CN108110125B - Printed conductive structure, light emitting module including the same, and method of manufacturing the same - Google Patents
Printed conductive structure, light emitting module including the same, and method of manufacturing the same Download PDFInfo
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- CN108110125B CN108110125B CN201710387355.4A CN201710387355A CN108110125B CN 108110125 B CN108110125 B CN 108110125B CN 201710387355 A CN201710387355 A CN 201710387355A CN 108110125 B CN108110125 B CN 108110125B
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a printed conductive structure, a light emitting module comprising the same and a manufacturing method thereof. The printed conductive structure comprises a substrate, a first circuit pattern, a second circuit pattern and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by a first conductive ink printed on one surface of the substrate. A gap is formed between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by a second conductive ink printed on the surface of the substrate. The third line pattern directly connects the first line pattern and the second line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
Description
Technical Field
The present invention relates to a printed conductive structure, a light emitting module including the same, and a method of manufacturing the same, and more particularly, to a printed conductive structure having a resistance formed in a printing manner, a light emitting module including the same, and a method of manufacturing the same.
Background
With the increasing saturation of consumer electronics products, such as mobile phones, tablet computers and notebook computers, industries begin to place the center of gravity on the design of consumer electronics products, so as to expect consumer electronics products from home to stand out from numerous consumer electronics products in the market, and to get consumer favor.
In order to decorate the shell of consumer electronic products such as mobile phones, tablet computers or notebook computers to improve the overall texture, the current common design includes arranging the light emitting module in the shell, so that the light emitted by the light emitting module can pass through the hollowed-out patterns on the shell, thereby presenting different visual effects. The conventional light emitting module generally uses a printed circuit board as a power supply line structure, and a resistor is soldered on the printed circuit board to regulate a power supply voltage of the power supply line. However, in response to the demands of thinning and green production of consumer electronic products, development of a thinned power supply circuit structure that does not require a photolithography process, a soldering process or an electroplating process has become a problem to be solved.
Disclosure of Invention
The invention relates to a printed conductive structure, a light emitting module comprising the same and a manufacturing method thereof, which solve the problem that the light emitting module needs to use a printed circuit board prepared by a micro-lithography etching process, a welding process or an electroplating process by virtue of the printed conductive structure with a resistor formed in a printing manner.
A printed conductive structure according to an embodiment of the present invention includes a substrate, a first circuit pattern, a second circuit pattern, and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by a first conductive ink printed on one surface of the substrate. A gap is formed between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by a second conductive ink printed on the surface of the substrate. The third line pattern directly connects the first line pattern and the second line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
An embodiment of the invention provides a light emitting module, which comprises the printed conductive structure, a light emitting element and a light guide plate. The printed conductive structure further includes a fourth line pattern, and the fourth line pattern is located on the substrate. The light-emitting element is arranged on the surface of the substrate and is electrically connected with the second circuit pattern and the fourth circuit pattern. The light guide plate is provided with a containing groove. The light guide plate is arranged on the base material, and the light-emitting element is positioned in the accommodating groove.
A method for manufacturing a printed conductive structure according to an embodiment of the invention includes printing a first conductive ink on a substrate to form a first conductive ink pattern and a second conductive ink pattern, and printing a second conductive ink on the substrate to form a third conductive ink pattern. The first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern. Baking the first conductive ink pattern, the second conductive ink pattern and the third conductive ink pattern to form a first circuit pattern, a second circuit pattern and a third circuit pattern respectively. A gap is formed between the first circuit pattern and the second circuit pattern. The first line pattern and the second line pattern are connected through a third line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
According to the printed conductive structure, the light emitting module including the same and the method of manufacturing the same disclosed in the present invention, the first circuit pattern and the second circuit pattern printed by the first conductive ink are directly connected through the third circuit pattern printed by the second conductive ink, and the second resistivity of the second conductive ink is greater than the first resistivity of the first conductive ink. Thus, a thin power supply circuit structure with a function of controlling the power supply voltage can be obtained without using a photolithography process, a soldering process or an electroplating process.
The foregoing description of the invention and the following description of embodiments are provided to illustrate and explain the spirit and principles of the invention and to provide a further explanation of the invention as set forth in the appended claims.
Drawings
Fig. 1 is an exploded perspective view of a light emitting module according to a first embodiment of the present invention.
Fig. 2 is a cross-sectional view of a light emitting module according to a first embodiment of the present invention.
Fig. 3 is a top view of a printed conductive structure of a light emitting module according to a first embodiment of the present invention.
Fig. 4 is a cross-sectional view of fig. 3 taken along section line 4-4'.
Fig. 5 is a flowchart of a method for manufacturing a light emitting module according to a first embodiment of the present invention.
Fig. 6 to 8 are schematic views of a manufacturing method of a printed conductive structure of a light emitting module according to a first embodiment of the present invention.
Fig. 9 is a cross-sectional view of a printed conductive structure of a light emitting module according to a second embodiment of the present invention.
Wherein, the reference numerals:
100. printed conductive structures
110. Substrate material
111. Surface of the body
120. First circuit pattern
130. Second circuit pattern
140. Third line pattern
150. Fourth line pattern
160. First connecting pad
170. Second connecting pad
180. Protective layer
200. Light-emitting element
300. Light guide plate
310. A first surface
311. Accommodating groove
320. A second surface
330. Adhesive agent
400. Pattern layer
410. Light-transmitting pattern area
G gap
W width
S100-S800 Steps 100-800
Detailed Description
The detailed features and advantages of the present invention will be set forth in the following detailed description of the embodiments, which is provided to enable any person skilled in the art to make and use the present invention, and the related objects and advantages of the present invention will be readily understood by those skilled in the art from the present disclosure, claims, and drawings. The following examples further illustrate the aspects of the invention in detail, but are not intended to limit the scope of the invention in any way.
First, a printed conductive structure 100 and a light emitting module including the printed conductive structure 100 according to a first embodiment of the present invention will be described, with reference to fig. 1 to 4. Fig. 1 is an exploded perspective view of a light emitting module according to a first embodiment of the present invention. Fig. 2 is a cross-sectional view of a light emitting module according to a first embodiment of the present invention. Fig. 3 is a top view of a printed conductive structure of a light emitting module according to a first embodiment of the present invention. Fig. 4 is a cross-sectional view of fig. 3 taken along section line 4-4'. As shown in fig. 1 to 4, the light emitting module of the first embodiment of the present invention includes a conductive structure 100, a light emitting element 200, a light guiding plate 300 and a pattern layer 400.
The printed conductive structure 100 includes a substrate 110, a first circuit pattern 120, a second circuit pattern 130, a third circuit pattern 140, a fourth circuit pattern 150, a first pad 160, a second pad 170 and a protective layer 180. The substrate 110 has a surface 111. The substrate 110 is, for example, a plate or a flexible sheet. The substrate 110 is made of plastic material, and may include Polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), polyethylene (PE), polypropylene (PP), polycycloolefin resin (Polycycloolefin resin), polycarbonate resin (Polycarbonate resin), polyurethane resin (Polyurethane resin) or cellulose triacetate (Triacetate Cellulose, TAC), for example.
The first circuit pattern 120 and the second circuit pattern 130 are located on the surface 111 of the substrate 110. The first circuit pattern 120 and the second circuit pattern 130 have a gap G therebetween, and a width W of the gap G is 0.1 millimeters (mm) to 1 millimeter (mm). The first circuit pattern 120 and the second circuit pattern 130 are formed by a first conductive ink printed on the surface 111. The first conductive ink is an oily ink. The first conductive ink includes, for example, a powder of gold, silver, copper, platinum, or other metal or alloy. The first conductive ink has a first resistivity of, for example, 10 -4 To 10 -6 Ohm-cm (Ω -cm).
The third circuit pattern 140 is located on the surface 111 of the substrate 110, and the third circuit pattern 140 directly connects the first circuit pattern 120 and the second circuit pattern 130. In detail, a portion of the third line pattern 140 is stacked on a side of the first line pattern 120 away from the substrate 110, a portion of the third line pattern 140 is stacked on a side of the second line pattern 130 away from the substrate 110, and another portion of the third line pattern 140 is located in the gap G between the first line pattern 120 and the second line pattern 130. The third circuit pattern 140 is formed by a second conductive ink printed on the surface 111 of the substrate 110. The second conductive ink is an oily ink. The second conductive ink includes, for example, carbon, graphene powder, or carbon nanotubes. The second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity. The second resistivity is, for example, 0.05 to 0.5 ohm-cm (Ω -cm).
In the first embodiment of the present invention, a part of the third line patterns 140 are stacked on the first line patterns 120, another part of the third line patterns 140 are stacked on the second line patterns 120, and another part of the third line patterns 140 are located in the gap G, but not limited thereto. In other embodiments of the present invention, the third line pattern may be entirely located in the gap and directly contact the first line pattern and the second line pattern at the same time.
The fourth line pattern 150 is located on the surface 111 of the substrate 110. The fourth line pattern 150 is formed of a first conductive ink printed on the surface 111. The first and second pads 160 and 170 are located on the surface 111 of the substrate 110. The first pad 160 is connected to the second circuit pattern 130, and the second pad 170 is connected to the fourth circuit pattern. In the first embodiment of the present invention, the first pads 160 and the second pads 170 are formed by the first conductive ink printed on the surface 111, so that the first circuit pattern 120, the second circuit pattern 130, the fourth circuit pattern 150, the first pads 160 and the second pads 170 are printed on the surface 111 of the substrate 110 in the same process step, but not limited thereto. In other embodiments of the present invention, the first and second pads may be formed of different conductive inks or conductive pastes, and thus may not be formed on the surface of the substrate along with the first, second and fourth line patterns. The first circuit pattern 120 and the fourth circuit pattern 150 further have a function of electrically connecting a power supply (not shown), so that power can be supplied to the light emitting element 200 through the first circuit pattern 120 and the fourth circuit pattern 150.
The protective layer 180 covers a portion of the surface of the substrate 110 and simultaneously covers the first, second, third and fourth line patterns 120, 130, 140 and 150. The material of the protective layer 180 includes, for example, a thermosetting resin or a thermoplastic resin, such as polyurethane, a vinyl chloride/vinyl acetate copolymer, polymethacrylate, or epoxy resin. The protection of the protection layer 180 can prevent the circuit pattern on the printed conductive structure 100 from being damaged or deteriorated due to friction or contact with the adhesive during the manufacturing process of the light emitting module, thereby affecting the manufacturing yield of the circuit pattern.
The light emitting device 200 is disposed on the first pad 160 and the second pad 170 on the surface 111 of the substrate 110. The light emitting device 200 is electrically connected to the second circuit pattern 130 and the fourth circuit pattern 150 through the first pad 160 and the second pad 170, respectively. The light emitting element 200 is, for example, a light emitting diode. In the first embodiment of the invention, the light emitting device 200 is disposed on the first pad 160 and the second pad 170 on the surface 111 of the substrate 110, but not limited thereto. In other embodiments of the present invention, the light emitting device may also penetrate through the substrate to connect the first pad and the second pad.
The light guide plate 300 has a first surface 310, a second surface 320, and a receiving groove 311. The accommodating groove 311 is located on the first surface 310 of the light guiding plate 300. The light guide plate 300 is disposed on the surface 111 of the substrate 110 with the first surface 310 facing the substrate 110, such that the first circuit pattern 120, the second circuit pattern 130 and the third circuit pattern 140 are located between the substrate 110 and the light guide plate 300. The light emitting element 200 is located in the accommodating groove 311. The light guide plate 300 is adhered to the substrate 110 by an adhesive 330. The material of the adhesive 330 includes, for example, ethylene-vinyl acetate copolymer (EVA), polyurethane acryl resin, polyester acryl resin, or the like.
In the first embodiment of the present invention, the first circuit pattern 120, the second circuit pattern 130 and the third circuit pattern 140 are located between the substrate 110 and the light guiding plate 300, but not limited thereto. In other embodiments of the present invention, the first circuit pattern, the second circuit pattern and the third circuit pattern may be located on a surface of the substrate away from the light guiding plate, and the light emitting element penetrates through the substrate to connect the first pad and the second pad. In the first embodiment of the invention, the light emitting element 200 is accommodated in the accommodating groove 311 of the first surface 310, but not limited thereto. In other embodiments of the present invention, the accommodating groove may be a through groove penetrating the first surface and the second surface of the light guiding plate, and the light emitting element is accommodated in the through groove.
The pattern layer 400 is disposed on the second surface 320 of the light guiding plate 300 away from the substrate 110. The pattern layer 400 has a light-transmitting pattern area 410, so that most of the light traveling in the light guide plate 300 can exit the light emitting module through the light-transmitting pattern area 410. The orthogonal projection of the light-transmitting pattern area 410 on the substrate 110 is offset from the orthogonal projection of the accommodating groove 311 on the substrate 110, so that the light emitted by the light-emitting device 200 is prevented from directly passing through the light-transmitting pattern area 410, and the brightness uniformity of the light-transmitting pattern area 410 is improved. In the first embodiment of the present invention, the pattern layer 400 is made of opaque material, and the transparent pattern region 410 is a hollowed-out area in the pattern layer 400, but not limited thereto. In other embodiments of the present invention, the pattern layer may be made of a low-transmittance material, and the light-transmittance pattern region may be made of a high-transmittance material.
When silver powder is included in the first conductive ink, the length of the first circuit pattern and the second circuit pattern formed by the silver powder are 5 centimeters (cm), the width is 1 millimeter (mm), the thickness is 11 micrometers (mum), the width of the gap G is 0.25 millimeter, carbon powder is included in the second conductive ink, and the thickness of the third circuit pattern is 7 micrometers, the resistance between the first circuit pattern and the second circuit pattern is 36 ohms. When the width of the gap G in the above condition was 0.35 mm, the resistance between the first line pattern and the second line pattern was 44 ohms. When the width of the gap G in the above condition was 0.45 mm, the resistance between the first line pattern and the second line pattern was 57 ohms. When the width of the gap G in the above condition was 0.55 mm, the resistance between the first line pattern and the second line pattern was 63 ohm.
The above measurement data demonstrate that the printed conductive structure 100 of the present invention can adjust the resistance value of the printed conductive structure without the need for a solder resistance. In this way, when the printed conductive structure 100 of the present invention is applied to a light emitting module, the voltage supplied to the light emitting element 200 can be adjusted to be the normal operating voltage of the light emitting element 200, so that the voltage entering the printed conductive structure is prevented from being higher than the normal operating voltage of the light emitting element 200, and the light emitting element 200 is prevented from being damaged due to the excessively high voltage.
The routing directions and shapes of the first, second and fourth circuit patterns 120, 130 and 150 in the first embodiment of the present invention are merely illustrative examples of the present invention, and those skilled in the art can adjust the present invention according to the spirit and actual requirements to obtain a suitable circuit layout.
Next, a light emitting module according to a second embodiment of the present invention is described with reference to fig. 9. Fig. 9 is a cross-sectional view of a printed conductive structure of a light emitting module according to a second embodiment of the present invention. The light emitting module of the second embodiment of the present invention is similar to the light emitting module of the first embodiment of the present invention, and the difference between the two is the lamination order of the first line pattern, the second line pattern and the third line pattern in the printed conductive structure. The following only describes the structures of the first circuit pattern, the second circuit pattern and the third circuit pattern, and the same points will not be described herein.
The third circuit pattern 140 is located on the surface 111 of the substrate 110. The third circuit pattern 140 is formed by a second conductive ink printed on the surface 111 of the substrate 110. The second conductive ink is an oily ink. The second conductive ink includes, for example, carbon, graphene powder, or carbon nanotubes. The second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity. The second resistivity is, for example, 0.05 to 0.5 ohm-cm (Ω -cm).
The first circuit pattern 120 and the second circuit pattern 130 are located on the surface 111 of the substrate 110, and at least a portion of the first circuit pattern and at least a portion of the second circuit pattern are stacked on the third circuit pattern. In other words, at least a portion of the first circuit pattern and at least a portion of the second circuit pattern are stacked on a side of the third circuit pattern away from the substrate 110. The first circuit pattern 120 and the second circuit pattern 130 have a space therebetweenGap G, width W of gap G is 0.1 millimeters (mm) to 1 millimeter (mm). At least a portion of the third line pattern 140 is exposed in the gap G, and the third line pattern 140 directly connects the first line pattern 120 and the second line pattern 130. The first circuit pattern 120 and the second circuit pattern 130 are formed by a first conductive ink printed on the surface 111. The first conductive ink is an oily ink. The first conductive ink includes, for example, a powder of gold, silver, copper, platinum, or other metal or alloy. The first conductive ink has a first resistivity of, for example, 10 -4 To 10 -6 Ohm-cm (Ω -cm).
Next, a method for manufacturing a light emitting module according to a first embodiment of the present invention is described with reference to fig. 2 and fig. 5 to 8. Fig. 5 is a flowchart of a method for manufacturing a light emitting module according to a first embodiment of the present invention. Fig. 6 to 8 are schematic views of a manufacturing method of a printed conductive structure of a light emitting module according to a first embodiment of the present invention. The manufacturing method of the light emitting module of the first embodiment of the present invention includes the following steps (S100 to S800).
First, a first conductive ink is printed on a substrate to form a first conductive ink pattern, a second conductive ink pattern, and a fourth conductive ink pattern (S100).
In detail, the first conductive ink is printed on the surface of the substrate 110 by using a screen printing, a gravure printing, a relief printing or an inkjet printing method to obtain a first conductive ink pattern, a second conductive ink pattern and a fourth conductive ink pattern. The first conductive ink pattern and the second conductive ink pattern have a gap therebetween having a width of 0.1 mm to 1 mm. The substrate 110 is, for example, a plate or a flexible sheet. The substrate 110 is made of plastic material, and may include Polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polyethylene naphthalate (Polyethylene Naphthalate, PEN), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), polyethylene (PE), polypropylene (PP), polycycloolefin resin (Polycycloolefin resin), polycarbonate resin (Polycarbonate resin), polyurethane resin (Polyurethane resin) or cellulose triacetate (Triacetate Cellulose, TAC), for example. The first conductive ink comprises gold, for exampleOily inks of powders of silver, copper, platinum or other metals or alloys. The first conductive ink has a first resistivity of, for example, 10 -4 To 10 -6 Ohm-cm (Ω -cm). In some embodiments of the invention, when screen printing is used, a pattern of conductive ink having a length of 20 cm is printed on the surface of the substrate at a speed of every 1 to 5 seconds. In another embodiment of the invention, when screen printing is used, the printing speed is such that a 20 cm length of conductive ink pattern is printed on the surface of the substrate every 3.3 seconds. In another embodiment of the invention, when gravure or letterpress printing is used, the printing speed is such that a pattern of conductive ink having a length of 70 cm to 90 cm is printed on the surface of the substrate per second. In another embodiment of the invention, when gravure or letterpress printing is used, the printing speed is 83 cm length of conductive ink pattern printed per second on the surface of the substrate. In another embodiment of the present invention, when ink jet printing is used, the printing speed is from 5 mm to 50 mm of the length of the conductive ink pattern printed per second on the surface of the substrate. In another embodiment of the invention, when ink jet printing is used, the printing speed is 1 cm length of conductive ink pattern per second printed on the surface of the substrate.
Next, the first, second and fourth conductive ink patterns are baked to form first, second and fourth line patterns (S200).
In detail, the first, second and fourth conductive ink patterns are baked at a temperature of 60 to 80 degrees celsius for a period of 5 to 15 minutes. The solvents in the first, second and fourth conductive ink patterns are removed by baking to form the first, second and fourth line patterns 120, 130 and 150. The width W of the gap G between the first and second line patterns 120 and 130 is 0.1 to 1 mm. When the baking temperature is too high or the baking time is too long and a non-heat-resistant substrate is used, the substrate is easily deformed by heat.
Next, a second conductive ink is printed on the substrate to form a third conductive ink pattern (S300).
In detail, the second conductive ink is printed on the surface of the substrate by using a screen printing, gravure printing, relief printing or ink-jet printing method to obtain a third conductive ink pattern, and the third conductive ink pattern is filled in the gap between the first conductive ink pattern and the second conductive ink pattern. The first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern. The second conductive ink is, for example, an oily ink including a powder of carbon, graphite, graphene, carbon nanotubes, or other conductive carbon material. The second conductive ink has a second resistivity of, for example, 0.05 to 0.5 ohm-cm (Ω -cm). In some embodiments of the invention, when screen printing is used, a pattern of conductive ink having a length of 20 cm is printed on the surface of the substrate at a speed of every 1 to 5 seconds. In another embodiment of the invention, when screen printing is used, the printing speed is such that a 20 cm length of conductive ink pattern is printed on the surface of the substrate every 3.3 seconds. In another embodiment of the invention, when gravure or letterpress printing is used, the printing speed is such that a pattern of conductive ink having a length of 70 cm to 90 cm is printed on the surface of the substrate per second. In another embodiment of the invention, when gravure or letterpress printing is used, the printing speed is 83 cm length of conductive ink pattern printed per second on the surface of the substrate. In another embodiment of the present invention, when ink jet printing is used, the printing speed is from 5 mm to 50 mm of the length of the conductive ink pattern printed per second on the surface of the substrate. In another embodiment of the invention, when ink jet printing is used, the printing speed is 1 cm length of conductive ink pattern per second printed on the surface of the substrate.
Next, the third conductive ink pattern is baked to form a third line pattern (S400).
In detail, the third conductive ink pattern is baked at a temperature of 80 to 150 degrees celsius for 15 to 45 minutes. The solvent in the third conductive ink pattern is removed by baking to form the third line pattern 140. The first and second line patterns 120 and 130 are connected through the third line pattern 140.
Next, a protective layer is formed on the substrate and covers the first, second, third and fourth line patterns (S500).
In detail, the protective layer 180 is formed on the surface 111 of the substrate 110 by screen printing, gravure printing, relief printing or inkjet printing, and the protective layer 180 covers the first line pattern 120, the second line pattern 130, the third line pattern 140 and the fourth line pattern 150. The material of the protective layer may be a thermosetting resin or a thermoplastic resin, such as polyurethane, vinyl chloride/vinyl acetate copolymer, polymethacrylate or epoxy resin, but not limited thereto.
Next, the light emitting device is disposed on the substrate and electrically connected to the second circuit pattern and the fourth circuit pattern (S600).
In detail, the light emitting element 200 is, for example, a light emitting diode. The light emitting device 200 is fixed on the surface 111 of the substrate 110 by conductive adhesive, and is electrically connected to the second circuit pattern 130 and the fourth circuit pattern 150 by the first pad 160 and the second pad 170, respectively. The conductive adhesive is, for example, polyester resin silver adhesive or solvent-free epoxy resin silver adhesive. In some embodiments of the present invention, the light emitting device may be fixed on the surface of the substrate by an adhesive, and then electrically connected to the first circuit pattern and the fourth circuit pattern by a conductive adhesive. In another embodiment of the present invention, the light emitting device may also penetrate through the substrate, and then the conductive adhesive is used to electrically connect the light emitting device to the first circuit pattern and the fourth circuit pattern.
Next, a light guide plate is disposed on the substrate (S700).
Specifically, the adhesive 330 is coated on the first surface 310 of the light guiding plate 300 having the accommodating groove 311, or the adhesive 330 is coated on the surface 111 of the substrate 110 where the circuit pattern and the light emitting device 200 are located. Then, the light guide plate 300 and the substrate 110 are bonded by the adhesive 330 such that the first, second, third and fourth line patterns 120, 130, 140 and 150 are located between the substrate 110 and the light guide plate 300, and the light emitting element 200 is located in the receiving groove 311. The light guide plate 300 is made of, for example, polyethylene terephthalate (Polyethylene Terephthalate, PET), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), or Polycarbonate (Polycarbonate). The material of the adhesive 330 includes, for example, ethylene-vinyl acetate copolymer (EVA), polyurethane acryl resin, or polyester acryl resin. In the present embodiment, the first line pattern 120, the second line pattern 130, the third line pattern 140 and the fourth line pattern 150 are located between the substrate 110 and the light guide plate 300, but not limited thereto. In other embodiments of the present invention, the first line pattern, the second line pattern, the third line pattern and the fourth line pattern are located on a surface of the substrate away from the light guiding plate.
Next, a pattern layer is disposed on a surface of the light guide plate away from the substrate (S800).
In detail, the pattern layer 400 having the light-transmitting pattern region 410 is formed on the second surface 320 of the light guide plate 300 by spraying, spin coating, screen printing, gravure printing, relief printing, or ink-jet printing. The orthogonal projection of the transparent pattern area 410 on the substrate 110 is offset from the orthogonal projection of the accommodating groove 311 on the substrate 110. The material of the pattern layer 400 is, for example, polyethylene terephthalate (Polyethylene Terephthalate, PET), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), or Polycarbonate (Polycarbonate). In other embodiments of the present invention, the pattern layer may also be a pattern sticker.
Thus, the thin power supply circuit structure with the function of controlling the power supply voltage and the light emitting module comprising the thin power supply circuit structure can be manufactured according to the manufacturing steps without using a micro-etching process, a welding process or an electroplating process.
In the method for manufacturing the light emitting module according to the first embodiment of the present invention, after the conductive ink pattern is printed on the substrate, baking is performed to form a circuit pattern, and then another conductive ink pattern is printed on the substrate and baked to form another circuit pattern, but not limited thereto. In the method for manufacturing the light emitting module according to the other embodiment of the present invention, after all the conductive ink patterns are printed on the substrate, baking is performed once again to form the circuit pattern.
The light emitting module of the second embodiment of the present invention is similar to the light emitting module of the first embodiment of the present invention in structure, and the manufacturing method thereof is also similar to the manufacturing method of the first embodiment. The difference between the manufacturing methods of the light emitting module of the first embodiment and the second embodiment is a process sequence exchange, and will not be described herein.
In summary, according to the printed conductive structure, the light emitting module including the printed conductive structure and the manufacturing method thereof disclosed in the invention, the first circuit pattern and the second circuit pattern printed by the first conductive ink are directly connected through the third circuit pattern printed by the second conductive ink, and the second resistivity of the second conductive ink is greater than the first resistivity of the first conductive ink, so that the third circuit pattern can be used as a resistive element in the printed conductive structure. Thus, a thin power supply circuit structure with a function of controlling the power supply voltage can be obtained without using a photolithography process, a soldering process or an electroplating process.
Of course, the present invention is capable of other various embodiments and its several details are capable of modification and variation in light of the present invention, as will be apparent to those skilled in the art, without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (19)
1. A printed conductive structure, comprising:
a substrate;
a first circuit pattern and a second circuit pattern formed by a first conductive ink printed on a surface of the substrate, wherein a gap is formed between the first circuit pattern and the second circuit pattern; and
a third circuit pattern formed by a second conductive ink printed on the surface of the substrate, the third circuit pattern directly connecting the first circuit pattern and the second circuit pattern;
the first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
2. The printed conductive structure of claim 1, wherein at least a portion of the third line pattern is located in the gap between the first line pattern and the second line pattern.
3. The printed conductive structure of claim 2, wherein a portion of the third line pattern is stacked on the first line pattern and another portion of the third line pattern is stacked on the second line pattern.
4. The printed conductive structure of claim 1, wherein at least a portion of the first circuit pattern and at least a portion of the second circuit pattern are stacked on a side of the third circuit pattern away from the substrate.
5. The printed conductive structure of claim 1, further comprising a protective layer on the surface of the substrate and covering the first, second and third circuit patterns.
6. The printed conductive structure of claim 1, wherein the substrate is a flexible substrate and the substrate comprises polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyethylene, polypropylene, polycycloolefin resin, polycarbonate resin, polyurethane resin, or cellulose triacetate.
7. The printed conductive structure of claim 1, wherein the gap has a width of 0.1 to 1 cm.
8. The printed conductive structure of claim 1, wherein the first conductive ink and the second conductive ink are oil-based inks.
9. A light emitting module, comprising:
the printed conductive structure of any one of claims 1-8, further comprising a fourth line pattern on the substrate;
a light emitting element disposed on the substrate and electrically connected to the second circuit pattern and the fourth circuit pattern; and
the light guide plate is provided with a containing groove, the light guide plate is arranged on the base material, and the light-emitting element is contained in the containing groove.
10. The light emitting module of claim 9, further comprising a patterned layer disposed on the light guide plate and away from the substrate, the patterned layer having a light transmissive pattern region.
11. The lighting module of claim 10, wherein the orthogonal projection of the light transmissive pattern region on the substrate is offset from the orthogonal projection of the receiving groove on the substrate.
12. The light emitting device of claim 9, wherein the first, second, third and fourth line patterns are located between the substrate and the light guide plate.
13. A method of manufacturing a printed conductive structure, comprising:
printing a first conductive ink on a substrate to form a first conductive ink pattern and a second conductive ink pattern, and printing a second conductive ink on the substrate to form a third conductive ink pattern, wherein the first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern; and
baking the first conductive ink pattern, the second conductive ink pattern and the third conductive ink pattern to form a first circuit pattern, a second circuit pattern and a third circuit pattern respectively, wherein a gap is reserved between the first circuit pattern and the second circuit pattern, and the first circuit pattern and the second circuit pattern are connected through the third circuit pattern;
the first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.
14. The method of claim 13 further including forming a protective layer over the substrate, the protective layer covering the first, second and third circuit patterns.
15. The method of claim 13, wherein the substrate is a flexible substrate, and the substrate comprises polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyethylene, polypropylene, polycycloolefin resin, polycarbonate resin, polyurethane resin, or cellulose triacetate.
16. The method of manufacturing a printed conductive structure according to claim 13, wherein the gap has a width of 0.1 to 1 cm.
17. The method of manufacturing a printed conductive structure according to claim 13, wherein the first conductive ink contains a metal powder and a resin, and the first conductive ink has a resistivity of 10 -4 To 10 -6 Ohm-cm.
18. The method of manufacturing a printed conductive structure according to claim 13, wherein the second conductive ink contains carbon and a resin, and the second conductive ink has a resistivity of 0.05 to 0.5 ohm-cm.
19. The method of claim 13, wherein the baking temperature is 60 to 150 degrees celsius and the time period is 5 to 45 minutes.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW105138735 | 2016-11-24 | ||
| TW105138735A TWI629806B (en) | 2016-11-24 | 2016-11-24 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
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| Publication Number | Publication Date |
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| CN108110125A CN108110125A (en) | 2018-06-01 |
| CN108110125B true CN108110125B (en) | 2024-04-02 |
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| CN201720603194.3U Withdrawn - After Issue CN206907790U (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure and light emitting module including the same |
| CN201710387355.4A Active CN108110125B (en) | 2016-11-24 | 2017-05-26 | Printed conductive structure, light emitting module including the same, and method of manufacturing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TWI629806B (en) * | 2016-11-24 | 2018-07-11 | 正美企業股份有限公司 | Ink-printed conductive structure, light emitting module including the same, and manufacturing methods thereof |
| TWI658765B (en) * | 2018-09-28 | 2019-05-01 | 正美企業股份有限公司 | Conductive circuit structure and passive wireless sensing device using the same |
| CN111065219B (en) * | 2018-10-17 | 2021-05-25 | 昆山华冠商标印刷有限公司 | Decoration assembly |
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| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
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| WO2016049647A1 (en) * | 2014-09-26 | 2016-03-31 | Texas Instruments Incorporated | Printed interconnects for semiconductor packages |
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| US7113179B2 (en) * | 2004-06-23 | 2006-09-26 | Interlink Electronics, Inc. | Force sensing resistor with calibration element and method of manufacturing same |
| US20060176350A1 (en) * | 2005-01-14 | 2006-08-10 | Howarth James J | Replacement of passive electrical components |
| US20090268450A1 (en) * | 2005-11-28 | 2009-10-29 | Katsutoshi Kojoh | Lighting device and method of producing the same |
| GB2459888B (en) * | 2008-05-09 | 2011-06-08 | Design Led Products Ltd | Capacitive sensing apparatus |
| US20150257278A1 (en) * | 2014-03-06 | 2015-09-10 | Tactotek Oy | Method for manufacturing electronic products, related arrangement and product |
| TWM545417U (en) * | 2016-11-24 | 2017-07-11 | 正美企業股份有限公司 | Ink-printed conductive structure and light emitting module including the same |
-
2016
- 2016-11-24 TW TW105138735A patent/TWI629806B/en active
-
2017
- 2017-05-26 CN CN201720603194.3U patent/CN206907790U/en not_active Withdrawn - After Issue
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040036780A (en) * | 2002-10-24 | 2004-05-03 | 대덕전자 주식회사 | Method of manufacturing resistor-embedded printed circuit board |
| JP2011061243A (en) * | 2010-12-22 | 2011-03-24 | Toshiba Corp | Flexible printed circuit board |
| WO2016049647A1 (en) * | 2014-09-26 | 2016-03-31 | Texas Instruments Incorporated | Printed interconnects for semiconductor packages |
| CN105307393A (en) * | 2015-11-13 | 2016-02-03 | 惠州市金百泽电路科技有限公司 | Manufacturing technology for improving resistance precision of conductive carbon oil printed circuit board |
| CN206907790U (en) * | 2016-11-24 | 2018-01-19 | 昆山华冠商标印刷有限公司 | Printed conductive structure and light emitting module including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN206907790U (en) | 2018-01-19 |
| TWI629806B (en) | 2018-07-11 |
| TW201820658A (en) | 2018-06-01 |
| CN108110125A (en) | 2018-06-01 |
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