CN108110125B - Printed conductive structure, light emitting module including same and method of manufacturing same - Google Patents

Abstract

The invention discloses a printed conductive structure, a light emitting module comprising the same and a manufacturing method thereof. The printed conductive structure comprises a substrate, a first circuit pattern, a second circuit pattern and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by a first conductive ink printed on one surface of the substrate. A gap is formed between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by a second conductive ink printed on the surface of the substrate. The third line pattern directly connects the first line pattern and the second line pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.

Description

Printed conductive structure, light emitting module including same and method of manufacturing same

Technical field

The present invention relates to a printed conductive structure, a light-emitting module including the printed conductive structure and a manufacturing method of the printed conductive structure, in particular to a printed conductive structure with a resistor formed by printing, a light-emitting module including the same and a manufacturing method thereof.

Background technique

As the demand for consumer electronic products, such as mobile phones, tablet computers and laptops, gradually reaches saturation in the market, industry players have begun to focus on the appearance design of consumer electronic products, hoping that their own consumer electronic products can stand out from the numerous consumer electronic products on the market and win the favor of consumers.

In order to decorate the shell of consumer electronic products such as mobile phones, tablet computers or laptops to enhance their overall texture, the commonly used design currently includes setting the light-emitting module in the shell so that the light emitted by the light-emitting module can pass through the hollow pattern on the shell to present different visual effects. Existing light-emitting modules usually use a printed circuit board as a power supply circuit structure, and solder resistors on the printed circuit board to adjust the power supply voltage of the power supply circuit. However, in the face of the demand for thinning and green production of consumer electronic products, the development of a thin power supply circuit structure that does not require the use of lithography, welding or electroplating processes has become a problem that needs to be solved urgently.

Summary of the invention

The present invention relates to a printed conductive structure, a light-emitting module including the same and a manufacturing method thereof. The printed conductive structure having a resistor formed by printing solves the problem that the light-emitting module needs to be prepared using a photolithography process, a welding process or an electroplating process. Printed circuit board issues.

A printed conductive structure according to an embodiment of the present invention includes a substrate, a first circuit pattern, a second circuit pattern and a third circuit pattern. The first circuit pattern and the second circuit pattern are formed by a first conductive ink printed on a surface of the substrate. There is a gap between the first circuit pattern and the second circuit pattern. The third circuit pattern is formed by a second conductive ink printed on the surface of the substrate. The third circuit pattern directly connects the first circuit pattern and the second circuit pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.

A light-emitting module according to an embodiment of the present invention includes the aforementioned printed conductive structure, a light-emitting element and a light guide plate. The aforementioned printed conductive structure further includes a fourth circuit pattern, and the fourth circuit pattern is located on the substrate. The light-emitting element is disposed on the surface of the substrate and is electrically connected to the second circuit pattern and the fourth circuit pattern. The light guide plate has a receiving groove. The light guide plate is arranged on the base material, and the light-emitting element is located in the accommodation groove.

A method for manufacturing a printed conductive structure according to an embodiment of the present invention includes printing a first conductive ink on a substrate to form a first conductive ink pattern and a second conductive ink pattern, and printing a second conductive ink on a substrate. The substrate is formed with a third conductive ink pattern. The first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern. The first conductive ink pattern, the second conductive ink pattern and the third conductive ink pattern are baked to form a first circuit pattern, a second circuit pattern and a third circuit pattern respectively. There is a gap between the first circuit pattern and the second circuit pattern. The first circuit pattern and the second circuit pattern are connected through the third circuit pattern. The first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.

According to the printed conductive structure, the light-emitting module including the same, and the manufacturing method thereof disclosed in the present invention, the first circuit pattern and the second circuit pattern formed by printing the first conductive ink are directly connected by the third circuit pattern formed by printing the second conductive ink, and the second resistivity of the second conductive ink is greater than the first resistivity of the first conductive ink. In this way, a thin power supply circuit structure with the function of controlling the power supply voltage can be obtained without using a lithography process, a welding process, or an electroplating process.

The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation of the claims of the present invention.

Description of drawings

FIG. 1 is an exploded perspective view of a light emitting module according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of a light emitting module according to a first embodiment of the present invention.

FIG. 3 is a top view of the printed conductive structure of the light-emitting module according to the first embodiment of the present invention.

Figure 4 is a cross-sectional view along the 4-4' section line of Figure 3.

FIG. 5 is a flow chart of a method for manufacturing a light emitting module according to a first embodiment of the present invention.

6 to 8 are schematic diagrams of a method for manufacturing the printed conductive structure of the light-emitting module according to the first embodiment of the present invention.

FIG. 9 is a cross-sectional view of a printed conductive structure of a light emitting module according to a second embodiment of the present invention.

Among them, the reference signs are:

100 Printed conductive structures

110 substrate

111 Surface

120 First Line Pattern

130 Second Line Pattern

140 Third Line Pattern

150 Fourth Line Pattern

160 first pad

170 Second pad

180 protective layer

200 light-emitting components

300 light guide plate

310 first surface

311 storage tank

320 Second Surface

330 Adhesive

400 pattern layers

410 Translucent pattern area

G gap

W Width

S100～S800 Step 100～Step 800

Detailed ways

The detailed features and advantages of the present invention are described in detail below in the embodiments. The content is sufficient to enable any person skilled in the art to understand the technical content of the present invention and implement it according to the content disclosed in this specification, the scope of protection of the claims and With the accompanying drawings, any person skilled in the art can easily understand the relevant objects and advantages of the present invention. The following examples further illustrate the concept of the present invention in detail, but do not limit the scope of the present invention in any way.

First, the printed conductive structure 100 and the light-emitting module including the printed conductive structure 100 according to the first embodiment of the present invention are introduced. Please refer to FIGS. 1 to 4 . Figure 1 is an exploded perspective view of a light emitting module according to the first embodiment of the present invention. Figure 2 is a cross-sectional view of the light-emitting module according to the first embodiment of the present invention. FIG. 3 is a top view of the printed conductive structure of the light-emitting module according to the first embodiment of the present invention. Figure 4 is a cross-sectional view along the 4-4' section line of Figure 3. As shown in FIGS. 1 to 4 , the light-emitting module according to the first embodiment of the present invention includes a brush conductive structure 100 , a light-emitting element 200 , a light guide plate 300 and a pattern layer 400 .

The printed conductive structure 100 includes a substrate 110, a first circuit pattern 120, a second circuit pattern 130, a third circuit pattern 140, a fourth circuit pattern 150, a first pad 160, and a second pad 170 and a protective layer 180. The substrate 110 has a surface 111 . The base material 110 is, for example, a plate or a flexible sheet. The base material 110 is made of plastic material, such as polyimide (PI), polyethylene terephthalate (PET), or polyethylene naphthalate (PEN). , polymethylmethacrylate (PMMA), polyethylene (PE), polypropylene (PP), polycycloolefin resin (Polycycloolefin resin), polycarbonate resin (Polycarbonate resin), polyurethane resin ( Polyurethane resin) or Triacetate Cellulose (TAC).

The first circuit pattern 120 and the second circuit pattern 130 are located on the surface 111 of the substrate 110 . There is a gap G between the first circuit pattern 120 and the second circuit pattern 130, and the width W of the gap G is 0.1 millimeter (mm) to 1 millimeter (mm). The first circuit pattern 120 and the second circuit pattern 130 are formed by the first conductive ink printed on the surface 111 . The first conductive ink is oil-based ink. The first conductive ink includes, for example, powders of gold, silver, copper, platinum or other metals or alloys. The first conductive ink has a first resistivity, and the first resistivity is, for example, 10 ^-4 to 10 ^-6 ohm·cm (Ω·cm).

The third circuit pattern 140 is located on the surface 111 of the substrate 110, and the third circuit pattern 140 directly connects the first circuit pattern 120 and the second circuit pattern 130. Specifically, a part of the third circuit pattern 140 is stacked on the side of the first circuit pattern 120 away from the substrate 110, and a part of the third circuit pattern 140 is stacked on the side of the second circuit pattern 130 away from the substrate. On one side of 110, another part of the third circuit pattern 140 is located in the gap G between the first circuit pattern 120 and the second circuit pattern 130. The third circuit pattern 140 is formed by a second conductive ink printed on the surface 111 of the substrate 110 . The second conductive ink is oil-based ink. The second conductive ink includes, for example, carbon, graphene powder or carbon nanotubes. The second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity. The second resistivity is, for example, 0.05 to 0.5 ohm·cm (Ω·cm).

In the first embodiment of the present invention, a part of the third circuit pattern 140 is stacked on the first circuit pattern 120, another part of the third circuit pattern 140 is stacked on the second circuit pattern 120, and a third part of the third circuit pattern 140 is stacked on the second circuit pattern 120. Located in the gap G, but not limited to this. In other embodiments of the present invention, the third circuit pattern may be completely located in the gap and directly contact the first circuit pattern and the second circuit pattern at the same time.

The fourth circuit pattern 150 is located on the surface 111 of the substrate 110 . The fourth circuit pattern 150 is formed by the first conductive ink printed on the surface 111 . The first pad 160 and the second pad 170 are both located on the surface 111 of the substrate 110 . The first pad 160 is connected to the second circuit pattern 130, and the second pad 170 is connected to the fourth circuit pattern. In the first embodiment of the present invention, the first pad 160 and the second pad 170 are both formed by the first conductive ink printed on the surface 111. Therefore, the first circuit pattern 120, the second circuit pattern 130, the fourth The circuit pattern 150, the first pad 160 and the second pad 170 are all printed on the surface 111 of the substrate 110 in the same process step, but this is not a limitation. In other embodiments of the present invention, the first pad and the second pad may be formed of different conductive inks or conductive adhesives, and therefore may not be formed together with the first circuit pattern, the second circuit pattern, and the fourth circuit pattern. The surface of the substrate. The first circuit pattern 120 and the fourth circuit pattern 150 also have the function of electrically connecting a power supply (not shown), so that power can be provided to the light emitting element 200 through the first circuit pattern 120 and the fourth circuit pattern 150 .

The protective layer 180 covers a portion of the surface of the substrate 110, and also covers the first circuit pattern 120, the second circuit pattern 130, the third circuit pattern 140, and the fourth circuit pattern 150. The material of the protective layer 180 includes, for example, a thermosetting resin or a thermoplastic resin, such as polyurethane, vinyl chloride/vinyl acetate copolymer, polymethacrylate, or epoxy resin. Through the protection of the protective layer 180, the circuit pattern on the printed conductive structure 100 can be prevented from being damaged or deteriorated due to friction or contact with adhesive during the manufacturing process of the light-emitting module, thereby affecting the manufacturing yield of the circuit pattern.

The light emitting element 200 is disposed on the first pad 160 and the second pad 170 on the surface 111 of the substrate 110. The light emitting element 200 is electrically connected to the second circuit pattern 130 and the fourth circuit pattern 150 through the first pad 160 and the second pad 170 respectively. The light emitting element 200 is, for example, a light emitting diode. In the first embodiment of the present invention, the light emitting element 200 is disposed on the first pad 160 and the second pad 170 on the surface 111 of the substrate 110, but is not limited thereto. In other embodiments of the present invention, the light emitting element may also penetrate the substrate to connect the first pad and the second pad.

The light guide plate 300 has a first surface 310 and a second surface 320 opposite to each other, and a receiving groove 311 . The accommodating groove 311 is located on the first surface 310 of the light guide plate 300 . The light guide plate 300 is disposed on the surface 111 of the base material 110 with the first surface 310 facing the base material 110, so that the first circuit pattern 120, the second circuit pattern 130 and the third circuit pattern 140 are located between the base material 110 and the light guide plate 300. between. The light-emitting element 200 is located in the accommodating groove 311. The light guide plate 300 and the base material 110 are bonded by an adhesive 330 . The material of the adhesive 330 includes, for example, ethylene-vinylacetate copolymer (EVA), polyurethane acrylic resin or polyester acrylic resin.

In the first embodiment of the present invention, the first circuit pattern 120, the second circuit pattern 130 and the third circuit pattern 140 are located between the substrate 110 and the light guide plate 300, but the present invention is not limited thereto. In other embodiments of the present invention, the first circuit pattern, the second circuit pattern and the third circuit pattern may be located on the surface of the substrate away from the light guide plate, and the light-emitting element penetrates the substrate to connect the first pad and the second pad. In the first embodiment of the present invention, the light-emitting element 200 is accommodated in the accommodating groove 311 of the first surface 310, but the present invention is not limited thereto. In other embodiments of the present invention, the accommodating groove may be a through groove that penetrates the first surface and the second surface of the light guide plate, and the light-emitting element is accommodated in the through groove.

The pattern layer 400 is disposed on the second surface 320 of the light guide plate 300 away from the base material 110 . The pattern layer 400 has a light-transmitting pattern area 410, so that most of the light traveling in the light guide plate 300 can pass through the light-transmitting pattern area 410 and leave the light-emitting module. The orthogonal projection of the light-transmitting pattern area 410 on the base material 110 and the orthogonal projection of the receiving groove 311 on the base material 110 are offset, thereby preventing the light emitted from the light-emitting element 200 from directly passing through the light-transmitting pattern area 410, thereby improving the transmittance. Brightness uniformity of light pattern area 410. In the first embodiment of the present invention, the pattern layer 400 is made of an opaque material, and the light-transmitting pattern area 410 is a hollowed-out area in the pattern layer 400, but it is not limited to this. In other embodiments of the present invention, the pattern layer may be made of a low-light-transmitting material, and the light-transmitting pattern area may be made of a high-light-transmitting material.

When the first conductive ink includes silver powder, the first and second circuit patterns formed therefrom have a length of 5 cm, a width of 1 mm, a thickness of 11 μm, and a width of the gap G of 0.25 mm, and the second conductive ink includes carbon powder, and the thickness of the third circuit pattern is 7 μm, the resistance between the first and second circuit patterns is 36 ohms. When the width of the gap G in the above conditions is 0.35 mm, the resistance between the first and second circuit patterns is 44 ohms. When the width of the gap G in the above conditions is 0.45 mm, the resistance between the first and second circuit patterns is 57 ohms. When the width of the gap G in the above conditions is 0.55 mm, the resistance between the first and second circuit patterns is 63 ohms.

The above measurement data illustrates that the printed conductive structure 100 of the present invention does not require welding resistors to adjust the resistance value of the printed conductive structure. In this way, when the printed conductive structure 100 of the present invention is applied to a light-emitting module, the voltage supplied to the light-emitting element 200 can be adjusted to the normal operating voltage of the light-emitting element 200, thereby preventing the voltage entering the printed conductive structure from being higher than the normal operating voltage of the light-emitting element 200. , to prevent the light-emitting element 200 from being damaged due to excessive voltage.

The routing directions and shapes of the first circuit pattern 120 , the second circuit pattern 130 and the fourth circuit pattern 150 in the first embodiment of the present invention are only examples for illustrating the present invention. Those skilled in the art can refer to the spirit of the present invention. Adjust to actual needs to obtain a suitable line layout.

Next, the light-emitting module according to the second embodiment of the present invention will be described. Please refer to FIG. 9 . FIG. 9 is a cross-sectional view of the printed conductive structure of the light-emitting module according to the second embodiment of the present invention. The light-emitting module according to the second embodiment of the present invention is similar to the light-emitting module according to the first embodiment of the present invention. The difference lies in the stacking sequence of the first circuit pattern, the second circuit pattern and the third circuit pattern in the printed conductive structure. Only the structures of the first circuit pattern, the second circuit pattern and the third circuit pattern will be described below, and the similarities will not be described again.

The third circuit pattern 140 is located on the surface 111 of the substrate 110 . The third circuit pattern 140 is formed by a second conductive ink printed on the surface 111 of the substrate 110 . The second conductive ink is oil-based ink. The second conductive ink includes, for example, carbon, graphene powder or carbon nanotubes. The second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity. The second resistivity is, for example, 0.05 to 0.5 ohm·cm (Ω·cm).

The first circuit pattern 120 and the second circuit pattern 130 are located on the surface 111 of the substrate 110, and at least part of the first circuit pattern and at least part of the second circuit pattern are stacked on the third circuit pattern. In other words, at least part of the first circuit pattern and at least part of the second circuit pattern are stacked on the side of the third circuit pattern away from the substrate 110. There is a gap G between the first circuit pattern 120 and the second circuit pattern 130, and the width W of the gap G is 0.1 mm to 1 mm. At least part of the third circuit pattern 140 is exposed in the gap G, and the third circuit pattern 140 directly connects the first circuit pattern 120 and the second circuit pattern 130. The first circuit pattern 120 and the second circuit pattern 130 are formed by a first conductive ink printed on the surface 111. The first conductive ink is an oil-based ink. The first conductive ink, for example, includes powders of gold, silver, copper, platinum or other metals or alloys. The first conductive ink has a first resistivity, and the first resistivity is, for example, ^10-4 to ^10-6 ohm·cm (Ω·cm).

Next, the manufacturing method of the light-emitting module according to the first embodiment of the present invention will be described. Please refer to FIG. 2 and FIG. 5 to FIG. 8 . FIG. 5 is a flow chart of the manufacturing method of the light-emitting module according to the first embodiment of the present invention. 6 to 8 are schematic diagrams of a method for manufacturing the printed conductive structure of the light-emitting module according to the first embodiment of the present invention. The manufacturing method of a light emitting module according to the first embodiment of the present invention includes the following steps (S100 to S800).

First, the first conductive ink is printed on the substrate to form the first conductive ink pattern, the second conductive ink pattern and the fourth conductive ink pattern (S100).

In detail, the first conductive ink is printed on the surface of the substrate 110 by screen printing, gravure printing, relief printing or inkjet printing to obtain a first conductive ink pattern, a second conductive ink pattern and a fourth conductive ink pattern. There is a gap with a width of 0.1 mm to 1 mm between the first conductive ink pattern and the second conductive ink pattern. The substrate 110 is, for example, a plate or a flexible sheet. The substrate 110 is made of plastic material, for example, may include polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), polyethylene (PE), polypropylene (PP), polycycloolefin resin, polycarbonate resin, polyurethane resin or triacetate cellulose (TAC). The first conductive ink is, for example, an oily ink including powders of gold, silver, copper, platinum or other metals or alloys. The first conductive ink has a first resistivity, and the first resistivity is, for example, 10 ^-4 to 10 ^-6 ohm·cm (Ω·cm). In some embodiments of the present invention, when screen printing is used, the printing speed is 1 to 5 seconds to print a conductive ink pattern with a length of 20 cm on the surface of the substrate. In another embodiment of the present invention, when screen printing is used, the printing speed is 3.3 seconds to print a conductive ink pattern with a length of 20 cm on the surface of the substrate. In another embodiment of the present invention, when gravure printing or relief printing is used, the printing speed is 70 cm to 90 cm per second to print a conductive ink pattern with a length of 90 cm on the surface of the substrate. In another embodiment of the present invention, when gravure printing or relief printing is used, the printing speed is 83 cm per second to print a conductive ink pattern with a length of 83 cm on the surface of the substrate. In another embodiment of the present invention, when inkjet printing is used, the printing speed is 5 mm to 50 mm per second to print a conductive ink pattern with a length of 5 mm on the surface of the substrate. In another embodiment of the present invention, when inkjet printing is used, the printing speed is 1 cm per second to print a conductive ink pattern with a length of 1 cm on the surface of the substrate.

Next, the first conductive ink pattern, the second conductive ink pattern and the fourth conductive ink pattern are baked to form the first circuit pattern, the second circuit pattern and the fourth circuit pattern (S200).

Specifically, the first conductive ink pattern, the second conductive ink pattern, and the fourth conductive ink pattern are baked at a temperature of 60 to 80 degrees Celsius for 5 to 15 minutes. The solvent in the first conductive ink pattern, the second conductive ink pattern, and the fourth conductive ink pattern is removed by baking to form the first line pattern 120, the second line pattern 130, and the fourth line pattern 150. The width W of the gap G between the first line pattern 120 and the second line pattern 130 is 0.1 mm to 1 mm. When the baking temperature is too high or the baking time is too long and a non-heat-resistant substrate is used, the substrate is easily deformed by heat.

Next, a second conductive ink is printed on the substrate to form a third conductive ink pattern ( S300 ).

Specifically, the second conductive ink is printed on the surface of the substrate using screen printing, gravure printing, relief printing or inkjet printing to obtain a third conductive ink pattern, and the third conductive ink pattern is filled into the first conductive ink pattern. in the gap between the ink pattern and the second conductive ink pattern. The first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern. The second conductive ink is, for example, an oil-based ink including powder of carbon, graphite, graphene, carbon nanotubes or other conductive carbon materials. The second conductive ink has a second resistivity, and the second resistivity is, for example, 0.05 to 0.5 ohm·cm (Ω·cm). In some embodiments of the present invention, when screen printing is used, the printing speed is to print a conductive ink pattern with a length of 20 cm on the surface of the substrate every 1 to 5 seconds. In another embodiment of the present invention, when screen printing is used, the printing speed is to print a conductive ink pattern with a length of 20 cm on the surface of the substrate every 3.3 seconds. In another embodiment of the present invention, when gravure printing or letterpress printing is used, the printing speed is to print a conductive ink pattern with a length of 70 cm to 90 cm per second on the surface of the substrate. In another embodiment of the present invention, when gravure printing or letterpress printing is used, the printing speed is to print a conductive ink pattern with a length of 83 cm per second on the surface of the substrate. In another embodiment of the present invention, when inkjet printing is used, the printing speed is to print a conductive ink pattern with a length of 5 mm to 50 mm on the surface of the substrate per second. In another embodiment of the present invention, when inkjet printing is used, the printing speed is to print a conductive ink pattern with a length of 1 cm per second on the surface of the substrate.

Next, the third conductive ink pattern is baked to form a third circuit pattern (S400).

Specifically, the third conductive ink pattern is baked at a temperature of 80 to 150 degrees Celsius, and the baking time is 15 to 45 minutes. The solvent in the third conductive ink pattern is removed by baking to form the third circuit pattern 140 . The first circuit pattern 120 and the second circuit pattern 130 are connected through the third circuit pattern 140 .

Next, a protective layer is formed on the base material and covers the first circuit pattern, the second circuit pattern, the third circuit pattern and the fourth circuit pattern (S500).

Specifically, the protective layer 180 is formed on the surface 111 of the substrate 110 by screen printing, gravure printing, relief printing or inkjet printing, and the protective layer 180 covers the first circuit pattern 120, the second circuit pattern 130, and the second circuit pattern 130. The third line pattern 140 and the fourth line pattern 150. The protective layer may be made of thermosetting resin or thermoplastic resin, such as polyurethane, vinyl chloride/vinyl acetate copolymer, polymethacrylate or epoxy resin, but is not limited thereto.

Next, a light-emitting element is disposed on the substrate and electrically connected to the second circuit pattern and the fourth circuit pattern (S600).

In detail, the light-emitting element 200 is, for example, a light-emitting diode. The light-emitting element 200 is fixed to the surface 111 of the substrate 110 by means of a conductive adhesive, and is electrically connected to the second circuit pattern 130 and the fourth circuit pattern 150 by means of a first pad 160 and a second step pad 170, respectively. The conductive adhesive is, for example, a polyester resin silver adhesive or a solvent-free epoxy resin silver adhesive. In some embodiments of the present invention, the light-emitting element may also be fixed to the surface of the substrate by means of an adhesive, and then the light-emitting element is electrically connected to the first circuit pattern and the fourth circuit pattern by means of a conductive adhesive. In another embodiment of the present invention, the light-emitting element may also penetrate the substrate, and then the light-emitting element is electrically connected to the first circuit pattern and the fourth circuit pattern by means of a conductive adhesive.

Next, the light guide plate is placed on the base material (S700).

Specifically, the adhesive 330 is applied to the first surface 310 of the light guide plate 300 having the receiving groove 311 , or the adhesive 330 is applied to the surface 111 of the substrate 110 where the circuit pattern and the light-emitting element 200 are located. Then, the light guide plate 300 and the base material 110 are bonded through the adhesive 330, so that the first circuit pattern 120, the second circuit pattern 130, the third circuit pattern 140 and the fourth circuit pattern 150 are located between the base material 110 and the light guide plate 300. , and the light-emitting element 200 is located in the accommodating groove 311. The light guide plate 300 is made of, for example, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA) or polycarbonate. The material of the adhesive 330 includes, for example, ethylene-vinyl acetate copolymer (EVA), polyurethane acrylic resin or polyester acrylic resin. In this embodiment, the first circuit pattern 120, the second circuit pattern 130, the third circuit pattern 140 and the fourth circuit pattern 150 are located between the base material 110 and the light guide plate 300, but it is not limited to this. In other embodiments of the present invention, the first circuit pattern, the second circuit pattern, the third circuit pattern and the fourth circuit pattern are located on the surface of the base material away from the light guide plate.

Next, a pattern layer is disposed on the surface of the light guide plate away from the base material (S800).

Specifically, the pattern layer 400 having the light-transmitting pattern area 410 is formed on the second surface 320 of the light guide plate 300 by spraying, spin coating, screen printing, gravure printing, letterpress printing or inkjet printing. The orthogonal projection of the light-transmitting pattern area 410 on the base material 110 is offset from the orthogonal projection of the accommodating groove 311 on the base material 110 . The pattern layer 400 is made of, for example, polyethylene terephthalate (PET), polymethylmethacrylate (PMMA) or polycarbonate. In other embodiments of the present invention, the pattern layer can also be a pattern sticker.

In this way, according to the aforementioned manufacturing steps, a thin power supply circuit structure without the use of photolithography, welding or electroplating processes and with the function of controlling the supply voltage can be produced, as well as a light-emitting module including this thin power supply circuit structure. .

In the manufacturing method of the light-emitting module according to the first embodiment of the present invention, after the conductive ink pattern is printed on the substrate, it is first baked to form a circuit pattern, and then another conductive ink pattern is printed on the substrate and baked to form another circuit pattern. A line pattern, but not limited to this. In the manufacturing method of the light-emitting module according to other embodiments of the present invention, all the conductive ink patterns can be printed on the substrate first, and then baked at once to form the circuit pattern.

The light emitting module of the second embodiment of the present invention has a similar structure to the light emitting module of the first embodiment of the present invention, and its manufacturing method is also similar to the manufacturing method of the first embodiment. The difference between the manufacturing methods of the light emitting modules of the first embodiment and the second embodiment is that the process sequence is changed, which will not be repeated here.

In summary, according to the printed conductive structure, the light-emitting module including the same and the manufacturing method disclosed in the present invention, the third circuit pattern formed by printing with the second conductive ink is directly connected to the third circuit pattern formed by printing with the first conductive ink. A circuit pattern and a second circuit pattern, and the second resistivity of the second conductive ink is greater than the first resistivity of the first conductive ink, so that the third circuit pattern can be used as a resistive element in the printed conductive structure. In this way, a thin power supply circuit structure can be obtained that does not require the use of photolithography, welding or electroplating processes and has the function of controlling the supply voltage.

Of course, the present invention can also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention. However, these corresponding Changes and deformations should fall within the protection scope of the appended claims of the present invention.

Claims (19)

1. A printed conductive structure, comprising:

a substrate;

a first circuit pattern and a second circuit pattern formed by a first conductive ink printed on a surface of the substrate, wherein a gap is formed between the first circuit pattern and the second circuit pattern; and

a third circuit pattern formed by a second conductive ink printed on the surface of the substrate, the third circuit pattern directly connecting the first circuit pattern and the second circuit pattern;

the first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.

2. The printed conductive structure of claim 1, wherein at least a portion of the third line pattern is located in the gap between the first line pattern and the second line pattern.

3. The printed conductive structure of claim 2, wherein a portion of the third line pattern is stacked on the first line pattern and another portion of the third line pattern is stacked on the second line pattern.

4. The printed conductive structure of claim 1, wherein at least a portion of the first circuit pattern and at least a portion of the second circuit pattern are stacked on a side of the third circuit pattern away from the substrate.

5. The printed conductive structure of claim 1, further comprising a protective layer on the surface of the substrate and covering the first, second and third circuit patterns.

6. The printed conductive structure of claim 1, wherein the substrate is a flexible substrate and the substrate comprises polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyethylene, polypropylene, polycycloolefin resin, polycarbonate resin, polyurethane resin, or cellulose triacetate.

7. The printed conductive structure of claim 1, wherein the gap has a width of 0.1 to 1 cm.

8. The printed conductive structure of claim 1, wherein the first conductive ink and the second conductive ink are oil-based inks.

9. A light emitting module, comprising:

the printed conductive structure of any one of claims 1-8, further comprising a fourth line pattern on the substrate;

a light emitting element disposed on the substrate and electrically connected to the second circuit pattern and the fourth circuit pattern; and

the light guide plate is provided with a containing groove, the light guide plate is arranged on the base material, and the light-emitting element is contained in the containing groove.

10. The light emitting module of claim 9, further comprising a patterned layer disposed on the light guide plate and away from the substrate, the patterned layer having a light transmissive pattern region.

11. The lighting module of claim 10, wherein the orthogonal projection of the light transmissive pattern region on the substrate is offset from the orthogonal projection of the receiving groove on the substrate.

12. The light emitting device of claim 9, wherein the first, second, third and fourth line patterns are located between the substrate and the light guide plate.

13. A method of manufacturing a printed conductive structure, comprising:

printing a first conductive ink on a substrate to form a first conductive ink pattern and a second conductive ink pattern, and printing a second conductive ink on the substrate to form a third conductive ink pattern, wherein the first conductive ink pattern and the second conductive ink pattern are connected through the third conductive ink pattern; and

baking the first conductive ink pattern, the second conductive ink pattern and the third conductive ink pattern to form a first circuit pattern, a second circuit pattern and a third circuit pattern respectively, wherein a gap is reserved between the first circuit pattern and the second circuit pattern, and the first circuit pattern and the second circuit pattern are connected through the third circuit pattern;

the first conductive ink has a first resistivity, the second conductive ink has a second resistivity, and the second resistivity is greater than the first resistivity.

14. The method of claim 13 further including forming a protective layer over the substrate, the protective layer covering the first, second and third circuit patterns.

15. The method of claim 13, wherein the substrate is a flexible substrate, and the substrate comprises polyimide, polyethylene terephthalate, polyethylene naphthalate, polymethyl methacrylate, polyethylene, polypropylene, polycycloolefin resin, polycarbonate resin, polyurethane resin, or cellulose triacetate.

16. The method of manufacturing a printed conductive structure according to claim 13, wherein the gap has a width of 0.1 to 1 cm.

17. The method of manufacturing a printed conductive structure according to claim 13, wherein the first conductive ink contains a metal powder and a resin, and the first conductive ink has a resistivity of 10 ^-4 To 10 ^-6 Ohm-cm.

18. The method of manufacturing a printed conductive structure according to claim 13, wherein the second conductive ink contains carbon and a resin, and the second conductive ink has a resistivity of 0.05 to 0.5 ohm-cm.

19. The method of claim 13, wherein the baking temperature is 60 to 150 degrees celsius and the time period is 5 to 45 minutes.