CN107102253B - Test equipment and power supply jig thereof - Google Patents
Test equipment and power supply jig thereof Download PDFInfo
- Publication number
- CN107102253B CN107102253B CN201710325163.0A CN201710325163A CN107102253B CN 107102253 B CN107102253 B CN 107102253B CN 201710325163 A CN201710325163 A CN 201710325163A CN 107102253 B CN107102253 B CN 107102253B
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- probe
- probe seat
- elastic probes
- groove
- power supply
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The embodiment of the invention provides a power supply jig which is used for injecting large current when a semiconductor laser is not subjected to an electrical isolation bare BAR test. The embodiment of the invention also relates to test equipment. The tips of the elastic probes of the power supply jig are positioned on the same plane, and the power supply jig can be in good contact with the bare BAR which is not electrically isolated through the test equipment, so that the power supply jig is beneficial to the bare BAR test which is not electrically isolated.
Description
Technical Field
The invention relates to the technical field of semiconductor laser chip testing, in particular to testing equipment and a power supply jig thereof.
Background
With the increasing expansion of the application fields of semiconductor lasers (LD, Laser Diode), such as LD Pumped Solid-State lasers (DPL), pump sources of various fiber lasers, Laser cutting, welding, medical treatment, Laser military applications, etc., the requirements on the output power and reliability of semiconductor lasers are also increasing. The semiconductor laser chip is a core part of the semiconductor laser and has a name of a semiconductor laser "CPU".
The Full BAR is a high-power semiconductor laser chip which is not electrically isolated, and testing and characterizing performance parameters (such as LIV characteristics, spectral characteristics and the like) of a bare BAR of the high-power semiconductor laser which is not electrically isolated is a key for deeply understanding the characteristics of the laser chip, optimizing the structure design of the chip and perfecting the chip production process, and is also an important basis for judging the quality of the laser chip. Therefore, the nondestructive testing of the high-power semiconductor laser chip which is not electrically isolated has extremely important significance for scientific research units, manufacturers and users.
The nondestructive testing of the bare BAR of the high-power semiconductor laser which is not electrically isolated needs to ensure that the power supply jig is reliably contacted with the bare BAR under certain pressure when the power supply is tested, and the power supply jig needs to stably and uniformly inject larger current, so that higher requirements are provided for the power supply jig required by the bare BAR testing.
Referring to fig. 1, fig. 1 is a schematic diagram of a power supply fixture in the prior art. The existing test of the bare BAR10 of the large-power semiconductor laser without electric isolation usually adopts the elastic sheet metal 20 as a power supply jig, and the main defects are as follows: although the power supply jig can reliably contact with the bare BAR10 with certain elasticity, the power supply jig and the bare BAR10 are difficult to integrally attach and contact, and the uniform injection of current on the bare BAR10 is difficult to ensure.
Disclosure of Invention
The invention provides a power supply jig which can solve the technical problem that the power supply jig and a bare BAR are difficult to attach and contact in the prior art.
In order to solve the technical problems, the invention adopts a technical scheme that: the power supply jig comprises a probe clamp and a plurality of elastic probes, wherein the plurality of elastic probes are clamped and fixed by the probe clamp, and one ends of the tips of the plurality of elastic probes are positioned on the same plane.
The probe fixture comprises a probe seat and a probe fixing piece, the probe seat is provided with an accommodating space, the elastic probes are arranged in the accommodating space, and the probe fixing piece is used for fixing the elastic probes.
The probe seat comprises a probe seat body and a lug extending from one side of the probe seat body, the accommodating space is formed in the middle of the probe seat body, and the lug is used for pre-fixing a power supply output wire.
The probe seat comprises a probe seat body, wherein a first groove is formed in the middle of the probe seat body, the first groove penetrates through the width direction of the probe seat body, an accommodating block is arranged in the first groove, an accommodating space is formed in the accommodating block, and the accommodating space is a second groove.
The top surface of the containing block is lower than the top surface of the probe seat body, the width of the containing block is smaller than that of the probe seat body, and the space close to the containing block in the first groove is used for placing solder.
The probe fixing piece comprises a fixing plate and a boss extending from the bottom surface of the fixing plate, the boss is connected with the first groove in a matched mode to fix the elastic probes, and the probe seat is fixedly connected with the fixing plate through screws.
Wherein, a plurality of elastic probes are overlapped in a plurality of rows.
Wherein, a plurality of elastic probes are two rows and set up, and every row has 25 elastic probes, and every elastic probe's external diameter is 0.35mm, and probe seat and probe mounting all adopt red copper processing to form and carry out nickel plating surface treatment.
The probe seat is positioned through the probe seat bottom surface placing surface and the probe seat side surface placing surface which are sequentially connected, the plurality of elastic probes are arranged on the probe seat, and one end of the probe point extends to the upper side of the probe engaging surface until abutting against the probe abutting surface.
According to the power supply jig provided by the embodiment of the invention, the plurality of elastic probes with the needle points in the same plane are arranged, so that the power supply jig is ensured to be in good contact with the electrically-isolated bare BAR, and the electrically-isolated bare BAR is favorably tested.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
FIG. 1 is a schematic diagram of a power supply fixture in the prior art;
FIG. 2 is a schematic perspective view of the power supply fixture of the present invention;
fig. 3 is an exploded view of the power supply jig shown in fig. 2;
fig. 4 is a schematic view of an assembly structure of the power supply jig and the planar manufacturing jig shown in fig. 2.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 2 and 3, fig. 2 is a schematic perspective view of a power feeding jig according to the present invention, and fig. 3 is a schematic view of an exploded structure of the power feeding jig shown in fig. 2. In this embodiment, the power feeding jig is used for injecting a large current when a semiconductor laser is tested without electrically isolating a bare BAR, where the bare BAR refers to an unpackaged BAR without electrical isolation, the power feeding jig includes a probe clamp and a plurality of elastic probes 101, the probe clamp clamps and fixes the plurality of elastic probes 101, and tips of the plurality of elastic probes 101 are located on the same plane. Because the elastic sheet metal foil in the prior art is replaced by the plurality of elastic probes 101, and one ends of the tips of the plurality of elastic probes 101 are positioned on the same plane, the bare BAR can be well attached, and thus the uniform injection of current is ensured. In this embodiment, the probe holder includes a probe base 201 and a probe fixing member 301.
The probe seat 201 is provided with an accommodating space, and the plurality of elastic probes 101 are arranged in the accommodating space. Specifically, the probe seat 201 includes a probe seat body 202 and a lug 203 extending from one side of the probe seat body 202, an accommodation space is formed in the middle of the probe seat body 202, the lug 203 is used for pre-fixing an electric power output wire, and preferably, the probe seat body 202 and the lug 203 are integrally formed. Further, a first groove 204 is formed in the middle of the probe socket body 202, the first groove 204 is disposed through the width direction of the probe socket body 202, an accommodating block 205 is disposed in the first groove 204, an accommodating space is formed in the accommodating block 205, and the accommodating space is a second groove 206. The top surface of the accommodating block 205 is lower than the top surface of the probe socket body 202, the width of the accommodating block 205 is smaller than the width of the probe socket body 202, and the space in the first groove 204 adjacent to the accommodating block 205 is used for placing solder. The accommodating space can also be formed at the side of the probe seat body 202. The top surface of the receiving block 205 may also be flush with the top surface of the probe socket body 202, and the height of the receiving block 205 is determined by the height of the elastic probe 101. It should be noted that, the two ends of the probe seat body 202 are respectively provided with a mounting hole 207 for integrally mounting the power supply jig to the testing equipment.
The probe fixing member 301 includes a fixing plate 302 and a boss 303 extending from a bottom surface of the fixing plate 302, the boss 303 is connected with the first groove 204 in a matching manner, the probe base 201 is fixedly connected with the fixing plate 302 through a screw 40, two screw holes are respectively formed in two sides of the probe base body 202 close to the first groove 204, two screw holes are respectively formed in corresponding positions of the fixing plate 302, and the probe base 201 is fixedly connected with the fixing plate 302 through 4 screws 40. In this embodiment, the boss 303 and the first groove 204 are preferably in transition fit or clearance fit, as long as the tip of the elastic probe 101 can be fixedly held on the same plane, and the manner of fitting the boss 303 and the first groove 204 is not limited. In other embodiments, the boss 303 may be absent. The fixing plate 302 and the boss 303 are preferably integrally formed.
The plurality of elastic probes 101 are arranged in a plurality of rows overlapping. Preferably, in this embodiment, the plurality of elastic probes 101 are arranged in two rows, each row has 25 elastic probes 101, the outer diameter of each elastic probe 101 is 0.35mm, and the elastic probes 101 in each row are closely connected. Of course, in other embodiments, 3 rows or 4 rows of elastic probes 101 may be provided, or elastic probes 101 with other outer diameters may be provided, and the number of rows and the outer diameters of the elastic probes 101 are not limited in the present invention.
The probe holder 201 and the probe fixing member 301 are preferably processed by red copper and subjected to nickel plating surface treatment, so that the probe holder 201 and the probe fixing member 301 can be easily welded.
In this embodiment, a split probe fixture is adopted, that is, the probe fixture includes a probe base 201 and a probe fixing member 301, and in other embodiments, an integrated probe fixture may also be adopted, which is not limited in the present invention.
Referring to fig. 4, fig. 4 is a schematic view of an assembly structure of the power supply jig and the planar manufacturing jig 50 shown in fig. 2. In the embodiment, the one ends of the tips of the plurality of elastic probes 101 are located on the same plane by the plane making jig 50, the plane making jig 50 includes a jig main body 506, a third groove 501 with a w-shaped cross section is formed in the jig main body 506, the third groove 501 includes a bottom placing surface 502, a side placing surface 503, a probe engaging surface 504 and a probe abutting surface 505 which are connected in sequence, the probe holder 201 is positioned by the bottom placing surface 502 and the side placing surface 503 of the probe holder 201, the plurality of elastic probes 101 are disposed on the probe holder 201, and one end of the tip extends to above the probe abutting surface 504 until abutting against the probe abutting surface 505. In other embodiments, a right-angled fixture may be directly utilized to make the tips of the elastic probes 101 be in the same plane, for example, the probe base 201 is fixed on the horizontal plane of the fixture, and the tips of the elastic probes 101 abut against the vertical plane to make the tips of the elastic probes 101 be in the same plane.
The structure of the power supply jig is described above, and the assembly process of the power supply jig is described below by way of example:
1. the power supply jig is fixed on the plane manufacturing fixture 50, 50 elastic probes 101 with the outer diameter of 0.35mm are arranged in an array one by one in the accommodating space of the probe seat body 202, and the array form of the elastic probes 101 is 2x 25;
2. the probe fixing piece 301 is fixed on the probe seat body 202 through 4M 2 screws;
3. adding solder into the space adjacent to the accommodating block 205 in the first groove 204, and connecting the elastic probe 101 array, the probe seat 201 and the probe fixing piece 301 into a whole;
4. and finally, locking the probe fixing piece 301 and taking down the power supply jig from the plane manufacturing fixture 50.
The invention also provides a test device which comprises the power supply jig of the embodiment, and the test device can integrate and test the characteristics of the bare BAR such as optical power, electricity, wavelength and the like, thereby providing a powerful guarantee for developing and producing a high-performance high-power semiconductor laser.
According to the power supply jig provided by the embodiment of the invention, the plurality of elastic probes with the needle points in the same plane are arranged, so that the power supply jig is ensured to be in good contact with the electrically-isolated bare BAR, and the electrically-isolated bare BAR is favorably tested. Further, non-destructive testing with pulse current carrying up to 200A is enabled.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A power supply jig is used for injecting large current when a semiconductor laser is tested without electrically isolating bare BAR, and is characterized by comprising a probe clamp and a plurality of elastic probes, wherein the probe clamp clamps and fixes the elastic probes, the needle points of the elastic probes are positioned on the same plane, the probe clamp comprises a probe seat and a probe fixing piece, the probe seat is provided with an accommodating space, the elastic probes are arranged in the accommodating space, the probe fixing piece is used for fixing the elastic probes, the probe seat comprises a probe seat body and a lug extending from one side of the probe seat body, the accommodating space is formed in the middle of the probe seat body, the lug is used for pre-fixing a power supply output wire, mounting holes are formed in two ends of the probe seat body and used for mounting the power supply jig to a test device integrally, the probe seat comprises a probe seat body and is characterized in that a first groove is formed in the middle of the probe seat body, the first groove penetrates through the width direction of the probe seat body, an accommodating space is formed in the first groove, the accommodating space is a second groove, the top surface of the accommodating block is lower than that of the probe seat body, the width of the accommodating block is smaller than that of the probe seat body, the space close to the accommodating block in the first groove is used for placing welding flux, the probe fixing piece comprises a fixing plate and a boss extending from the bottom surface of the fixing plate, the boss is connected with the first groove in a matched mode to fix the elastic probes, and the probe seat is fixedly connected with the fixing plate through screws.
2. The power feeding jig according to claim 1, wherein the plurality of elastic probes are arranged in a plurality of rows in an overlapping manner.
3. The power feeding jig of claim 2, wherein the plurality of elastic probes are arranged in two rows, each row has 25 elastic probes, the outer diameter of each elastic probe is 0.35mm, and the probe base and the probe fixing member are both processed by red copper and subjected to nickel plating surface treatment.
4. The power feeding jig according to claim 1, wherein the plurality of elastic probes make the tips of the plurality of elastic probes in a same plane through a planar manufacturing jig, the planar manufacturing jig includes a jig main body, a third groove having a w-shaped cross section is formed in the jig main body, the third groove includes a probe seat bottom surface placing surface, a probe seat side surface placing surface, a probe engaging surface and a probe abutting surface, which are connected in sequence, the probe seat is positioned by the probe seat bottom surface placing surface and the probe seat side surface placing surface, the plurality of elastic probes are disposed on the probe seat, and one tip of the plurality of elastic probes extends to above the probe engaging surface until abutting against the probe abutting surface.
5. A test device characterized in that it comprises a power feeding jig according to any one of claims 1 to 4.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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CN201710325163.0A CN107102253B (en) | 2017-05-10 | 2017-05-10 | Test equipment and power supply jig thereof |
PCT/CN2018/086234 WO2018205960A1 (en) | 2017-05-10 | 2018-05-10 | Test device and power supply fixture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710325163.0A CN107102253B (en) | 2017-05-10 | 2017-05-10 | Test equipment and power supply jig thereof |
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CN107102253A CN107102253A (en) | 2017-08-29 |
CN107102253B true CN107102253B (en) | 2020-05-08 |
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CN201710325163.0A Active CN107102253B (en) | 2017-05-10 | 2017-05-10 | Test equipment and power supply jig thereof |
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WO (1) | WO2018205960A1 (en) |
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CN107102253B (en) * | 2017-05-10 | 2020-05-08 | 深圳瑞波光电子有限公司 | Test equipment and power supply jig thereof |
CN110017971B (en) * | 2019-05-21 | 2024-09-03 | 深圳市杰普特光电股份有限公司 | Laser bar photoelectric detection device |
Family Cites Families (12)
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JP2003185701A (en) * | 2001-12-20 | 2003-07-03 | Nec Kansai Ltd | Device and method for measuring electrical characteristics of semiconductor chip |
JP2008211121A (en) * | 2007-02-28 | 2008-09-11 | Shinka Jitsugyo Kk | Tool, apparatus and method of inspecting characteristics of semiconductor device |
KR101149759B1 (en) * | 2011-03-14 | 2012-06-01 | 리노공업주식회사 | A testing apparatus of the semiconductor device |
CN104638510B (en) * | 2013-11-14 | 2018-01-02 | 山东华光光电子股份有限公司 | A kind of semiconductor laser storehouse junior unit test, the device and method of aging |
CN204287405U (en) * | 2014-10-17 | 2015-04-22 | 深圳瑞波光电子有限公司 | The proving installation of semiconductor laser chip assembly |
CN104375273B (en) * | 2014-10-21 | 2016-11-09 | 武汉锐科光纤激光技术股份有限公司 | A kind of high-power semiconductor laser spot shaping device |
CN105988069B (en) * | 2015-01-29 | 2020-01-10 | 山东华光光电子股份有限公司 | Testing and aging device and method for semiconductor laser |
CN205720553U (en) * | 2016-04-07 | 2016-11-23 | 深圳清华大学研究院 | Multistation chip of laser assembly loading platform |
CN205720305U (en) * | 2016-04-14 | 2016-11-23 | 深圳清华大学研究院 | The test device of semiconductor laser chip assembly |
CN106597263A (en) * | 2017-01-20 | 2017-04-26 | 深圳清华大学研究院 | Test system of semiconductor laser chip |
CN206930747U (en) * | 2017-05-10 | 2018-01-26 | 深圳瑞波光电子有限公司 | Test equipment and its to electric tool |
CN107102253B (en) * | 2017-05-10 | 2020-05-08 | 深圳瑞波光电子有限公司 | Test equipment and power supply jig thereof |
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2017
- 2017-05-10 CN CN201710325163.0A patent/CN107102253B/en active Active
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2018
- 2018-05-10 WO PCT/CN2018/086234 patent/WO2018205960A1/en active Application Filing
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CN107102253A (en) | 2017-08-29 |
WO2018205960A1 (en) | 2018-11-15 |
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