sent out with control command
Raw device, data cache controller and the connection of multiple data sinks;The data cache controller and the data buffer storage mould
Block is connected;The control command generator is connected by trigger manager with triggering interface circuit;The communication interface modules is used
In receiving and parsing through host computer order, and send to control command generator, control command generator is by host computer order
Acquisition instructions write register, and acquisition instructions are sent into corresponding LI(link interface), realization pair by data link selector
The control that collection in correspondence collection link is stacked;Data in the collection stacking transmitted from LI(link interface), pass through data receiver
After device, data link selector, write in data cache module and cached by the data cache controller, and by described
Communication interface modules is uploaded to host computer.
4 LI(link interface)s are provided with the distributive array management module, 4 collection links pass through the link respectively
Interface is connected with the distributed capture array management module, and each acquisition link route 3, which is stated data acquisition and stacked, passes through level
Join bus connection;Each data acquisition, which is stacked, to be included setting on 10 sensor acquisition modules, each sensor acquisition module
It is equipped with 3 data acquisition channels.
The control module includes M-LVDS bus interface circuits, triggering interface circuit, subtending port circuit, voltage conversion
Circuit, data buffer storage unit, FLASH memory cell and FPGA basic modules, the voltage conversion circuit are used for the control
Molding block and sensor acquisition module are powered, and the FPGA basic modules pass through M-LVDS bus interface circuits and the sensing
Device acquisition module is connected, and is connected by triggering interface circuit with external trigger, passes through subtending port circuit and DBMS up and down
Collection is stacked or the connection of distributed capture array management module, and the FPGA basic modules are used to receive external trigger transmission
The data reception command that trigger signal and host computer are sent, and according to being received the starting signal and data reception command
The data of sensor acquisition module collection simultaneously carry out being sent to the data buffer storage unit and FLASH memory cell after data compile frame
Stored.
The FPGA basic modules include M-LVDS transceiver communications administrative unit, external trigger administrative unit, usb communication
Administrative unit, data cache controller, data storage controller, control command generator and arbitration unit, the external trigger
Administrative unit is connected with triggering interface circuit and control command generator, for trigger signal to be transferred into control command
Device, the cascade administrative unit is connected with subtending port circuit and control command generator, for the data for transmitting host computer
Receive and control command generator is sent to after order is parsed, control command generator manages single with M-LVDS transceiver communications
Member connection, for passing through M-LVDS transceiver communications pipes after generating data acquisition command according to trigger signal and data reception command
Reason unit is sent to sensor acquisition module;M-LVDS transceiver communications administrative unit and data cache controller and data storage
Controller is connected, the data for sensor acquisition module to be gathered carry out data compile be sent to after frame data buffer storage unit,
FLASH memory cell is stored, and the arbitration unit is connected with the data cache controller and usb communication administrative unit, is used for
The data that data buffer storage unit and FLASH memory cell are stored are sent to host computer by subtending port.
The sensor acquisition module include interface module, programming amplifying module, program control filtering module, AD conversion module,
Data cache module, M-LVDS interface chips, fpga core controller and voltage transformation module, the interface module and sensor
Connection, for powering and receiving sensor collection signal to the sensor, the signal of sensor collection is through the interface mould
The fpga core controller, the FPGA are transferred to after block, programming amplifying module, program control filtering module, after AD conversion module
Core controller by FIFO by data buffer storage to the data cache module, and after data requesting instructions are received, from FIFO
Data are read in module and control module is transferred to by M-LVDS interface chips;The fpga core controller is used to judge each
The state of individual acquisition channel, and control module is sent to by M-LVDS buses, the fpga core controller is additionally operable to receive
The configuration parameter and acquisition instructions of control module transmission, and to after the programming amplifying module, program control filtering module, AD
The data handling procedure of modular converter is controlled.
The sensor acquisition module is respectively IEPE sensors acquisition module or bridge type magnetic sensor acquisition module;When described
When sensor acquisition module is IEPE sensor acquisition modules, the interface module is IEPE interface modules, the IEPE interfaces
Module is connected with IEPE sensors, for providing constant current to IEPE sensors, and receives the collection signal of IEPE sensors;When
When the sensor acquisition module is bridge type magnetic sensor acquisition module, the interface module is bridge type magnetic sensor interface module, institute
State bridge type magnetic sensor interface module to be connected with bridge type magnetic sensor, for providing voltage drive to bridge type magnetic sensor, and receive bridge
The collection signal of formula sensor.
The programming amplifying module includes instrument amplifier AD8226 and variable gain amplifier AD603, the program control filter
Ripple module includes quadravalence Butterworth filter circuit and the programmable filter based on MAX264;The AD conversion module model
AD7693。
3 sensor interfaces are provided with each sensor acquisition module, each sensor acquisition module bag
3 AD conversion modules are included, the acquisition channel of 3 tunnel independences is formed, the data collecting system includes 10 sensor collection moulds
Block.
The present invention has the advantages that compared with prior art:
1st, distributed type minisize data collecting system of the invention is using distributed, miniaturized design thought, by building daisy chain
Formula data transfer mode, is effectively simplified the physical connection mode between each data acquisition stacking, many with passage, expansible
Property it is strong, using flexible, the features such as reliability is high, single collection is stacked and at most just can be extended to 30 acquisition channels, and single channel is adopted
Sample rate is up to 500kSa/s, and whole distributed type minisize data collecting system at most can be extended to 360 acquisition channels;In addition,
Each data acquisition is stacked to be made up of the additional multiple data acquisition modules of a control module, with independent data acquisition and pipe
Reason ability, by stacked structures reasonable in design, can also improve the shock resistance that single collection is stacked while assurance function
Ability(1000g can be brought up to);
2nd, the present invention is applied to the collection under various adverse circumstances to data such as vibration, impact, pressure, strain and temperature, leads to
Cross and build the number of channels that distributed data acquisition stacks greatly growth data acquisition system, can be applied in adverse circumstances
Inspection and Performance Evaluation to change system;
3rd, distributed type minisize data collecting system of the invention is provided with gigabit ethernet interface and USB3.0 interfaces, can distinguish
It is connected with local host computer and long-range host computer, so that the waveform for carrying out data shows and analyzed and processed;
4th, distributed type minisize data collecting system of the invention can be that Aeronautics and Astronautics and ground equipment system provide reliable quick
Means of testing, can effectively save man power and material, and good control is established to optimize and improving equipment function.
Brief description of the drawings
Fig. 1 is a kind of distributed type minisize data collecting system structured flowchart that the embodiment of the present invention is proposed;
Fig. 2 is the internal structure schematic diagram of individual data collection stacking in the embodiment of the present invention;
Fig. 3 is the contour structures schematic diagram of data acquisition stacking in the embodiment of the present invention;
Fig. 4 is single daisy chain connected mode structured flowchart in the embodiment of the present invention;
Fig. 5 is the structured flowchart of distributed capture array management module in the embodiment of the present invention;
Fig. 6 is the structural representation of the control module of individual data collection stacking in the embodiment of the present invention;
Fig. 7 is the structural representation of the sensor acquisition module of individual data collection stacking in the embodiment of the present invention;
Fig. 8 is complete machine software block diagram in the embodiment of the present invention.
Embodiment
, below will be in the embodiment of the present invention to make the purpose, technical scheme and advantage of the embodiment of the present invention clearer
Technical scheme be clearly and completely described, it is clear that described embodiment be the present invention a part of embodiment, without
It is whole embodiments;Based on the embodiment in the present invention, those of ordinary skill in the art are not before creative work is made
The every other embodiment obtained is put, the scope of protection of the invention is belonged to.
As shown in Fig. 1 ~ Fig. 5, a kind of distributed type minisize data collecting system proposed in the embodiment of the present invention, such as Fig. 1 institutes
Show, the distributed type minisize data collecting system includes host computer 1, distributed capture array management module 2 and 12 data acquisitions
3 are stacked, the distributive array management module 2 is connected with the host computer 1, set in the distributive array management module 2
There are 4 LI(link interface)s, multiple collection links are connected by the LI(link interface) with the distributed capture array management module respectively,
Each acquisition link route 3 data acquisitions stackings and is formed by connecting by cascade bus, in same collection link, each
The cascade mode that data acquisition is stacked is configured as daisy chain connected mode.
As shown in Figures 2 and 3, each data acquisition, which stacks 3, includes control module 31 and the collection of multiple sensors
2 cascade ports 33 are provided with module 32, the control module 31 that the data acquisition is stacked, 2 cascades port 33 is used
In by the control module 31 and the superior and the subordinate data acquisitions stack 3 or distributed capture array management module 2 be connected;Multiple sensings
Device acquisition module 32 is connected after stacking gradually connection with control module 31, and 3 biographies are provided with each sensor acquisition module 32
Include the data acquisition channel of 3 tunnel independences, the sensor collection inside sensor access interface 34, each sensor acquisition module
Module 32 is connected by M-LVDS communication bus with the control module;The control module is used to adopt the multiple sensor
Each data acquisition channel for collecting module realizes management, sends control instruction, receives gathered data, data storage and passed to described
Sensor acquisition module is powered;The quantity of sensor acquisition module can be arranged as required to, on each sensor acquisition module
Sensor interface is provided with, for being connected with sensor.
As shown in figure 3, during the data acquisition in the present invention is stacked, the control module and multiple sensor acquisition modules
After being encapsulated respectively by Embedding Material, individually it is arranged in bumper housing;Multiple sensor acquisition modules heap successively
Stack and be connected with the control module after folded connection, the contact between the bumper housing of the multiple sensor acquisition module is set
M-LVDS communication interfaces and power interface are provided with surface, then in control module and sensor acquisition module in the same of stacking
When, it can also realize circuit connection and configure.
Then distributed type minisize data collecting system of the invention can extend to 360 data acquisition channels.In addition, this hair
In bright distributed type minisize data collecting system, LI(link interface) and data acquisition in distributed capture array management module are stacked
Quantity can also be to be less or more, the quantity of sensor acquisition module during each data acquisition is stacked can also be less
Or it is more, particular number can be configured according to the data channel to be gathered.
When host computer, which is sent, to be instructed, host computer instruction, control command hair are received and parsed through by communication interface management module
Acquisition instructions are write related register group by raw device, and acquisition instructions are sent into specific link by data link selector
Interface, realizes the control stacked to collection;Read the data during collection is stacked one by one using distributed capture array management module
When, data are cached using DDR2 SDRAM, and computer is uploaded to by communication interface management module.The present embodiment
In, multiple collections are stacked using being concatenated together by way of daisy chain distributed capture array management module, is formed and divided
Cloth data collecting system, the module can build 4 daisy chain type data acquisition links, and every collection link can carry 3
Collection is stacked, and can effectively extend the number of channels of acquisition system.
As shown in figure 4, the chrysanthemum connected mode structured flowchart stacked for the data acquisition in single collection link.The present invention
Design is managed collectively and centralized Control using daisy chain connected mode to the stacking of each in data acquisition array.It is this micro-
Cascade port is devised in type data collecting system, the cascade mode of acquisition system is configured to daisy chain connected mode, port
Inside includes data/address bus, controlling bus, status bus and power supply signal etc..In single daisy chain type connected mode, on link
Multilevel device constitute between a closed network, including main equipment and multistage slave unit, adjacent slave unit there are data
Or instruction interaction function, in Transmission system order, acquisition system 1 is as daisy chain proximally by cascade port I receptions
Position machine control instruction, outer triggering signal and supply input signal, by cascade port II be sequentially output it is remote to daisy chain
The collection at end is stacked;When reading data, acquisition system 3 is uploaded data by cascade bus as the distal end of daisy chain step by step
Collection to near-end is stacked, and is achieved in the centralized Control to wall scroll daisy chain.
As shown in figure 5, the distributed capture array management module 2 includes communication interface modules, trigger manager, control
Command generator, data link selector, 4 data sinks connected one to one with 4 LI(link interface)s, data buffer storage control
Device processed(DDR2 controllers), data cache module(DDR2SDRAM);It is additionally provided with the distributed capture array management module
Ethernet interface circuit, usb circuit and triggering interface circuit;The communication interface modules passes through ethernet interface circuit
Or usb circuit is connected with host computer, the communication interface modules connects with control command generator, data cache controller
Connect;The data link selector is connected with control command generator, data cache controller and multiple data sinks;
The data cache controller is connected with the data cache module;The control command generator is by trigger manager with touching
Send out interface circuit connection;The communication interface modules is used to receive and parse through host computer order, and sends to control command generation
Acquisition instructions in host computer order are write register by device, control command generator, and will be adopted by data link selector
Collection instruction is sent to corresponding LI(link interface), realizes the control stacked to the collection in correspondence collection link;Passed from LI(link interface)
Data in defeated collection stacking, after data sink, data link selector, are write by the data cache controller
Cached in data cache module, and host computer is uploaded to by the communication interface modules.
Further, as shown in fig. 6, the control module during the data acquisition is stacked includes M-LVDS EBIs electricity
Road, triggering interface circuit, subtending port circuit, voltage conversion circuit, data buffer storage unit, FLASH memory cell and FPGA
Basic module, the voltage conversion circuit is used to power to the control module and sensor acquisition module, the FPGA bases
Plinth module is connected by M-LVDS bus interface circuits with the sensor acquisition module, is touched by triggering interface circuit with outside
Device connection is sent out, is connected by subtending port circuit with the superior and the subordinate's data acquisition stacking or distributed capture array management module, institute
Stating FPGA basic modules is used to receive the data reception command that the trigger signal and host computer of external trigger transmission are sent, and
Receive the data of the sensor acquisition module collection according to the starting signal and data reception command and carry out data and compile frame
After be sent to the data buffer storage unit and FLASH memory cell is stored.
Further, as shown in fig. 6, the FPGA basic modules include M-LVDS transceiver communications administrative unit, outside
Trigger administrative unit, cascade administrative unit, data cache controller, data storage controller, control command generator and arbitration
Unit, the external trigger administrative unit is connected with triggering interface circuit and control command generator, for trigger signal to be passed
Defeated to arrive control command generator, the cascade administrative unit is connected with subtending port circuit and control command generator, for inciting somebody to action
The data reception command of host computer transmission is sent to control command generator, control command generator and M-LVDS after being parsed
Transceiver communications administrative unit is connected, for passing through M- after generating data acquisition command according to trigger signal and data reception command
LVDS transceiver communications administrative units are sent to sensor acquisition module;M-LVDS transceiver communications administrative unit and data buffer storage
Controller and data storage controller connection, the data for sensor acquisition module to be gathered be sent to after data compile frame
Data buffer storage unit, the storage of FLASH memory cell, the arbitration unit are managed with the data cache controller and usb communication
Unit connect, for by data buffer storage unit and FLASH memory cell storage data by usb communication administrative unit send to
Host computer.
Further, as shown in fig. 7, the sensor acquisition module during the data acquisition is stacked includes interface module, journey
Control amplification module, program control filtering module, AD conversion module, data cache module, M-LVDS interface chips, fpga core controller
And voltage transformation module, the interface module is connected with sensor, adopted for powering and receiving sensor to the sensor
Collect signal, the signal of sensor collection is after the interface module, programming amplifying module, program control filtering module, AD conversion module
After be transferred to the fpga core controller, the fpga core controller is by FIFO by data buffer storage to the data buffer storage
Module, and after data requesting instructions are received, data are read from fifo module and control is transferred to by M-LVDS interface chips
Molding block;The fpga core controller is used for the state for judging each acquisition channel, and is sent to control by M-LVDS buses
Molding block, the fpga core controller is additionally operable to receive the configuration parameter and acquisition instructions of the control module transmission, and
To after the programming amplifying module, program control filtering module, the data handling procedure of AD conversion module is controlled.
Further, the sensor acquisition module is respectively IEPE sensors acquisition module or bridge type magnetic sensor collection mould
Block;When the sensor acquisition module is IEPE sensor acquisition modules, the interface module is IEPE interface modules, described
IEPE interface modules are connected with IEPE sensors, for providing constant current to IEPE sensors, and receive adopting for IEPE sensors
Collect signal;When the sensor acquisition module is bridge type magnetic sensor acquisition module, the interface module connects for bridge type magnetic sensor
Mouth mold block, the bridge type magnetic sensor interface module is connected with bridge type magnetic sensor, for providing voltage drive to bridge type magnetic sensor, with
And receive the collection signal of bridge type magnetic sensor.
Further, the programming amplifying module includes instrument amplifier AD8226 and variable gain amplifier AD603, institute
Stating program control filtering module includes quadravalence Butterworth filter circuit and the programmable filter based on MAX264;The AD conversion module
Model AD7693, data bit width is 16.In order to improve acquisition capacity of the acquisition system to small-signal, make collection signal
Amplitude is consistent with the input range of A/D conversion chips, and enhanced processing is done to collection signal by the way of two-stage is amplified.Using
Instrument amplifier AD8226 and variable gain amplifier AD603 design programme-controlled gain amplifying circuits, by two-stage amplification to signal
Nursed one's health.Program control filtering module is main to carry out program control filtering according to filtering parameter to collection signal.Program control filtering module is main
It is made up of quadravalence Butterworth filter circuit with the programmable filter based on MAX264, the increasing between 0dB ~+62.14dB can be achieved
Benefit adjustment, built-in Butterworth filter cut-off frequency is 40kHz;Can be according to the bandwidth of collected signal to programmable filter
Q values and cut-off frequency are adjusted, and by setting, different working methods can realize different filter functions.In the present invention
The core circuit of program control filtering circuit can be grammed switch capacitive filter MAX264, and programmable function is realized by FPGA.
Further, as shown in figure 8, the distributed type minisize data collecting system of the present embodiment, its host computer Software for Design
Using the systems of Win 7 as development platform, Software for Design uses modular design method, by primary control program, driver, parameter
Configurator and functions of modules program composition.The system be one using hardware as control, the entirety that software, hardware are combined closely,
Specifically include input parameter configuration module, storage parameter configuration module, program control parameter configuration module, calibrating parameters configuration module,
Data acquisition and control module, data storage control module, Data Analysis Services module, waveform display module, data management module,
The parts such as Ethernet interface driving, USB interface driving.Application program main interface design is the region of several functional independences, successively
For work(parameter setting area, status display area, data analysis area, function menu area.
Finally it should be noted that:Various embodiments above is merely illustrative of the technical solution of the present invention, rather than its limitations;To the greatest extent
The present invention is described in detail with reference to foregoing embodiments for pipe, it will be understood by those within the art that:Its according to
The technical scheme described in foregoing embodiments can so be modified, or which part or all technical characteristic are entered
Row equivalent substitution;And these modifications or replacement, the essence of appropriate technical solution is departed from various embodiments of the present invention technology
The scope of scheme.