CN205720553U - Multistation chip of laser assembly loading platform - Google Patents
Multistation chip of laser assembly loading platform Download PDFInfo
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- CN205720553U CN205720553U CN201620284895.0U CN201620284895U CN205720553U CN 205720553 U CN205720553 U CN 205720553U CN 201620284895 U CN201620284895 U CN 201620284895U CN 205720553 U CN205720553 U CN 205720553U
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- assembly loading
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Abstract
This utility model provides a kind of multistation chip of laser assembly loading platform, this multistation chip of laser assembly loading platform includes positioning heat-sink unit and to electric unit, wherein location heat-sink unit is for clamping the semiconductor laser chip of COS encapsulation type, and when test, semiconductor laser chip is carried out liquid cooling type radiation；For clamping probe module and probe module is made with semiconductor laser chip to contact and then test in elastic lifting mode to electric unit.The multistation chip of laser assembly loading platform that this utility model provides can carry out large-scale production test, can preferably ensure probe position relative with semiconductor laser chip and be difficult to chip is produced damage.
Description
Technical field
This utility model belongs to semiconductor laser chip field tests, relates to a kind of multistation and partly leads
Body laser chip ageing test platform, especially a kind of multistation chip of laser assembly loads flat
Platform.
Background technology
Along with semiconductor laser (LD, Laser Diode) application such as LD pumped solid swashs
Light device (DPL, Diode-Pumped Solid-State Laser), the pumping source of all kinds of optical fiber laser,
Day by day widening, to semiconductor laser of cut, welding, medical treatment and laser Military Application etc.
The requirement of device reliability is the most increasing.Semiconductor laser chip is semiconductor laser core
Point, there is the title of semiconductor laser " CPU ".
The most normal packing forms of semiconductor laser chip is COS (Chip On Submount), i.e.
Semiconductor laser chip is directly encapsulated on high heat sink of heat conductivity.COS crash rate accorded with the time
Closing the tub curve shown in Fig. 1, the most each COS needs to carry out certain time before Secondary Design
Burn-in test carry out brush choosing, short time content was easily lost efficacy, bad COS that the life-span is shorter is carried out
Reject, filter out the COS that the short time is difficult to inefficacy, energy high probability is survived for a long time and carry out follow-up
Secondary Design uses.The follow-up Secondary Design to be carried out of COS is (such as To_Can encapsulation, optical fiber coupling
Deng) form laser instrument, can the life-span of COS can directly influence laser instrument and reach intended use
Performance.No matter therefore developing and develop semiconductor laser aging testing system for R&D institution, life
Produce manufacturer, use client all to have particularly important meaning.
COS burn-in test is an important step of test system, a kind of multistation chip of laser
Assembly loading platform is provided that the non-destructive testing of relatively multistation, stable power-supplying, excellent radiating effect.Existing
The defect that some aging testing systems are primarily present is:
(1) single COS tests, it is impossible to carry out large-scale production test；
(2) testing with less station, probe portion and chip positioning part are relatively fixed,
Cannot preferably ensure the relative position of probe and COS, under the biggest electric current, probe is relatively thick, and chip can
Contact gives electricity region little, therefore requires higher, as shown in Figure 2 to overall structure；
(3) existing method of testing realizes to electricity frequently with rigid contact, easily chip is produced and damage
Wound.
Utility model content
This utility model provides a kind of multistation chip of laser assembly loading platform, existing to solve
Technology cannot be carried out large-scale production test, cannot preferably ensure the probe relative position with COS
And easily chip is produced the technical problem of damage.
For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide one
Plant multistation chip of laser assembly loading platform, including:
Location heat-sink unit, for clamping the semiconductor laser chip of COS encapsulation type, and in test
Time described semiconductor laser chip is carried out liquid cooling type radiation；
To electric unit, for clamping probe module and with elastic lifting mode make described probe module with
Described semiconductor laser chip contacts and then tests.
According to this utility model one preferred embodiment, described location heat-sink unit includes:
Sink main body, is inside provided with fluid passage；
Heat-radiating substrate, is connected with described sink main body heat conduction；
Semiconductor laser chip location-plate, compresses described semiconductor laser chip and is positioned at described dissipating
On hot substrate.
According to this utility model one preferred embodiment, described location heat-sink unit also includes:
Water-in and water-out water pipe, forms fluid circuit with the fluid passage of described sink main body；
Tank integral installation block, fixedly mounts with by described location heat-sink unit.
According to this utility model one preferred embodiment, described location heat-sink unit also includes:
Tank sealing plate, is tightly connected with described sink main body, and described water-in and water-out water pipe is with described
Tank sealing plate is tightly connected, and described tank integral installation block is fixing with described tank sealing plate even
Connect.
According to this utility model one preferred embodiment, described location heat-sink unit also includes compact heap,
Described heat-radiating substrate is pressed abd fixed on the surface of described sink main body by described compact heap.
According to this utility model one preferred embodiment, described include to electric unit:
Integral installation base plate；
Elastic lifting mechanism, is located on described integral installation base plate for making described probe module bullet
Property lifting；
Cam mechanism, is located on described integral installation base plate for applying described elastic lifting mechanism
Downforce.
According to this utility model one preferred embodiment, described elastic lifting mechanism includes:
A pair lifting guide pillar, is located on described integral installation base plate；
Lifting guide pin bushing, is sheathed on described lifting guide pillar；
Probe installation base plate, fixes with described lifting guide pin bushing and rises with Tong Bu with described lifting guide pin bushing
Fall；
Spring, is sheathed on described lifting guide pillar, is used for providing described lifting guide pin bushing and described probe
The active force of installation base plate upwards lifting.
According to this utility model one preferred embodiment, described elastic lifting mechanism also includes that guide rod is fixed
Connecting plate, described guide rod fixed connecting plate is connected to the top of the pair of lifting guide pillar, to strengthen
The pair of lifting guide pillar structural strength.
According to this utility model one preferred embodiment, described cam mechanism includes:
Pair of cams bearing, is located on described integral installation base plate；
Cam installs rotating shaft, and rotatory is located on described cam bearer；
Cam, is fixed at described cam and installs in rotating shaft；
Actuated by cams handle, is connected to described cam and installs the outer end of rotating shaft；
Cam limit block, be fixed on described probe installation base plate with when described cam rotates by institute
The active force stating cam rotation is converted into downward pressure.
According to this utility model one preferred embodiment, described also include that to electric unit probe module is fixed
Plate, described probe module fixed plate is fixing with described probe installation base plate to be connected, described probe module
Fixed plate is provided with fluting, in described probe module is located at described fluting and is locked by limit block.
The beneficial effects of the utility model are: be different from the situation of prior art, and this utility model carries
The multistation chip of laser assembly loading platform of confession can carry out large-scale production test, can be relatively
Ensure well probe position relative with semiconductor laser chip and be difficult to chip is produced damage.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in this utility model embodiment, below will be to enforcement
In example description, the required accompanying drawing used is briefly described, it should be apparent that, in describing below
Accompanying drawing is only embodiments more of the present utility model, for those of ordinary skill in the art,
On the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings,
Wherein:
Fig. 1 is the graph of a relation of COS crash rate and time；
Fig. 2 is that in prior art, COS burn-in test uses rigid contact to realize to the simplification signal of electricity
Figure；
Fig. 3 is that the structure of the multistation chip of laser assembly loading platform that this utility model provides is shown
It is intended to；
Fig. 4 is the structural representation positioning heat-sink unit in Fig. 3；
Fig. 5 is the structural representation in Fig. 3 to electric unit；
Fig. 6 is the structural representation of Fig. 3 middle probe module；
Fig. 7 is the structural representation that Fig. 5 middle probe module is installed；
The schematic diagram of cam when Fig. 8 is to be in working position in Fig. 5.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, in this utility model embodiment
Technical scheme is clearly and completely described, it is clear that described embodiment is only that this practicality is new
A part of embodiment of type rather than whole embodiments.Based on the embodiment in this utility model,
It is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of this utility model protection.
Referring to Fig. 3, Fig. 3 is that the multistation chip of laser assembly that this utility model provides loads
The structural representation of platform.
As it is shown on figure 3, this utility model provides a kind of multistation chip of laser assembly loading platform,
This multistation chip of laser assembly loading platform includes positioning heat-sink unit 100 and to electric unit
200。
Wherein, location heat-sink unit 100 is for clamping the semiconductor laser chip of COS encapsulation type
10, and when test, semiconductor laser chip 10 is carried out liquid cooling type radiation；To electric unit 200
Probe module 20 and semiconductor laser core is made for clamping probe module 20 and in elastic lifting mode
Sheet 10 contacts and then tests.
Specifically, seeing also Fig. 4, Fig. 4 is that the structure positioning heat-sink unit in Fig. 3 is shown
It is intended to.
As shown in Figure 4, location heat-sink unit 100 include sink main body 110, heat-radiating substrate 120,
Semiconductor laser chip location-plate 130, water inlet water pipe 141, water outlet water pipe 142, tank entirety peace
Dress block 150, tank sealing plate 160 and compact heap 170.
Wherein, the T-shaped shape of sink main body 110, including main part 112 and side portion 114, water
Being provided with fluid passage in groove body 110, this sink main body 110 is through to main body from side portion 114
In portion 112, sink main body 110 can use the preferable material of heat conductivity, such as aluminum alloy materials
Deng.
Heat-radiating substrate 120 is connected with sink main body 110 heat conduction, specifically, heat-radiating substrate 120 in
Rectangular plate-like, is close on a surface of main part 112, and heat-radiating substrate 120 can use heat conduction
The oxygen-free copper that coefficient is higher, the used heat produced when can quickly be worked by semiconductor laser chip is delivered to
On the sink main body 110 of aluminum alloy material, quickly used heat is taken away by cooling water.
Semiconductor laser chip 10 is compressed and is positioned at heat radiation by semiconductor laser chip location-plate 130
On substrate 120, in this utility model embodiment, semiconductor laser chip location-plate 130 can be
Plastic material.
Water inlet water pipe 141, water outlet water pipe 142 form fluid with the fluid passage of sink main body 110
Loop, tank integral installation block 150 fixedly mounts with by location heat-sink unit 100.
Specifically, in this utility model embodiment, use tank sealing plate 160 and sink main body
110 are tightly connected, and tank sealing plate 160 can be fastened by screw with sink main body 110, and
In the middle of both, Elastic plastic-rubber sealing ring is set；Water inlet water pipe 141, water outlet water pipe 142 further with
Tank sealing plate 160 is tightly connected, equally, and water inlet water pipe 141, water outlet water pipe 142 and tank
It is provided with Elastic plastic-rubber sealing ring between sealing plate 160 and is fastened by screw；Tank integral installation block
150 are connected by screw or welding manner are fixing with tank sealing plate 160.
Use compact heap 170 that heat-radiating substrate 120 is pressed abd fixed on the surface of sink main body 110,
Compact heap 170 can be the metal derby of L-type.
Seeing also Fig. 5, Fig. 5 is to the structural representation of electric unit in Fig. 3.
As it is shown in figure 5, include integral installation base plate 210, elastic lifting mechanism to electric unit 200
And cam mechanism, wherein, elastic lifting mechanism is located on integral installation base plate 210 for making
Probe module 20 elastic lifting；Cam mechanism is located on integral installation base plate 210 for elasticity
Elevating mechanism applies downforce.
Specifically, elastic lifting mechanism include a pair lifting guide pillar 220, lifting guide pin bushing 222,
Probe installation base plate 224, spring (not shown) and guide rod fixed connecting plate 226.
Wherein, a pair lifting guide pillar 220 is vertical on integral installation base plate 210；Lifting guide pin bushing
222 are sheathed on lifting guide pillar 220；Probe installation base plate 224 fixes with lifting guide pin bushing 222
With with lifting guide pin bushing 222 synchronization lifting；Spring housing is located on lifting guide pillar 220 and is positioned at overall peace
Between dress base plate 210 and probe installation base plate 224, spring is typically at confined state, uses
In providing lifting guide pin bushing 222 and the active force of probe installation base plate 224 upwards lifting；Guide rod is fixed
Connecting plate 226 is connected to the top of a pair lifting guide pillar 220, to strengthen a pair lifting guide pillar 220
Structural strength.
In this utility model embodiment, cam mechanism includes that pair of cams bearing 228, cam are pacified
Dress rotating shaft 230, cam 232, actuated by cams handle 234, cam limit block 236, probe module
Fixed plate 238
Wherein, pair of cams bearing 228 is vertical on integral installation base plate 210；Cam is installed
Rotating shaft 230 can be located on cam bearer 228 by bearing rotary；Cam 232 is fixed at convex
Wheel is installed in rotating shaft 230；Actuated by cams handle 234 is connected to cam and installs the outer end of rotating shaft 230,
So that operator hold thus rotate cam 232；Cam limit block 236 is fixed on probe peace
The active force that cam 232 rotates is converted into downwards when cam 232 rotates on dress substrate 224
Pressure；Probe module fixed plate 238 is fixing with the front end of probe installation base plate 224 to be connected.
See also the structural representation that Fig. 6 and Fig. 7, Fig. 6 are Fig. 3 middle probe modules；Figure
7 is the structural representation that Fig. 5 middle probe module is installed.
As shown in Figure 6 and Figure 7, probe module 20 includes fixed body 201 and probe 202, one
Interior several probes of can optionally placing of fixed body 201, such as 4, probe module fixed plate 238
Being provided with fluting 239, probe module 20 can be clamped by instruments such as tweezers in being located at fluting 239 and adjust
Locked by limit block 21 after good position.
See also the schematic diagram of cam when Fig. 8, Fig. 8 are to be in working position in Fig. 5.
As shown in Figure 8, cam 232 is provided with fixing hole 233, is apparent from conjunction with Fig. 5, cam 232
When being in working position, fixing hole 233 is located substantially at the top of cam 232, its relative bottom to
Probe installation base plate 224 applies the thrust to face, and spring is compressed simultaneously, and probe module 20 is whole
Press under body elasticity and semiconductor laser chip 10 Elastic Contact, survey formula after energising, can be carried out.
In this utility model one preferred embodiment, a block semiconductor laser chip location-plate 130 can
20 semiconductor laser chip 10 location are fixed on sink main body 110 simultaneously.
In sum, those skilled in the art hold understanding, the multistation laser that this utility model provides
Device chip assembly loading platform can carry out large-scale production test, can preferably ensure probe and half
The relative position of conductor Laser chip and be difficult to chip is produced damage, it is achieved to multiple quasiconductors
Laser chip 10 carries out electric current injection with uniform pressure and has the loading platform of good heat radiating function,
Overcome when at present semiconductor laser chip 10 being carried out burn-in test, it is more difficult to carry out multistation aging
The defect of test.There is simple in construction simultaneously, with low cost, simple operation and other advantages.
The foregoing is only embodiment of the present utility model, not thereby limit of the present utility model specially
Profit scope, every equivalent structure utilizing this utility model description and accompanying drawing content to be made or equivalence
Flow process converts, or is directly or indirectly used in other relevant technical fields, is the most in like manner included in this
In the scope of patent protection of utility model.
Claims (10)
1. a multistation chip of laser assembly loading platform, it is characterised in that including:
Location heat-sink unit, for clamping the semiconductor laser chip of COS encapsulation type, and in test
Time described semiconductor laser chip is carried out liquid cooling type radiation；
To electric unit, for clamping probe module and with elastic lifting mode make described probe module with
Described semiconductor laser chip contacts and then tests.
Multistation chip of laser assembly loading platform the most according to claim 1, it is special
Levying and be, described location heat-sink unit includes:
Sink main body, is inside provided with fluid passage；
Heat-radiating substrate, is connected with described sink main body heat conduction；
Semiconductor laser chip location-plate, compresses described semiconductor laser chip and is positioned at described dissipating
On hot substrate.
Multistation chip of laser assembly loading platform the most according to claim 2, it is special
Levying and be, described location heat-sink unit also includes:
Water-in and water-out water pipe, forms fluid circuit with the fluid passage of described sink main body；
Tank integral installation block, fixedly mounts with by described location heat-sink unit.
Multistation chip of laser assembly loading platform the most according to claim 3, it is special
Levying and be, described location heat-sink unit also includes:
Tank sealing plate, is tightly connected with described sink main body, and described water-in and water-out water pipe is with described
Tank sealing plate is tightly connected, and described tank integral installation block is fixing with described tank sealing plate even
Connect.
Multistation chip of laser assembly loading platform the most according to claim 2, it is special
Levying and be, described location heat-sink unit also includes compact heap, and described compact heap is by described heat-radiating substrate
It is pressed abd fixed on the surface of described sink main body.
Multistation chip of laser assembly loading platform the most according to claim 1, it is special
Levy and be, described include to electric unit:
Integral installation base plate；
Elastic lifting mechanism, is located on described integral installation base plate for making described probe module bullet
Property lifting；
Cam mechanism, is located on described integral installation base plate for applying described elastic lifting mechanism
Downforce.
Multistation chip of laser assembly loading platform the most according to claim 6, it is special
Levying and be, described elastic lifting mechanism includes:
A pair lifting guide pillar, is located on described integral installation base plate；
Lifting guide pin bushing, is sheathed on described lifting guide pillar；
Probe installation base plate, fixes with described lifting guide pin bushing and rises with Tong Bu with described lifting guide pin bushing
Fall；
Spring, is sheathed on described lifting guide pillar, is used for providing described lifting guide pin bushing and described probe
The active force of installation base plate upwards lifting.
Multistation chip of laser assembly loading platform the most according to claim 7, it is special
Levying and be, described elastic lifting mechanism also includes guide rod fixed connecting plate, and described guide rod is fixing to be connected
Plate is connected to the top of the pair of lifting guide pillar, strong to strengthen the pair of lifting guide pillar structure
Degree.
Multistation chip of laser assembly loading platform the most according to claim 7, it is special
Levying and be, described cam mechanism includes:
Pair of cams bearing, is located on described integral installation base plate；
Cam installs rotating shaft, and rotatory is located on described cam bearer；
Cam, is fixed at described cam and installs in rotating shaft；
Actuated by cams handle, is connected to described cam and installs the outer end of rotating shaft；
Cam limit block, be fixed on described probe installation base plate with when described cam rotates by institute
The active force stating cam rotation is converted into downward pressure.
Multistation chip of laser assembly loading platform the most according to claim 9, it is special
Levy and be, the described probe module fixed plate that also includes to electric unit, described probe module fixed plate with
Described probe installation base plate is fixing to be connected, and described probe module fixed plate is provided with fluting, described probe
In module is located at described fluting and locked by limit block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620284895.0U CN205720553U (en) | 2016-04-07 | 2016-04-07 | Multistation chip of laser assembly loading platform |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620284895.0U CN205720553U (en) | 2016-04-07 | 2016-04-07 | Multistation chip of laser assembly loading platform |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107102253A (en) * | 2017-05-10 | 2017-08-29 | 深圳瑞波光电子有限公司 | Test equipment and its to electric tool |
| CN107884705A (en) * | 2017-12-13 | 2018-04-06 | 镭神技术（深圳）有限公司 | A kind of high-power chip ageing machine |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN110927561A (en) * | 2019-12-19 | 2020-03-27 | 江西智慧云测安全检测中心有限公司 | Single-point laser test platform |
| CN111239581A (en) * | 2020-03-16 | 2020-06-05 | 北京工业大学 | Single tube semiconductor laser aging testing device |
| CN111751712A (en) * | 2020-07-02 | 2020-10-09 | 武汉永力睿源科技有限公司 | Constant-temperature waterway system for chip aging |
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN112415359A (en) * | 2020-09-30 | 2021-02-26 | 深圳瑞波光电子有限公司 | Chip testing jig |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
| CN115296139A (en) * | 2022-10-11 | 2022-11-04 | 昆山三智达自动化设备科技有限公司 | COS (chip operating System) assembling method and equipment based on modular base |
| CN117129833A (en) * | 2023-08-29 | 2023-11-28 | 武汉永力睿源科技有限公司 | Aging testing device for laser chip |
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2016
- 2016-04-07 CN CN201620284895.0U patent/CN205720553U/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018205960A1 (en) * | 2017-05-10 | 2018-11-15 | 深圳瑞波光电子有限公司 | Test device and power supply fixture thereof |
| CN107102253A (en) * | 2017-05-10 | 2017-08-29 | 深圳瑞波光电子有限公司 | Test equipment and its to electric tool |
| CN107884705A (en) * | 2017-12-13 | 2018-04-06 | 镭神技术（深圳）有限公司 | A kind of high-power chip ageing machine |
| CN108254676A (en) * | 2018-03-26 | 2018-07-06 | 苏州联讯仪器有限公司 | A kind of high precision laser chip aging clamp |
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN110927561B (en) * | 2019-12-19 | 2021-08-24 | 江西智慧云测安全检测中心股份有限公司 | Single-point laser test platform |
| CN110927561A (en) * | 2019-12-19 | 2020-03-27 | 江西智慧云测安全检测中心有限公司 | Single-point laser test platform |
| CN111239581A (en) * | 2020-03-16 | 2020-06-05 | 北京工业大学 | Single tube semiconductor laser aging testing device |
| CN111751712A (en) * | 2020-07-02 | 2020-10-09 | 武汉永力睿源科技有限公司 | Constant-temperature waterway system for chip aging |
| CN112415359A (en) * | 2020-09-30 | 2021-02-26 | 深圳瑞波光电子有限公司 | Chip testing jig |
| CN112798823A (en) * | 2020-12-17 | 2021-05-14 | 中国电子科技集团公司第十三研究所 | COS fixture for burn-in power-up |
| CN115296139A (en) * | 2022-10-11 | 2022-11-04 | 昆山三智达自动化设备科技有限公司 | COS (chip operating System) assembling method and equipment based on modular base |
| CN117129833A (en) * | 2023-08-29 | 2023-11-28 | 武汉永力睿源科技有限公司 | Aging testing device for laser chip |
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