CN107113966B - Flexible circuit with partial earthing path - Google Patents
Flexible circuit with partial earthing path Download PDFInfo
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- CN107113966B CN107113966B CN201580073262.3A CN201580073262A CN107113966B CN 107113966 B CN107113966 B CN 107113966B CN 201580073262 A CN201580073262 A CN 201580073262A CN 107113966 B CN107113966 B CN 107113966B
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- electrical contact
- flexible circuit
- conductivity
- operation part
- ink
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- 230000036961 partial Effects 0.000 title description 2
- 239000004020 conductor Substances 0.000 claims abstract description 31
- 230000000717 retained Effects 0.000 claims abstract description 22
- 238000003860 storage Methods 0.000 claims abstract description 11
- 210000003491 Skin Anatomy 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 53
- 239000000758 substrate Substances 0.000 claims description 31
- 230000005611 electricity Effects 0.000 claims description 14
- 230000003068 static Effects 0.000 claims description 9
- 238000009825 accumulation Methods 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 3
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000004070 electrodeposition Methods 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive Effects 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920001721 Polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N iso-propanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- 230000003213 activating Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002146 bilateral Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 230000002070 germicidal Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000000670 limiting Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000002688 persistence Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- -1 polyethylene naphthalenedicarboxylate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Abstract
A kind of head assembly for fc tape storage device FC including head and is connected to the flexible circuit on head.Flexible circuit includes retained part, the end including the electrical contact for head, the conductor extended from electrical contact, and forms pattern on electrical contact and retained part to form the ink of electrical path therebetween.The skin contact ink of user is responded, electrostatic charge is transmitted to ground connection user from electrical contact and conductor by ink.
Description
Technical field
This application involves flexible circuit and its constructions.
Background technique
Flexible electronic or flexible circuit are gathered by the way that electronic device is mounted on such as polyimides or electrically conducting transparent
The electronic circuit formed on flexible base board as ester film.Flexible circuit is also possible to the silver electricity of the silk-screen printing on polyester
Road.Flexible print circuit is manufactured by photoetching technique.In other examples, flexible foils circuit or flexible flat cable can pass through
It manufactures being coated with laminated thin copper bar between resinoid and two layers of PET activating during lamination treatment.
Flexible circuit can be advantageous in accordance with desired shape and in some cases, include (a) needing on 3 axis
The Electronic Packaging closely assembled to be electrically connected, (b) component needs to be soft electrical connection, (c) subgroup during use
Replace the electrical connection of harness between part, and (d) plate thickness or space constraint are the electrical connections of limiting factor.
Summary of the invention
A kind of fc tape storage device FC includes head assembly.Head assembly includes head and the flexible electrical for being connected to head
Road.Flexible circuit includes retained part, the end including the electrical contact for head, the conductor extended from electrical contact, with
And pattern is formed on electrical contact and retained part to form the ink of electrical path therebetween, to respond the skin of user
Ink is contacted, electrostatic charge is transmitted to ground connection user from electrical contact and conductor.Ink can be silk-screen ink.Ink can be with
With at least resistivity of 5k Ω/.Ink can have smaller than the conductivity of electrical contact but than flexible circuit insulation
The big conductivity of the conductivity of layer.The resistance of one electrical path of electrical path can be at least 100k Ω.
A kind of head assembly for fc tape storage device FC includes head and the flexible circuit for being connected to head.Flexible electrical
Road includes retained part and the end with the electrical contact for head, from the conductor of electrical contact extension, and is being touched
The trace extended between some contacts and retained part of point.The material of trace has at least resistivity of 5k Ω/, so that by
Electrical path that at least one trace of trace defines, from a contact of contact to retained part is at least 100k Ω's
Resistance.Material can be ink.Ink can be silk-screen ink.Material can form a part of retained part.Trace can be with
Contact contact every a contact.Material can have smaller than the conductivity of contact but the insulating layer than flexible circuit electricity
The big conductivity of conductance.Resistance may be approximately equal to 1M Ω.
A kind of flexible circuit includes substrate, substrate defining operation part and has electrical pad and conductor on substrate.
The electrical pad of one of each conductor of conductor from electrical pad extends.Flexible circuit also includes to contact some of electrical pad
The electrical pad and some patterns for covering operation part form one layer of ink on substrate, so that being grounded the skin of user
Contact between ink is so that be transmitted to user via ink by the electrostatic charge that electrical pad or conductor carry.Ink can
To be silk-screen ink.Ink can have the resistivity of at least 5k Ω/.Ink can have smaller than the conductivity of electrical pad
But the conductivity bigger than the conductivity of insulating layer associated with substrate.Ink can be with electrical pad every a touching
Point.Resistance associated with pattern can be at least 100k Ω.
Detailed description of the invention
Fig. 1 is the plan view for the head assembly with storage equipment.
Fig. 2 is the plan view of a part of the flexible circuit of the head assembly of Fig. 1.
Fig. 3 A to Fig. 3 C is the schematic diagram of the trace patterns for flexible circuit.
Specific embodiment
It is described herein embodiment of the disclosure.It will be appreciated, however, that the disclosed embodiments be only example and other
Embodiment can take form various or as substitution.Figure is not necessarily to scale；It may exaggerate or minimize
Feature is to show the details of particular elements.Therefore, specific structure and function details disclosed herein are not construed as restricted
, and representative basis of the invention is diversely used as just professor those skilled in the art.
Those of ordinary skill in the art will be understood that any one with reference to attached drawing illustrates and the various features of description can
To be combined with the feature illustrated in other one or more figures, to be produced without the embodiment for explicitly illustrating or describing.
Illustrated by feature combination provide be used for typical case representative embodiment.However, meeting the feature of the instruction of the disclosure
Various combinations and modification may be desired for specifically applying or being achieved in that.
In the presence of several base configurations associated with flexible circuit, comprising: unilateral flexible circuit, double accesses or back are naked
Reveal flexible circuit, engraving flexible circuit, bilateral flexible circuit, multi-layer soft circuit, rigid flexible circuit and polymer thick film
Flexible circuit.
Unilateral flexible circuit has individually leads made of such as metal or conducting polymer on flexible dielectric film
Body layer.Member ends feature can be accessed from side.Hole can be formed in basis film to allow component leads to pass through to be used for
Interconnection.
Double accesses or the exposed flexible circuit in back have single conductor layer.However, the feature of selected conductive pattern
It can be accessed from two sides.
It carves flexible circuit (subset of flex circuit) to manufacture via multi-step engraving method, this method is along circuit
Generate the copper conductor of different-thickness.For example, conductor can be thin in flexible region and thick at interconnection point.
There are two conductor layers for double side flexible circuit tool, and can be manufactured with or not have electroplating ventilating hole.Plating
Through-hole allows to be arranged on the two sides of circuit the stop of electronic component.In this way, component can be placed on either side.Protectiveness
Coating can be placed on the side of the circuit of completion, on two sides or be not placed in any side.
Multi-layer flexible circuit has the conductor of three layers or more layers.These layers are interconnected typically by means of electroplating ventilating hole.
Other than the region as occupied by electroplating ventilating hole, layer can be throughout constructing continuously laminated together or be not laminated to one
It rises.
Rigid flex-circuits are the combination constructions for being laminated together into the rigid substrates and flexible base board of single structure.
Polymer thick film (PTF) flexible circuit has the conductor being printed on such as polymer base film.They are typical
Ground is single conductor layer structure.However, it is possible to sequentially print two or more metal layers, and insulating layer is printed on institute
Between the conductor layer of printing.
Basic flexible circuit material often includes basis, adhesive binder and metal foil.Basic material is flexible polymer
Object film provides the substrate for lamination.Typically, most of physical properties of flexible circuit basic material definition circuit and
Electrical properties.However, the basic material in adhesive-free circuit structure defines complete characteristic property.It can be used many different
Based on material, including polyester, polyimides, polyethylene naphthalenedicarboxylate, polyetherimide and various fluoropolymers.
Although thickness is possible on a large scale, many fexible films are fabricated in the range of 12 μm to 125 μm.
Thinner and thicker material is also possible.Thinner material is more flexible, and Film stiffness usually with thickness cube at
Ratio increases.
Adhesive may be used as the cementing medium for creating lamination.However, these adhesives are typically relative to temperature
The performance constraint element of degree, especially when polyimides is as basic material.However, it is possible to use different polymeric families
Adhesive system solves the problems, such as this.Similar with basis film, adhesive is fabricated to different thickness.And thickness selects allusion quotation
It is type the function of application.For example, different adhesive thickness is usually when coating is created using thick to meet different copper foils
The filling demand of degree.
Metal foil is flexible laminated common conducting element, and is circuit paths usually from the material wherein etched.Though
So using have variable thickness various metals (and metal alloy) foil, but copper foil be often preferably as they
Cost and physical characteristic and electrical characteristic.Copper foil is typically electrically deposited or forges (rolling)-and generates different property.
As a result, many different types of copper foils can be used for flexible circuit application.About most of copper foils, thin list surface treatment is usually applied to
The side of foil is to improve the bonding that it arrives basis film.
Those flexible circuits as described above use in fc tape storage device FC.For example, head assembly may include
It is connected to the flexible circuit of the element of transducer on head.Element in the record head of tape drive with the time become compared with
It is small.As a result, problem associated with flexible circuit static discharge (ESD) becomes more frequently.For example, if more track record heads
Single track due to esd event without work, then entire head will not work.Therefore, it is interested for managing the technology of ESD
's.
Inventor has been found that electrostatic charge can be accumulated in the external of the flexible circuit of record head by Germicidal efficacy,
This can generate charge in the conductor of record head.And when record head ground connection when (for example, plugging in), quilt in conductor
The charge generated may cause problematic electric current and flow through head.Certain arrangements disclosed herein can be helped and for example be recorded
The reduction of associated electrostatic charge.
The previous trial for solving the electrostatic accumulated in flexible circuit is possibly relied on the conductor of circuit or is insulated
It include quiescent dissipation layer on layer.However, this layer may be expensive, and charge is kept for certain sensitive equipments
It is failure in 0V aspect.Other trials possibly rely on user and use isopropyl alcohol flexible circuit (alcohol before activation
Serving as resistor-prevents repid discharge.) however, may be decreased the validity of the technology using inconsistency.
Here, in some examples, with known resistivity ink or other materials can on flexible circuit shape
Electrical path at one layer to create conductor between the part of the flexible circuit for operating purpose.Therefore, work as flexible circuit
When being operated during installation, the charge in these arrangements can be advanced through ink and be dissipated from conductor.That is, working as connector
When being inserted into power supply, conductor can be continuously grounded.
With reference to Fig. 1 and Fig. 2, the head assembly 10 for fc tape storage device FC 12 includes the head with multiple element of transducers
Portion 14 and flexible circuit 16.Flexible circuit 16 includes end 17, retained part 18 and substrate 19, has on substrate 19 and uses
In head 14 electrical contact or pad 20 (for example, gold), element of transducer is electrically coupled to leading for electrical contact 20
Body 22 (for example, copper) and trace 24.Show the connector of zero insertion force type.However, it is possible to use any connection appropriate
Device.Moreover, the bottom basic element of character of flexible circuit 16 is constructed in a similar mode of example with example described above.
However, it is possible to use any construction appropriate.
Trace 24 starts at electrical contact 20 (in this example, electrical contact 20 every an electrical contact),
Extend between electrical contact 20 and retained part 18 along end 17, and is terminated at retained part 18.If space allows,
Trace 24 can start at each electrical contact of electrical contact 20.Other configurations are also possible.
The trace 24 of Fig. 1 and Fig. 2 is formed with tree pattern.That is, thin " leaf " of trace 24 is contacted with electrical contact 20, mark
The thickness " trunk " of line 24 forms (in the region for being typically used to operational tip 17) on the perimeter of retained part 18, and mark
" branch " of line 24 extends between " leaf " and " trunk ".As described in more detail below, this tree pattern and trace 24
Material composition combine the expectation that is selected to achieve in the quiescent dissipation range between electrical contact 20 and retained part 18
Resistance, to help electrostatic charge to dissipate in operation.
If, should when selection is used for the width of electrical contact 20 using silk screen process technical application trace 24
Consider silk screen process alignment tolerances.In the example of Fig. 1 and Fig. 2, the width of each of electrical contact is 0.64mm.Moreover, if
It needs to print on edge, the zonule of such as 1mm should be cut out so that edge is exposed in all strong points.
In the example of fig. 1 and 2, trace 24 is the bottom folder applied to (for example, silk screen process arrives) flexible circuit 16
Hold the ink (for example, silk-screen ink) on part 18, electrical contact 20 and conductor 22.However, it is possible to use other materials appropriate
Expect (for example, thin metallic film etc.).The ink for forming trace 24 has at least resistivity of 500k Ω/.Other ink and suitable
When trace material can have the resistivity within the scope of such as 5k Ω/ to 1M Ω/, it is assumed that this resistivity and trace diagram
Case/dimension combination generates the expectation resistance (for example, 100k Ω to 100G Ω) within the scope of quiescent dissipation.In other words, certain traces
Material can have conductivity smaller than the conductivity of electrical contact 20 but bigger than the conductivity of the insulating layer of flexible circuit 16.
The tree pattern for giving the electrical characteristic of ink described above and being formed by trace 24, in electrical contact 20
The resistance in the electric traces path between one electrical contact and the section of the retained part 18 covered by ink is about 1M Ω.
Depending on application demand and design requirement, the resistance in other this electrical paths in other examples can be from least 100k
Ω to be more than 1M Ω range.
With reference to Fig. 3 A to Fig. 3 C, other example trace patterns are schematically illustrated.For example, if using identical trace material
Create these patterns, it is likely that resistance associated with the electrical path defined by these trace patterns will be different.However,
It is possible that properly selecting trace material for each design, similar path resistor can be able to achieve.That is, trace material resistivity
Change from a pattern to another pattern can compensate (offset) different pattern to the electrical path defined by trace
The influence of resistance.
It can be improved using the flexible circuit of the trace concept discussed herein about the component comprising this flexible circuit
Yield because can reduce the quantity of the component lost during being inserted into power supply due to esd event.Similarly, because it is soft
The operation of property circuit can make electrostatic charge dissipate before it becomes problematic, and reliability can be improved.
Word used in the description is description rather than the word of limitation, and it is to be understood that can carry out various
Change without departing from spirit and scope of the present disclosure.
As described earlier, the feature of various embodiments can be combined to be formed and may not have explicitly description or example
The more embodiments of the invention shown.Although various embodiments may have been depicted as relative to one or more desired characteristics
The advantages of providing better than other embodiments or prior art implementation is either preferred, however ordinary skill people
For member it will be recognized that can compromise one or more features or characteristic are to realize desired overall system attribute, this depends on tool
The application of body and implementation.These attributes may include, but be not limited to, cost, intensity, persistence, life cycle cost,
Marketability, appearance, encapsulation, size, serviceability, weight, manufacturability, assembling be easy etc..In this way, depicted here as phase
For one or more characteristics not as good as other embodiments or the desired embodiment of prior art implementation not in the disclosure
Range outside and may for specifically application be desired.
Claims (31)
1. a kind of fc tape storage device FC, comprising:
Head assembly, comprising:
Head；And
It is connected to the flexible circuit on head, the flexible circuit includes:
Substrate with end section, the end section include the electrical contact for head,
At least one insulating layer of deposition on the substrate,
The retained part defined by the marginal portion expanded outwardly before the end section of flexible circuit,
The conductor extended from electrical contact, and
Pattern is formed on electrical contact and retained part to form the electricity of predefined shape between electrical contact and retained part
Electrostatic charge is transmitted to by the ink of gas circuit diameter to respond the skin contact ink of ground connection user from electrical contact and conductor
User is grounded,
Wherein ink has smaller than the conductivity of electrical contact but conductance than at least one insulating layer described in flexible circuit
The big conductivity of rate, and wherein the ink contacts each electrical contact in the electrical contact, and
Wherein the electrical path of predefined shape has the conductivity based on ink and predefined size is being predefined with providing
Target zone in electrical contact and retained part between resistance.
2. fc tape storage device FC according to claim 1, wherein ink is silk-screen ink.
3. fc tape storage device FC according to claim 1, wherein the resistance is at least 100k Ω.
4. a kind of head assembly for fc tape storage device FC, comprising:
Head；And
Flexible circuit is connected to head and includes:
Substrate with end section, the end section have the electrical contact for head,
At least one insulating layer of deposition on the substrate,
The retained part defined by the marginal portion expanded outwardly before the end section of flexible circuit,
The conductor extended from electrical contact, and
In the trace of some electrical contacts in electrical contact and the predefined shape extended between retained part,
Wherein the material of trace have it is smaller than the conductivity of electrical contact but than at least one insulating layer described in flexible circuit
The big conductivity of conductivity, and wherein each electrical contact in electrical contact described in the trace contacts, and
Wherein the trace of predefined shape has the conductivity based on the material and predefined size is being predefined with providing
Target zone in electrical contact and retained part between resistance.
5. component according to claim 4, wherein material is ink.
6. component according to claim 5, wherein ink is silk-screen ink.
7. component according to claim 4, wherein material forms a part of retained part.
8. component according to claim 4, wherein the predefined target zone includes 1M Ω.
9. a kind of flexible circuit, comprising:
Substrate, with electrical pad and conductor on the end of the substrate and the defining operation part before the end
The marginal portion expanded outwardly, wherein each conductor in conductor extends from the electrical pad of one in electrical pad；And
Ink, to contact some electrical pads in electrical pad and cover having for some operation parts in operation part
The pattern of predefined shape and on substrate formed one layer so that ground connection user skin and ink between contact so that by
The electrostatic charge that electrical pad or conductor carry is transmitted to ground connection user via ink,
Wherein ink has electricity smaller than the conductivity of electrical pad but bigger than the conductivity of insulating layer associated with substrate
Conductance, and wherein the ink contacts the electrical pad of each of the electrical pad, and
Wherein the predefined shape of ink logo has the conductivity based on ink and predefined size to provide
Electrical pad in predefined target zone and the resistance between operation part.
10. circuit according to claim 9, wherein ink is silk-screen ink.
11. circuit according to claim 9, wherein the resistance is at least 100k Ω.
12. a kind of flexible circuit, comprising:
Substrate, the substrate have end section, and the end section has electrical contact；
At least one insulating layer of deposition on the substrate；
Along the operation part of the substrate, the operation part has surface；And
Deposition on the substrate, be deposited on the surface of the operation part and in the operation part and the electricity
The material extended between at least some of gas contact,
Wherein the material has the conductivity smaller than the conductivity of the electrical contact,
Wherein the material has the conductivity bigger than the conductivity of at least one insulating layer described in the flexible circuit, and
Wherein each electrical contact in electrical contact described in the material, and
Wherein conductivity of the material based on the material with predefined pattern be deposited, with provide the electrical contact and
The resistance in predefined target zone between the operation part.
13. flexible circuit according to claim 12, wherein the predefined target zone includes 1M Ω.
14. flexible circuit according to claim 12, wherein the resistance is at least 100k Ω.
15. flexible circuit according to claim 12, wherein the material is deposited so that accumulation of static electricity is described in
Operation part electric discharge.
16. flexible circuit according to claim 12, wherein the material is deposited so that accumulation of static electricity is described in
Operation part is discharged to ground connection user.
17. flexible circuit according to claim 12, wherein the material is deposited so that coming from the electrical contact
Accumulation of static electricity discharged by the operation part.
18. flexible circuit according to claim 12, wherein the predefined target zone includes quiescent dissipation range.
19. a kind of magnetic memory drive, comprising:
Flexible circuit, comprising:
Substrate, the substrate have end section, and the end section has electrical contact；
At least one insulating layer of deposition on the substrate；
Along the operation part of the substrate, the operation part has surface；And
Deposition on the substrate, be deposited on the surface of the operation part and in the operation part and the electricity
The material extended between at least some of gas contact,
Wherein the material has the conductivity smaller than the conductivity of the electrical contact,
Wherein the material has the conductivity bigger than the conductivity of at least one insulating layer described in the flexible circuit, and
Wherein each electrical contact in electrical contact described in the material,
Wherein conductivity of the material based on the material with predefined pattern be deposited, with provide the electrical contact and
The resistance in predefined target zone between the operation part；And
It is electrically coupled to the magnetic storage head of the flexible circuit.
20. magnetic memory drive according to claim 19, wherein the predefined target zone includes 1M Ω.
21. magnetic memory drive according to claim 19, wherein the resistance is at least 100k Ω.
22. magnetic memory drive according to claim 19, wherein the material is deposited so that accumulation of static electricity passes through
The operation part electric discharge.
23. magnetic memory drive according to claim 19, wherein the material is deposited so that accumulation of static electricity passes through
The operation part is discharged to ground connection user.
24. magnetic memory drive according to claim 19, wherein the material is deposited so that from described electrical
The accumulation of static electricity of contact is discharged by the operation part.
25. magnetic memory drive according to claim 19, wherein the predefined target zone includes quiescent dissipation
Range.
26. a kind of method for being used to form flexible circuit, comprising:
It is deposited at least one insulating layer deposited on substrate；
Electrical contact is formed on the end section of the substrate；
Along substrate formation operation part, the operation part has surface；And
On the substrate and in the upper deposition materials of at least some of described operation part, and make the material described
Extend between at least some of operation part and the electrical contact,
Wherein the material has the conductivity smaller than the conductivity of the electrical contact,
Wherein the material has the conductivity bigger than the conductivity of at least one insulating layer described in the flexible circuit, and
Wherein each electrical contact in electrical contact described in the material, and
Wherein conductivity of the material based on the material with predefined pattern be deposited, with provide the electrical contact and
The resistance in predefined target zone between the operation part.
27. according to the method for claim 26, wherein the predefined target zone includes 1M Ω.
28. according to the method for claim 26, wherein the resistance is at least 100k Ω.
29. further including according to the method for claim 26, depositing the material so that accumulation of static electricity can be by described
Operation part electric discharge.
30. further including according to the method for claim 26, depositing the material so that accumulation of static electricity can be by described
Operation part is discharged to ground connection user.
31. further including according to the method for claim 26, depositing the material so that from the quiet of the electrical contact
Electrodeposition is tired to be discharged by the operation part.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/541,843 | 2014-11-14 | ||
| US14/541,843 US9681542B2 (en) | 2014-11-14 | 2014-11-14 | Flexible circuit with partial ground path |
| PCT/US2015/058930 WO2016077112A1 (en) | 2014-11-14 | 2015-11-04 | Flexible circuit with partial ground path |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107113966A CN107113966A (en) | 2017-08-29 |
| CN107113966B true CN107113966B (en) | 2019-07-16 |
Family
ID=
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644092A (en) * | 1985-07-18 | 1987-02-17 | Amp Incorporated | Shielded flexible cable |
| US6353445B1 (en) * | 1998-11-25 | 2002-03-05 | Ge Medical Systems Global Technology Company, Llc | Medical imaging system with integrated service interface |
| US6995954B1 (en) * | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4644092A (en) * | 1985-07-18 | 1987-02-17 | Amp Incorporated | Shielded flexible cable |
| US6353445B1 (en) * | 1998-11-25 | 2002-03-05 | Ge Medical Systems Global Technology Company, Llc | Medical imaging system with integrated service interface |
| US6995954B1 (en) * | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
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