CN107129137A - The cutting-off method of glass substrate and the manufacture method of glass substrate - Google Patents
The cutting-off method of glass substrate and the manufacture method of glass substrate Download PDFInfo
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- CN107129137A CN107129137A CN201710173236.9A CN201710173236A CN107129137A CN 107129137 A CN107129137 A CN 107129137A CN 201710173236 A CN201710173236 A CN 201710173236A CN 107129137 A CN107129137 A CN 107129137A
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- glass substrate
- laser
- cutting
- glass
- irradiation area
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
- C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Laser Beam Processing (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of cutting-off method of glass substrate and the manufacture method of glass substrate.The cutting-off method of the glass substrate irradiates laser and is cut off glass substrate along cut-out preset lines, it is characterized in that, make the irradiation area of the laser of the table surface irradiation laser comprising the side to glass substrate, the region of a part for the width orthogonal with cut-out preset lines of glass substrate is bent on the width of glass substrate, in the irradiation area of laser, from the surface of a side of glass substrate, the laser irradiating part untill the surface of the opposing party is heated to more than the temperature of gasification, cut-out preset lines of the irradiation area of laser along glass substrate are made relatively to be moved relative to glass substrate.
Description
The application is that International Application Serial No. PCT/JP2014/061849 entered National Phase in China, Shen on October 28th, 2015
Please number for 201480024048.4, the application of entitled " cutting-off method of glass substrate and the manufacture method of glass substrate "
Divisional application.
Technical field
The present invention relates to the manufacture method of the cutting-off method of glass substrate and glass substrate.
Background technology
As the cutting-off method of glass substrate, the cutting-off method using laser have studied.
For example patent document 1 discloses it is a kind of by irradiate laser and the notch recesses of newly formed defined depth it
Using compressed gas etc. force the cutting-off method of the glass substrate of cooling afterwards.
Moreover, Patent Document 2 discloses a kind of cutting-off method of glass substrate, being scanned to glass substrate and irradiating sharp
Light, makes glass melting in the irradiation part of laser, blows winged using gas is aided in by the glass of melting.
【Citation】
【Patent document】
【Patent document 1】Japanese Laid-Open 2004-059328 publications
【Patent document 2】The clear 60-251138 publications of Japanese Laid-Open
The content of the invention
【The invention problem to be solved】
However, the cutting-off method for the glass substrate recorded according to patent document 1, comprising by cutting off surface irradiation laser to it
Formed by part corresponding to notch recesses and the part that is formed in the bottom of notch recesses when having carried out forcing cooling afterwards,
Both surfaces characteristic are different.
In the case of there is the different part of surface characteristic using cutting-off method as cause so in section, for shape
Section is ground into product, it is necessary to be formed as the homogeneous section of surface characteristic.Accordingly, with respect to the grinding of section
Process needs the time.
Moreover, being needed after laser has just been irradiated to glass substrate injection compressed gas (auxiliary gas), therefore exist
The easy displacement in position of glass substrate and the situation for cutting off precise decreasing.
The cutting-off method for the glass substrate recorded according to patent document 2, the glass substrate due to the pressure for aiding in gas
Position is subjected to displacement, the problem of precision when there is cut-out reduces so sometimes.Moreover, according to the energy density of laser not
Together, the heat distortion amount that there is a situation where local glass increases and glass substrate produces cracking.In addition, by aiding in gas to remove
Melting glass attachment, section or its periphery are freezed solidly on, therefore in order to be removed and grinding step needs the time.
The present invention in view of the problem of above-mentioned prior art, its object is to provide it is a kind of with it is above-mentioned auxiliary to glass substrate injection
Help the cutting-off method of the conventional glass substrate of gas to compare, cutting off processing accurately can be carried out to glass substrate, suppress
The generation of the cracking of glass substrate, obtain homogeneous section glass substrate cutting-off method.
【Scheme for solving problem】
In order to solve above-mentioned problem, the present invention provides a kind of cutting-off method of glass substrate, irradiate laser and along cut-out
Preset lines cut off glass substrate, it is characterised in that the surface comprising the side to the glass substrate is irradiated the laser
Laser irradiation area, described glass substrate with the region of a part for the orthogonal width of cut-out preset lines in institute
State and bent on the width of glass substrate, in the laser-irradiated domain, from the table of a side of the glass substrate
Laser irradiating part of the face untill the surface of the opposing party is heated to more than the temperature of gasification, make the irradiation area of the laser along
The cut-out preset lines of the glass substrate are relatively moved relative to the glass substrate.
【Invention effect】
According to the cutting-off method of the glass substrate of the present invention, the cut-out with the conventional glass substrate for having used auxiliary gas
Method is compared, and accurately can carry out cutting off processing to glass substrate.Moreover, can suppress to glass substrate in cut-out
The generation of cracking, can be formed as homogeneous section.
Brief description of the drawings
Fig. 1 is the explanation figure of the cutting-off method of the glass substrate of embodiments of the present invention.
Fig. 2A is to the laser oscillation apparatus and glass substrate when laser is irradiated in surface comprising irregular glass substrate
The distance between the surface of a side explanation figure.
Fig. 2 B are to the laser oscillation apparatus and glass substrate when laser is irradiated in surface comprising irregular glass substrate
The distance between the surface of a side explanation figure.
Fig. 3 is the explanation figure of the configuration example for the transport roller for possessing supporting member.
Fig. 4 is that the transport roller that will be provided with supporting member configures the explanation of configuration example in the transport path of glass substrate
Figure.
Fig. 5 is that the transport roller that will be provided with supporting member configures the explanation of configuration example in the transport path of glass substrate
Figure.
Fig. 6 is the explanation figure of the configuration example of the transport roller of the region bends of a part for the width for making glass substrate.
Fig. 7 is the explanation figure of the heating process in the cutting-off method of the glass substrate of embodiments of the present invention.
Fig. 8 is the explanation figure of the refrigerating work procedure in the cutting-off method of the glass substrate of embodiments of the present invention.
Fig. 9 is on the precipitate in refrigerating work procedure in the cutting-off method of the glass substrate of embodiments of the present invention
Illustrate figure.
Figure 10 is the transporting velocity of glass substrate and the energy density of laser of the experimental example 1 of the present invention and commenting for section
The explanation figure of the relation of valency.
Figure 11 is the transporting velocity of glass substrate and the energy density of laser of the experimental example 2 of the present invention and commenting for section
The explanation figure of the relation of valency.
Figure 12 is the transporting velocity of glass substrate and the energy density of laser of the experimental example 3 of the present invention and commenting for section
The explanation figure of the relation of valency.
Figure 13 is the transporting velocity of glass substrate and the energy density of laser of the experimental example 4 of the present invention and commenting for section
The explanation figure of the relation of valency.
Figure 14 is the explanation figure of other methods of the region bends of a part for the width for making glass substrate.
【Label declaration】
11 glass substrates
12 laser
33 supporting members
40 holding members
71 laser irradiating parts
The periphery of 72 laser irradiating parts
81st, 82 precipitate
Embodiment
Hereinafter, referring to the drawings, the mode for implementing the present invention is illustrated, but the present invention is not by embodiment disclosed below
Limitation, does not depart from the scope of the present invention and can apply various modifications and displacement to embodiment disclosed below.
In the present embodiment, the configuration example for the cutting-off method of the glass substrate of the present invention is illustrated.
The cutting-off method of the glass substrate of present embodiment is to irradiate laser and cut glass substrate along cut-out preset lines
The cutting-off method of disconnected glass substrate, with following structure.
Make comprising to glass substrate a side table surface irradiation laser laser it is irradiation area, glass substrate with cutting
The region of a part for the orthogonal width of disconnected preset lines (following, to be also recited as " width of glass substrate ") is in glass
Bent on the width of substrate.
Also, in the irradiation area of laser, the laser on the surface from a side to the surface of the opposing party of glass substrate shines
The portion of penetrating is heated to more than the temperature of gasification.
In addition, being the cutting-off method of the glass substrate with following feature：Make the irradiation area of laser along glass substrate
Cut-out preset lines and relatively moved relative to glass substrate.
Using Fig. 1~Fig. 8, specifically illustrate.
Fig. 1 is schematically shown from the glass substrate upper surface of irradiation laser side (face side of a side) by this
The glass substrate cutting-off method of invention glass substrate is cut off in place of structure.
Glass substrate 11 is handled upside down along the direction in Fig. 1 shown in arrow A, vibrates from laser oscillation apparatus (not shown)
The part (laser-irradiated domain) irradiated of laser 12 can be moved along the cut-out preset lines 13 on glass substrate.
Also, in the cutting-off method of the glass substrate of present embodiment, make the glass base of the irradiation area comprising laser
The region of a part for the width orthogonal with cut-out preset lines of plate is bent on the width of glass substrate.On this
A bit, it is described below.
Relatively thin in the thickness of slab of glass substrate, in the case that especially glass substrate is handled upside down, glass substrate is produced sometimes
Fold.When producing fold in glass substrate, the surface of glass substrate includes bumps.Also, it is irregular being included to surface
When glass substrate irradiates laser, laser is irradiated to the convex portion 22 for the glass substrate 11 being handled upside down in transport roller 21 as shown in Figure 2 A
In the case of, turn between the surface of a side of laser oscillation apparatus 23 and glass substrate 11 apart from D1.In contrast, such as Fig. 2 B
It is shown, in the case of irradiating laser to the recess 24 for the glass substrate 11 being handled upside down in transport roller 21, laser oscillation apparatus 23
Position do not change, it is therefore longer than apart from D1 between the surface of a side of laser oscillation apparatus 23 and glass substrate 11, as away from
From D2.So, due to the bumps of glass baseplate surface and between the surface of a side of laser oscillation apparatus and glass substrate away from
From change, suitably glass substrate can not be heated by laser sometimes.
In contrast, make the width orthogonal with cut-out preset lines of the glass substrate of the irradiation area comprising laser
The region bends of a part, thus part at least for the bending of glass substrate can suppress to produce fold in glass substrate
Situation.Therefore, in laser-irradiated domain, surface and the laser of the light source as laser of a side of glass substrate 11 can be made
The distance between oscillation device is stable, can suitably be heated along the cut-out preset lines of glass substrate.Further, it is possible to high
Cutting off processing is carried out to precision to glass substrate, homogeneous section can be formed as.
Make comprising to glass substrate 11 a side table surface irradiation laser 12 laser it is irradiation area, glass substrate
The method that the region of a part for the width orthogonal with cut-out preset lines is bent on the width of glass substrate does not have
It is particularly limited to.It should be noted that on the width of glass substrate bending could also say that make with carrying direction it is vertical
The section of glass substrate is upward or lower section is bent.
Here, the method on making the region of a part for above-mentioned glass substrate be bent on the width of glass substrate
Configuration example, illustrated using Fig. 3~Fig. 6 and Figure 14.Fig. 3 shows the configuration example for possessing the transport roller 32 of supporting member 33.
Fig. 4, Fig. 5 are schematically shown shown in Fig. 3 from the glass substrate upper surface of irradiation laser side (face side of a side)
The transport roller 32 for possessing supporting member 33 configure the structure of the configuration example in the transport path of glass substrate.
The method bent as the region for the part for making glass substrate on the width of glass substrate, can enumerate with
Make the region of a part of the width of the glass substrate of the irradiation area comprising laser from other parts of glass substrate
Region protrude mode, using supporting member from the method for the face side support glass substrate of the opposing party of glass substrate.
As shown in figure 3, when the part configuration supporting member 33 of the width in transport roller 32, the branch can be utilized
Bearing member 33, so that the surface in the region 31 of a part for glass substrate is raised than the region 34 of other parts of glass substrate
Mode, supported from the lower face side (surface side of the opposing party) of glass substrate.
Also, as shown in figure 4, it can will configure the glass substrate being handled upside down in the direction along along figure shown in block shape arrow A
Transport path on multiple transport rollers 32 at least one of transport roller 32 be set to possess supporting member 33 as described above
Transport roller 32.By so constituting transport roller, make the width of glass substrate in the scope shown in region 41 that can be in Fig. 4
The region bends of the part in direction.That is, the section of the glass substrate vertical with carrying direction can be made to bend upward.Need
Illustrate now, option and installment can possess in the way of making the irradiation area of laser 12 at least in above-mentioned zone 41
The position of the transport roller of above-mentioned supporting member 33.
In fig. 4 it is shown that being only provided with the example of supporting member 33 in the end side of a side of the width of transport roller 32
Son, but it is not defined to aforesaid way.According to the quantity of the cut-out preset lines 13 of glass substrate, can glass substrate width
Multiple positions in direction set supporting member 33.For example in the situation for cutting off the both ends of the width of glass substrate
Under, the end side on the opposing party of the width of transport roller 32 can also set supporting member 33.
It should be noted that the structure of the supporting member 33 on being formed in transport roller 32 is not particularly limited.Such as Fig. 4 institutes
Show, in the case where forming supporting member 33 according to each transport roller 32, for example, match somebody with somebody as supporting member 33 in transport roller 32
O-ring etc. is put, thus a region on the width on the surface of transport roller 32 can form the convex portion of ring-type.Moreover,
It can not set, and be passed by the banding guiding elements being wound around between multiple transport rollers as shown in Figure 5 according to each transport roller 32
Send and bring composition supporting member 33.In this case, in scope in Figure 5 shown in region 41, glass substrate 11 can also be made
The region bends with a part for the orthogonal width of cut-out preset lines.That is, the glass vertical with carrying direction can be made
The section of substrate is bent upward.
Its structure is not particularly limited supporting member as described above, it is preferred that as shown in figure 5, by being wound around multiple remove
The banding guiding elements between roller is transported to constitute supporting member.Because, guide structure in the banding by being hung between transport roller
Part, also can be by the supporting member from the surface side supporting glass of the opposing party between transport roller come in the case of constituting supporting member
Substrate, can equably keep the shape of the part of the bending of glass substrate, can further suppress the generation of fold.
Height H on the supporting member 33 shown in Fig. 3 is not particularly limited, can be according to the plate of the glass substrate of cut-out
Thickness etc. is arbitrarily selected.
Moreover, the shape on the face connected with glass substrate of supporting member 33 is not particularly limited, can be such as Fig. 3 institutes
Flat shape is shown as, furthermore, it is also possible to be the shape bent on the width of transport roller.
It is used as the others of the region bends of a part for the width orthogonal with cut-out preset lines for making glass substrate
Method, can enumerate the transport roller 32 of the method for example shown in Fig. 6, the i.e. part on laser-irradiated domain periphery by with diameter ratio
The transport roller 32 of the thin part 61 in other parts is constituted.
So, by setting the diameter part 61 thinner than other parts in transport roller 32, so that in transport roller 32
Surface forms recess (concave).Therefore, in the recess, glass substrate flexure, as shown in fig. 6, in diameter than other parts
Thin part 61 near the boundary of other parts with that also can bend glass substrate 11.That is, can make and carry direction hang down
The section of straight glass substrate is bent downwards.
Make the one of the width orthogonal with cut-out preset lines of glass substrate as the shape independent of transport roller
The method of partial region bends, can enumerate the method for example shown in Figure 14, even if being protected by the holding member such as transport roller or platform 40
A part of region for the glass substrate 11 held is exposed from holding member 40, and a part of region is scratched using deadweight
It is bent and bend.It should be noted that when holding member 40 is platform, making at least one in glass substrate 11 and laser oscillation apparatus
Fang Yidong, cutting off processing is carried out to glass substrate 11.
Make the region of a part for the width of the glass substrate of the irradiation area comprising laser 12 as described above
During bending, the irradiation area of laser 12 is preferably configured in the chamfered portion in the part of the bending of glass substrate.So, such as scheming
3rd, the chamfered portion of the glass substrate of the bending shown in Fig. 6 and Figure 14, from the surface of the opposing party (lower surface) side bearing glass
Gap is produced between the transport roller 32 of substrate, supporting member 33 or holding member 40 and glass substrate 11.Therefore, in irradiation laser
When, the heated situations such as transport roller 32, supporting member 33 can be suppressed, the damage of the grade of transport roller 32 can be suppressed.
The incident angle relative to glass substrate of laser 12 is not particularly limited.Such as in the figure of Fig. 3, Fig. 6, Figure 14 institute
Show, laser 12 can be the area of other parts of the glass substrate in such as Fig. 3 with the unbent region with glass substrate
The mode that the glass baseplate surface in domain 34 is substantially vertical is irradiated.Furthermore, it is also possible to according to the glass of the irradiation area of laser 12
The angle of laser 12 is irradiated at the inclination angle of glass substrate to adjust.That is, can also be in the irradiation area of laser so that glass substrate
The 11 surface mode substantially vertical with laser 12 irradiates laser 12 to glass substrate 11.
Moreover, in the context of fig. 3, glass substrate is parabolically bent to shape, therefore oblique in the part of the bending
Face right side and left side in figure in figure are produced.Accordingly it is also possible to which into figure, the inclined-plane irradiation in left side swashs as shown in arrow 12 '
Light.
But, in the case of having multiple inclined-planes in the part of the bending of glass substrate, supporting member 33 is preferably with as follows
Mode support glass substrate：The one of width protruded in the region of other parts from glass substrate, glass substrate
The irradiation area of laser is configured on the inclined-plane of the end side of the width of in partial region, glass substrate.That is, laser
Irradiation area is preferably in the inclined-plane of the end side of the width of glass substrate.
As long as described above, making the area of a part for the width of the glass substrate of the irradiation area including at least laser
Domain is bent on the width of glass substrate, and the scope that the length direction on glass substrate bends glass substrate does not have
It is particularly limited to.I.e., it is possible to which the scope of the irradiation area only for the laser in the length direction of glass substrate, makes glass substrate
Bent with the region of a part for the orthogonal width of cut-out preset lines on the width of glass substrate.Need explanation
, the length direction of glass substrate said here represents the direction that to carry direction parallel with glass substrate.
However, it is preferred to which the irradiation area in the laser from glass substrate to along the cut-out preset lines of glass substrate is separated by rule
Scope untill the part of set a distance, makes a part for the width of the glass substrate of the cut-out preset lines comprising glass substrate
Region bent on the width of glass substrate.
As described above, the width orthogonal with cut-out preset lines of the glass substrate on the irradiation area including at least laser
The region of the part in direction,, can in the irradiation area of laser compared with unbent situation if bending glass substrate
Suppress the generation of fold.However, for example in the case where being carried to glass substrate, when will be in the tight of the irradiation area of laser
When front makes the glass substrate bend as described above, there is a situation where that the inhibition level of the generation of fold is insufficient.It is therefore preferable that
In defined scope of the irradiation area than laser by the upstream side in the carrying direction of such as glass substrate, on including glass base
The region of a part for the width of the glass substrate of the cut-out preset lines of plate, so that the cut-out preset lines configuration of glass substrate
Mode on inclined-plane bends glass substrate.
In the case that for example shown in Fig. 4 configuration possesses the transport roller 32 of supporting member 33, preferably make the irradiated region of laser 12
Domain reaches the summit of the transport roller 32 for possessing the supporting member 33 than being configured in the most upstream side in the carrying direction of glass substrate
At the downstream of position.I.e., in the case of figure 4, preferably match somebody with somebody at the carrying direction downstream than X-X ' lines by glass substrate
Put the irradiation area of laser.Moreover, especially when irradiating laser in order to prevent the damage of the grade of transport roller 32, the irradiation of laser 12
Region is preferably configured between transport roller 32.
As described above, in the cutting-off method of the glass substrate of present embodiment, the irradiation area comprising laser is made
The region of a part for the width orthogonal with cut-out preset lines of glass substrate is bent on the width of glass substrate.
Also, in the part (irradiation area of laser) of irradiation laser 12, the surface from a side to the surface of the opposing party of glass substrate
Laser irradiating part be heated (heating process).In addition, the region 14 of illuminated laser is removed due to glass substrate 11
Fortune and separated from the irradiation area of laser, laser irradiating part after laser irradiation (illuminated laser and part that glass has gasified)
15 periphery is cooled (refrigerating work procedure).On this point, Fig. 1, Fig. 7, Fig. 8 used below are illustrated.Need explanation
It is that, for the ease of recording in Fig. 1, Fig. 7, Fig. 8, the periphery on the irradiation area of laser is also recited as flat shape.And
And, it is not the line set on actual glass substrate although the cut-out preset lines 13 of glass substrate are shown in figure.
It can be not particularly limited using the composition of the glass substrate of the cutting-off method of the glass substrate of present embodiment, energy
Enough it is applied to various glass substrates.Can enumerate for example alkali-free pyrex, pyrex, soda-lime glass, high silica glass, its
His oxide system glass using silica as principal component etc..
Moreover, the thickness on glass substrate is also not particularly limited, for example can be according to the laser oscillation apparatus used
Output etc. and arbitrarily select.
But, especially easily produce fold in glass substrate in the case where the thickness of slab of glass substrate is relatively thin.Moreover,
In the cutting-off method of the glass substrate of present embodiment, in the irradiation area of laser, the surface on the side from glass substrate
To the whole thickness of slab direction of the laser irradiating part on the surface of the opposing party, i.e. glass substrate, more than the temperature for being heated to glass gasification.
The reasons why 2 more than, effect is especially played in the case where the thickness of slab of glass substrate is relatively thin.Thus, for example, glass
The thickness of slab of glass substrate is preferably below 3.0mm, more preferably below 1.0mm, more preferably below 0.5mm, particularly preferably
For below 0.2mm.It is not particularly limited on lower limit.
Moreover, glass substrate shown in Fig. 1 is shaped as rectangle, but the shape of glass substrate is also not particularly limited.
For example, it may be the glass substrate of the banding shaped by the glass substrate building mortion of float glass process or glass tube down-drawing etc..
Next, the heating process that explanation is carried out in the irradiation area (part that laser is irradiated to glass substrate) of laser.
Fig. 7 is the figure of the irradiation area periphery enlarged representation of the laser 12 in the section at the B-B ' lines by Fig. 1.
In the cutting-off method of the glass substrate of the present invention, by irradiating laser 12 to glass substrate as described above, and
Heating process is carried out in the irradiation area of laser.
On the irradiation area of the laser of glass substrate, from the surface of a side of glass substrate to the opposing party of glass substrate
Surface laser irradiation portion 71 be heated to glass gasification temperature more than.Here, the surface of a side of glass substrate is
Refer to the face of laser light incident side, the surface of the opposing party refers to its opposite face.Accordingly, with respect to the irradiation portion 71 of laser, glass gasification
And in a short time along direction of illumination (thickness direction of glass substrate) the formation through hole of laser.
Also, the periphery 72 of the irradiation portion 71 on laser, is added also by the heat transfer from the irradiation portion of laser
Heat.
So, after carrying out the heating process in heating process or just, i.e. when laser irradiates (when glass gasifies) or just
Carry out after laser irradiation, do not aid in gas (without using auxiliary gas) to laser irradiating part injection, can be in the short time
It is interior glass is gasified for laser irradiating part.Therefore, position changing of the relative positions of glass substrate etc. will not be produced and can accurately entered
Row processing, can suppress the generation of the cracking of glass substrate.
Do not limited as the irradiation condition of the laser in heating process, as long as being selected in such a way：
In the laser-irradiated domain of glass substrate, with from the surface of a side of glass substrate (face of laser light incident side) side to another
The laser irradiating part of the face side of side can be heated to more than the gasification temperature of glass.
Specifically, as long as example, according to the thickness of slab of the glass substrate as cut-off thing, glass composition, glass substrate
Transporting velocity (relative moving speed relative to glass substrate of the irradiation area of laser) etc., on laser irradiating part with energy
Enough modes heated as described above select energy density of laser etc..For example can by carrying out pilot study in advance and
Calculate.
The relative moving speed relative to glass substrate of the especially irradiation area of laser is set to v (m/ hours), described
The energy density of laser is set to E (W/mm2), in the case that the thickness of slab of glass substrate is set to t (mm), preferably to meet E >=50 × t
The mode of × v relation adjusts the energy density of the laser of irradiation.
The cut-out of the glass substrate comprising heating process is carried out in the state of above-mentioned regulation is met, thus in the photograph of laser
Penetrate in region, can be reliable by the laser irradiating part from surface to the surface of the opposing party of glass substrate of a side of glass substrate
Ground is heated to more than the temperature of glass gasification.
On the point footpath (the beam footpath of the laser in the surface of a side of glass substrate) of the laser irradiated to glass substrate
Also do not limit, can be selected according to required machining accuracy etc..
It should be noted that the species of the laser on using is not particularly limited, as long as by being irradiated to glass substrate
The laser of vibration, and glass substrate can be heated on the part of the irradiation.Specifically, it can use for example
CO2Laser, excimer laser, copper evaporation laser, YAG laser etc..
In heating process, by irradiating laser to glass substrate as described above, glass gas is made for laser irradiating part
Change.Therefore, the glass ingredient (gas) gasified is produced in laser irradiating part and its periphery.Mentioned component is to configuration in laser
When the surface of the optical systems such as the lens or speculum of the laser oscillation apparatus in light path separates out, adhered to, existing can not be for glass
Glass substrate irradiates the situation of the laser of sufficient energy, without situation of position irradiation laser desired by normal direction etc., may give
Machining accuracy of glass substrate etc. is impacted.It is therefore preferable that by irradiating laser by the glass gasified to glass substrate
Composition is removed.That is, in heating process, preferably the glass ingredient of the laser irradiating part gasified is removed.On by gas
The device that the glass ingredient changed is removed, is not particularly limited, can use the machine attracted the glass ingredient gasified
Structure, the glass ingredient gasified is blown to winged mechanism etc. using gas.As long as being selected on its configuration according to the device used
Select, as long as configuring as follows：Heating process is not hindered and can be by the glass ingredient gasified to configuration
Removed before the attachment such as the lens in the light path of laser, speculum.For example, in the figure 7, it is contemplated that configure shining as shown at 73
Penetrate the situation of the vicinity of the part of laser.
It should be noted that in the case of using the glass ingredient gasified to be blown to winged mechanism using gas, using
The species of gas be not particularly limited, but be due to that the periphery of the part heated in glass substrate by laser is used, therefore excellent
Choosing uses non-flammable gases.Specifically, inert gas, air etc. such as nitrogen, argon can be used.Moreover, in this case,
For the displacement of the position that prevents glass substrate, preferably gas is supplied in the way of avoiding contact with glass substrate.
Next, being illustrated to refrigerating work procedure.
Refrigerating work procedure is after laser has been irradiated, by moving glass substrate, to make the laser irradiating part after laser irradiation
(part for having irradiated laser) is cooled down away from the irradiation area of laser to the periphery of laser irradiating part.
In refrigerating work procedure, as shown in fig. 7, to laser irradiating part (in heating process illuminated laser and gasified
Part) 71 periphery 72 cooled down.In cooling, as shown in figure 8, at least a portion of the periphery 72 is present as big
Cause the precipitate 81,82 of wire and analysed to glass baseplate surface (surface and/or the surface of the opposing party of a side of glass substrate)
Situation about going out.This is due to the low thermal conductivity of glass, therefore after heating process, is produced in refrigerating work procedure in the periphery 72
Temperature inclination, thus push away think stress due to producing in the periphery 72 and at least a portion of periphery 72 is excluded and
Situation about separating out on the glass substrate.It should be noted that in figure, a upper surface (side from precipitate 81,82 to glass substrate
Surface) separate out, but there is also situation about being separated out to lower surface (surface of the opposing party) side.Moreover, being analysed in refrigerating work procedure
The position for going out thing precipitation is changed according to cooling condition etc., therefore is not particularly limited, but for example the precipitate 81,82 exists
The position leaned at the downstream for carrying direction of glass substrate and deviateed from the irradiation area of laser 12 than the irradiation area of laser 12
Put precipitation.
So, at least a portion of the periphery 72 of laser irradiating part is excluded from the section for having irradiated laser, therefore
Homogeneous section can finally be obtained.
The precipitate is produced in refrigerating work procedure, in order to obtain homogeneous section and it is preferred that with appropriate cooling velocity
The periphery of laser irradiating part is cooled down.The cooling velocity can be according to the irradiation area of laser relative to glass substrate
Relative moving speed and change.It is therefore preferable that carrying out preliminary experiment etc. and to produce above-mentioned precipitate in refrigerating work procedure
Mode selects the relative moving speed relative to glass substrate of the irradiation area of laser.
The relative moving speed relative to glass substrate of the irradiation area of laser as described above can be according to preliminary experiment
Deng being selected, although be not specific value, but can be set to more than such as 144 (m/ hours).
In refrigerating work procedure, when produce precipitate 81,82 when, according between temperature of precipitate 81,82 or both away from
From etc., and there is a situation where precipitate 81 and bonded with precipitate 82.And then difference according to circumstances, when precipitate 81 and precipitate
82 when bonding, and exists and is difficult to discharge a part for the periphery 72 and cutting for glass substrate from the periphery 72 of laser irradiating part 71
Section can not turn into the situation of homogeneous section.However, in the cutting-off method of the glass substrate of present embodiment, making to include
The region of a part for irradiation area, glass substrate the width orthogonal with cut-out preset lines of laser is in glass substrate
Width on bend.Thus, for example shown in Fig. 9, (adding in the extra high laser irradiating part of temperature of precipitate 81,82
Illuminated laser in thermal technology's sequence and the part gasified) 71 periphery, the glass substrate 91 of a cut-off side side and the opposing party side
Glass substrate 92 height it is different.Therefore, on the periphery of laser irradiating part 71, precipitate 81,82 mutual bondings can be suppressed, its
As a result, it is possible to which section more reliably is formed as into homogeneous section.
It should be noted that precipitate 81 is separated out between transport roller, and the upper surface of the glass substrate 92 to the opposing party side
Side or lower face side are separated out.In fig .9 for the ease of the record of accompanying drawing, it appears that bottom sidespin from precipitate 81 to transport roller
Enter, even if but in the case that precipitate 81 is separated out to the lower face side of the glass substrate 92 of the opposing party side, also being located at such as glass
Without the behavior of obstruction transport roller between glass substrate 92 and transport roller.
The precipitate 81,82 produced in refrigerating work procedure can also turn into the obstruction of cooling sometimes, therefore preferred remove is being swashed
The precipitate that the periphery of illumination part is produced.As the method for removing the precipitate, it is not particularly limited, for example, can lead to
Cross and be blown using gas, carry out attraction removing, simply being removed using the method for brushing or disturbing the removing such as plate etc..
It should be noted that in the case where blowing winged precipitate using gas, vibration etc. can be assigned to glass substrate, in order to
Avoid impacting and preferably using the gas of low pressure to the cut-out precision of glass substrate.
Refrigerating work procedure is cooled down to the periphery 72 of the laser irradiating part after laser irradiation as described above, on its cooling
Temperature is not limited.For example, the periphery of laser irradiating part be preferably cooled to after the heating of laser irradiating part vitrification point with
Under.
Now, after heating process, in the case where being cooled down using the temperature of periphery atmosphere, peripheral temperature is preferably extremely
It is preferably less than 100 DEG C, particularly preferred less than 40 DEG C below vitrification point less.It should be noted that periphery temperature said here
Degree at least carries out the temperature on the periphery of the part of refrigerating work procedure, it is preferred that being overall comprising the glass substrate cut off
The temperature on periphery.
The cutting-off method of the glass substrate of the present embodiment illustrated so far is especially preferably used in along glass
When the cutting line in the carrying direction of glass substrate cuts off glass substrate.
Also, generally when manufacturing glass substrate, in order that glass substrate turns into desired size, and by glass substrate
The both ends of width cut off with the cutting line in the carrying direction along glass substrate, but can now preferably use this
The cutting-off method of the glass substrate of embodiment.In this case, after the both ends of the width of glass substrate are cut off,
Using only the central portion of width as product, thus the width in glass substrate both ends be ear cut-out after,
It is preferred that being separated from the transport path of glass substrate.
Specifically, for example, setting ear's separative element in the carrying direction downstream than heating process by glass substrate,
The ear of the glass substrate after cut-out can be changed to what is deviated from from the carrying direction of glass substrate by ear's separative element
Direction is simultaneously separated.
The specific structure of ear's separative element is not particularly limited, but for example can be stable by transport roller and ear
Holding unit is constituted, and the transport roller turns into the fulcrum of the direction change of the ear of glass substrate, and the stable holding unit of the ear exists
The opposite side of transport roller as fulcrum contacts with the ear of glass substrate and ear is pressed together with transport roller.
The ear of glass substrate after separation imports to the secondary transport path different from transport path, can be with glass substrate
Central portion differently separately reclaim.
In the explanation of the cutting-off method of the glass substrate of present embodiment more than, to be removed in transport roller 32 by level
The cutting-off method of the glass substrate of present embodiment is illustrated exemplified by the glass substrate of fortune.However, the glass base of present embodiment
The cutting-off method of plate is not defined to the cut-out for the glass substrate carried by level, for the shaping such as by glass tube down-drawing, quilt
The glass substrate vertically carried can also be applicable.In this case, for example from the face of a side of glass substrate, by pressing structure
Part, can make irradiation area, glass substrate the width orthogonal with cut-out preset lines of the laser comprising irradiation laser
The region of a part bent on the width of glass substrate.Also, by carrying out heating process, bosher as described above
Sequence, also can similarly cut off for the glass substrate vertically carried.
Moreover, in the case where to glass substrate vertically carry, being cut by the width both ends of glass substrate
The cutting-off method of the glass substrate of present embodiment can also be preferably used when disconnected.In this case, it is also preferred that making after cut-out
The both ends of the width of glass substrate are separated from the transport path of glass substrate.
The cutting-off method of the glass substrate of the present invention is this concludes the description of, but in the cutting-off method of above-mentioned glass substrate,
It is not to be blown auxiliary gas to glass substrate, can be accurately right therefore, it is possible to the displacement for the position for suppressing glass substrate
Glass substrate carries out cutting off processing.Moreover, the generation of the cracking of glass substrate can be suppressed in cut-out, surface can be formed as
The homogeneous section of characteristic.
The cutting-off method of the glass substrate of present embodiment described above can be applied to the manufacture work of glass substrate
Sequence, is formed as having used the manufacture method of the glass substrate of the cutting-off method of the glass substrate.
In the manufacture method of above-mentioned glass substrate, cutting off processing, Neng Gou accurately can be carried out to glass substrate
Suppress the generation of the cracking of glass substrate during cut-out, homogeneous section can be formed as, therefore the system of glass substrate can be obtained
Make the effect that the raising of yield rate, the shortening of the milling time of section in grinding step or grinding step are omitted.
【Embodiment】
It is exemplified below and illustrates specific embodiment, but the present invention is not defined to these embodiments.
[experimental example 1]
In this experimental example, make energy density, the relative shifting relative to glass substrate of the irradiation area of laser of laser
Move velocity variations and cut off glass substrate, evaluated for the section of the glass substrate after cut-out.
When the cut-out of glass substrate, the structure according to Fig. 1, for indulging 100mm, horizontal 100mm, thickness of slab 0.1mm
Glass substrate (the Asahi Glass Co., Ltd's trade name being made up of alkali-free pyrex:AN100), while being carried with defined
Speed moving glass substrate, while CO will have been used along cut-out preset lines2The laser of laser is so that about 0.3mm is in a footpath and turns into
The mode of defined energy density is irradiated.When being cut off, the peripheral temperature (environment temperature) of glass substrate is room temperature
(25℃)。
Moreover, now, as shown in Figure 3, Figure 4, supporting member 33 is set in transport roller 32, while making comprising irradiation laser
The region of a part for the width of the glass substrate of the irradiation area of laser is bent on the width of glass substrate, and one
Side carries out the irradiation of laser.Now, laser 12 as shown in width from arrow 12 in Fig. 3 to glass substrate end side it is oblique
Face is irradiated.Moreover, as shown in figure 4, supporting member 33 is located at 2 transport rollers 32, the transport roller 32 provided with supporting member 33 it
Between be configured with the irradiation area of laser 12.
Glass substrate after for being cut off, is evaluated as C, although be able to will cut by the glass substrate for failing cut-out
It is disconnected but do not become homogeneous or in glass when the part for having irradiated laser does not observe precipitate and visually confirms section
The glass substrate that glass substrate generates cracking is evaluated as B.It is possible to breaking glass substrate and is visually able to confirm that homogeneous cut
The glass substrate of section is evaluated as A.As a result as shown in table 1 and Figure 10.Figure 10 is that a part for the result of table 1 is carried out into coordinate diagram
Figure after change.
[table 1]
In the coordinate diagram shown in Figure 10, in the relative moving speed relative to glass substrate of the irradiation area of laser
(being herein the transporting velocity of glass substrate) is set to v (m/ hours), the energy density of the laser and is set to E (W/mm2), glass base
In the case that the thickness of slab of plate is set to t (mm), straight line X is E=50 × t × v straight line.
Also, straight line Y represent to generate in refrigerating work procedure precipitate, laser irradiation area relative to glass base
The minimum value of the relative moving speed (being herein the transporting velocity of glass substrate) of plate, is in this case 144 (m/ hours).
According to Figure 10, A is evaluated and is distributed in the range of straight line X and straight line Y are surrounded, the energy density feelings smaller than straight line X
Condition is evaluated as C, and the transporting velocity situation slower than straight line Y is evaluated as B.
This consideration is because of first, in the relative moving speed (glass relative to glass substrate of the irradiation area of each laser
The transporting velocity of glass substrate) in, in the case where having irradiated more than the straight line X laser of energy density, for the irradiation of laser
The surface of the side from glass substrate in region can reliably be heated to glass to the laser-irradiated domain on the surface of the opposing party
It is more than the temperature of glass gasification.
And consider be because, by so be formed as more than straight line Y transporting velocity, swashing after can laser be irradiated
The periphery in light irradiation region is sufficiently cool, can be excluded as precipitate from section part, therefore, it is possible to be formed as surface
The homogeneous section of characteristic.
That is, in the glass substrate for becoming C evaluations, it is impossible to which imparting is for the irradiation area of laser relative to glass base
The energy of sufficient laser for the relative moving speed (transporting velocity of glass substrate) of plate, for the irradiation area of laser,
Fail to be heated to untill the surface of the opposing party of glass substrate more than the temperature of glass gasification (for the whole of glass substrate
The scope in thickness of slab direction can not fully heat up).Therefore, push away that think can not breaking glass substrate.
Moreover, become B evaluation glass substrate can irradiate for laser irradiation area relative to glass substrate
Relative moving speed (transporting velocity of glass substrate) for sufficient energy density laser, therefore glass substrate can be carried out
Cut-out.
However, the relative moving speed (transporting velocity of glass substrate) relative to glass substrate of the irradiation area of laser
Insufficient, the cooling velocity of the periphery of the laser-irradiated domain after laser irradiation is slack-off, and the periphery can not as precipitate
Exclude and remain, push away and think that section does not become homogeneous.Or, the temperature of the periphery of the laser-irradiated domain after laser irradiation
When because glass substrate is handled upside down and cooling down, due to not being desired cooling velocity, therefore push away and think in section and its week
While generating cracking.
In contrast, it is believed that the glass substrate that A is evaluated correspond to the irradiation area of laser relative to glass substrate
Relative moving speed (transporting velocity of glass substrate) can properly select the energy density of laser.Thus, it is believed that for
The irradiation area of laser, more than the surface to the surface of the opposing party of a side of glass substrate, the temperature for being heated to glass gasification.
Further, since the transporting velocity of glass substrate is appropriate, it can thus be assumed that the periphery of the laser-irradiated domain after laser irradiation with
Appropriate cooling velocity is cooled, and the periphery of the laser-irradiated domain after laser irradiation is excluded as precipitate, can be obtained
To homogeneous section.
[experimental example 2]
It is same with experimental example 1 in addition to the thickness of slab of the glass substrate cut off is 0.2mm in this experimental example, make
The energy density of laser, the relative moving speed relative to glass substrate of the irradiation area of laser change and cut glass substrate
It is disconnected, evaluated for the section of the glass substrate after cut-out.
As a result as shown in table 2, Figure 11.Figure 11 is that the result of table 2 has been carried out to the figure after coordinate diagram.
【Table 2】
In the coordinate diagram shown in Figure 11, straight line X is also above-mentioned E=50 × t × v (t=0.2mm) straight line.
Moreover, straight line Y represent to generate in refrigerating work procedure precipitate, laser irradiation area relative to glass base
The minimum value of the relative moving speed (being herein the transporting velocity of glass substrate) of plate, is in this case 144 (m/ hours).
According to such case, be able to confirm that A evaluate be distributed in by straight line X and straight line Y surround in the range of situation.
[experimental example 3]
It is same with experimental example 1 in addition to the thickness of slab of the glass substrate cut off is 0.3mm in this experimental example, make
The energy density of laser, the relative moving speed relative to glass substrate of the irradiation area of laser change and cut glass substrate
It is disconnected, evaluated for the section of the glass substrate after cut-out.
As a result as shown in table 3, Figure 12.Figure 12 is that the result of table 3 has been carried out to the figure after coordinate diagram.
【Table 3】
In the coordinate diagram shown in Figure 12, straight line X is also above-mentioned E=50 × t × v (t=0.3mm) straight line.
Moreover, straight line Y represent to generate in refrigerating work procedure precipitate, laser irradiation area relative to glass base
The minimum value of the relative moving speed (being herein the transporting velocity of glass substrate) of plate, is in this case 144 (m/ hours).
In this experimental example, the transporting velocity of glass substrate is not changed, make irradiation laser energy density change and
Carry out the cut-out of glass substrate.According to such case, the energy bigger than straight line X is formed as increasing the energy density of laser
In the case of density, on the irradiation area of laser, from the surface of a side of glass substrate to the surface of the opposing party for laser
Irradiation area can be heated to more than the temperature of glass gasification, be able to confirm that situation about being evaluated as A.
[experimental example 4]
It is same with experimental example 1 in addition to the thickness of slab of the glass substrate cut off is 0.6mm in this experimental example, make
The energy density of laser, the relative moving speed relative to glass substrate of the irradiation area of laser change and cut glass substrate
It is disconnected, evaluated for the section of the glass substrate after cut-out.
As a result as shown in table 4, Figure 13.Figure 13 is that the result of table 4 has been carried out into the figure of coordinate diagram.
【Table 4】
In the coordinate diagram shown in Figure 13, straight line X is also above-mentioned E=50 × t × v (t=0.6mm) straight line.
Moreover, straight line Y represent to generate in refrigerating work procedure precipitate, laser irradiation area relative to glass base
The minimum value of the relative moving speed (being herein the transporting velocity of glass substrate) of plate, is in this case 144 (m/ hours).
In this experimental example, the energy density of the laser of irradiation is lower than straight line X.Thus, it is believed that can not assign for swashing
Sufficient laser for the relative moving speed (transporting velocity of glass substrate) relative to glass substrate of the irradiation area of light
Energy, the irradiation portion on laser, it is impossible to be heated to untill the surface of the opposing party of glass substrate glass substrate gasification
Temperature more than.Thus, it is believed that can not breaking glass substrate and as C evaluate.
More than, the cutting-off method of glass substrate and the manufacture method of glass substrate are illustrated using embodiment etc., still
The present invention is not defined to above-mentioned embodiment etc..In the range of the purport of the invention that claims are recorded, Neng Goujin
Row various modifications, change.
Claims (12)
1. a kind of cutting-off method of glass substrate, irradiates laser and cuts off glass substrate along cut-out preset lines, the glass
The cutting-off method of substrate is characterised by,
The surface comprising the side to the glass substrate is set to irradiate irradiation area, the described glass base of the laser of the laser
The region of the width orthogonal with cut-out preset lines of plate is temporarily curved on the width of the glass substrate
Song,
In the laser-irradiated domain, while bending the glass substrate, while the table of the side from the glass substrate
Laser irradiating part of the face untill the surface of the opposing party is heated to more than the temperature of gasification,
Make cut-out preset lines of the irradiation area of the laser along the glass substrate relative to the glass substrate relatively
It is mobile.
2. the cutting-off method of glass substrate according to claim 1, wherein,
It is separated by the scope of predetermined distance in the cut-out preset lines along the glass substrate of the range of exposures comprising the laser
On bend the glass substrate.
3. the cutting-off method of glass substrate according to claim 1 or 2, wherein,
So that the region of the width of the glass substrate of the irradiation area comprising the laser is from glass substrate
The mode that the regions of other parts is protruded, described in the surface side bearing using supporting member from the opposing party of the glass substrate
Glass substrate, so that the region of the width of the glass substrate of the irradiation area comprising the laser is described
Bent on the width of glass substrate.
4. the cutting-off method of glass substrate according to claim 3, wherein,
The supporting member supports the glass substrate as follows：Region in other parts from glass substrate
The end of the width of in the region of the width of the prominent, the glass substrate, glass substrate
The irradiation area of the laser is configured on the inclined-plane of side.
5. the cutting-off method of glass substrate according to claim 1 or 2, wherein,
So that the region of the width of the glass substrate of the irradiation area comprising the laser is by conducting oneself with dignity from glass
The mode of the field flexes of other parts of glass substrate, using holding member from the face side of the opposing party of the glass substrate
The glass substrate is kept, so that the area of the width of the glass substrate of the irradiation area comprising the laser
Domain is bent on the width of the glass substrate.
6. according to the cutting-off method of glass substrate according to any one of claims 1 to 5, wherein,
The periphery of the laser irradiating part is cooled to below vitrification point after the heating of the laser irradiating part.
7. according to the cutting-off method of glass substrate according to any one of claims 1 to 6, wherein,
Relative to the relative moving speed of glass substrate v (m/ hours), the laser are set in the irradiation area of the laser
Energy density is set to E (W/mm2), in the case that the thickness of slab of glass substrate is set to t (mm), meet E >=50 × t × v relation.
8. according to the cutting-off method of glass substrate according to any one of claims 1 to 7, wherein,
The irradiation area of the laser is more than 144 (m/ hours) relative to the relative moving speed of glass substrate.
9. according to the cutting-off method of glass substrate according to any one of claims 1 to 8, wherein,
The glass ingredient of the laser irradiating part gasified is removed.
10. according to the cutting-off method of glass substrate according to any one of claims 1 to 9, wherein,
The precipitate of periphery generation in the laser irradiating part is removed.
11. according to the cutting-off method of glass substrate according to any one of claims 1 to 10, wherein,
The thickness of slab of the glass substrate is below 3.0mm.
12. a kind of manufacture method of glass substrate, has used the cut-out of the glass substrate any one of claim 1~11
Method.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013-112182 | 2013-05-28 | ||
| JP2013112182 | 2013-05-28 | ||
| CN201480024048.4A CN105164073B (en) | 2013-05-28 | 2014-04-28 | The cutting-off method of glass substrate and the manufacturing method of glass substrate |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201480024048.4A Division CN105164073B (en) | 2013-05-28 | 2014-04-28 | The cutting-off method of glass substrate and the manufacturing method of glass substrate |
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| CN201710173236.9A Pending CN107129137A (en) | 2013-05-28 | 2014-04-28 | The cutting-off method of glass substrate and the manufacture method of glass substrate |
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| JP (1) | JP6379392B2 (en) |
| KR (1) | KR20160013841A (en) |
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| JP6379392B2 (en) * | 2013-05-28 | 2018-08-29 | Ａｇｃ株式会社 | Glass substrate cutting method and glass substrate manufacturing method |
| JP6579040B2 (en) * | 2016-05-31 | 2019-09-25 | 日本電気硝子株式会社 | Manufacturing method of glass roll |
| JP6738043B2 (en) * | 2016-05-31 | 2020-08-12 | 日本電気硝子株式会社 | Glass film manufacturing method |
| JP2018024536A (en) * | 2016-08-08 | 2018-02-15 | 日本電気硝子株式会社 | Method for cutting belt-like glass film |
| US11459264B2 (en) | 2017-02-07 | 2022-10-04 | Nippon Electric Glass Co., Ltd. | Method for producing glass film |
| JP6748920B2 (en) * | 2017-03-13 | 2020-09-02 | 日本電気硝子株式会社 | Glass film manufacturing method |
| JP6909403B2 (en) * | 2017-07-31 | 2021-07-28 | 日本電気硝子株式会社 | Glass film manufacturing method |
| JPWO2019065533A1 (en) * | 2017-09-27 | 2020-11-05 | 三星ダイヤモンド工業株式会社 | Glass substrate cutting device, cutting method, program, and storage medium |
| JP6883282B2 (en) * | 2017-11-27 | 2021-06-09 | 日本電気硝子株式会社 | Glass roll manufacturing method |
| JP7227273B2 (en) * | 2018-11-30 | 2023-02-21 | Hoya株式会社 | Glass plate manufacturing method, glass plate chamfering method, and magnetic disk manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305467A (en) * | 1992-04-27 | 1993-11-19 | Central Glass Co Ltd | Method for cutting optical transmission material by laser beam |
| CN101712529A (en) * | 2008-09-29 | 2010-05-26 | 康宁股份有限公司 | Laser separation of glass sheets |
| CN102656105A (en) * | 2009-12-16 | 2012-09-05 | 康宁股份有限公司 | Separation of glass sheets from a laser-scored curved glass ribbon |
| CN105164073B (en) * | 2013-05-28 | 2018-06-12 | 旭硝子株式会社 | The cutting-off method of glass substrate and the manufacturing method of glass substrate |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467168A (en) * | 1981-04-01 | 1984-08-21 | Creative Glassworks International | Method of cutting glass with a laser and an article made therewith |
| KR100971042B1 (en) * | 2005-08-12 | 2010-07-16 | 시바우라 메카트로닉스 가부시키가이샤 | System for brittle material cutting process and method employed therein |
| DE102006018622B3 (en) * | 2005-12-29 | 2007-08-09 | H2B Photonics Gmbh | Device for cutting through components made of brittle material |
| JP2010099708A (en) * | 2008-10-24 | 2010-05-06 | Japan Steel Works Ltd:The | Method and apparatus for processing cut surface of cut material |
| CN101613180A (en) * | 2009-07-24 | 2009-12-30 | 深圳市大族激光科技股份有限公司 | A kind of method of cutting glass by laser |
| JP5532219B2 (en) * | 2010-01-18 | 2014-06-25 | 日本電気硝子株式会社 | Sheet glass cutting method and apparatus |
| JP5194076B2 (en) * | 2010-08-27 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Laser cleaving device |
| JP5202595B2 (en) * | 2010-09-10 | 2013-06-05 | 三星ダイヤモンド工業株式会社 | Laser cleaving device |
| JP2012061681A (en) * | 2010-09-15 | 2012-03-29 | Mitsuboshi Diamond Industrial Co Ltd | Laser cleaving apparatus |
| US9790121B2 (en) * | 2011-03-30 | 2017-10-17 | Corning Incorporated | Methods of fabricating a glass ribbon |
| JP2013014016A (en) * | 2011-06-30 | 2013-01-24 | Mitsubishi Electric Corp | Splitting method |
| JP5884691B2 (en) * | 2011-09-15 | 2016-03-15 | 日本電気硝子株式会社 | Glass plate cutting method |
| JP5861864B2 (en) * | 2011-09-15 | 2016-02-16 | 日本電気硝子株式会社 | Glass plate cutting method and glass plate cutting device |
-
2014
- 2014-04-28 JP JP2015519748A patent/JP6379392B2/en not_active Expired - Fee Related
- 2014-04-28 WO PCT/JP2014/061849 patent/WO2014192482A1/en active Application Filing
- 2014-04-28 CN CN201480024048.4A patent/CN105164073B/en not_active Expired - Fee Related
- 2014-04-28 CN CN201710173236.9A patent/CN107129137A/en active Pending
- 2014-04-28 KR KR1020157026147A patent/KR20160013841A/en not_active Application Discontinuation
- 2014-05-19 TW TW103117511A patent/TWI651280B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05305467A (en) * | 1992-04-27 | 1993-11-19 | Central Glass Co Ltd | Method for cutting optical transmission material by laser beam |
| CN101712529A (en) * | 2008-09-29 | 2010-05-26 | 康宁股份有限公司 | Laser separation of glass sheets |
| CN102656105A (en) * | 2009-12-16 | 2012-09-05 | 康宁股份有限公司 | Separation of glass sheets from a laser-scored curved glass ribbon |
| CN105164073B (en) * | 2013-05-28 | 2018-06-12 | 旭硝子株式会社 | The cutting-off method of glass substrate and the manufacturing method of glass substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI651280B (en) | 2019-02-21 |
| CN105164073A (en) | 2015-12-16 |
| JPWO2014192482A1 (en) | 2017-02-23 |
| KR20160013841A (en) | 2016-02-05 |
| JP6379392B2 (en) | 2018-08-29 |
| TW201504173A (en) | 2015-02-01 |
| CN105164073B (en) | 2018-06-12 |
| WO2014192482A1 (en) | 2014-12-04 |
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