TWI574185B - Conductive film, touch panel including the conductive film and display apparatus including the conductive film - Google Patents

Description

Conductive film, touch panel containing the same, and display device containing the same

The present invention relates to a conductive film and a touch panel and display device including the same.

Recently, a conductive film including a transparent conductive film has been applied to various electronic devices such as a display, a touch panel, and the like. Such a conductive film is formed by forming a transparent conductive (low resistance) film on a plastic substrate and patterning the transparent conductive film.

Prior art transparent conductive films are typically formed by vacuum deposition of materials such as indium tin oxide. However, the use of indium tin oxide results in high material costs, and vacuum deposition results in low productivity. Further, indium tin oxide does not have flexibility, and thus it is difficult to apply it to a flexible electronic device. Moreover, the high electrical resistance of indium tin oxide makes it difficult to apply indium tin oxide to large area electronic devices.

Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a conductive film, a touch panel including the same, and a display device including the same, and the conductive film has excellent performance And can be manufactured by a simple process and can be applied to a touch panel.

According to an embodiment, the present invention provides a conductive film for use in a touch panel, the conductive film comprising: a base member having a sensing region and an inactive region defined therein; a sensing electrode formed In the sensing region and the inactive region on the base member, the sensing electrode includes a nanomaterial conductor defining a network structure; a cover coating configured to cover The sensing region and the sensing electrode in the inactive region; and a wiring electrode formed on the overcoat layer in the inactive region, the wiring electrode including a pad portion electrically connected to the sensing electrode And a wiring portion connected to the pad portion, wherein the overcoat layer includes a first portion located between the sensing electrode and the wiring electrode and including a recess, the recess including passing through the At least one perforation formed by covering the coating and a film portion for providing the first portion having a smaller thickness than the remainder of the coating.

According to another embodiment, the present invention provides a touch panel including the above-mentioned conductive film and a sensing electrode for the touch panel, the sensing electrode is separated from the sensing electrode of the conductive film and configured Extending in a direction across the sensing electrode of the conductive film.

According to still another embodiment, the present invention provides a display device including the above touch panel and a display panel located behind the touch panel for displaying images.

10‧‧‧First conductive film

12‧‧‧First base component

14‧‧‧First sensing electrode

14a‧‧‧Nano material conductor

14b‧‧‧ Residual

16‧‧‧First wiring electrode

18‧‧‧First cover coating

18a‧‧‧Perforation

18b‧‧‧ Film section

19‧‧‧First flexible printed circuit board

20‧‧‧Second conductive film

22‧‧‧Second base component

24‧‧‧Second sensing electrode

26‧‧‧Second wiring electrode

28‧‧‧Second overlay coating

28a‧‧‧Perforation

29‧‧‧Second flexible printed circuit board

30‧‧‧ Covering substrate

32‧‧‧hard coating

40‧‧‧pressure tools

42‧‧‧First transparent adhesive layer/pressure block

44‧‧‧Second transparent adhesive layer

100‧‧‧ touch panel

142‧‧‧First sensor section

144‧‧‧ first connection

146‧‧‧First wiring connection

146a‧‧‧ Groove

162‧‧‧First pad section

164‧‧‧First wiring part

180‧‧‧ recess

181‧‧‧Part 1

181a‧‧‧Area

182‧‧‧Part II

200‧‧‧ display device

210‧‧‧Frame

220‧‧‧ display panel

230‧‧‧Backlight unit

232‧‧‧Lighting elements

234‧‧‧ circuit board

236‧‧‧ reflector

237‧‧‧Lighting unit

239‧‧‧Light diffuser

240‧‧‧Back cover

242‧‧‧Second sensor section

244‧‧‧Second connection

246‧‧‧Second wiring connection

262‧‧‧Second pad section

264‧‧‧Second wiring part

280‧‧‧ recess

AA‧‧‧Active Area

NA‧‧‧inactive area

T1‧‧‧first thickness

T3‧‧‧ thickness

T4‧‧ depth

T5‧‧ depth

T6‧‧ depth

The above and other objects, features, and other advantages of the present invention will be more clearly understood from 2 is a cross-sectional view taken along line II-II of FIG. 1; FIG. 3 is a perspective view showing an example of a pressure tool forming a recess in the touch panel shown in FIG. 1; FIG. 4 is a view A cross-sectional view of a portion of a touch panel in accordance with an alternative embodiment of the present invention; FIG. 5 is a cross-sectional view showing a portion of a touch panel in accordance with another alternative embodiment of the present invention; and FIG. 6 is a view showing still another alternative embodiment in accordance with the present invention a plan view of a portion of the touch panel; FIG. 7 is a plan view showing a portion of the touch panel according to a further alternative embodiment of the present invention; and FIG. 8 is a cross-sectional view showing the touch panel according to another embodiment of the present invention; FIG. 10 is a cross-sectional view showing a touch panel according to another embodiment of the present invention; FIG. 10 is a cross-sectional view showing a touch panel according to a further embodiment of the present invention; and FIG. 11 is a view showing an embodiment according to an embodiment of the present invention; A schematic perspective view of the device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the invention is not limited to the embodiments and various changes can be made.

In the drawings, parts that are not related to the description are described in a clear and concise manner, and the same reference numerals are used throughout the description to refer to the same or very similar parts. Further, the thickness, width, and the like are increased or reduced in the drawings for the sake of clarity, but the thickness, width, and the like of the present invention are not limited to the description of the drawings.

In addition, throughout the specification, when an element is referred to as "comprising" another element, the term "comprising" is intended to mean the existence of another element, and does not exclude the existence of other additional elements unless the context clearly dictates otherwise. In addition, when an element such as a layer, a film, an area or a plate is referred to as being "on" another element, the one element can be directly on the other element and one or more intervening elements It can also exist. In contrast, when an element such as a layer, a film, an area, or a plate is referred to as being "directly on" another element, there are no one or more intervening elements.

Hereinafter, a touch panel, a method of manufacturing the touch panel, and a conductive film included in the touch panel and a method of manufacturing the same according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. Further, a display device including the touch panels according to an embodiment of the present invention will be described in detail.

1 is a plan view showing a touch panel according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II of FIG. 1. For clarity and concise description, in FIG. 1, the first sensing electrode 14 and the second sensing electrode 24 are preferentially described with the first wiring electrode 16 and the second wiring electrode 26, and the cover substrate 30 is not described. Transparent adhesive layer 42 and second transparent adhesive layer 44, first base member 12 and second base member 22, first cover coating 18 and second cover coat 28, and the like.

As exemplarily shown in FIGS. 1 and 2, the touch panel 100 according to the present embodiment includes an active area AA and an inactive area NA located around the active area AA. The active area AA is an area in which the sensing electrodes 14 and 24 are provided for touch sensing by a user's hand or an input device such as a stylus pen. The inactive area NA is a touch control unit in which a display is connected to an external circuit (for example, a display device that controls the touch panel 100) for transmission in the active area. The areas of the Flexible Printed Circuit Boards (FPCBs) 19 and 29 and the wiring electrodes 16 and 26 connected to the FPCBs 19 and 29, etc., are sensed in the AA. In addition, a border, a black printed layer, or the like may be disposed in the inactive area NA, wherein the frame and the black printed layer are used to physically fix various layers, components, and the like constituting the touch panel 100 and are used to cover These and various other elements are provided in the inactive area NA.

The touch panel 100 according to the present embodiment includes a first conductive film 10 having a first sensing electrode 14 and a first wiring electrode 16 connected to the first sensing electrode 14 and a second sensing electrode 24 configured To be isolated from the first sensing electrode 14; and a second wiring electrode 26 connected to the second sensing electrode 24.

In the present embodiment, the second sensing electrode 24 and the second wiring electrode 26 are disposed on the second base member 22 to constitute the second conductive film 20. In addition, the touch panel 100 further includes a cover substrate 30, a first transparent adhesive layer 42 that adheres the cover substrate 30 and the first conductive film 10 to each other, and a second transparent adhesive layer 44 that the first conductive film 10 and the first conductive film 10 The two conductive films 20 are adhered to each other. This will be explained in more detail below.

The cover substrate 30 may be formed of a material that protects the touch panel 100 from external impact and allows light to be transmitted through the touch panel 100. For example, the cover substrate 30 may be formed of glass. However, the present invention is not limited thereto, and various changes can be made to the material covering the substrate 30 and the like.

The first transparent adhesive layer 42 is interposed between the cover substrate 30 and the first conductive film 10 to bond them to each other, and the second transparent adhesive layer 44 is interposed between the first conductive film 10 and the second conductive film 20 to place them Combine with each other. The plurality of layers constituting the touch panel 100 may be integrally coupled to each other by the first transparent adhesive layer 42 and the second transparent adhesive layer 44. In this case, after the first flexible printed circuit board 19 and the second flexible printed circuit board 29 are adhered to the first conductive film 10 and the second conductive film 20, the first conductive film 10 and the second conductive film The film 20 is bonded to the first transparent adhesive layer 42 and/or the second transparent adhesive layer 44, respectively.

The first transparent adhesive layer 42 and the second transparent adhesive layer 44 may be formed of a material having adhesiveness to allow layers on both sides thereof to be adhered thereto and also having light transmissivity, in particular, may be made of optical glue (Optical Clear) Adhhesive, OCA) formation. The optical adhesive has excellent adhesion and high moisture resistance, heat resistance, foaming and workability and prevents first feeling Degradation of the measuring electrode 14 and/or the second sensing electrode 24 and the first wiring electrode 16 and/or the second wiring electrode 26. The first transparent adhesive layer 42 and the second transparent adhesive layer 44 may be formed of any of various known optical glues.

The first conductive film 10 and the second conductive film 20 are disposed on the cover substrate 30 (on the lower surface of the cover substrate 30 in the drawing). In the present embodiment, although the first sensing electrode 14 is formed on the first base member 12 to constitute the first conductive film 10 and the second sensing electrode 24 is formed on the second base member 22 to constitute the second conductive The film 20, but the invention is not limited thereto and various changes can be made. This will be explained in more detail later with reference to Figs. 8 to 10.

The first conductive film 10 includes a first pedestal element 12, a first sensing electrode 14 formed on the first pedestal element 12, a first overcoat layer 18 covering the first sensing electrode 14, and first A wiring electrode 16 is formed on the first overcoat layer 18 and electrically connected to the first sensing electrode 14 in the inactive region NA.

The first base member 12 may take the form of a film, a sheet, a substrate, or the like and may be formed of a material having light transmissivity and insulation and capable of maintaining the mechanical strength of the first conductive film 10. The first base member 12 may be made of polyethylene, polypropylene, polyethylene terephthalate, polyethylene 2,6-naphthalenedicarboxylate, polypropyl terephthalate, polyimine, poly Amidoxime, polyether oxime, polyetheretherketone, polycarbonate, polyarylate, cellulose propionate, polyvinyl chloride, polyvinylidene chloride, polyvinyl alcohol, polyether phthalimide, polyphenylene At least one of thioether, polyphenylene ether, polystyrene, and the like is formed. For example, the first base member 12 may be formed of polyethylene terephthalate, although the invention is not limited thereto, and the first base member 12 may be formed of any of various other materials other than the materials described above.

The first sensing electrode 14 formed on the first base member 12 includes a first sensor portion 142 and a first connecting portion 144 that respectively connects adjacent first sensor portions 142 to each other, and the first sensing The first portion 142 and the first connecting portion 144 are disposed in the active area AA, and the first wiring connecting portion 146 is extended by the first sensor portion 142 or the first connecting portion 144 located in the active area AA so as to be inactive District NA.

The first sensor portion 142 is used to sufficiently sense the touch through the input device or the user's finger. The figure illustrates that the first sensor portion 142 has a diamond shape and occupies a wide area in the active area AA, along with the second sensor portion 242 of the second sensing electrode 24 to effectively sense the touch. However, the present invention is not limited thereto and the first sensor portion 142 may There are any of various other shapes such as a polygonal shape including a triangular shape and a rectangular shape, a circle, an ellipse, and the like. The first connection portion 144 is for interconnecting the first sensor portion 142 in the first direction (horizontal direction of the drawing). As such, the first sensing electrode 14 can extend a long length in the first direction within the active area AA.

The first wiring connection portion 146 extends from the first sensor portion 142 or the first connection portion 144 into the inactive area NA and has a direct connection or an electrical connection to the first wiring electrode 16 (in particular, the first pad portion 162) Some parts of it. The drawing illustrates that each of the first wiring connection portions 146 is a part of the diamond shape of the first sensor portion 142. With such a configuration, the first wiring connection portion 146 may have a pattern similar to that of the first sensor portion 142 and have a relatively large width or area which ensures between the first wiring connection portion 146 and the first gasket portion 162 Easy to connect. In this case, the first wiring connection portion 146 is stacked on the first wiring electrode 16 (particularly, the first pad portion 162) for a firm connection with the first pad portion 162. This will be explained in more detail below when the first wiring electrode 16 is described.

In the present embodiment, the first sensing electrode 14 is formed of a transparent and electrically conductive light transmissive material. For example, the first sensing electrode 14 may include a nanomaterial conductor 14a having a mesh structure (for example, a metal nanowire exemplified by a silver nanowire, a copper nanowire, a platinum nanowire, etc.). Here, the network structure is a structure in which, for example, a neighboring nanomaterial conductor of a nanowire is entangled at its contact point to form a network, a mesh or the like, whereby electrical connection is achieved via the contact point.

Because the first sensing electrode 14 includes a transparent and electrically conductive nanomaterial conductor 14a, the first sensing electrode 14 can be formed via a wet coating process that has a lower processing cost than deposition. That is, the first sensing electrode 14 may be formed by wet coating a paste, ink, mixture, solution, or the like including a nanomaterial conductor such as a nanowire to form an electrode layer and pattern the electrode layer. . In this case, the concentration of the nanomaterial conductor 14a included in the solution, the mixture, the paste, and the like used in the wet coating is very low (for example, 1% or less). Therefore, the synthesized first sensing electrode 14 can be manufactured at a lower cost and thus productivity is improved.

In addition, the first sensing electrode 14 including the nanomaterial conductor 14a can achieve low electrical resistance and excellent electrical performance while being capable of conducting light. For example, the surface of the silver (Ag) nanoparticle may have various crystal faces, and thus easily cause anisotropic growth and enable the silver nanowire to be easily produced. The silver nanowire may have a resistance of about 10 Ω/m 2 to 400 Ω/m 2 , which gives a first impression The measuring electrode 14 has a low resistance of about 10 Ω/m 2 to 150 Ω/m 2 . Therefore, the first sensing electrode 14 can have any of various resistances. In particular, the first sensing electrode 14 can exhibit a higher electrical conductivity than indium tin oxide having a resistance of about 200 Ω/m 2 to 400 Ω/m 2 . Further, the silver nanowire may have a higher light transmittance (for example, 90% or more) than indium tin oxide. Furthermore, the silver nanowires can be flexible and therefore suitable for use in flexible devices and the provision of such materials is stable.

As described above, for example, the nanowire (especially, the silver nanowire) may have a radius of 10 nm to 60 nm and a long axis length of 10 μm to 200 μm . Within this range, the silver nanowires can have a high aspect ratio (for example, 1:300 to 1:20000), thus forming a mesh structure and effectively protecting the first sensing electrode 14. However, the present invention is not limited thereto and the radius, the major axis length, and the aspect ratio of the nanowire may vary.

In the present embodiment, since the first sensing electrode 14 includes the nano material conductor 14a having a mesh structure, reduction in material cost and various performance improvements are achieved.

The first sensing electrode 14 in the form of a conductive layer comprising a nanomaterial conductor 14a having a mesh structure as described above may be configured such that the nanomaterial conductor 14a is present in a layer having a uniform thickness, or a void is present in Between the nanomaterial conductors 14a. Indeed, the first sensing electrode 14 can be formed via the application of a mixture of nanomaterial conductors 14a and a minimal amount of solvent, binder, and the like. Therefore, the first sensing electrode 14 includes the residual portion 14b formed of a solvent, a binder, or the like, and the residual portion 14b has a relatively small first thickness T1 such that the conductor 14a extends outside the residual portion 14b. Therefore, the mesh structure defined by the conductor 14a may have a relatively large second thickness T2. In the following description, it is noted that the thickness of the first sensing electrode 14 is not the first thickness T1 representing the residual portion 14b, but represents the entire thickness of the residual portion 14b and a layer in which the conductor 14a protruding upward from the residual portion 14b is present, that is, , the second thickness T2.

The thickness of the first sensing electrode 14 may vary to different values depending on the size of the touch panel 100, the required resistance value, and the material of the first sensing electrode 14. In this case, when the first sensing electrode 14 includes a metal nanowire having a mesh structure, the thickness of the first sensing electrode 14 can be minimized. For example, the first sensing electrode 14 may have a thickness of 50 nm to 350 nm because this thickness ensures that the first sensing electrode 14 having a desired resistance is easily formed. However, the present invention is not limited thereto, and the thickness of the first sensing electrode 14 may have any various other values.

First covering of the first sensing electrode 14 overlying the first base member 12 Layer 18 serves to physically and chemically protect first sensing electrode 14. More specifically, the first cover coat layer 18 is configured to surround all of the conductors 14a extending out of the residual portion 14b to prevent damage to the conductor 14a or oxidation of the conductor 14a. More specifically, the first cover coat layer 18 can physically protect the conductor 14a that protrudes upward from the residual portion 14b to prevent the conductor 14a from being bent by an external force or the like.

Further, since the conductor 14a can be oxidized when exposed to the outside air for a long time, thus exhibiting a reduced conductivity, the first overcoat layer 18 can be formed to cover the conductor 14a. In the present embodiment, since the first sensing electrode 14 includes the nano material conductor 14a having a mesh structure, provision can improve the physical stability of the conductor 14a and prevent oxidation of the conductor 14a.

For example, some first overcoat layers 18 may be introduced into the voids between the conductors 14a to fill the cavities, and some of the first overcoat layer 18 may be present over the conductors 14a. Unlike the present embodiment, even when the conductor 14a is included in the residual portion 14a instead of protruding upward from the residual portion 14b, the first cover coat layer 18 can be used to prevent the conductor 14a from being oxidized by the outside air entering the residual portion 14a. Thus, the first overcoat layer 18 can be formed in direct contact with the first sensing electrode 14 or the conductor 14a.

Further, the first overcoat layer 18 may be entirely formed on the first pedestal member 12 to cover the first sensing electrode 14. Here, the term "all formed" means not only a perfect formation, no empty area, but also a necessity to omit the formation of some parts.

The first cover coat layer 18 as described above may be formed of a resin. For example, the first cover coat 18 may be formed of an acrylic resin. However, the present invention is not limited thereto, and the first cover coat 18 may be formed of any of various other materials. Additionally, the first overcoat layer 18 can form a first sensing electrode 14 that covers all of the various coating methods.

For example, the first cover coat layer 18 may have a thickness of 50 nm to 200 nm. When the thickness of the first overcoat layer 18 is less than 50 nm, the first overcoat layer 18 fails to sufficiently prevent oxidation of the conductor 14a. When the thickness of the first cover coat layer 18 exceeds 200 nm, the material cost increases. However, the invention is not limited thereto, and the thickness of the first cover coat layer 18 may include various other values.

The drawings and the above embodiment illustrate that the residual portion 14b of the first sensing electrode 14 and the first overcoat layer 18 are configured as different layers. However, the invention is not limited thereto. In another embodiment, for example, by supplying ink that is a mixture of the conductor 14a of the first sensing electrode 14 and the constituent material of the residual portion 14b and the first overcoat layer 18, the conductor 14a may be included in a single A cover coat 18 is included. Various other changes can also be made.

Provided on the first overcoat layer 18 in the inactive area NA is the first wiring electrode 16 connected to the first wiring connection portion 146. More specifically, the first wiring electrode 16 includes a first pad portion 162 stacked on the first wiring connection portion 146 with a first overcoat layer 18 interposed therebetween, thereby being electrically connected to the first wiring connection portion 146 And a first wiring portion 164 that extends outward from the first pad portion 162. In this case, the width of the first pad portion 162 may be greater than the width of the first wiring portion 164 to achieve a stable connection between the first pad portion 162 and the first wire connecting portion 146.

As described above, the first cover coat layer 18 can physically protect the first sensing electrode 14 including the nano material conductor 14a having a mesh structure, and prevent the problem of oxidation due to the conductor 14a. Therefore, the first overcoat layer 18 of the present embodiment is located above the first sensor portion 142 and the first connection portion 144 of the first sensing electrode 14 and the first wiring connection portion 146 located in the inactive region NA. Above.

Therefore, in the present embodiment, since the first overcoat layer 18 is located between the first sensing electrode 14 and the first wiring electrode 16 (particularly, between the first wiring connecting portion 146 and the first pad portion 162) The first overcoat layer 18 may cause deterioration of the connection between the first sensing electrode 14 and the first wiring electrode 16. This is because, although the first overcoat layer 18 has a small thickness and does not hinder the electrical connection between the first sensing electrode 14 and the first wiring electrode 16, the first overcoat layer 18 may be formed of an insulating resin or the like. Therefore, it has the function of electrical connection.

For clarity of description, hereinafter, the first overcoat layer 18 is located between the first wiring connecting portion 146 and the first pad portion 162 (for example, between the first wiring connecting portion 146 and the first pad portion 162 so as to The portion in contact therewith will be referred to as the first portion 181, and in addition to the first portion 181, another portion of the first cover coat 18 covering the first sensor portion 142 will be referred to as the second portion 182. While the second portion 182 of the first overcoat layer 18 serves to enhance the performance of the first sensor portion 142 described above, and the first portion 181 of the first overcoat layer 18 serves to enhance the performance of the first wiring connection portion 146, The first portion 181 may cause deterioration of electrical connection between the first wiring connection portion 146 and the first gasket portion 162.

In view of this problem, in the present embodiment, each of the first portions 181 includes the through holes 18a formed in some of its positions to allow the first wiring connecting portion 146 to contact and connect the first pad portion 162. Since the first portion 181 is used to raise the first wiring connection portion 146 as above The performance, preferably in the region of the first portion 181 between the first wiring connecting portion 146 and the first pad portion 162, remaining after the perforations 18a are formed at some positions, covers the first wiring connecting portion 146 to prevent For example, the oxidation of the conductor 14a in the first wiring connection portion 146.

Although the present embodiment illustrates that the perforations 18a are formed in some positions of the first portion 181 through the first portion 181, the region of the first portion 181 has a smaller thickness than the remaining portion to form a film portion (see reference numeral 18b of Fig. 5). . This will be explained in detail below with reference to Fig. 5.

For example, assume that a large area of perforations 18a is formed in the first overcoat layer 18 that covers the first sensing electrode 14. Oxidation of the first sensing electrode 14 (particularly, the first wiring connecting portion 146) may occur, causing deterioration in performance of the first sensing electrode 14. In view of this problem, in the present embodiment, a plurality of small-area perforations 18a may be formed between each of a first wiring connecting portion 146 and a first pad portion 162 connected to the first wiring connecting portion 146. A first part 181. In this manner, the first overcoat layer 18 can achieve a stable connection between the first wiring connection portion 146 and the first gasket portion 162 while still providing the first sensing electrode 14 with improved performance.

For example, 4 to 64 perforations 18a may be formed in each of the first portions 181. When the number of the perforations 18a formed in each of the first portions 181 is less than 4, the electrical connection may be insufficient. When the number of the perforations 18a exceeds 64, the area of the first overcoat layer 18 in the first portion 181 is too small, which may make it difficult for the first overcoat layer 18 to improve the performance of the first wiring connecting portion 146. However, the present invention is not limited thereto, and it is sufficient to provide each of the first portions 181 having two or more through holes 18a.

In this case, it is contemplated that the perforations 18a can have any of a variety of configurations. For example, the through holes 18a may be disposed in a matrix in a plurality of columns and a plurality of rows of each of the first portions 181. This configuration can ensure a uniform and dense connection between the first wiring connecting portion 146 and the first gasket portion 162, and increases between the nanomaterial conductor 14a and the first gasket portion 162 of the first wiring connecting portion 146. The possibility of connection.

Furthermore, this regular configuration of the perforations 18a can reduce the shock applied via the first wiring connection portion 146 during the formation of the perforations 18a, thereby minimizing any damage to the nanomaterial 14a. This is because the perforations 18a are formed by applying pressure to the first portion 181 of the first cover coat layer 18. The formation of the perforations 18a will be described in more detail below.

For example, the perforations 18a in each of the first portions 181 can be arranged to have a matrix of 2 to 8 columns and 2 to 8 rows. Such a matrix is configured to maximize the electrical connection through the perforations 18a and the effects obtained by the first portion 181. More specifically, the perforations 18a may be provided in a matrix having 3 to 5 columns and 3 to 5 rows. However, the invention is not limited thereto, and other changes can be made.

The columns or rows of the perforations 18a may be disposed parallel to one side of the first wiring connection portion 146, but may not be disposed parallel to the edge of the first wiring connection portion 146. Various other configurations are equally possible.

Here, the area of the region 181a (see Fig. 1) in which the through holes 18a (i.e., the areas of the virtual regions defined by the outermost peripheral perforations 18a of all the through holes 18a) are provided may be all the first wiring connections. The portion 146 or all of the first pad portion 162 is in the range of 20% to 80% of the area. When the area of the region 181a is less than 20%, the area occupied by the through holes 18a is too small, which may cause an insufficient electrical connection between the first wiring connecting portion 146 and the first pad portion 162. When the area of the region 181a exceeds 80%, the area occupied by the through holes 18a is excessively large, which may require an increase in the configuration accuracy with respect to the first wiring connecting portion 146. This is because a decrease in configuration accuracy may cause the perforations 18a to be formed in an undesired position.

In this case, the length or width of the region 181a in which the perforations 18a are provided may be in the range of 15% to 85% of the length or width of the first pad portion 162. When the length or width of the region 181a is less than 15%, the area occupied by the perforations 18a is too small, which may cause an insufficient electrical connection between the first wiring connecting portion 146 and the first pad portion 162.

When the length or width of the region 181a exceeds 85%, the area occupied by the through holes 18a is excessively large, which may require an increase in the configuration accuracy with respect to the first wiring connecting portion 146. This is because the decrease in the configuration accuracy may cause the perforation 18a to be formed in an unnecessary position instead of being formed in the first wiring connection portion 146. However, the present invention is not limited thereto, and the area and length or width of the region 181a may include various other numerical values.

The entire area of the perforations 18a (the total value of the areas of all the perforations 18a) may be in the range of 30% to 50% of the area of the region 181a where the perforations 18a are provided. When the area of the through hole 18a is less than 30%, the area of the through hole 18a is insufficient, and this may cause an insufficient electrical connection between the first wiring connecting portion 146 and the first pad portion 162. When the area of the perforation 18a is super When 50% is exceeded, the area of the first overcoat layer 18 in each of the first portions 181 is reduced, and this may cause deterioration in performance of the first wiring connecting portion 146.

For example, the width or diameter of each of the perforations 18a may be in the range of 10 μm to 500 μm. Here, the maximum width or diameter of the perforations 18a, or the major axis length of the perforations 18a, may be determined as the width or diameter of the perforations 18a. When the width or diameter of each of the perforations 18a is less than 10 μm, the electrical connection may be inefficient. When the width or diameter of each of the perforations 18a exceeds 500 μm, the area of the first overcoat layer 18 in each of the first portions 181 is reduced, which may cause deterioration in performance of the first wiring connecting portion 146. In order to achieve an improvement in the electrical connection and performance of the first wiring connecting portion 146, the width or diameter of the through holes 18a may be in the range of 10 μm to 100 μm. However, the present invention is not limited thereto, and the width or diameter of the perforations 18a may be varied to various other values.

Further, the distance between adjacent perforations 18a may be in the range of 0.1 mm to 0.9 mm. Here, the shortest distance between adjacent perforations 18a can be determined as the distance between adjacent perforations 18a. When the distance between the adjacent perforations 18a is less than 0.1 mm, the area of the first overcoat layer 18 in each of the first portions 181 is reduced, which may cause deterioration in performance of the first wiring connection portion 146. When the distance between adjacent perforations 18a exceeds 0.9 mm, electrical connections may be inefficient. However, the present invention is not limited thereto, and the distance between the perforations 18a may vary to various other values.

Each of the perforations 18a may have any of various shapes such as a polygonal shape including a rectangular shape and a triangular shape, a circular shape, an elliptical shape, a wedge shape, and the like.

In the present embodiment, the perforation 18a can be placed on the first cover coat 18 by applying a pressure tool 40 as exemplarily shown in Fig. 3 including a pressure block 42 having a pointed tip such as a pin and then applying pressure. It is formed to cause damage or damage of the first cover coat layer 18. Thereby, the perforations 18a can take the form of a pressurization point (i.e., a crack generated by pressure or a recess or a notch generated by pressure). This is possible because the first cover coat 18 has a small thickness. By using the formation of the perforation 18a by this method, the perforations 18a can be formed without complicated patterning, such as etching with a mask, etc.

Since the formation of the perforations 18a utilizes a pressure tool 40 having a pressure block 42 having a pointed end, the perforations 18a have a position opposite the first base member 12 (i.e., at the surface of the first overcoat layer 18 (ie, at the surface of the first overcoat layer 18 ( Outer surface) or away from the first base member 12 and the first electricity The position of the pole 14 is a small area. This is because the first cover coat 18 is first formed and then the perforations 18a are formed by applying pressure to the surface of the first cover coat 18 using the pressure tool 40. For example, as the area of the perforations 18a may gradually increase with increasing distance from the first base member 12, the perforations 18a may have a notched cross-section (eg, a V-shaped cross section).

The side of the perforation 18a may have a greater surface roughness than the surface roughness of the surface of the first cover coat 18. When the perforation 18a is formed by applying pressure to the first cover coat 18 to cause damage or damage of the first cover coat 18 as described above, the side of the perforation 18a may be due to the pressure applied during the formation of the perforation 18a. Has a considerable surface roughness. For example, the surface roughness of the side surface of the through hole 18a may be 10 nm or more (for example, in the range of 10 nm to 10 μm), and the surface roughness of the surface of the first cover coat layer 18 may be less than 10 nm.

However, the surface roughness of the side surface of the perforation 18a may vary depending on the processing conditions or the like when the perforation 18a is formed, and the surface roughness of the surface of the first overcoat layer 18 may be formed according to the constituent material of the first overcoat layer 18. The method changes and so on. Therefore, the present invention is not limited to the above numerical values.

The perforation 18a may be formed through the first cover coating 18 such that the tip end of the perforation 18a (ie, the end of the perforation 18a proximate the first base member 12) contacts the first wiring connection portion 146. In this case, as shown in the drawing, the through hole 18a extends to the first wiring connecting portion 146 to increase the first pad portion 162 contacting the first sensing electrode 14 (in particular, in the first wiring connecting portion 146) The possibility of the nanomaterial conductor 14a. That is, the through holes 18a may be formed in the first overcoat layer 18 and the first wiring connecting portion 146. Thereby, the first pad portion 162 filling the through hole 18a can reach the inside of the first wiring connecting portion 146, thus achieving the connection with the nano material conductor 14a of the first wiring connecting portion 146 is improved. For example, the depth T4 of the through hole 18a formed in the first wiring connection portion 146 may be within a range of 40% to 100% of the thickness T3 of the first wiring connection portion 146. This results in an increase in the connection between the first wiring connecting portion 146 and the first pad portion 162.

However, the invention is not limited thereto and various modifications are possible. Therefore, the depth T4 of the through hole 18a formed in the first wiring connecting portion 146 may be 40% or less of the thickness T3 of the first wiring connecting portion 146. Furthermore, the position of the perforations 18a can be changed. This will be explained below with reference to Figs. 4 and 5. Figures 4 and 5 show the replacement according to the present invention. A cross-sectional view of the through hole 18a of the first conductive film 10 of the embodiment is shown, and a part of the enlarged circle corresponding to the right side of the second figure is displayed.

As exemplarily shown in FIG. 4, the perforations 18a may extend to the first base member 12 and the first cover coating 18 and the first wiring connection portion 146. That is, the through hole 18a may extend through the first cover coat layer 18 and the first wire connecting portion 146 and be formed in the region of the first base member 12. Therefore, the through hole 18a can be sufficiently formed through the first cover coat layer 18, which can stably maximize the connection between the first wire connection portion 146 and the first pad portion 162. In this case, when the through hole 18a is formed in the first base member 12 by an excessively large depth, the structural stability of the first base member 12 may be deteriorated. Therefore, the depth of the through hole 18a formed in the first wiring connecting portion 146 (that is, the sum of the thickness T3 of the first wiring connecting portion 146 and the depth T5 of the through hole 18a in the first base member 12) may be at the first wiring The connecting portion 146 is within 110% of the thickness T3. That is, the depth T5 of the through hole 18a in the first base member 12 may be within 10% of the thickness T3 of the first wiring connecting portion 146. However, the invention is not limited thereto, and various modifications are possible.

In another example, as exemplarily shown in FIG. 5, the film portion 18b, rather than the perforations 18a, is present in the region of the first covercoat layer 18. That is, it may be provided in the first portion 181 that only the film portion 18b does not penetrate the first cover coat layer 18 and causes the first cover coat layer 18 to have a smaller thickness in the corresponding region than the remainder thereof. Providing the film portion 18b of the first covercoat layer 18 having a reduced thickness allows the first covercoat layer 18 to be present throughout the first portion 181. Therefore, the entire first wiring connection portion 146 is covered by the first cover coat layer 18, which can maximize the performance improvement of the first wiring connection portion 146 by the first cover coat layer 18. Further, the film portion 18b can achieve a reduced distance between the first wiring connection portion 146 and the first gasket portion 162, which improves the electrical connection between the first wiring connection portion 146 and the first gasket portion 162.

The depth T6 of the film portion 18b may be 20% or more (for example, 50% or more) of the thickness T3 of the first wiring connecting portion 146. When the depth T6 of the film portion 18b is smaller than the above value, the film portion 18b may fail to exhibit a sufficient effect, although the present invention is not limited thereto.

The above description regarding the film portion 18b can be directly applied to the number, arrangement, and planar shape of the film portion 18b, while omitting the area and thickness of the region where the film portion 18b is provided The entire area of the film portion 18b, the width or diameter of the film portion 18b, the distance between the film portions 18b, the method of forming the film portion 18b, the cross-sectional shape of the film portion 18b, and the like, and thus the related detailed description.

As described above, in the present embodiment, the recess 180 may be formed in the first portion 181 of the first cover coat 18, the recess 180 being included by the first cover coat 18 or by partial removal in the thickness direction thereof The perforation 18a is formed by the first film portion 18b obtained by covering the coating layer 18. That is, the recess refers to any recessed portion having a smaller thickness than the thickness of the remaining portion of the first cover coat layer 18 or a through hole formed in the first cover coat layer 18, and is not limited to a planar shape. Settings and so on.

In the above description and description, it has been explained that the recess 180 includes a perforation 18a or a film portion 18b. However, the present invention is not limited thereto, and the recess 180 between a first wiring connecting portion 146 and a first pad portion 162 corresponding to the first wiring connecting portion 146 may include both the through hole 18a and the film portion 18b. By. Various other changes are possible.

Referring again to FIGS. 1 and 2, the first wiring electrode 16 may be formed of a highly conductive metal, and the first pad portion 162 may be filled with the perforation 18a (or the film portion 18b) by filling the material of the first pad portion 162. ) formed. The first pad portion 162 may be stacked on the first wiring connection portion 146 with the first cover coating layer 18 (particularly, the first portion 181) interposed therebetween, and may have a relatively large width or area for connection with the first wiring Portion 146 is connected.

Further, the present embodiment illustrates that the first pad portion 162 has a smaller area than the first wiring connecting portion 146 and all of the first pad portions 162 overlap the first wiring connecting portion 146. For example, the drawing illustrates that the first wiring connection portion 146 has a shape corresponding to one half of the first sensor portion 142, that is, an approximately trapezoidal shape or an equilateral triangle shape, and the first pad portion 162 has a shape suitable for being included in The first wiring connecting portion 146 has an approximately octagonal shape. This minimizes the area of the first pad portion 162, thereby achieving a reduction in material cost and the like.

However, the present invention is not limited thereto, and the first wiring connecting portion 146 and the first pad portion 162 may have various other shapes depending on the required performance. These different examples will be explained below with reference to Figs. 6 and 7. 6 and 7 are plan views showing different examples of the wiring connecting portion and the pad portion in the conductive film according to the embodiment of the present invention, and show a part corresponding to the enlarged portion of Fig. 1.

Referring to FIG. 6, in the present alternative embodiment, the first pad portion 162 may have a larger area than the first wire connecting portion 146. For example, the drawing illustrates that the first wiring connection portion 146 has a shape corresponding to one half of the first sensor portion 142, that is, an approximately trapezoidal shape or an equilateral triangle shape, in view of the first gasket portion 162 being connected to the first wiring portion. The 146 has a large area and has an approximately octagonal shape such that all of the wiring connection portions 146 overlap the first pad portion 162. Thereby, the first pad portion 162 having an increased area can achieve a reduced electrical resistance, and further, an electrical connection with the first wiring connecting portion 146 is improved.

Referring to FIG. 7, in the present alternative embodiment, the recess 146a may be formed in the first wiring connecting portion 146. In this case, the groove 146a is retracted from at least one edge of the first wiring connecting portion 146 when viewed in a plane, specifically, the groove 146a of the first wiring connecting portion 146 is viewed when viewed in a plane. It is placed to overlap the first pad portion 162 and is placed to connect to the perforation 18a. Thereby, when the first pad portion 162 is formed, the first pad portion 162 may sequentially fill the through holes 18a and the grooves 146a, which may increase the contact area of the first wiring connecting portion 146 with the first pad portion 162. In this way, a strong electrical connection between the first pad portion 162 and the first wire connecting portion 146 can be achieved.

Although the drawings illustrate that the first pad portion 162 has a larger area than the first wire connecting portion 146, the present invention is not limited thereto, and various other modifications are possible.

Referring again to FIGS. 1 and 2, the first wiring connection portion 146 connected to the first pad portion 162 may have a relatively small width and an elongated shape so as to extend to the first flexible printed circuit board 19.

The first wiring electrode 16 can be formed by any of various methods. For example, the first wiring electrode 16 may be formed by supplying a conductive paste by, for example, various coating methods and curing the paste by heat treatment or baking. The first wiring electrode 16 may be formed of metal to achieve high conductivity. For example, the first wiring electrode 16 may be formed of a conductive paste containing a conductive powder such as silver (Ag) powder or the like. However, the present invention is not limited thereto, and the first wiring electrode 16 may have any other different shape and be formed of any other different conductive material.

The first conductive film 10 described above can be formed by the following method. First, the first sensing electrode 14 is dried and/or heat treated by supplying a mixture of nano material conductors 14a, a solvent, a binder, or the like over the entire first base member 12, and by wet etching, The mixture is patterned by laser etching or the like. In this case, at the time of etching, all The conductor 14a, the residual portion 14b, and the first cover coat 18 may be removed in a predetermined area. Alternatively, at the time of etching, only the conductor 14a may be selectively removed from the predetermined region such that the predetermined region has a void corresponding to the conductor 14a and thus prevents the flow of current. Then, a first overcoat layer 18 is formed on the first sensing electrode 14. However, the present invention is not limited thereto, and the patterning regarding the first sensing electrode 14 may be performed after the first overcoat layer 18 is formed. Various other changes are equally possible.

Then, a recess 180 such as the perforation 18a, the film portion 18b, etc., by placing the pressure tool 40 shown in FIG. 3 on the first cover coat 18 corresponds to the first sense electrode in the inactive area NA The position of the first wiring connection portion 146 of 14 is applied and pressure is applied to the first cover coat layer 18 by the pressure block 42 to cause damage or breakage of the first cover coat layer 18. Subsequently, the conductive paste forming the first wiring electrode 16 is supplied into the formation of the first wiring electrode 16, and drying and/or baking of the supplied conductive paste is performed to form the first wiring electrode 16. In this case, the conductive paste used to form the first wiring electrode 16 is cured while filling the recess 180 such as the through hole 18a, the film portion 18b, and the like. This manufacturing method is given by way of example only, and the invention is not limited thereto.

The figure illustrates that the first wiring electrode 16 is located at both ends of the first sensing electrode 14 to implement a dual routing structure. This serves to reduce the electrical resistance of the first sensing electrode 14 having a relatively long length, thereby preventing any loss due to electrical resistance. However, the present invention is not limited thereto, and any other different structure, for example, a single routing structure in which the first wiring electrode 16 has only one side connected to the first sensing electrode 14 is possible.

Further, the drawing illustrates that the first wiring electrode 16 is connected to any external component via two inactive regions NA located on both sides of the active area AA. However, the present invention is not limited thereto, and the first wiring electrode 16 is connected to the external component via one inactive region NA located on one side of the active region AA, or may extend to any of the upper and lower sides of the active region AA. One side is connected to the external component via the corresponding side of the active area AA. Various other changes are equally possible.

The first wiring electrode 16 may be connected to the first flexible printed circuit board 19 for external connection. The first flexible printed circuit board 19 may include a base member and a wiring formed on the base member. Since the wiring of the first flexible printed circuit board 19 contacts the first wiring electrode 16, the first wiring electrode 16 and the first flexible printed circuit board 19 can be electrically connected to each other. however, The present invention is not limited thereto, and a conductive adhesive member such as an anisotropic conductive adhesive (ACA), an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), or the like may be located at the first flexible The wiring of the printed circuit board 19 and the first wiring electrode 16 are used to achieve an electrical connection therebetween.

The second conductive film 20 includes a second pedestal element 22 and a second sensing electrode 24 formed on the second pedestal element 22, a second overcoat layer 28 covering the second sensing electrode 24, and a second A wiring electrode 26 is formed on the second cover coat layer 28 and electrically connected to the second sense electrode 24 in the inactive area NA.

The second sensing electrode 24 formed on the second base member 22 may include a second sensor portion 242 and a second connecting portion 244 that respectively connects the adjacent second sensor portions 242 to each other, the second sensing The second portion 242 and the second connecting portion 244 are disposed in the active area AA, and the second wiring connecting portion 246 extends from the second sensor portion 242 and the second connecting portion 244 located in the active area AA so as to be located in the non- Active area NA. The second cover coat layer 28 is configured to cover the second sense electrode 24, and the second wire electrode 26 is formed on the second cover coat layer 28 in the inactive area NA so as to be connected to the second wire connection portion 246. More specifically, the second wiring electrode 26 includes a second pad portion 262 stacked on the second wiring connection portion 246 with a second overcoat layer 28 therebetween to be electrically connected to the second wiring connection portion 246, and A second wiring portion 264 that extends outwardly from the second pad portion 262.

The second sensor portion 242 is disposed at a position in which the first sensor portion 142 is not disposed, and the second connection portion 244 extends in a second direction (vertical direction of the drawing) across the first sensing electrode 14 The second sensor portions 242 are connected to each other. The figure illustrates that the second wiring electrode 26 is located on the lower side of the second sensing electrode 24 to achieve a single routing structure. Therefore, the second wiring electrode 26 is formed in the inactive area NA located on the lower side of the active area AA. However, the present invention is not limited thereto, and the second wiring electrode 24 may be located on one or more sides of the active area AA above, below, left, and right sides, and various different modifications are possible.

The second covercoat layer 28 can include a first portion that is positioned between the second wire connection portion 246 and the second pad portion 262, and a second portion other than the first portion. Each of the first portions may be provided with a recess 280 such as a perforation 28a, a film portion, or the like.

The description of the first conductive film 10 can be directly applied to the second conductive film 20 except for the extending direction of the second sensing electrode 24 in the plane, the position of the second wiring electrode 26, and the like. that is, The description of the first pedestal element 12 can be applied directly to the second pedestal element 22, and the description of the first sensing electrode 14 can be applied directly to the second sensing electrode 24. The description of the first cover coat 18 and the recess 180 formed in the first cover coat 18, such as the perforations 18a or film portions 18b, may be applied directly to the second cover coat 28 and to the second cover coat 28 For example, the perforations 28a or the recesses 280 of the film portion. The description of the first wiring electrode 16 can be directly applied to the second wiring electrode 26. Further, the description of the method of manufacturing the first conductive film 10 can be directly applied to the method of manufacturing the second conductive film 20.

The second wiring electrode 26 may be connected to the second flexible printed circuit board 29 for external connection. The description of the first flexible printed circuit board 19 can be directly applied to the second flexible printed circuit board 29, and thus, a detailed description thereof will be omitted.

In the drawings and the above description, for clarity and brevity of the description, the first conductive film 10 has been described and illustrated to include a first base member 12, a first sensing electrode 14, a first overcoat layer 18, and a first The electrode 16 is wired, and the second conductive film 20 has been described and illustrated to include the second pedestal element 22, the second sensing electrode 24, the second overcoat layer 28, and the second wiring electrode 26. However, the invention is not limited thereto. Therefore, the first conductive film 10 and the second conductive film 20 may further include a protective hard coat layer, an adhesion layer, respectively, to enhance adhesion between one layer, a primer layer, and the like stacked on the other. Various other structures can be applied to the first conductive film 10 and the second conductive film 20 as well.

The touch panel 100 can be manufactured by adhering the first conductive film 10 and the second conductive film 20 as described above to the cover substrate 30 with the first transparent adhesive layer 42 and the second transparent adhesive layer 44. In the touch panel 100 having the above configuration, when an input device or a user's finger touches the first sensing electrode 14 and the second sensing electrode 24, the capacitance difference may occur at the touch position of the input device. And the position where the capacitance difference occurs can be sensed as the touch position.

In the conductive films 10 and 20 used in the touch panel 100 or the touch panel 100 according to the present embodiment, since the sensing electrodes 14 and 24 include the nano material conductor 14 having a mesh structure, the sensing electrode 14 is provided. And 24 can improve various performances. Furthermore, by covering the sensing electrodes 14 and 24 with the overcoat layers 18 and 28, physical damage or oxidation of the sensing electrodes 14 and 24, for example, can be prevented, thereby improving the performance of the sensing electrodes 14 and 24. . In this case, the first portions 181 of the overcoat layers 18 and 28 for connecting between the sensing electrodes 14 and 24 and the wiring electrodes 16 and 26 are provided with recesses 180 and 280 to improve the sensing electrodes 14 and 24 and the wiring. Electricity The electrical connection between poles 16 and 26 while maintaining the utility of overlay coatings 18 and 28. In this way, the conductive films 10 and 20 including the sensing electrodes 14 and 24 can improve the resistance uniformity of the sensing electrodes 14 and 24 and the wiring electrodes 16 and 26, and improve the sensing electrodes 14 and 24 and the wiring electrode 16 and Electrical connections between 26, wherein the sensing electrodes 14 and 24 are provided with a nanomaterial conductor 14a having a mesh structure.

Hereinafter, a touch panel and a conductive film according to other embodiments of the present invention will be described in detail. Detailed descriptions of the same or similar parts to those described above will be omitted, and only different parts will be described in detail. The above embodiments and alternative embodiments that can be applied to the present application, the following embodiments and alternative embodiments that can be applied to the present invention can be combined in various ways.

Figure 8 is a cross-sectional view showing a touch panel in accordance with another embodiment of the present invention. Referring to FIG. 8 , the touch panel according to the present embodiment includes a cover substrate 30 , a first transparent adhesive layer 42 disposed on the cover substrate 10 , and a first conductive film 10 disposed on the first transparent adhesive layer 42 . The first conductive film 10 is provided on one surface thereof with a first sensing electrode 14, a first overcoat layer 18, and a first wiring electrode 16, and a second sensing electrode 24 is provided on the other surface thereof. The second cover coat layer 28 and the second wiring electrode (see element symbol 26 of Fig. 1). That is, in the present embodiment, the first sensing electrode 14 and the second sensing electrode 24, which are two electrodes included in the touch panel, may be located on different surfaces of the first base member 12, and respectively The first wiring electrode 16 and the second wiring electrode 26 connected to the first sensing electrode 14 and the second sensing electrode 24 are located on different surfaces of the first base member 12. With this configuration, the touch panel can have a simple structure, and the thickness can be reduced by reducing the number of base members as the largest thickness member.

Figure 9 is a cross-sectional view showing a touch panel still according to another embodiment of the present invention. Referring to FIG. 9, the touch panel according to the present embodiment includes a cover substrate 30 provided with a second sensing electrode 24, a second cover coat layer 28, and a second wiring electrode (see reference numeral 26 in FIG. 1), a first transparent adhesive layer 42 disposed on the cover substrate 30 to cover the second sensing electrode 24 and the first conductive film 10 disposed on the first transparent adhesive layer 42 and provided with the first sensing electrode 14 The first cover coat layer 18 and the first wiring electrode 16. In the present embodiment, since the second sensing electrodes 24 and the like are disposed on the cover substrate 30, the touch panel can have a simple structure and minimize the thickness.

In this case, the second sensing electrode 24 may be composed of the first sensing electrode 14 The same material or different materials are formed. For example, when the second sensing electrode 24 is formed of indium tin oxide, the second sensing electrode 24 can be easily formed on the cover substrate 30. The second sensing electrode 24 formed of indium tin oxide can eliminate the need for the second overcoat layer 28. The difference in resistance or the like of different materials of the first sensing electrode 14 and the second sensing electrode 24 can be uniformed by adjusting the thicknesses of the first sensing electrode 14 and the second sensing electrode 24, and the like. Alternatively, when the touch panel has a difference in its horizontal length and vertical length, the first sensing electrode 14 having a relatively low resistance may be an electrode located in the long axis, and the second sensing electrode 24 having a relatively high resistance may be It is the electrode located in the short axis. Various other changes are equally possible.

Figure 10 is a cross-sectional view showing a touch panel according to still another embodiment of the present invention. Referring to FIG. 10, in the present embodiment, the cover substrate 30 and the first transparent adhesive layer 42 are omitted, and the hard coat layer 32 is disposed on the front surface of the first conductive film 10. For example, the hard coat layer 32 may be formed of an acryl resin. By omitting the cover substrate 30 and the first transparent adhesive layer 42, the touch panel achieves cost reduction and thickness reduction.

The touch panel 100 as described above can be applied to various electronic devices, and in particular, the display device can enable the touch operation of the display device. For example, the touch panel 100 can be applied to a television whose main function is to display an image, to a screen of a mobile phone, a tablet, a notebook, a watch, or the like that performs an image display function and other functions, or to an image display function. It is not its main function, when the image display function is added to the display screen of the home appliance such as a refrigerator, a washing machine, a water purifier, etc., which has improved performance. In this way, the touch panel 100 is used to improve the operation of the display device.

Hereinafter, referring to FIG. 11, an example of the display device 200 according to various embodiments of the present invention may be applied to the display device 200. The description and description of the display device 200 with reference to Fig. 11 are merely by way of example, and the present invention is not limited thereto. Further, in the eleventh diagram, for the sake of brevity and clarity of the description, the description of the portion not directly related to the present invention will be omitted, and the display device 200 will be illustrated.

Figure 11 is a schematic perspective view showing a display device according to an embodiment of the present invention. Referring to FIG. 11, the display device designated by reference numeral 200 includes a frame 210, a touch panel 100, a display panel 220, a backlight unit 230, and a back cover 240.

The frame 210 and the rear cover 240 are not only used to accommodate internal components such as the touch panel 100, the display panel 220, and the backlight unit 230, but are also used to stably fix these. Component. This embodiment illustrates providing the frame 210 and the rear cover 240 to accommodate and fix the touch panel 100, the display panel 220, and the backlight unit 230, although the invention is not limited thereto. Instead of the frame 210 and the back cover 240, various other known structures capable of accommodating and fixing the touch panel 100, the display panel 220, and the backlight unit 230 can be applied to the present invention. In particular, the structure for fixing the touch panel 100, the display panel 220, and the backlight unit 230 may vary in various ways depending on the field of application of the touch panel 100.

The touch panel 100 may be a touch panel including the conductive film as described above with reference to FIGS. 1 to 10. The display panel 220 located behind the touch panel 100 to display images may be selected from various known types of display panels. For example, the embodiment illustrates that the display panel 220 is a liquid crystal display panel. Since the liquid crystal display panel has no self-luminous function, the backlight unit 230 is provided to emit light to the display panel 220.

The backlight unit 230 may include a light emitting unit 237 having a light emitting element 232 to emit light, and a light diffusing plate 239 that uniformly diffuses light emitted from the light emitting element 232.

This embodiment illustrates a vertical type structure in which the light-emitting elements 232 are distributed in a plane. The vertical type structured light emitting unit 237 may include a light emitting light emitting element 232, a circuit board 234 on which the light emitting element 232, and a reflector 236 having a hole for inserting the light emitting element 232, although the invention is not limited this. Therefore, for example, the light emitting unit 237 may have an edge type structure in which the light emitting element 232 is located close to one side surface. In the edge type structure, for example, a light guide plate for diffusely reflecting light may be provided together with the light emitting element 232. Various known techniques for this edge type structure can be applied.

Light-emitting elements 232 are point sources and, for example, may be light-emitting diodes (LEDs). LEDs have long life and low energy consumption, can be reduced in size and are environmentally friendly. However, the present invention is not limited thereto, and various other light-emitting elements that emit light based on various other principles and methods may be used. Further, the shape of the light-emitting element 232 can be varied in various ways to a linear light source, a planar light source, and the like.

The light emitting elements 232 may be spaced apart from each other and fixed to the circuit board 234 by a prescribed distance. Circuit board 234 has a circuit pattern to provide the required energy to assist illumination element 232 to emit light. Circuit board 234 can be a printed circuit board (PCB). Alternatively, the circuit board 234 may be a metal printed circuit board (MPCB) provided with a metal layer (for example, an aluminum layer) on its lower surface to radiate heat generated from the light-emitting element 232 to the outside.

The reflector 236 is fixed to the circuit board 234 such that the light emitting element 232 fixed to the circuit board 234 is inserted into the hole of the reflector 236. The reflector 236 is used to reflect light emitted from the light-emitting element 232, thereby preventing unnecessary light loss and increased brightness. The reflector 236 can be formed of any different material capable of reflecting light and, for example, can be formed of metal.

Meanwhile, the present embodiment explains the configuration of the light emitting unit 237 such that the light emitting element 232 provided on the circuit board 234 is inserted into the hole of the reflector 236, the present invention is not limited thereto, and the light emitting unit 237 can have any of various other structures.

The light diffusion plate 239 is disposed on the light emitting unit 237 to diffusely reflect the light emitted from the light emitting element 232 and uniformly transmit the light to the display panel 220. Various known structures and types such as various optical films, light-shielding patterns, ruthenium structures, and the like can be applied to the light diffusion plate 239.

In the above description, the display panel 220 has been described as a liquid crystal display panel by way of example. However, the present invention is not limited thereto, and the display panel 220 may be any of various other panels such as plasma display panels (PDPs), organic light emitting diode (OLED) display panels, and the like. When the display panel 220 is a PDPs or an OLED display panel, the display panel 220 has a self-illuminating function and the backlight unit 230 may be omitted.

In addition to the touch panel 100, the display panel 220, and the backlight unit 230, the display device 200 may further include various other components. For example, a protective film, a glass plate, or the like may be provided between the frame 210 and the touch panel 100 to protect the touch panel 100; a circuit unit or the like may be further provided to electrically connect the touch panel 100 and the display panel 220 to each other The display panel 220 is connected and driven; and fastening elements, adhesive elements, and the like can be further provided to connect the respective components to each other. Various other changes are equally possible.

The display device 200 according to the present embodiment includes the touch panel 100 having excellent electrical characteristics as described above, so that excellent touch characteristics can be achieved.

At least one embodiment of the invention includes the features, configurations, utilities, and the like described above, but should not be limited to only one embodiment. In addition, the features, configurations, functions, and the like described in the embodiments may be combined with other embodiments, or those having ordinary knowledge in the art to which the present invention pertains, without departing from the spirit and scope of the present invention. When you can make a variety of changes and retouching. Therefore, the scope of the invention is defined by the scope of the appended claims.

This application is filed on the Korean Intellectual Property Office on August 14, 2014. The Korean Patent Application No. 10-2014-0105994 and the Korean Patent Application No. 10-2014-0125108, filed on Sep. 19, 2014, are hereby incorporated by reference.

10‧‧‧First conductive film

12‧‧‧First base component

14‧‧‧First sensing electrode

14a‧‧‧Nano material conductor

14b‧‧‧ Residual

16‧‧‧First wiring electrode

18‧‧‧First cover coating

18a‧‧‧Perforation

19‧‧‧First flexible printed circuit board

20‧‧‧Second conductive film

22‧‧‧Second base component

24‧‧‧Second sensing electrode

28‧‧‧Second overlay coating

29‧‧‧Second flexible printed circuit board

30‧‧‧ Covering substrate

42‧‧‧First transparent adhesive layer/pressure block

44‧‧‧Second transparent adhesive layer

142‧‧‧First sensor section

144‧‧‧ first connection

146‧‧‧First wiring connection

162‧‧‧First pad section

164‧‧‧First wiring part

180‧‧‧ recess

181‧‧‧Part 1

182‧‧‧Part II

AA‧‧‧Active Area

NA‧‧‧inactive area

T1‧‧‧first thickness

T2‧‧‧second thickness

T3‧‧‧ thickness

T4‧‧ depth

Claims (20)

A conductive film for use in a touch panel, the conductive film comprising: a base member having a sensing region and an inactive region defined therein; a sensing electrode formed on the base member In the sensing region and the inactive region, the sensing electrode includes a nanomaterial conductor defining a network structure; a capping layer configured to cover the sensing region and the sensing electrode in the inactive region; a wiring electrode formed on the overcoat layer in the inactive region, the wiring electrode including a pad portion electrically connected to the sensing electrode and a wiring portion connected to the pad portion, wherein the cap coating The layer includes a first portion between the sensing electrode and the wiring electrode and includes a recess including a through hole formed through the cover coating. The conductive film of claim 1, wherein the recess of the first portion comprises a plurality of recesses in a first portion. The conductive film according to claim 2, wherein the number of the recesses of the first portion in a first portion is 4 to 64. The conductive film according to claim 2, wherein the plurality of recesses of the first portion are arranged in a matrix configuration. The conductive film of claim 1, wherein the through hole extends to the sensing electrode. The conductive film according to claim 5, wherein the through hole in the sensing electrode has a depth in a range of 40% to 100% of a thickness of the sensing electrode. The conductive film of claim 1, wherein the through hole penetrates the sensing electrode and extends to the base member. The conductive film of claim 7, wherein the through hole in the base member has a depth within a range of 10% of the thickness of the sensing electrode. The conductive film according to claim 1, wherein the recess has a larger area in a region away from the base member than in a region close to the base member. The conductive film according to claim 9, wherein the size of the recess gradually increases as the distance from the base member increases. The conductive film according to claim 1, wherein the recess has a notched shape. The conductive film according to claim 1, wherein the recess comprises a side surface having a larger surface roughness than a surface roughness of a surface of the cover coating. The conductive film according to claim 12, wherein the surface roughness of the side surface of the recess is 10 nm or more; and the surface roughness of the surface of the overcoat layer is 10 nm or less. The conductive film of claim 1, wherein the sensing electrode comprises a plurality of sensor portions, a plurality of connecting portions configured to connect the sensor portions to each other, and a wiring connection portion Dividing from each of the sensor portions or the connecting portions to the inactive region; the wiring electrode including the pad portion configured to fill the recess and connect to the wiring connecting portion, and the wiring a portion connected to the pad portion; and the recess is located in a region having an area within a range of 20% to 80% of an area of the wire connecting portion or the pad portion. The conductive film of claim 1, wherein the sensing electrode comprises a plurality of sensor portions, a plurality of connecting portions, configured to connect the sensor portions to each other, and a wiring connecting portion Extending from each of the sensor portions or the connecting portions to the inactive region; the wiring electrode including the pad portion configured to fill the recess and connect to the wiring connecting portion, and the wiring portion Connected to the pad portion; the recess of the first portion between the sensing electrode and the wiring electrode includes a plurality of recesses in a first portion; and the plurality of recesses in the first portion The total area is in the range of 30% to 50% of the area of the area in which the recesses are provided. The conductive film according to claim 1, wherein the recess has a width or a diameter in the range of 10 μm to 100 μm. The conductive film of claim 1, wherein the recess of the first portion between the sensing electrode and the wiring electrode comprises a plurality of recesses in a first portion; and in the one A portion of the plurality of recesses are spaced apart from one another by a distance in the range of 0.1 mm to 0.9 mm. The conductive film of claim 1, wherein the sensing electrode comprises a plurality of sensor portions, a plurality of connecting portions, configured to connect the sensor portions to each other, and a wiring connecting portion Extending from each of the sensor portions or the connecting portions to the inactive region; and the wiring connecting portion has a recess connected to the through hole. A touch panel comprising: a conductive film for a touch panel according to any one of claims 1 to 18; and another sensing electrode, the sensing of the conductive film The electrodes are spaced apart and configured to extend in a direction across the sensing electrode of the conductive film. A display device comprising: the touch panel according to claim 19; and a display panel located behind the touch panel to display an image.