CN107154382A - Laser lift-off device - Google Patents
Laser lift-off device Download PDFInfo
- Publication number
- CN107154382A CN107154382A CN201710080793.6A CN201710080793A CN107154382A CN 107154382 A CN107154382 A CN 107154382A CN 201710080793 A CN201710080793 A CN 201710080793A CN 107154382 A CN107154382 A CN 107154382A
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- laser lift
- suction
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- 239000000758 substrate Substances 0.000 claims abstract description 64
- 239000000428 dust Substances 0.000 claims abstract description 53
- 238000007664 blowing Methods 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 18
- 230000001678 irradiating effect Effects 0.000 abstract description 6
- 239000007789 gas Substances 0.000 description 12
- 238000004140 cleaning Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000003517 fume Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- High Energy & Nuclear Physics (AREA)
- Laser Beam Processing (AREA)
- Cleaning In General (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Abstract
The present invention relates to the laser lift-off device of the dust produced by can remove in laser lift-off process, above-mentioned laser lift-off device includes：Workbench is there is provided the place for loading aforesaid substrate, can perform laser lift-off to aforesaid substrate；Laser irradiation device, positioned at the upside of above-mentioned workbench, for the part irradiation laser to the aforesaid substrate for being loaded into above-mentioned workbench；And inhalator, it is located at the upside of above-mentioned workbench with separating predetermined distance, for removing by irradiating above-mentioned laser from above-mentioned laser irradiation device to above-mentioned substrate-side come in the dust produced by a part for aforesaid substrate.
Description
Technical field
The present invention relates to the laser lift-off device used in the laser lift-off process of substrate, in more detail, being related to can
Remove the laser lift-off device of produced dust in the laser lift-off process of substrate etc..
Background technology
Recently, with the development of technology, the stability of laser beam and output are improved, and its scope of application is extended to pair
The process that semiconductor substance is processed.Especially, in order to form light emitting diode (LED, Light Emittiing Diode) etc.
Element, carry out the process that is separated using laser beam to the film on substrate, the representational dress for this process
It is set to laser lift-off (LLO, Laser Lift Off) device.
As shown in figure 1, during laser lift-off process is implemented, when irradiating laser to substrate, can produce based on laser
Smog (fume) or particulate (particle) etc..Now produced smog or particulate causes to get dirty inside laser lift-off device
Dye.By this rises the disqualification rate for causing produced semiconductor element, thus this pollution must be inhibited.
The problem of to being polluted by the dust of the smog or particulate produced by during laser lift-off etc. related existing
Technology has No. 10-2012-0071525 (title of invention of KR published patent：The particulate removal device of laser lift-off device,
Hereinafter, referred to as prior art 1) and No. 10-2012-0104956 (title of invention of KR published patent：Laser lift-off is filled
Put, hereinafter referred to as prior art 2) etc..
According to prior art 1, vavuum pump is replaced using Venturi tube, thus solves what life-span of vavuum pump was shortened etc.
Problem, still, four directions is splashed in the dust produced by the locally region of irradiation laser at a terrific speed, and because with excellent
Elegant adhesive force, so that the pollution problem based on dust can not be solved.
According to prior art 2, it is difficult to which a variety of sizes for tackling substrate are made a return journey except dust.That is, only the work of substrate is being placed
The periphery of platform forms blast pipe, therefore, irradiates the distance between region and blast pipe of laser farther out, therefore, is removing irradiation
There is limitation in terms of produced smog or dust during laser.
As described above, according to conventional laser lift-off device, being very difficult to remove the cigarette produced by irradiating during laser
The dust of mist or particulate etc., will increase the disqualification rate of semiconductor element.
The content of the invention
The problem of present invention is used to solve as described above conventional, it is an object of the present invention to provide can remove in laser
The laser lift-off device of dust produced by stripping process.
For realizing that the laser lift-off device of the invention of above-mentioned purpose is characterised by, including：Workbench there is provided for
The place of aforesaid substrate is loaded, there is provided the field for loading (loading) aforesaid substrate can perform laser lift-off to aforesaid substrate
Institute；Laser irradiation device, positioned at the upside of above-mentioned workbench, for being shone to a part for the aforesaid substrate for being loaded into above-mentioned workbench
Penetrate laser；And inhalator, it is located at the upside of above-mentioned workbench with separating predetermined distance, for removing from above-mentioned laser irradiation device
The dust (dust) produced by a part to the above-mentioned laser of above-mentioned substrate-side irradiation in aforesaid substrate.
Wherein, it is a feature of the present invention that above-mentioned inhalator includes the suction module for being used to suck above-mentioned dust, above-mentioned
In suction module, the first suction inlet is formed in the downside of above-mentioned suction module in the way of the upper side towards above-mentioned workbench,
The second suction inlet is formed along the direction parallel with above-mentioned workbench.
And then, it is a feature of the present invention that being formed at above-mentioned first suction inlet of above-mentioned suction module or above-mentioned second suction
Entrance is in gap (slit) form in the way of along side direction length.
Also, it is a feature of the present invention that above-mentioned inhalator includes more than one inhalation group, above-mentioned inhalation group includes two
Above-mentioned suction module more than individual, two above-mentioned suction modules for forming an above-mentioned inhalation group are matched somebody with somebody with being spaced from each other predetermined distance
Put, each above-mentioned second suction inlet of two above-mentioned suction modules is configured with separating predetermined distance in opposite mode.
And then, it is a feature of the present invention that multiple above-mentioned inhalation group continuous arrangements included by above-mentioned inhalator, Duo Geshang
Inhalation group is stated with the side for separating space connection for being spaced apart formation in two above-mentioned suction modules in an above-mentioned inhalation group
Formula is irradiated along side direction continuous arrangement, above-mentioned laser by the above-mentioned space that separates to the upper side of aforesaid substrate.
In addition, it is a feature of the present invention that multiple above-mentioned suction modules can make to above-mentioned first suction inlet or above-mentioned respectively
The inhalation power that second suction inlet sucks above-mentioned dust is different.
Wherein, it is a feature of the present invention that present invention additionally comprises workbench cleaner, above-mentioned workbench cleaner is to separate
The mode of predetermined distance is located at the upside of above-mentioned workbench, above-mentioned after unloading (unloading) aforesaid substrate for removing
The dust that the upper side of workbench is present.
And then, it is a feature of the present invention that above-mentioned workbench cleaner and above-mentioned workbench along with above-mentioned workbench
The parallel direction of upper side produces mutually relative displacement.
And then, blow gas it is a feature of the present invention that being formed with to penetrate for downward side spray in above-mentioned workbench cleaner
(blow-gas) jet, to remove the dust for the upper side for being present in above-mentioned workbench.
In addition, it is a feature of the present invention that above-mentioned jet is in gar shape in the way of from a lateral opposite side length.
And then, it is present in above-mentioned work for suction it is a feature of the present invention that being formed with above-mentioned workbench cleaner
The suction inlet of the dust of the upper side of platform.
In addition, it is a feature of the present invention that above-mentioned suction inlet is in gar shape in the way of from a lateral opposite side length.
In addition, it is a feature of the present invention that above-mentioned jet is formed at the downside of above-mentioned workbench cleaner, with it is above-mentioned
The mode that the upper side of workbench is perpendicular is formed, and above-mentioned suction inlet at least forms two or more, so that more than above-mentioned suction inlet
State symmetrical, upper side inclination predetermined angular of the above-mentioned suction inlet relative to above-mentioned workbench centered on jet.
In addition, it is a feature of the present invention that blowing gas by what the above-mentioned jet of above-mentioned workbench cleaner sprayed
Injection pressure produced in the way of ultrasonic wave (ultra sonic wave) fluctuation change.
The laser lift-off device of the present invention can be in the dust dispersion produced by being performed to substrate in laser lift-off process
And be removed before spreading.Therefore, it can prevent or even suppress process environment to be polluted by dust in laser lift-off device,
Dust is sucked centered on the region for irradiating laser, therefore the substrate of a variety of sizes can be tackled.Therefore, have the effect that,
That is, the productivity ratio of semiconductor element product is favorably improved, the management to laser lift-off device becomes simple.
Brief description of the drawings
Fig. 1 is the figure of the generation for the irradiation and dust for schematically illustrating the laser in laser lift-off process.
Fig. 2 is the partial sectional of a part for the inhalator for the laser lift-off device for schematically illustrating the cutting embodiment of the present invention
Stereogram.
Fig. 3 is the inhalator and its included suction module for the laser lift-off device for schematically illustrating the embodiment of the present invention
Sectional view.
Fig. 4 is the figure of the downside for the inhalator for schematically illustrating the embodiment of the present invention.
Fig. 5 is the stereogram of the workbench cleaner for the laser lift-off device for schematically illustrating the embodiment of the present invention.
Fig. 6 is that the part side of the side of the workbench cleaner for the laser lift-off device for schematically illustrating the embodiment of the present invention is cutd open
View.
Fig. 7 is the figure for the cleaning process for schematically illustrating the laser lift-off device using the embodiment of the present invention.
Embodiment
Hereinafter, by referring to preferred embodiment formed by accompanying drawing, the present invention will be described, so as to more specifically
Ground understands the present invention.
Fig. 1 is the figure of the generation for the irradiation and dust for schematically illustrating the laser in laser lift-off process.Fig. 2 is to schematically illustrate
Cut the partial sectional stereogram of a part for the inhalator of the laser lift-off device of the embodiment of the present invention.Fig. 3 is to schematically illustrate
The sectional view of the inhalator of the laser lift-off device of the embodiment of the present invention and its included suction module.Fig. 4 is briefly to show
Go out the figure of the downside of the inhalator of the embodiment of the present invention.
First, reference picture 2 is to Fig. 4, and the laser lift-off device of the embodiment of the present invention includes workbench, laser irradiation device and suction
Enter device, it is highly preferred that may also include workbench cleaner (stage cleaner).
Workbench 100 provides the place for loading substrate 20 to perform laser lift-off to substrate 20.
Wherein, as shown in figure 1, substrate 20 generally forms flexible print circuit (FPC, Flexible Printed in downside
Circuit) 21, glass (glass) 25 is formed with upside, thin-film component is formed between flexible print circuit 21 and glass 25
23。
Moreover, as shown in figure 3, for that can irradiate laser L to substrate 20, workbench 100 provides the space for placing substrate 20.Dress
Carry and be positioned over the substrate 20 above workbench 100 and fixed, by the way that laser L will be irradiated into the substrate 20 loaded
Partial illumination laser L, thus carry out laser lift-off process.
It is therefore preferred that in order to stably load substrate 20, the area of workbench 100 is more than the area of substrate 20.
Then, the laser irradiation device upside (not shown) positioned at workbench 100.Moreover, to being loaded on workbench 100
The part irradiation laser L of substrate 20.As shown in figure 1, carrying out laser to substrate 20 by the laser L irradiated from laser irradiation device
Peel off.
Wherein it is preferred to, the laser L irradiated from laser irradiation device is PRK (Excimer Laser).
Inhalator 200 is located at the upside of workbench 100 in the way of separating predetermined distance.Moreover, from laser irradiation device to
Laser is irradiated in the side of substrate 20, thus can remove in dust D1, D2 produced by a part for aforesaid substrate 20.
Wherein, as reference, for convenience of description, dust D1, D2 described in this manual is particulate or smog etc.
General name, it will be understood that into fragment or foreign matter for referring to pollute in initiating device etc..
Inhalator 200 includes the suction module 2100,2200 for being used to suck dust D1, D2.Suction module 2100,2200 is wrapped
Include：First suction inlet 2110,2210, above-mentioned suction module is formed in the way of the upper side towards above-mentioned workbench 100
2100th, 2200 downside；And second suction inlet 2120,2220, formed along the direction parallel with workbench 100.
It is further preferred that in order to be sucked by the first suction inlet 2110,2210 and the second suction inlet 2120,2220
Dust D1, D2, the first suction inlet 2110,2210 and the second suction inlet 2120,2220 and vavuum pump (not shown) etc. are connected.
Wherein it is preferred to, the first suction inlet 2110,2210 and the second suction inlet 2120,2220 are in close to rounded form
Pore morphology, but it is highly preferred that as shown in Figures 3 and 4, the first suction inlet 2110,2210 and the second suction inlet 2120,2220 are with edge
The mode for side length is in gar shape.
If irradiating laser L to substrate 20, the dust D1 that disperses will be produced and to substrate 20 or the upper side of workbench 100
The dust D2 of upper splashing.The dust D1 dispersed is mainly inhaled by the second suction inlet 2120,2220 of suction module 2100,2200
Enter.Moreover, being sucked to the dust D2 splashed on the upper side of substrate 20 or workbench 100 by the first suction inlet 2110,2210
And remove.
Above-mentioned dust D1, D2 are schematically illustrated in figure by the first suction inlet 2110,2210 and the second suction inlet 2120,2220
The mobile route of suction.
It is further preferred that as shown in figure 3, the first suction inlet 2110,2210 and the second suction inlet 2120,2220 with by
Nearly inner side is tapered (taper).I.e., it is preferable that so that the first suction inlet 2110,2210 or the second suction inlet 2120,2220
Attenuate further away from the narrower mode of the width of workbench 100.
Wherein, two suction modules 2100,2200 constitute an inhalation group (crew) 2000, and inhalator 200 includes one
Inhalation group as described above 2000 above.
For instance, it is preferred that as shown in Figures 2 to 4, forming two suction modules 2100,2200 of an inhalation group 2000
The configuration of the ground of predetermined distance 2050 is spaced from each other, each second suction inlet 2120,2220 of two suction modules 2100,2200 is with phase
To mode separate the ground of predetermined distance 2050 configuration.
Wherein it is preferred to, as shown in Figures 2 to 4, the continuous arrangement of multiple inhalation groups 2000 included by inhalator 200 is more
Individual inhalation group 2000 separates sky with what being separated between two suction modules 2100,2200 in an inhalation group 2000 to be formed
Between 2050 modes being connected along side direction continuous arrangement.In that case it is preferable that irradiated from laser irradiation device
Laser L is irradiated by separating space 2050 to the upper side of substrate 20.
Wherein, to substrate 20 irradiate laser L can relative to substrate 20 upper side vertical irradiation, but also as shown in figure 3,
Also can by laser L incident angle and real estate formation acute angle in the way of oblique illumination.It is preferred that to make to incline
The laser L of oblique illumination is not drawn into device 200 and blocked, and is also formed in the laser L parts passed through and separates space 2055.
And, although the inhalation power of each suction module 2100,2200 can be identical, but it is also possible to preferably sucks each
The inhalation power of module 2100,2200 is different.I.e., it is preferable that make suction module 2100 close to irradiation laser L part,
2200 inhalation power is big, makes the inhalation power for being located at the suction module 2100,2200 that how much there is distance from irradiation laser L part
It is small.
Moreover, inhalator 200 and workbench 100 produce mutually relative displacement.For example, laser irradiation device and inhalator 200
It is in a fixed position, the workbench 100 for loading substrate 20 is moved in parallel from a lateral opposite side.As described above, can be in substrate 20
Change laser L during together being moved in parallel with workbench 100 from a lateral opposite side to the position irradiated on substrate 20,
Inhalator 200 is inhalable and removes dust D1, D2 produced by irradiation laser L position.
Then, reference picture 5 is illustrated to Fig. 6 to workbench cleaner.
Fig. 5 is the stereogram of the workbench cleaner for the laser lift-off device for schematically illustrating the embodiment of the present invention.Fig. 6 is letter
The partially cut-away side view of the side of the workbench cleaner of the laser lift-off device of the embodiment of the present invention is shown.
As shown in Figure 5 to Figure 6, workbench cleaner 300 is located at the upper of workbench 100 in the way of separating predetermined distance
Side.Moreover, for removing the dust in the upper side presence of the workbench 100 in the state of carried base board 20 is unloaded.Certainly,
In the state of workbench 100 can be loaded into being in substrate 20 using workbench cleaner 300 remove be present in workbench 100 or
The dust of the upside of substrate 20.
Wherein, workbench cleaner 300 and workbench 100 are mutual along the direction parallel with the upper side of workbench 100
Produce relative displacement.
That is, by moving workbench 100 or moving workbench cleaner 300, relative displacement is produced mutually.Example
Such as, in the case of being fixed in the position of workbench cleaner 300, it can be moved by workbench 100 from a lateral opposite side, to make
Workbench cleaner 300 is cleaned to the upper side of workbench 100.
It is formed with workbench cleaner 300 and the jet 3110 for blowing gas is penetrated for downward side spray, removes presence
In the dust of the upper side of workbench 100.
It is further preferred that being formed with the ash for being present in the upper side of workbench 100 for sucking in workbench cleaner 300
The suction inlet of dirt.
Gas is blowed by means of what the jet 3110 of workbench cleaner 300 sprayed, and dust etc. can be from workbench 100
Upper side or the upper side etc. of substrate 20 depart from.As shown in fig. 6, dust departed from the manner etc. passes through work
The suction inlet 3120,3130 of platform cleaner 300 is sucked, thus, and dust etc. is removed in laser lift-off device.
Preferably, the injection pressure of gas is blowed with ultrasound by what the jet 3110 of workbench cleaner 300 sprayed
The mode of ripple produces fluctuation change.Blowing gas can be sprayed by jet 3110 by prescribed strength, if but being blowed in injection
The vibration (vibration) of ultrasonic wave typically is given during gas, then the upper side that can make to be attached to workbench 100 or substrate 20
The dust of upper side preferably comes off, thus preferably.
It is further preferred that the rounded form of jet 3110 of workbench cleaner 300, with long from a lateral opposite side
Mode be in gar shape it is also preferred that.
It is identical with jet 3110, it is preferable that the suction inlet 3120 of workbench cleaner 300,3130 rounded forms, with
From the mode of a lateral opposite side length be in gar shape it is also preferred that.
Irradiate laser L part close to it is circular a bit, if but suction inlet 3120,3130 and jet 3110 with gap
The mode of form length is formed, then with when swept the floor with the besom of in-line face when formed face it is identical, by spray and suck come to work
The upper side of the upper side or substrate 20 of making platform 100 removes dust, thus preferably.
It is further preferred that jet 3110 is formed at the downside of workbench cleaner 300, with the upside with workbench 100
The perpendicular mode in face is formed, as shown in fig. 6, suction inlet 3120,3130 at least forms two or more, so that above-mentioned suction inlet
3120th, 3130 is symmetrical centered on jet 3110.As shown in Figure 6, it is preferable that suction inlet 3120,3130 is formed at injection
The back and forth or left and right of mouth 3110.
Wherein, it is further preferred that suction inlet 3120,3130 tilts predetermined angular relative to the upper side of workbench 100.It is excellent
Selection of land, if suction inlet 3120,3130 tilts predetermined angular, and makes to blow gas direction and workbench from what jet 3110 sprayed
The part that 100 upper side or the upper side of substrate 20 are in contact, then can make when the upper side for blowing gas contact workbench 100
Or substrate 20 upper side when depart from dust be directly inhaled into mouth 3120,3130 suction.
Reference V1 and V2 in Fig. 6 are the dotted line for the central shaft for showing each suction inlet 3120,3130, show suction
Mouth tilts predetermined angular and formed, and Fig. 6 is schematically illustrated and blowed gas direction and substrate 20 or workbench from what jet 3110 sprayed
The part that 100 upper side is in contact.
As reference, V1 gradient and V2 gradient are different, this it is also preferred that.
Reference picture 7, illustrates the dust minimizing technology using laser lift-off device as described above.
Fig. 7 is the figure for the cleaning process for schematically illustrating the laser lift-off device using the embodiment of the present invention.
Reference picture 7, first, is cleaned by workbench cleaner 300 to the upper side of workbench 100.Wherein, as schemed
Shown in 7 (a) part, the upper side of workbench 100 is in the state before loading substrate 20, before substrate 20 is loaded, is
Neatly the upper side of cleaning platform 100, passes through the upper side of the cleaning platform 100 of workbench cleaner 300.
Then, as shown in Fig. 7 (b) part, the substrate 20 for carrying out laser lift-off is loaded to the upper side of workbench 100.
Moreover, cleaning the substrate 20 loaded to the upper side of workbench 100 by workbench cleaner 300.
Blow gas from what the jet 3110 of workbench cleaner 300 sprayed and there may be present in the upside of substrate 20
The dust in face is together absorbed by suction inlet 3120,3130, so as to form cleaning.
Then, as shown in Fig. 7 (c) part, removed using inhalator 200 to the base cleaned by workbench cleaner
Plate 20 irradiates laser come dust produced during implementing laser lift-off.
Dust also can fully be removed by the above method, it is, however, preferable that also performing two following steps.
As shown in Fig. 7 (d) part, it is preferable that cleaned by workbench cleaner 300 and complete the substrate that laser irradiates
20。
Afterwards, as shown in Fig. 7 (e) part, the base cleaned in unloading by inhalator 200 or workbench cleaner 300
After plate 20, pass through the cleaning platform 100 of workbench cleaner 300.That is, can receive next under cleaner environment
The mode of the substrate 20 of cis-position passes through the cleaning platform 100 of workbench cleaner 300.
As described above, the present invention laser lift-off device can to substrate perform laser lift-off process in produced by
It is removed before dust dispersion and diffusion.Therefore, it can prevent or even suppress process environment in laser lift-off device by ash
The pollution of dirt, sucks dust, therefore can tackle the substrate of a variety of sizes centered on the region for irradiating laser.Therefore, have
Following effect, i.e. be favorably improved the productivity ratio of semiconductor element product, the management to laser lift-off device becomes simple.
As described above, specifically illustrating the present invention referring to the drawings, above-described embodiment only passes through the preferred embodiments of the present invention
It is illustrated, therefore, the invention is not limited in above-described embodiment, scope is claimed in invention of the invention should be by invention
Scope and its equivalents are claimed to understand.
Claims (14)
1. a kind of laser lift-off device, it is characterised in that including：
Workbench is there is provided the place for loading substrate, can perform laser lift-off to aforesaid substrate；
Laser irradiation device, positioned at the upside of above-mentioned workbench, for the part to the aforesaid substrate for being loaded into above-mentioned workbench
Irradiate laser；And
Inhalator, is located at the upside of above-mentioned workbench with separating predetermined distance, for removing from above-mentioned laser irradiation device to above-mentioned
Substrate-side irradiates the dust of above-mentioned laser and the part generation in aforesaid substrate.
2. laser lift-off device according to claim 1, it is characterised in that
Above-mentioned inhalator includes the suction module for being used to suck above-mentioned dust,
In above-mentioned suction module, the is formed in the downside of above-mentioned suction module in the way of the upper side towards above-mentioned workbench
One suction inlet, the second suction inlet is formed along the direction parallel with above-mentioned workbench.
3. laser lift-off device according to claim 2, it is characterised in that be formed at above-mentioned the first of above-mentioned suction module
Suction inlet or above-mentioned second suction inlet are in gar shape in the way of along side direction length.
4. laser lift-off device according to claim 2, it is characterised in that
Above-mentioned inhalator includes more than one inhalation group, and above-mentioned inhalation group includes more than two above-mentioned suction modules,
Two above-mentioned suction modules for forming an above-mentioned inhalation group are configured with being spaced from each other predetermined distance, two above-mentioned suction moulds
Each above-mentioned second suction inlet of block is configured with separating predetermined distance in opposite mode.
5. laser lift-off device according to claim 4, it is characterised in that
Multiple above-mentioned inhalation group continuous arrangements included by above-mentioned inhalator,
Multiple above-mentioned inhalation groups are so that two above-mentioned suction modules in an above-mentioned inhalation group are spaced apart separating of being formed
Space connection mode along side direction continuous arrangement,
Above-mentioned laser is irradiated by the above-mentioned space that separates to the upper side of aforesaid substrate.
6. laser lift-off device according to claim 5, it is characterised in that multiple above-mentioned suction modules be able to make to
The inhalation power that above-mentioned first suction inlet or above-mentioned second suction inlet suck above-mentioned dust is different.
7. laser lift-off device according to claim 1, it is characterised in that also including workbench cleaner, above-mentioned work
Platform cleaner is located at the upside of above-mentioned workbench in the way of separating predetermined distance, for removing after unloading aforesaid substrate
State the dust that the upper side of workbench is present.
8. laser lift-off device according to claim 7, it is characterised in that above-mentioned workbench cleaner and above-mentioned workbench
Relative displacement is produced mutually along the direction parallel with the upper side of above-mentioned workbench.
9. laser lift-off device according to claim 7, it is characterised in that being formed with above-mentioned workbench cleaner is used for
Downward side spray penetrates the jet for blowing gas, to remove the dust for the upper side for being present in above-mentioned workbench.
10. laser lift-off device according to claim 9, it is characterised in that above-mentioned jet is with from a lateral opposite side
Long mode is in gar shape.
11. laser lift-off device according to claim 9, it is characterised in that be formed with use in above-mentioned workbench cleaner
It is present in the suction inlet of the dust of above-mentioned workbench upper side in suction.
12. laser lift-off device according to claim 11, it is characterised in that above-mentioned suction inlet is with from a lateral opposite side
Long mode is in gar shape.
13. laser lift-off device according to claim 11, it is characterised in that
Above-mentioned jet is formed at the downside of above-mentioned workbench cleaner, in the mode perpendicular with the upper side of above-mentioned workbench
Formed,
Above-mentioned suction inlet at least forms two or more, so that above-mentioned suction inlet is symmetrical centered on above-mentioned jet,
Above-mentioned suction inlet tilts predetermined angular relative to the upper side of above-mentioned workbench.
14. laser lift-off device according to claim 13, it is characterised in that pass through the above-mentioned of above-mentioned workbench cleaner
The injection pressure for blowing gas of jet injection produces fluctuation change in the way of ultrasonic wave.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160025816A KR101900283B1 (en) | 2016-03-03 | 2016-03-03 | Dust Remove Equipment for Laser Lift Off Process |
| KR10-2016-0025816 | 2016-03-03 |
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| CN107154382A true CN107154382A (en) | 2017-09-12 |
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| CN201710080793.6A Pending CN107154382A (en) | 2016-03-03 | 2017-02-15 | Laser lift-off device |
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| KR102454256B1 (en) | 2018-02-22 | 2022-10-17 | 삼성디스플레이 주식회사 | Substrate cutting device |
| KR102679073B1 (en) | 2018-09-11 | 2024-07-02 | 삼성디스플레이 주식회사 | Laser ablation apparatus and method of manufacturing display device |
| CN111185667B (en) * | 2020-01-21 | 2022-04-29 | 上海精测半导体技术有限公司 | Pumping device and laser cutting device |
| KR102214104B1 (en) * | 2020-12-03 | 2021-02-09 | 주식회사 아성 | Mask frame surface treatment method using laser cleaning |
| CN113798865B (en) * | 2021-08-25 | 2023-12-22 | 新疆钢之盛建筑科技有限公司 | Numerical control cutting machine for high-precision batch production |
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Also Published As
| Publication number | Publication date |
|---|---|
| KR101900283B1 (en) | 2018-11-05 |
| KR20170104046A (en) | 2017-09-14 |
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