201211872 L· 六、發明說明： 【發明所屬之技術領域】 本發明涉及靜電電容觸摸感測器及包括該靜電電容觸摸感測器 之帶視窗面板一體型靜電電容觸摸板。 【先前技術】 已知過去的觸摸感測器有電阻膜方式、靜電電容方式等多種方式 的觸摸感測器，其中，靜電電容觸摸感測器在靜電電容觸摸感測器基 板由氧化銦錫（ITO,indium tin oxide)的透明導電性物質形成透明電 極圖案，在該透明電極電連接與外部連接的撓性電路基板而形成。在 撓性電路基板形成有用於向透明電極圖案選擇性地施加從外部施加 之電源的電路配線，用於選擇性地連接該電路配線和透明電極圖案的 電極配線形成在靜電電容觸摸感測器基板。 通常’靜電電容觸摸感測器的透明電極圖案一般形成在靜電電容 觸摸感測器基板的中心部，沿著透明電極圖案的周邊形成上述的電極 配線’該電極配線一般包括用於與撓性電路基板連接之導電性的端子 部。將該端子部用各向異性導電性薄膜或各向異性導電拴黏接劑與撓 性電路基板連接。 這樣，將用於電連接撓性電路基板的電路配線和靜電電容觸摸感 1器的透明電極圖案之電極配線及端子部以銀鹽印刷等方式形成在 靜電電容觸摸感測器基板上，所以難以體現微細圖案，隨之，具有製 造過程變得複雜、費用增加的問題。 【發明内容】 3本發明疋為了解決如上述的問題而提出，本發明要解決的課題是 $供-種容易形成用於連接靜電電容觸摸感測㈣透明電極圖案和 ，性電路基板的配線之靜電電容觸摸感測器及包括該靜電電容觸摸 感測器之帶視窗面板_體型靜電電容觸摸板。 笋實^上述課題之根據本發明一實施例的靜電電容觸摸感測 ^ ’匕括：靜電電容觸摸感測器基板；形成在上述靜電電容觸摸感測 201211872 器基板的透明電極圖案；具備用於與上述透明電極圖案電連接之電路 配線的撓性電路基板；以及包括分別接觸於上述撓性電路基板和上述 透明電極®案的部分’將上述撓性電路基板的電路配線和上述透明電 極圖案黏接成相互電連接的狀態之各向異性導電性黏接部件。 上述各向異性導電性黏接部件可以配置在上述透明電極 邊緣的一部分。 ' 上述透明電極圖案可以形成為在上述靜電電容觸摸感測器基板 的邊緣部分具備空白區域；上述各向異性導電性黏接部件可以貫穿上 述靜電電容觸摸感调j器基板的邊緣部分的空白區域和ϋ透明電極 圖案的邊緣的一部分而配置。 上述透明電極圖案可以形成為在上述靜電電容觸摸感測器基板 的邊緣部分具備空自區域；上述各向異性導電性黏接部件可以配置在 上述透明電極圖案的邊緣的—部分。並且，靜電電觸摸感測器還可以 包括黏接綱’絲接騎配置在上述靜電電簡㈣靡基板的邊 緣部t的空自區域和上述撓性1路基板之間，黏接上述靜電電容觸摸 感測器基板和上述撓性電路基板。 上述撓性電路基板可以形成為具有在上述透明電極圖案外側中 一部分未配置的形態。 ^上述撓性電路基板之電路配線可以形成為藉由上述各向異性導 t性黏接部件可以直接電連接在上述透明電極圖案。 另方面，根據本發明實施例之帶視窗面板一體型靜電電容觸摸 =括▼®口面板，配置在上述帶視窗面板下方的靜電電容觸摸 二』器基板，形成在上述靜電電容觸摸感測器基板上表面的透明電極 配置在上述透明電極圖案和上述帶視窗面板的下表面之間，將 上述透明電極®案的上述靜電電容觸減㈣基板黏接在上 Γ雷固口面板的透明黏接劑層；具備用於與上述透明電極圖案電連接 線㈣性€路基板；錢包括分職觸於上述撓性電路基板 逆月電極圖案的部分，將上述撓性電路基板的電路配線和上述 極圖案黏接成相互電連接的狀態之各向異性導電性黏接部件。 201211872 另一方面’根據本發明另一實施例的帶視窗面板一體型靜電電容 觸摸板，包括.帶窗ΰ面板；配置在上述帶視窗面板下方的靜電電容 觸摸感測器基板；形成在上述靜電電容觸摸感測器基板下表面的透明 電極圖案；配置在靜電電容觸摸感測器基板和上述帶窗口面板的下表 面之間，將上述靜電電容觸摸感測器基板黏接在上述帶窗口面板的透 明黏接劑層；具備用於與上述透明電極圖案電連接之電路配線的撓性 電路基板；以及包括分別接觸於上述撓性電路基板和上述透明電極圖 案的部分，將上述撓性電路基板的電路配線和上述透明電極圖案黏接 成相互電連接的狀態之各向異性導電性黏接部件。 上述各向異性導電性黏接部件可以配置在上述透明電極圖案的 邊緣的·一部分。 上述透明電極圖案可以形成為在上述靜電電容觸摸感測器基板 的邊緣部分具備空白區域；上述各向異性導電性點接部件可以貫穿上 述靜電電谷觸摸感測器基板之邊緣部分的空白區域和上述透明電極 圖案的邊緣的一部分而配置。 上述透明電極圖案可以形成為在上述靜電電容觸摸感測器基板 的邊緣部分具備空白區域；上述各向異性導電性黏接部件可以配置在 上述透明電極圖案的邊緣的一部分。並且，帶視窗面板一體型靜電電 容觸摸感測器還可以包括黏接劑層，該黏接劑層配置在 觸摸感難紐之親料較白區域和上述肢 接上述靜電電容觸摸感測器基板和上述撓性電路基板。 上述撓性電路基板之電路配線可以形成為可以藉由上述各向異 性導電性黏接部件直接電連接在上述透明電極圖案。 根據本發明另一實施例的帶視窗面板一體型靜電電容觸摸板，包 括：帶窗口面板；形成在上述靜電電容觸摸感測器基板下表面的透明 電極圖案；具備用於與上述透明電極圖案電連接之電路配線的撓性電 路基板；以及包括分別接觸於上述撓性電路基板和上述透明電極圖案 的。卩刀，將上述撓性電路基板的電路配線和上述透明電極圖案黏接成 相互電連接狀態之各向異性導電性黏接部件。 201211872 上述各向異性導電性黏接部件可 、 邊緣的一部分。 置在上述透明電極圖案的 ==ESi:== 透明:=;====:=， 件於撓性電路基板的電路配線形成為藉由:::: 【實施方式】 在以下，參照附圖詳細說明本發明之實施例。 ^中’為了明確表現多個層及區域，放大厚度表示。 位，對於類似的部分附上相同的附圖符號。表述層或膜等的^201211872 L. VI. Description of the Invention: [Technical Field] The present invention relates to an electrostatic capacitance touch sensor and a window-panel integrated electrostatic capacitance touch panel including the electrostatic capacitance touch sensor. [Prior Art] It is known that the past touch sensors have various types of touch sensors such as a resistive film method and an electrostatic capacitance method, wherein the electrostatic capacitance touch sensor is made of indium tin oxide on the electrostatic capacitance touch sensor substrate ( The transparent conductive material of ITO (indium tin oxide) forms a transparent electrode pattern, and is formed by electrically connecting the transparent electrode to a flexible circuit board connected to the outside. Circuit wiring for selectively applying a power source applied from the outside to the transparent electrode pattern is formed on the flexible circuit substrate, and electrode wiring for selectively connecting the circuit wiring and the transparent electrode pattern is formed on the electrostatic capacitance touch sensor substrate . Generally, the transparent electrode pattern of the 'electrostatic capacitance touch sensor is generally formed at a central portion of the electrostatic capacitance touch sensor substrate, and the electrode wiring described above is formed along the periphery of the transparent electrode pattern. The electrode wiring generally includes a flexible circuit for use with the flexible circuit. A conductive terminal portion to which the substrate is connected. The terminal portion is connected to the flexible circuit board by an anisotropic conductive film or an anisotropic conductive iridium adhesive. In this way, the circuit wiring for electrically connecting the flexible circuit board and the electrode wiring and the terminal portion of the transparent electrode pattern of the electrostatic capacitance touch sensor are formed on the electrostatic capacitance touch sensor substrate by silver salt printing or the like, which is difficult. Reflecting the fine pattern, there is a problem that the manufacturing process becomes complicated and the cost increases. SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems as described above, and the problem to be solved by the present invention is that it is easy to form a wiring for connecting an electrostatic capacitance touch sensing (four) transparent electrode pattern and a circuit board. An electrostatic capacitance touch sensor and a window panel _ body type electrostatic capacitance touch panel including the electrostatic capacitance touch sensor. The electrostatic capacitance touch sensing according to an embodiment of the present invention is as follows: a capacitive touch sensor substrate; a transparent electrode pattern formed on the electrostatic capacitance touch sensing 201211872 substrate; a flexible circuit board having circuit wiring electrically connected to the transparent electrode pattern; and a portion including a contact with the flexible circuit substrate and the transparent electrode о, respectively, 'bonding the circuit wiring of the flexible circuit substrate and the transparent electrode pattern An anisotropically conductive adhesive member in a state of being electrically connected to each other. The anisotropically conductive adhesive member may be disposed on a part of the edge of the transparent electrode. The transparent electrode pattern may be formed to have a blank region at an edge portion of the electrostatic capacitance touch sensor substrate; and the anisotropic conductive adhesive member may penetrate a blank portion of an edge portion of the electrostatic capacitance touch sensor substrate And arranging a part of the edge of the transparent electrode pattern. The transparent electrode pattern may be formed to have an empty region at an edge portion of the electrostatic capacitance touch sensor substrate, and the anisotropic conductive adhesive member may be disposed at a portion of an edge of the transparent electrode pattern. Moreover, the electrostatic electric touch sensor may further include a bonding device disposed between the empty portion of the edge portion t of the electrostatic (Si) substrate and the flexible one-way substrate, and bonding the electrostatic capacitance touch A sensor substrate and the above flexible circuit substrate. The flexible circuit board may be formed to have a form in which a part of the outer side of the transparent electrode pattern is not disposed. The circuit wiring of the flexible circuit board may be formed to be directly electrically connected to the transparent electrode pattern by the anisotropic conductive bonding member. On the other hand, according to the embodiment of the present invention, the integrated capacitive touch panel with a window panel is included in the above-mentioned capacitive capacitive touch sensor substrate disposed under the window panel, and is formed on the electrostatic capacitance touch sensor substrate. a transparent electrode on the upper surface is disposed between the transparent electrode pattern and the lower surface of the window panel, and the electrostatic capacitance of the transparent electrode (the substrate) is bonded to the transparent adhesive of the upper reticular panel. a layer; a portion for electrically connecting to the transparent electrode pattern; and a portion for contacting the reverse electrode pattern of the flexible circuit substrate, the circuit wiring of the flexible circuit substrate and the polar pattern An anisotropic conductive adhesive member bonded to each other in an electrically connected state. 201211872 In another aspect, a window-panel integrated capacitive touch panel according to another embodiment of the present invention includes: a window panel; a capacitive touch sensor substrate disposed under the window panel; a transparent electrode pattern on the lower surface of the capacitive touch sensor substrate; disposed between the electrostatic capacitance touch sensor substrate and the lower surface of the window panel, bonding the electrostatic capacitance touch sensor substrate to the window panel a transparent adhesive layer; a flexible circuit board having circuit wiring for electrically connecting to the transparent electrode pattern; and a portion including the flexible circuit substrate and the transparent electrode pattern, respectively, and the flexible circuit substrate The circuit wiring and the transparent electrode pattern are bonded to each other in an anisotropic conductive bonding member in a state of being electrically connected to each other. The anisotropic conductive adhesive member may be disposed on a part of the edge of the transparent electrode pattern. The transparent electrode pattern may be formed to have a blank region at an edge portion of the electrostatic capacitance touch sensor substrate; the anisotropic conductive dot contact member may penetrate a blank region of an edge portion of the electrostatic battery touch sensor substrate and A part of the edge of the transparent electrode pattern is disposed. The transparent electrode pattern may be formed to have a blank region at an edge portion of the electrostatic capacitance touch sensor substrate, and the anisotropic conductive adhesive member may be disposed on a part of an edge of the transparent electrode pattern. Moreover, the integrated capacitive touch sensor with a window panel may further comprise an adhesive layer disposed in the white area of the touch sensitive material and the above-mentioned electrostatic capacitive touch sensor substrate And the above flexible circuit substrate. The circuit wiring of the flexible circuit board may be formed to be directly electrically connected to the transparent electrode pattern by the anisotropic conductive bonding member. A window-panel-integrated electrostatic capacitance touch panel according to another embodiment of the present invention includes: a window panel; a transparent electrode pattern formed on a lower surface of the electrostatic capacitance touch sensor substrate; and a pattern for being electrically connected to the transparent electrode pattern a flexible circuit substrate to which the circuit wiring is connected; and a contact between the flexible circuit substrate and the transparent electrode pattern, respectively. In the boring tool, the circuit wiring of the flexible circuit board and the transparent electrode pattern are bonded to each other to form an anisotropic conductive bonding member electrically connected to each other. 201211872 The above anisotropic conductive bonding member can be part of the edge. ==ESi:== transparent:=;====:=, the circuit wiring of the flexible circuit board is formed by:::: [Embodiment] In the following transparent electrode pattern, the following is attached The drawings illustrate embodiments of the invention in detail. ^中' In order to clearly represent multiple layers and regions, the thickness is expressed. Bits, the same reference numerals are attached to similar parts. Expression layer or film, etc. ^
广:、他部分“上方’’ A “下方，，時’這不僅包括位於其他部分VGuang: He is partially "above" 'A' below, when 'this' includes not only the other parts V
:方或“正下方”的情況’還包括在其中間具有其他部分 J 某個部分位於其他部分“正上方”或“正下方”日夺，表示^ 沒有其他部分。 根據本發明實施例的帶視窗面板_體型靜電電容觸摸板包 據本發明實施例的靜電電容觸摸感測器，以下，為了方便說明 民 據本發明實施例的帶視窗面板—體型靜電電容觸摸板進行說明，省艮 包括於此之根據本發明實施例之靜電電容觸摸感測器之另外的說明略 201211872 首先，具備帶視窗面板110。例如帶視窗面板11〇可以具有大致 四邊形平板的形狀，可以由具有光透射性的玻璃或丙烯酸樹脂的合成 樹脂等形成。 另一方面，雖在附圖中省略，但是可以沿著帶視窗面板u〇下表 面的外廓邊角形成具有一定寬度之四邊形帶子形狀的設計層。設計層 可以由不透明的材質形成，例如可以將非導電性的不透明材質藉由絲 網等方法印刷或蒸鑛來形成。 根據本發明實施例的靜電電容觸摸感測器200配置在帶視窗面板 110下方。 參照第1圖至第3圖，靜電電容觸摸感測器基板2〇()配置在帶窗 面板110下方。 靜電電容觸摸感測器200包括：靜電電容觸摸感測器基板21〇及 透明電極圖案22G。透明電_案22G可以形成在靜電電容觸摸感測 器基板210的上表面或下表面。根據第丨圖至第4圖的實施例是透明 電極圖案220形成在靜電電容觸摸感測器基板21〇上表面的情況，根 據第5圖及第6圖的實施例是透明電極圖案22〇形成在靜電電容觸摸 感測益基板210下表面的情況。 參照第2圖及第3圖，透明電極圖案22〇形成在靜電電容觸摸感 測器基板210的上表面。 靜電電谷觸摸感測器基板210可以由玻璃或pet薄膜等透明的材 質形成，透明電極圖案220可以在靜電電容感測器基板210上濺射或 蒸鍍氧化銦錫（ITO，inciume tin oxide)、氧化銦鋅（izo, indume zinc oxide)、氧化辞（ZnO)等而形成。這時，透明電極圖案220可以包 括沿相互垂直的方向延長而形成的第1電極圖案221和第2電極圖案 223，第1電極圖案221和第2電極圖案223的形態及延長的方向不 限於圖中所示的形態，可以多樣地變更。 具備用於與外部之介面的撓性電路基板（flexible printed circuit board，FPCB) 230。撓性電路基板230的電路配線233用於與透明電 極圖案220電連接。即，撓性電路基板230具有將外部的電訊號選擇 性地施加於透明電極圖案220的功能。 201211872 挽性電路基板230可以包括撓性基板231和形成於其表面的電路 配線233，撓性基板231可以由撓性的合成樹脂材質形成，電路配線 233可以由鋼等具有導電性的金屬材質形成。 各向異性導電性黏接部件240包括分別接觸於撓性電路基板230 的電$配線233和透明電極圖案22〇的部分。電路配線233可以由預 先设疋的圖案形成’以便選擇性地向透明電極圖案22〇施加電訊號。 隨之’如第3圖所示’撓性電路基板23〇的電路配線233形成在撓性 基板231的下表面’各向異性導電性黏接部件24〇配置在撓性電路基 板230和透明電極圖案220之間，從而各向異性導電性黏接部件240 電連接撓性電路基板230的電路配線233和透明電極圖案22〇。 各向異性導電性黏接部件24〇是沿厚度方向（在第3圖中上下方 向）為導電性、表面方向（在第3圖中橫方向）為電絕緣性之具有電 各向異性的黏接部件。例如各向異性導電性黏接部件24()是在薄膜狀 ，接劑中均勻分散導電性之微粒的部件可以由經過熱壓工序沿膜的 厚度方向為導電性、沿面方向為電絕緣性之具有電各向異性的電路連 接用材料即各向異性導電性薄膜（aniSGt_e _duCdVe film，ACF ) ί、向異〖生導電性黏接劑（Anisotropic conductive adhesive, ACA )形 成。 里μΪ性電路基板23㈣電路配線233 *透明電極圖案220藉由各向 :'、電眭黏接部件240相互黏貼’電路配線233和透明電極圖案220 Τ以電連接，藉由各向異性導電性黏接部件的電各向異性，可以 防止電路配線233之間相互被電短路。 μ道^時’挽性電路基板230力電路配線233形成為可以藉由各向異 ? m张性黏接部件施直接電連接在透明電極圖案22G。例如，如第 撓性電路基板230具有圍繞透明電極圖案220外廓之四邊 形狀’從而可以形成為藉由各向異性導電性黏接部件240可 透明電極圖案220。但是’撓性電路基板230和電路配 妙嫂為厂^限於四邊帶子形狀，根據透明電極圖案22()的電極連 w的μ位置’可以形成為在透明電極圖案22G的外側中-部分未配 U例如，透明電極圖案220可以形成整體上具有四邊形的外 201211872 形，撓性電路基板230可以形成為僅配置於透明電極圖案22〇四伽冰: The case of "square" or "below" also includes other parts in between J. A part is located "directly above" or "directly below" in other parts, indicating that ^ has no other parts. According to the embodiment of the present invention, the electrostatic capacitance touch panel of the present invention is provided with a window panel-body type electrostatic capacitance touch panel according to an embodiment of the present invention. In addition, the description of the electrostatic capacitance touch sensor according to the embodiment of the present invention is omitted. 201211872 First, a window panel 110 is provided. For example, the window panel 11 can have a substantially quadrangular shape, and can be formed of a synthetic resin such as glass or acrylic resin having light transparency. On the other hand, although omitted in the drawings, a design layer having a quadrangular tape shape having a certain width may be formed along the outer corner of the lower surface of the window panel. The design layer may be formed of an opaque material, for example, a non-conductive opaque material may be formed by printing or steaming a wire mesh or the like. The electrostatic capacitance touch sensor 200 according to an embodiment of the present invention is disposed under the windowed panel 110. Referring to Figs. 1 to 3, the electrostatic capacitance touch sensor substrate 2 is disposed under the windowed panel 110. The electrostatic capacitance touch sensor 200 includes an electrostatic capacitance touch sensor substrate 21A and a transparent electrode pattern 22G. The transparent electricity pattern 22G may be formed on the upper surface or the lower surface of the electrostatic capacitance touch sensor substrate 210. The embodiment according to the fourth to fourth embodiments is a case where the transparent electrode pattern 220 is formed on the upper surface of the electrostatic capacitance touch sensor substrate 21, and the transparent electrode pattern 22 is formed according to the embodiment of FIGS. 5 and 6. In the case where the electrostatic capacitance touch senses the lower surface of the substrate 210. Referring to Figures 2 and 3, a transparent electrode pattern 22 is formed on the upper surface of the capacitive touch sensor substrate 210. The electrostatic electric valley touch sensor substrate 210 may be formed of a transparent material such as glass or a pet film, and the transparent electrode pattern 220 may be sputtered or vapor-deposited on the electrostatic capacitance sensor substrate 210 (ITO, indiume tin oxide). It is formed by indium zinc oxide (ZnO), oxidation (ZnO), and the like. In this case, the transparent electrode pattern 220 may include the first electrode pattern 221 and the second electrode pattern 223 which are formed to extend in mutually perpendicular directions. The form and the direction of the extension of the first electrode pattern 221 and the second electrode pattern 223 are not limited to those in the drawing. The form shown can be varied in various ways. A flexible printed circuit board (FPCB) 230 is provided for the interface with the outside. The circuit wiring 233 of the flexible circuit board 230 is used to be electrically connected to the transparent electrode pattern 220. That is, the flexible circuit board 230 has a function of selectively applying an external electric signal to the transparent electrode pattern 220. 201211872 The elaboration circuit substrate 230 may include a flexible substrate 231 and a circuit wiring 233 formed on the surface thereof. The flexible substrate 231 may be formed of a flexible synthetic resin material, and the circuit wiring 233 may be formed of a conductive metal material such as steel. . The anisotropic conductive bonding member 240 includes portions that are in contact with the electric wiring 233 and the transparent electrode pattern 22A of the flexible circuit board 230, respectively. The circuit wiring 233 may be formed by a pattern of a pre-set 以便 to selectively apply a telecommunication signal to the transparent electrode pattern 22A. Then, as shown in FIG. 3, the circuit wiring 233 of the flexible circuit board 23 is formed on the lower surface of the flexible substrate 231. The anisotropic conductive bonding member 24 is disposed on the flexible circuit board 230 and the transparent electrode. Between the patterns 220, the anisotropic conductive bonding member 240 electrically connects the circuit wiring 233 of the flexible circuit board 230 and the transparent electrode pattern 22A. The anisotropic conductive adhesive member 24A is an electrically anisotropic adhesive which is electrically conductive in the thickness direction (vertical direction in FIG. 3) and is electrically insulating in the surface direction (horizontal direction in FIG. 3). Connect the parts. For example, the anisotropic conductive adhesive member 24 () is a member in which a conductive fine particle is uniformly dispersed in a film form, and the conductive material can be electrically conductive in the thickness direction of the film and electrically insulating in the surface direction through a hot pressing process. An anisotropic conductive film (ACA) which is a material for circuit connection having electrical anisotropy is formed by an anisotropic conductive adhesive (ACA). Ϊμ Ϊ 电路 电路 ( ( * * * * * * * * * * * * * * * * * * * * 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明 透明The electrical anisotropy of the bonding member prevents the circuit wirings 233 from being electrically short-circuited with each other. The dummy circuit board 233 is formed so as to be directly electrically connected to the transparent electrode pattern 22G by the respective differential opening members. For example, if the first flexible circuit substrate 230 has a quadrangular shape 'around the outer shape of the transparent electrode pattern 220, it can be formed such that the electrode pattern 220 can be transparent by the anisotropic conductive bonding member 240. However, the 'flexible circuit substrate 230 and the circuit arrangement are limited to the shape of the four-sided tape, and the μ position of the electrode connection w according to the transparent electrode pattern 22 () may be formed in the outer side of the transparent electrode pattern 22G - the portion is not matched. U, for example, the transparent electrode pattern 220 may be formed into an outer 201211872 shape having a quadrangular shape as a whole, and the flexible circuit substrate 230 may be formed only to be disposed on the transparent electrode pattern 22
............ 叩圪稞取在靜電電 摸感測器基板上於透明電極圖案周圍另外形成電極配線之後將 此與撓性電路基板的電路配線連接的方式。即，過去也使用過I供田............ A method of connecting the circuit wiring to the flexible circuit board after the electrode wiring is additionally formed around the transparent electrode pattern on the electrostatic sensor substrate. That is, I used I for the past.
…^ w,巩㈤沿签很π用龈麗tp刷或蒸鑛形成電極配 線而具有難以體現微細圖案的問題，妓根據本發明的實施例 性電路基板形成電路配線，所以可以利用在製作撓性電路基板時利用...^ w, Gong (5) along the sign is very π with a beautiful tp brush or steam to form electrode wiring and has a problem that it is difficult to embody a fine pattern, and the circuit board according to the embodiment of the present invention forms a circuit wiring, so it can be used in manufacturing Use in circuit board
另-方面，參照第3 ® ’各向異性導電性黏接部件24〇配置 明電極圖案220的邊緣的-部分。即，各向異性導電性黏接部件⑽ 配置成與透明電極圖案220的邊緣的一部分沿上下方向重疊。 另外’參照第3圖’透明電極圖案22〇可以形成為在^電電容觸 摸感測器基板210的邊緣部分具備㉔區域，各向異性導電性黏接部 件240可以配置在透明電極圖案的邊緣的—部分。並且，還可以 具備配置於靜電電容繼感難基板21G的邊緣部分的空白區域和挽 ，電路基板23G之間的黏接劑層25G。黏接劑層㈣具有黏貼靜電電 容觸摸感測器基板210和撓性電路基板23〇的功能。 ，供规列盃丞奴ζιυ黏貼在帶窗口面 可以由如光學用透明黏接劑（optically 板110。例如，透明黏接劑層120 clear adhesive，OCA)形成。 另方面參‘，、、第2圖及第3圖，根據本發明實施例的帶視窗面 板-體型靜電電容觸摸感測器包括配置在透明電極圖案，和帶視窗 面板110下表面之間的透明黏接劑層120。透明黏接劑们2〇將形成 為透明電極圖案22G的靜電電容觸摸感測器基板細黏貼在帶窗口面 第4圖是表示根據本發明另一實施例的靜電電容觸摸感測器及包 括該靜電電容觸摸感測器的帶視窗面板—體型靜電電容觸摸板之 201211872 :其=浪明的實施例相同的部分使用相同的附圖符號，省略 參照第4圖，透明電極圖案22()形成為在靜On the other hand, the portion of the edge of the electrode pattern 220 is disposed with reference to the 3 ® ' anisotropic conductive bonding member 24'. That is, the anisotropic conductive adhesive member (10) is disposed so as to overlap a portion of the edge of the transparent electrode pattern 220 in the vertical direction. Further, 'refer to FIG. 3', the transparent electrode pattern 22 can be formed to have 24 regions at the edge portion of the capacitive touch sensor substrate 210, and the anisotropic conductive bonding member 240 can be disposed at the edge of the transparent electrode pattern. -section. Further, an adhesive layer 25G disposed between the blank region of the edge portion of the electrostatic capacitor dynaming substrate 21G and the handle and the circuit board 23G may be provided. The adhesive layer (4) has a function of adhering the electrostatic capacitance touch sensor substrate 210 and the flexible circuit substrate 23A. For the specification of the cup, the ζ ζ ζ can be adhered to the window surface. It can be formed by a transparent adhesive such as optics (for example, transparent adhesive layer 120, for example, transparent adhesive layer, OCA). In another aspect, the window panel-body type electrostatic capacitance touch sensor according to the embodiment of the present invention includes a transparent electrode pattern disposed between the transparent electrode pattern and the lower surface of the window panel 110. Adhesive layer 120. The transparent adhesive 2 细 is formed by the electrostatic capacitance touch sensor substrate formed as the transparent electrode pattern 22G on the window surface. FIG. 4 is a view showing an electrostatic capacitance touch sensor according to another embodiment of the present invention and including the same The window panel of the electrostatic capacitance touch sensor - the body type electrostatic capacitance touch panel 201211872: the same parts of the same embodiment are the same reference numerals, and the reference to the fourth figure is omitted, and the transparent electrode pattern 22 () is formed as In silence
=咖P她白區域，各向異性導電性黏接==J 基晋板210邊緣部分的空白區域和透明電極圖案 220的邊緣的-部分配置。即，各向異性導電 明=電路基板咖的電路配線 第卜追加性的黏接劑也可以提高黏接力。 第5圖疋表不根據本發明另一實施例的靜 括該靜電電容觸摸感測器的帶視窗面板一 == ==遍賴施例相同的部分使用相同的 第5圖的實施例與第3圖的實施例類似，透 在靜電電錢減測11純11G的下表面，舰 ^开置= 透明電極圖㈣0下方’藉由各向異性導電_ 接$ 明電極圖案22G。這時，電連接在透明電_案22 配^在透 ^在撓性電路基板23G的上表面。並且，黏 = 透明電極圖案220和各向異性導電性黏接部件2 及= 電容觸摸感測器基板2K)和撓性電路基板⑽之間 $ 電電容觸摸感測器基板2H)上表面和帶視窗 2 接劑層 130。 第6圖是表示根據本發明另一實施例的静 — 括該靜電電容觸摸感測器的帶視窗面板—體^觸％感測器及包 其之說明。 使用相同的附圖符號，省略對 若參照第6圖’透明電極圖案220形成右挺册 板110的下表面，這時透明電極圖案220形成^電容觸摸感測器基 器基板21G的邊緣部分具備空白區域，各向靜電電容觸摸感測 貫穿靜電電容觸摸感測器基板210的邊緣部八電性黏接部件6 4 0 圖請的邊緣的-部分配置。即’各向異:生導;=== 201211872 明電極圖案220和撓性電路基板加的電路配線的連接部位 刀付。隨之，不需要另外返加性的黏接劑也可以提高黏接力。 以下’參照第7圖及第8圖對根據本發明另一實施例的帶視窗面 板-體型靜電電容觸摸板進行說明。省略對與上面說明的實施例 的部分的說.明。 =第7圖及第8圖所不’在本實施例中透明電極圖案22()形成在 視®面板110的下表面。即’不需要另外的靜電電容觸摸感測器基 板二透明電極圖案，直接形成在帶視窗面板m的下表面。這時， 沿耆帶視窗面板11GT表面和外廓❹可以形成設計層，這時透 極圖案220可以貫穿帶視窗面板11〇下表面的中心部及設計層的 一部分形忐。 具備撓性電路基230 ’該撓性電路基板23〇具有用於與透明電 極圖案220電連接的電路配線，還具備各向異性導電性黏接部件 240，該各向異性導電性黏接部件24〇包括分別接觸於撓性電路基板 230和透明電極圖案220的部分，將撓性電路基板23〇的電路配線和 透明電極圖案220以相互電連接的狀態黏接。 撓性電路基板230配置在透明電極圖案22〇下方，藉由各向異性 導電性黏接部件240黏接在透明電極圖案220。這時，電連接在透明 電極圖案220的電路配線233形成在撓性電路基板23〇的上表面。並 且，黏接劑層250可以配置在透明電極圖案220和各向異性導電性黏 接部件240的外側、以及帶視窗面板110和撓性電路基板23〇之間。 另一方面，參照第8圖，透明電極圖案220形成為在帶視窗^板 】10的邊緣部分具備空白區域’各向異性導電性黏接部件640貫穿帶 視窗面板110的邊緣部分的空白區域和透明電極圖案220的邊緣的一 部分配置。即’各向異性導電性黏接部件640形成為比透明電極圖案 220和撓性電路基板230的電路配線的連接部位分佈得寬。隨之，不 需要另外追加性的黏接劑也可以提南黏接力。 以上所使用的“透明”用語的意義不僅包括光學上完全透明的 情況，還包括部分透明的情況。 11 201211872 在以上已說明本發明的實施例，但是本發明的申請專利範圍不限 於此，還包括本發明所屬技術領域的普通技術人員根據本發明的實施 例容易變更而被認為均等之範圍内的所有變更及修改。 【圖式簡單說明】 第1圖是根據本發明之實施例之帶視窗面板一體型靜電電容觸 摸板的立體圖； 第2圖是根據本發明之實施例之帶視窗面板一體型靜電電容觸 摸板的分解立體圖； 第3圖是沿圖lm — ii線剖開之剖面圖； 第4圖是根據本發明另一實施例之帶視窗面板一體型靜電電容 觸摸板的剖面圖； 第5圖是根據本發明另一實施例之帶視窗面板一體型靜電電容 觸摸板的剖面圖； 第6圖是根據本發明另一實施例之帶視窗面板一體型靜電電容 觸摸板的剖面圖； 第7圖是根據本發明另一實施例之帶視窗面板一體型靜電電容 觸摸板的剖面圖；以及 第8圖是根據本發明另一實施例之帶視窗面板一體型靜電電容 觸摸板的剖面圖。 【主要元件符號說明】 110 帶視窗面板 120 透明黏接劑層 130 透明黏接劑層 200 靜電電容觸摸感測器 210 靜電電容觸摸感測器基板 220 透明電極圖案 221 第1電極圖案 223 第2電極圖案 12 201211872 230 撓性電路基板 231 撓性基板 233 電路配線 240 各向異性導電性黏接部件 250 黏接劑層 440 各向異性導電性黏接部件 640 各向異性導電性黏接部件 13= coffee P her white area, anisotropic conductive bonding == J The blank area of the edge portion of the substrate 210 and the edge-part configuration of the transparent electrode pattern 220. In other words, the anisotropic conductive material = circuit wiring of the circuit board coffee can also improve the adhesion. FIG. 5 is a view showing a window panel without the electrostatic capacitance touch sensor according to another embodiment of the present invention. A==== The same portion of the embodiment is the same as the embodiment of the fifth FIG. The embodiment of Fig. 3 is similar, through the lower surface of the electrostatic 11% pure 11G, and the lower surface of the transparent electrode (4) 0 is 'by anisotropic conduction _ $ the electrode pattern 22G. At this time, the electric connection is electrically connected to the upper surface of the flexible circuit board 23G. And, between the adhesive = transparent electrode pattern 220 and the anisotropic conductive bonding member 2 and the = capacitive touch sensor substrate 2K) and the flexible circuit substrate (10), the upper surface of the capacitive touch sensor substrate 2H) Window 2 adhesive layer 130. Fig. 6 is a view showing a window panel-body touch sensor and a description thereof, including the electrostatic capacitance touch sensor, according to another embodiment of the present invention. The same reference numerals are used, and the lower surface of the right elongate plate 110 is formed by referring to the transparent electrode pattern 220 of FIG. 6, and the transparent electrode pattern 220 is formed with a blank portion of the edge portion of the capacitive touch sensor base substrate 21G. In the region, each of the electrostatic capacitance touch sensing passes through the edge portion of the electrostatic capacitance touch sensor substrate 210, and the eight-part electrical connection member is disposed in an edge-part configuration. That is, 'different: raw conductor; === 201211872 The connection portion between the electrode pattern 220 and the circuit wiring to which the flexible circuit board is applied is a knife. As a result, the adhesion can be improved without the need for an additional additive. Hereinafter, a window-panel-body type electrostatic capacitance touch panel according to another embodiment of the present invention will be described with reference to Figs. 7 and 8. The description of the parts of the embodiment described above is omitted. = Fig. 7 and Fig. 8 No. In the present embodiment, the transparent electrode pattern 22 () is formed on the lower surface of the view panel 110. That is, no additional electrostatic capacitance touch sensor substrate two transparent electrode patterns are required, which are directly formed on the lower surface of the window panel m. At this time, a design layer may be formed along the surface of the tape window panel 11GT and the outer frame, and the lens pattern 220 may penetrate the center portion of the lower surface of the window panel 11 and a part of the design layer. The flexible circuit substrate 230 ′ has the circuit wiring for electrically connecting to the transparent electrode pattern 220 , and further includes an anisotropic conductive bonding member 240 , and the anisotropic conductive bonding member 24 The 〇 includes portions that are in contact with the flexible circuit board 230 and the transparent electrode pattern 220, respectively, and the circuit wiring of the flexible circuit board 23 and the transparent electrode pattern 220 are bonded to each other in a state of being electrically connected to each other. The flexible circuit board 230 is disposed under the transparent electrode pattern 22, and is bonded to the transparent electrode pattern 220 by the anisotropic conductive bonding member 240. At this time, the circuit wiring 233 electrically connected to the transparent electrode pattern 220 is formed on the upper surface of the flexible circuit board 23A. Further, the adhesive layer 250 may be disposed outside the transparent electrode pattern 220 and the anisotropic conductive bonding member 240, and between the windowed panel 110 and the flexible circuit substrate 23A. On the other hand, referring to Fig. 8, the transparent electrode pattern 220 is formed to have a blank region in the edge portion of the window panel 10, and a blank region in which the anisotropic conductive bonding member 640 penetrates the edge portion of the window panel 110 and A portion of the edge of the transparent electrode pattern 220 is disposed. In other words, the anisotropic conductive adhesive member 640 is formed to be wider than the connection portion of the transparent electrode pattern 220 and the circuit wiring of the flexible circuit board 230. As a result, the adhesion can be improved without the need for additional adhesives. The meaning of the term "transparent" as used above includes not only the case of being optically completely transparent, but also the case of partial transparency. 11 201211872 The embodiments of the present invention have been described above, but the scope of the present invention is not limited thereto, and includes those skilled in the art to which the present invention pertains, which are easily changed and are considered to be within the scope of the present invention. All changes and modifications. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an integrated capacitive touch panel with a window panel according to an embodiment of the present invention; FIG. 2 is an integrated capacitive touch panel with a window panel according to an embodiment of the present invention. 3 is a cross-sectional view taken along the line lm-ii; FIG. 4 is a cross-sectional view of the integrated capacitive touch panel with a window panel according to another embodiment of the present invention; FIG. 6 is a cross-sectional view of an integrated capacitive touch panel with a window panel according to another embodiment of the present invention; FIG. 7 is a cross-sectional view of a capacitive touch panel with a window panel according to another embodiment of the present invention; A cross-sectional view of a window-panel-integrated electrostatic capacitance touch panel according to another embodiment of the invention; and FIG. 8 is a cross-sectional view of the window-panel-integrated electrostatic capacitance touch panel according to another embodiment of the present invention. [Main component symbol description] 110 with window panel 120 transparent adhesive layer 130 transparent adhesive layer 200 electrostatic capacitance touch sensor 210 electrostatic capacitance touch sensor substrate 220 transparent electrode pattern 221 first electrode pattern 223 second electrode Pattern 12 201211872 230 Flexible circuit substrate 231 Flexible substrate 233 Circuit wiring 240 Anisotropic conductive bonding member 250 Adhesive layer 440 Anisotropic conductive bonding member 640 Anisotropic conductive bonding member 13