CN107099768B - A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate - Google Patents
A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate Download PDFInfo
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- CN107099768B CN107099768B CN201710294714.1A CN201710294714A CN107099768B CN 107099768 B CN107099768 B CN 107099768B CN 201710294714 A CN201710294714 A CN 201710294714A CN 107099768 B CN107099768 B CN 107099768B
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- plate
- calibrated
- kidney slot
- locating rod
- mask plate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of calibrating installations of quartz oscillator vacuum sputtering coating mask plate, it includes bottom plate (5), positioning plate (6) and correcting plate (7), positioning plate (6) is fixed on the top of bottom plate (5), positioning plate (6) is longitudinally disposed, positioning column (8) section is triangular in shape, correcting plate (7) is placed on bottom plate (5) and covers kidney slot and electromagnet (11), there are two V-arrangement card slot (12) for setting on the edge of correcting plate (7), it further includes the first locating rod (13) and the second locating rod (14), the lower end of first locating rod (13) is through correcting plate (7) and is butted in the first kidney slot (9), the lower end of second locating rod (14) passes through correcting plate (7) and is butted in the second kidney slot (10), the outer diameter of locating rod is less than the width of kidney slot；It also discloses calibration method.The beneficial effects of the present invention are: it is compact-sized, improve calibration efficiency, reduce labor intensity, be easy to operate.
Description
Technical field
The present invention relates to the technical field of upper and lower mask plate calibration, especially a kind of quartz oscillator vacuum sputtering plating
The calibrating installation and method of film mask plate.
Background technique
Quartz oscillator is the oscillator of a kind of high-precision and high stability, is widely used in telecommunication, defends
Star communication, mobile telephone system, global positioning system (GPS), navigation, remote control, aerospace, high-speed computer, accurate measurement
In instrument and consumer consumer electronic product.Because its have the characteristics that frequency stability it is high this, therefore one in electronic technology field
Directly occupy an important position.In recent years, with the development of modern science and technology, to the size of quartz oscillator, quality, steady
The new requirement of qualitative continuous proposition.As the reduction of the size of quartz oscillator and the quick of communications industry are popularized,
The practical problem for producing quartz oscillator is also more obvious.
Having a kind of mask plate at present includes upper mask plate (1) and lower mask plate (2), as shown in Figure 1, upper mask plate (1)
Outer edge is upper side frame, and the outer edge of lower mask plate (2) is lower frame, there are two a side of upper side frame and lower frame opens up
V-shaped groove (3), and edge hole (4) are offered on upper side frame and lower frame, the middle part of upper mask plate (1) and lower mask plate (2) is equal
The hole in array is offered, quartz wafer need to be clipped in the hole of upper mask plate (1) under in vacuum sputtering coating by quartz wafer
Between the hole of mask plate (2), vacuum coating then just can be carried out, realize the plated film of quartz wafer upper and lower surface.Therefore it must protect
The hole of mask plate (1) and the alignment of the hole of lower mask plate (2) on card, no at will affect coating quality, alignment operation is to cover up and down
Two of diaphragm plate face Bian Pingqi.Current calibration method mainly uses and manually carries out range estimation calibration under high magnification microscope, due to
The requirement of product electrode size is small, manually needs accurately to be aligned upper and lower mask plate very much in operation, this process difficulty
It is larger, and the employee's operation that needs to be skilled in technique, in short, prior art the disadvantages of that there are accuracys is poor, repeated bad, it can be to electricity
The defects of dislocation, is brought in pole, seriously affects product quality and production efficiency.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology, provides a kind of compact-sized, raising calibration efficiency, mitigation
The calibrating installation and method of labor intensity, quartz oscillator vacuum sputtering coating mask plate easy to operate.
The purpose of the present invention is achieved through the following technical solutions: a kind of quartz oscillator vacuum sputtering coating exposure mask
The calibrating installation of plate, it includes bottom plate, positioning plate and correcting plate, and the positioning plate is fixed on the top of bottom plate, and positioning plate is vertical
Sequentially arrange that there are four positioning columns from front to back to setting, on the right side of positioning plate, positioning column section is triangular in shape, described
Fluted, the first kidney slot and the second kidney slot, setting in groove is arranged in right side on the top surface of bottom plate and positioned at positioning plate
There is electromagnet, kidney slot is longitudinally disposed, and the correcting plate is placed on bottom plate and covers kidney slot and electromagnet, the side of correcting plate
There are two V-arrangement card slots, V-arrangement card slot is stuck on two positioning columns of front side of positioning plate respectively for setting on edge, the folder of V-arrangement card slot
Angle is greater than positioning column apex angle, it further includes the first locating rod and the second locating rod, and correcting plate is run through in the lower end of the first locating rod
And be butted in the first kidney slot, the lower end of the second locating rod passes through correcting plate and is butted in the second kidney slot, outside locating rod
Diameter is less than the width of kidney slot.
The positioning plate is connected on bottom plate through screw thread.
First kidney slot is located at the rear side of the second kidney slot.
The correcting plate is rectangular-shaped.
The method of the described device calibration quartz oscillator vacuum sputtering coating mask plate, it the following steps are included:
The tooling of S1, lower mask plate to be calibrated: lower mask plate to be calibrated is laid flat and is placed in base top surface and is placed in school
The rear side of positive plate, and the V-shaped groove of lower mask plate to be calibrated is stuck in respectively on the positioning column of rear side of positioning plate, to realize
The tooling of lower mask plate to be calibrated；
The tooling of S2, upper mask plate to be calibrated: upper mask plate to be calibrated is laid flat and is placed in lower exposure mask to be calibrated in step S1
The top surface of plate, and the V-shaped groove of upper mask plate to be calibrated is stuck in respectively on the positioning column of rear side of positioning plate, to realize
The tooling of upper mask plate to be calibrated；
S3, it is to be calibrated up and down mask plate calibration: first electromagnet is powered off, electromagnet is separated with correcting plate, then while to
After push the first locating rod and the second locating rod, the first locating rod is moved along the first kidney slot, and the second locating rod is along second
Kidney slot is mobile, and correcting plate is leaned against simultaneously on the front of upper mask plate to be calibrated and lower mask plate to be calibrated at this time, to guarantee
Each corresponding sides of mask plate is concordant above and below to be calibrated, further realizes the calibration of mask plate up and down to be calibrated.
The invention has the following advantages that structure of the invention is compact, improves calibration efficiency, reduces labor intensity, is easy to operate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of mask plate；
Fig. 2 is structural schematic diagram of the invention；
Fig. 3 is the A-A cross-sectional view of Fig. 2；
Fig. 4 is the B-B cross-sectional view of Fig. 2；
Fig. 5 is the structural schematic diagram of bottom plate；
In figure, the upper mask plate of 1-, mask plate under 2-, 3-V shape slot, 4- edge hole, 5- bottom plate, 6- positioning plate, 7- correcting plate,
8- positioning column, the first kidney slot of 9-, the second kidney slot of 10-, 11- electromagnet, 12-V shape card slot, the first locating rod of 13-, 14-
Two locating rods, 15- screw, 16- lower mask plate to be calibrated, 17- upper mask plate to be calibrated.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing, and protection scope of the present invention is not limited to as described below:
As shown in Fig. 2 ~ 5, a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate, it includes bottom plate
5, positioning plate 6 and correcting plate 7, the positioning plate 6 are fixed on the top of bottom plate 5, and positioning plate 6 is threadedly connected to bottom through screw 15
On plate 5, positioning plate 6 is longitudinally disposed, and sequentially there are four positioning column 8, positioning columns 8 for arrangement from front to back on the right side of positioning plate 6
Section is triangular in shape, and fluted, 9 and of the first kidney slot is arranged in the right side on the top surface of the bottom plate 5 and positioned at positioning plate 6
Second kidney slot 10, the first kidney slot 9 are located at the rear side of the second kidney slot 10, and electromagnet 11 is provided in groove, and kidney slot is vertical
To setting.After electromagnet 11 must be electric, bottom plate 5 is sucked electromagnet 11；After electromagnet 11 powers off, electromagnet 11 and bottom plate 5
Separation.
The correcting plate 7 be it is rectangular-shaped, correcting plate 7 is made of metal material, and correcting plate 7 is placed on bottom plate 5 and covers
Kidney slot and electromagnet 11, there are two V-arrangement card slot 12, V-arrangement card slot 12 is stuck in respectively is located at positioning for setting on the edge of correcting plate 7
On two positioning columns 8 of 6 front side of plate, the angle of V-arrangement card slot 12 is greater than 8 apex angle of positioning column.It further includes 13 He of the first locating rod
The lower end of second locating rod 14, the first locating rod 13 through correcting plate 7 and is butted in the first kidney slot 9, the second locating rod 14
Lower end pass through and correcting plate 7 and be butted in the second kidney slot 10, the outer diameter of locating rod is less than the width of kidney slot.
The method of the described device calibration quartz oscillator vacuum sputtering coating mask plate, it the following steps are included:
The tooling of S1, lower mask plate to be calibrated: lower mask plate 16 to be calibrated is laid flat and is placed in 5 top surface of bottom plate and is placed in
The rear side of correcting plate 7, and the V-shaped groove 3 of lower mask plate 16 to be calibrated is stuck in respectively on the positioning column 8 of 6 rear side of positioning plate,
The bottom of V-shaped groove 3 is overlapped with the top of positioning column 8, to realize the tooling of lower mask plate 16 to be calibrated；
The tooling of S2, upper mask plate to be calibrated: upper mask plate 17 to be calibrated is laid flat be placed in it is to be calibrated in step S1 under cover
The top surface of diaphragm plate 16, and the V-shaped groove 3 of upper mask plate 17 to be calibrated is stuck in the positioning column 8 positioned at 6 rear side of positioning plate respectively
On, the bottom of V-shaped groove 3 is overlapped with the top of positioning column 8, to realize the tooling of upper mask plate 17 to be calibrated；
The calibration of S3, mask plate up and down to be calibrated: first electromagnet 11 is powered off, electromagnet 11 is separated with correcting plate 7, then together
Shi Xianghou pushes the first locating rod 13 and the second locating rod 14, the first locating rod 13 to move along the first kidney slot 9, the second positioning
Bar 14 is moved along the second kidney slot 10, and correcting plate 7 moves backward, and correcting plate 7 leans against upper mask plate 17 to be calibrated simultaneously at this time
On the front of lower mask plate 16 to be calibrated, thus guarantee the concordant of each corresponding sides of mask plate up and down to be calibrated, it is further real
Mask plate up and down to be calibrated is connected as one, then from bottom plate by the calibration for having showed mask plate up and down to be calibrated after calibration
On remove, for next time calibration prepare, have the characteristics that reproducible.Furthermore the present apparatus is compared using manually micro- in high power
Range estimation calibration is carried out under mirror, calibration efficiency is higher, reduces manual calibration bring error, and it is more accurate to calibrate, and also reduces
The labor intensity of worker.
Claims (1)
1. a kind of calibration method of quartz oscillator vacuum sputtering coating mask plate, this method carries out school using calibrating installation
Standard, the calibrating installation include bottom plate (5), positioning plate (6) and correcting plate (7), and the positioning plate (6) is fixed on bottom plate (5)
Top, positioning plate (6) is longitudinally disposed, and sequentially there are four positioning column (8) for arrangement from front to back on the right side of positioning plate (6), fixed
Position column (8) section is triangular in shape, on the top surface of the bottom plate (5) and be located at positioning plate (6) right side setting it is fluted, the
One kidney slot (9) and the second kidney slot (10) are provided with electromagnet (11) in groove, and kidney slot is longitudinally disposed, the correcting plate
(7) it is placed on bottom plate (5) and covers kidney slot and electromagnet (11), there are two V-arrangement card slots for setting on the edge of correcting plate (7)
(12), V-arrangement card slot (12) is stuck in respectively on two positioning columns (8) on front side of positioning plate (6), the angle of V-arrangement card slot (12)
Greater than positioning column (8) apex angle, it further includes the first locating rod (13) and the second locating rod (14), the lower end of the first locating rod (13)
Portion is through correcting plate (7) and is butted in the first kidney slot (9), and the lower end of the second locating rod (14) passes through correcting plate (7) and supports
In the second kidney slot (10), the outer diameter of locating rod is less than the width of kidney slot, and the positioning plate (6) is through screw (15) screw thread
It is connected on bottom plate (5), first kidney slot (9) is located at the rear side of the second kidney slot (10), and the correcting plate (7) is
It is rectangular-shaped, it is characterised in that: method includes the following steps:
The tooling of S1, lower mask plate to be calibrated: lower mask plate (16) to be calibrated is laid flat and is placed in bottom plate (5) top surface and is placed in
The rear side of correcting plate (7), and the V-shaped groove (3) of lower mask plate (16) to be calibrated is stuck in respectively and is determined on rear side of positioning plate (6)
On position column (8), to realize the tooling of lower mask plate (16) to be calibrated；
The tooling of S2, upper mask plate to be calibrated: upper mask plate (17) to be calibrated is laid flat and is placed in lower exposure mask to be calibrated in step S1
The top surface of plate (16), and the V-shaped groove (3) of upper mask plate (17) to be calibrated is stuck in respectively and is determined on rear side of positioning plate (6)
On position column (8), to realize the tooling of upper mask plate (17) to be calibrated；
The calibration of S3, mask plate up and down to be calibrated: first powering off electromagnet (11), and electromagnet (11) is separated with correcting plate (7), then
Push the first locating rod (13) and the second locating rod (14) backward simultaneously, the first locating rod (13) is moved along the first kidney slot (9)
Dynamic, the second locating rod (14) is mobile along the second kidney slot (10), and correcting plate (7) leans against upper mask plate to be calibrated simultaneously at this time
(17) and on the front of lower mask plate to be calibrated (16), to guarantee the concordant of each corresponding sides of mask plate up and down to be calibrated, into one
The calibration for realizing mask plate up and down to be calibrated of step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710294714.1A CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710294714.1A CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107099768A CN107099768A (en) | 2017-08-29 |
| CN107099768B true CN107099768B (en) | 2019-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710294714.1A Expired - Fee Related CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
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| Country | Link |
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| CN (1) | CN107099768B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111254389A (en) * | 2020-04-13 | 2020-06-09 | 柯学 | Calibration device for vacuum sputtering coating mask plate of quartz crystal oscillator |
| CN112645716A (en) * | 2020-12-22 | 2021-04-13 | 西安鑫垚陶瓷复合材料有限公司 | Deposition sizing tool and method for ceramic matrix composite part |
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| CN1279629C (en) * | 2001-12-10 | 2006-10-11 | 伊斯曼柯达公司 | Mask for producing organic LED device by calibrating multiple madk sections for assembly |
| CN101101458A (en) * | 2007-08-03 | 2008-01-09 | 上海微电子装备有限公司 | Optical etching device aligning method and system |
| WO2008152150A1 (en) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Production of adjustment structures for a structured layer deposition on a microsystem technology wager |
| CN105063551A (en) * | 2015-07-15 | 2015-11-18 | 中国工程物理研究院激光聚变研究中心 | Mask method for preparing thin mask layer composed of multiple materials in zoning mode |
| CN205152315U (en) * | 2015-12-01 | 2016-04-13 | 中国电子科技集团公司第二十六研究所 | Integral type crystal mask |
| CN105483638A (en) * | 2015-12-16 | 2016-04-13 | 昆山国显光电有限公司 | Positioning device of evaporation equipment |
| CN206692715U (en) * | 2017-04-28 | 2017-12-01 | 东晶锐康晶体（成都）有限公司 | A kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate |
-
2017
- 2017-04-28 CN CN201710294714.1A patent/CN107099768B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1279629C (en) * | 2001-12-10 | 2006-10-11 | 伊斯曼柯达公司 | Mask for producing organic LED device by calibrating multiple madk sections for assembly |
| WO2008152150A1 (en) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Production of adjustment structures for a structured layer deposition on a microsystem technology wager |
| CN101101458A (en) * | 2007-08-03 | 2008-01-09 | 上海微电子装备有限公司 | Optical etching device aligning method and system |
| CN105063551A (en) * | 2015-07-15 | 2015-11-18 | 中国工程物理研究院激光聚变研究中心 | Mask method for preparing thin mask layer composed of multiple materials in zoning mode |
| CN205152315U (en) * | 2015-12-01 | 2016-04-13 | 中国电子科技集团公司第二十六研究所 | Integral type crystal mask |
| CN105483638A (en) * | 2015-12-16 | 2016-04-13 | 昆山国显光电有限公司 | Positioning device of evaporation equipment |
| CN206692715U (en) * | 2017-04-28 | 2017-12-01 | 东晶锐康晶体（成都）有限公司 | A kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate |
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| CN107099768A (en) | 2017-08-29 |
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