CN107099768A - The calibrating installation and method of a kind of quartz oscillator vacuum sputtering coating mask plate - Google Patents
The calibrating installation and method of a kind of quartz oscillator vacuum sputtering coating mask plate Download PDFInfo
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- CN107099768A CN107099768A CN201710294714.1A CN201710294714A CN107099768A CN 107099768 A CN107099768 A CN 107099768A CN 201710294714 A CN201710294714 A CN 201710294714A CN 107099768 A CN107099768 A CN 107099768A
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- mask plate
- mounting hole
- locating rod
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The invention discloses a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate, it includes bottom plate(5), location-plate(6)And correcting plate(7), location-plate(6)It is fixed on bottom plate(5)Top, location-plate(6)It is longitudinally disposed, locating dowel(8)Section is triangular in shape, correcting plate(7)It is positioned over bottom plate(5)Upper and covering mounting hole and electromagnet(11), correcting plate(7)Edge on be provided with two V-arrangement necks(12), it also includes the first locating rod(13)With the second locating rod(14), the first locating rod(13)Bottom run through correcting plate(7)And it is butted on the first mounting hole(9)It is interior, the second locating rod(14)Bottom pass through correcting plate(7)And it is butted on the second mounting hole(10)Interior, the external diameter of locating rod is less than the width of mounting hole;It also discloses calibration method.The beneficial effects of the invention are as follows:Compact conformation, improve calibration efficiency, reduce labor intensity, it is simple to operate.
Description
Technical field
The present invention relates to the technical field of mask plate calibration up and down, particularly a kind of quartz oscillator vacuum sputtering plating
The calibrating installation and method of film mask plate.
Background technology
Quartz oscillator is the oscillator of a kind of high accuracy and high stability, is widely used in telecommunication, defends
Star communication, mobile telephone system, global positioning system(GPS), navigation, remote control, Aero-Space, high-speed computer, accurate measurement
In instrument and consumer consumer electronic product.Because it has this high feature of frequency stability, therefore one in electronic technology field
Directly occupy an important position.In recent years, with the development of modern science and technology, to the size of quartz oscillator, quality, steady
The new requirement of qualitative continuous proposition.With the quick popularization of the reduction of the size of quartz oscillator, and communications industry,
The practical problem for producing quartz oscillator is also more obvious.
There is a kind of mask plate to include upper mask plate at present(1)With lower mask plate(2), as shown in figure 1, upper mask plate(1)'s
Outward flange is upper side frame, lower mask plate(2)Outward flange be lower frame, a side of upper side frame and lower frame offers two
V-shaped groove(3), and offer edge hole on upper side frame and lower frame(4), upper mask plate(1)With lower mask plate(2)Middle part it is equal
The hole in array is offered, quartz wafer need to be clipped in upper mask plate by quartz wafer in vacuum sputtering coating(1)Hole and under
Mask plate(2)Hole between, then could carry out vacuum coating, realize the plated film of quartz wafer upper and lower surface.Therefore it must protect
Mask plate on card(1)Hole and lower mask plate(2)Hole alignment, no into that can influence coating quality, alignment operation is to cover up and down
It is concordant that two of diaphragm plate face side.Current calibration method mainly carries out range estimation calibration using artificial under high-power microscope, due to
Product electrode size requires small, and manually needing in operation very accurately will mask plate alignment, this process difficulty up and down
It is larger, and the employee's operation that needs to be skilled in technique, in a word, prior art exist accuracy it is poor, it is repeated bad the shortcomings of, can be to electricity
The defects such as dislocation are brought in pole, have a strong impact on product quality and production efficiency.
The content of the invention
It is an object of the invention to the shortcoming for overcoming prior art, there is provided a kind of compact conformation, raising calibration efficiency, mitigation
Labor intensity, the calibrating installation of quartz oscillator vacuum sputtering coating mask plate simple to operate and method.
The purpose of the present invention is achieved through the following technical solutions:A kind of quartz oscillator vacuum sputtering coating mask
The calibrating installation of plate, it includes bottom plate, location-plate and correcting plate, and described location-plate is fixed on the top of bottom plate, and location-plate is indulged
To setting, four locating dowels are sequentially disposed with the right side of location-plate from front to back, positioning column section is triangular in shape, described
On the top surface of bottom plate and set in fluted, the first mounting hole and the second mounting hole, groove and set positioned at the right side of location-plate
There is electromagnet, mounting hole is longitudinally disposed, the correcting plate is positioned on bottom plate and covers mounting hole and electromagnet, the side of correcting plate
Two V-arrangement necks are provided with edge, V-arrangement neck is stuck in two locating dowels on front side of location-plate respectively, the folder of V-arrangement neck
Angle is more than locating dowel drift angle, and it also includes the first locating rod and the second locating rod, and correcting plate is run through in the bottom of the first locating rod
And be butted in the first mounting hole, the bottom of the second locating rod passes through correcting plate and is butted in the second mounting hole, outside locating rod
Footpath is less than the width of mounting hole.
Described location-plate is connected on bottom plate through screw thread.
The first described mounting hole is located at the rear side of the second mounting hole.
Described correcting plate is rectangular-shaped.
The method that described device calibrates quartz oscillator vacuum sputtering coating mask plate, it comprises the following steps:
S1, lower mask plate to be calibrated frock:Lower mask plate to be calibrated is kept flat and is placed in base top surface and is positioned over correcting plate
Rear side, and the V-shaped groove of lower mask plate to be calibrated is stuck in the locating dowel on rear side of location-plate respectively, it is achieved thereby that treating
The frock of the lower mask plate of calibration;
S2, upper mask plate to be calibrated frock:Upper mask plate to be calibrated is kept flat and is placed in lower mask plate to be calibrated in step S1
Top surface, and the V-shaped groove of upper mask plate to be calibrated is stuck in the locating dowel on rear side of location-plate respectively, it is achieved thereby that treating
The frock of mask plate in calibration;
S3, mask plate up and down to be calibrated calibration:First electromagnet is powered off, electromagnet is separated with correcting plate, then simultaneously to pusher
Dynamic first locating rod and the second locating rod, the first locating rod are moved along the first mounting hole, and the second locating rod is along the second kidney-shaped
Hole is moved, and now correcting plate is leaned against on the front of upper mask plate to be calibrated and lower mask plate to be calibrated simultaneously, so as to ensure to treat school
Each corresponding sides of mask plate is concordant above and below standard, further realizes the calibration of mask plate up and down to be calibrated.
The present invention has advantages below:Compact conformation of the present invention, improve calibration efficiency, reduce labor intensity, it is simple to operate.
Brief description of the drawings
Fig. 1 is the structural representation of mask plate;
Fig. 2 is structural representation of the invention;
Fig. 3 is Fig. 2 A-A sectional views;
Fig. 4 is Fig. 2 B-B sectional views;
Fig. 5 is the structural representation of bottom plate;
In figure, the upper mask plates of 1-, mask plate under 2-, 3-V shape grooves, 4- edge holes, 5- bottom plates, 6- location-plates, 7- correcting plates, 8- is fixed
Position post, the mounting holes of 9- first, the mounting holes of 10- second, 11- electromagnet, 12-V shape necks, the locating rods of 13- first, 14- second determines
Position bar, 15- screws, 16- lower mask plates to be calibrated, 17- upper mask plates to be calibrated.
Embodiment
The present invention will be further described below in conjunction with the accompanying drawings, and protection scope of the present invention is not limited to as described below:
As shown in Fig. 2 ~ 5, a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate, it includes bottom plate 5, determined
Position plate 6 and correcting plate 7, described location-plate 6 are fixed on the top of bottom plate 5, and location-plate 6 is threadedly connected to bottom plate 5 through screw 15
On, location-plate 6 is longitudinally disposed, is sequentially disposed with four locating dowels 8, the section of locating dowel 8 on the right side of location-plate 6 from front to back
It is triangular in shape, fluted, the first mounting hole 9 and second is set on the top surface of described bottom plate 5 and positioned at the right side of location-plate 6
Mounting hole 10, the first mounting hole 9, which is located in the rear side of the second mounting hole 10, groove, is provided with electromagnet 11, and mounting hole is longitudinally set
Put.After electromagnet 11 must be electric, electromagnet 11 holds bottom plate 5;After electromagnet 11 is powered off, electromagnet 11 is separated with bottom plate 5.
The correcting plate 7 is rectangular-shaped, and correcting plate 7 is made up of metal material, and correcting plate 7 is positioned on bottom plate 5 and covered
Two V-arrangement necks 12 are provided with mounting hole and electromagnet 11, the edge of correcting plate 7, V-arrangement neck 12 is stuck in positioned at positioning respectively
In two locating dowels 8 of the front side of plate 6, the angle of V-arrangement neck 12 is more than the drift angle of locating dowel 8.It also includes the He of the first locating rod 13
Second locating rod 14, the bottom of the first locating rod 13 is run through correcting plate 7 and is butted in the first mounting hole 9, the second locating rod 14
Bottom through correcting plate 7 and being butted in the second mounting hole 10, the external diameter of locating rod is less than the width of mounting hole.
The method that described device calibrates quartz oscillator vacuum sputtering coating mask plate, it comprises the following steps:
S1, lower mask plate to be calibrated frock:Lower mask plate 16 to be calibrated is kept flat and is placed in the top surface of bottom plate 5 and is positioned over correction
The rear side of plate 7, and the V-shaped groove 3 of lower mask plate 16 to be calibrated is stuck in the locating dowel 8 of the rear side of location-plate 6 respectively, V-arrangement
The bottom of groove 3 is overlapped with the top of locating dowel 8, it is achieved thereby that the frock of lower mask plate 16 to be calibrated;
S2, upper mask plate to be calibrated frock:Upper mask plate 17 to be calibrated is kept flat and is placed in lower mask plate to be calibrated in step S1
16 top surface, and the V-shaped groove 3 of upper mask plate 17 to be calibrated is stuck in the locating dowel 8 of the rear side of location-plate 6 respectively, V-arrangement
The bottom of groove 3 is overlapped with the top of locating dowel 8, it is achieved thereby that the frock of upper mask plate 17 to be calibrated;
S3, mask plate up and down to be calibrated calibration:First electromagnet 11 is powered off, electromagnet 11 is separated with correcting plate 7, then simultaneously to
After promote the first locating rod 13 and the second locating rod 14, the first locating rod 13 is moved along the first mounting hole 9, the second locating rod 14
Moved along the second mounting hole 10, correcting plate 7 is moved rearwards by, now correcting plate 7 leans against upper mask plate 17 to be calibrated and treated simultaneously
On the front of the lower mask plate 16 of calibration, so as to ensure the concordant of each corresponding sides of mask plate up and down to be calibrated, further realize
The calibration of mask plate up and down to be calibrated, mask plate up and down to be calibrated is connected as one, then taken from bottom plate after calibration
Under, be next time calibration prepare, with it is reproducible the characteristics of.In addition the present apparatus is compared using artificial under high-power microscope
Range estimation calibration is carried out, calibration efficiency is higher, reduce the error that manual calibration is brought, it is more accurate to calibrate, and also reduces workman
Labor intensity.
Claims (5)
1. a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate, it is characterised in that:It includes bottom plate
(5), location-plate(6)And correcting plate(7), described location-plate(6)It is fixed on bottom plate(5)Top, location-plate(6)Longitudinal direction is set
Put, location-plate(6)Right side on be sequentially disposed with four locating dowels from front to back(8), locating dowel(8)Section is triangular in shape,
Described bottom plate(5)Top surface on and positioned at location-plate(6)Right side set fluted, the first mounting hole(9)With the second waist
Shape hole(10), electromagnet is provided with groove(11), mounting hole is longitudinally disposed, the correcting plate(7)It is positioned over bottom plate(5)It is upper and
Cover mounting hole and electromagnet(11), correcting plate(7)Edge on be provided with two V-arrangement necks(12), V-arrangement neck(12)Respectively
It is stuck in positioned at location-plate(6)Two locating dowels of front side(8)On, V-arrangement neck(12)Angle be more than locating dowel(8)Drift angle, it
Also include the first locating rod(13)With the second locating rod(14), the first locating rod(13)Bottom run through correcting plate(7)And support
In the first mounting hole(9)It is interior, the second locating rod(14)Bottom pass through correcting plate(7)And it is butted on the second mounting hole(10)It is interior,
The external diameter of locating rod is less than the width of mounting hole.
2. a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate according to claim 1, it is special
Levy and be:Described location-plate(6)Through screw(15)It is threadedly connected to bottom plate(5)On.
3. a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate according to claim 1, it is special
Levy and be:The first described mounting hole(9)Positioned at the second mounting hole(10)Rear side.
4. a kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate according to claim 1, it is special
Levy and be:Described correcting plate(7)To be rectangular-shaped.
5. the device calibration quartz oscillator vacuum sputtering coating mask plate according to any one in claim 1 ~ 4
Method, it is characterised in that:It comprises the following steps:
S1, lower mask plate to be calibrated frock:By lower mask plate to be calibrated(16)Keep flat and be placed in bottom plate(5)Top surface and it is positioned over
Correcting plate(7)Rear side, and by lower mask plate to be calibrated(16)V-shaped groove(3)It is stuck in respectively positioned at location-plate(6)Rear side is determined
Position post(8)On, it is achieved thereby that lower mask plate to be calibrated(16)Frock;
S2, upper mask plate to be calibrated frock:By upper mask plate to be calibrated(17)Keep flat and be placed in lower mask to be calibrated in step S1
Plate(16)Top surface, and by upper mask plate to be calibrated(17)V-shaped groove(3)It is stuck in respectively positioned at location-plate(6)Rear side is determined
Position post(8)On, it is achieved thereby that upper mask plate to be calibrated(17)Frock;
S3, mask plate up and down to be calibrated calibration:First by electromagnet(11)Power-off, electromagnet(11)With correcting plate(7)Separation, then
The first locating rod is promoted backward simultaneously(13)With the second locating rod(14), the first locating rod(13)Along the first mounting hole(9)Move
It is dynamic, the second locating rod(14)Along the second mounting hole(10)Move, now correcting plate(7)Lean against upper mask plate to be calibrated simultaneously
(17)With lower mask plate to be calibrated(16)Front on so that ensure it is to be calibrated up and down each corresponding sides of mask plate it is concordant, enter one
What is walked realizes the calibration of mask plate up and down to be calibrated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710294714.1A CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
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CN201710294714.1A CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
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CN107099768A true CN107099768A (en) | 2017-08-29 |
CN107099768B CN107099768B (en) | 2019-07-12 |
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CN201710294714.1A Expired - Fee Related CN107099768B (en) | 2017-04-28 | 2017-04-28 | A kind of calibrating installation and method of quartz oscillator vacuum sputtering coating mask plate |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111254389A (en) * | 2020-04-13 | 2020-06-09 | 柯学 | Calibration device for vacuum sputtering coating mask plate of quartz crystal oscillator |
CN112645716A (en) * | 2020-12-22 | 2021-04-13 | 西安鑫垚陶瓷复合材料有限公司 | Deposition sizing tool and method for ceramic matrix composite part |
CN117646183A (en) * | 2023-12-29 | 2024-03-05 | 武汉中科先进材料科技有限公司 | High-yield glass surface metallization mask clamp |
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CN1279629C (en) * | 2001-12-10 | 2006-10-11 | 伊斯曼柯达公司 | Mask for producing organic LED device by calibrating multiple madk sections for assembly |
CN101101458A (en) * | 2007-08-03 | 2008-01-09 | 上海微电子装备有限公司 | Optical etching device aligning method and system |
WO2008152150A1 (en) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Production of adjustment structures for a structured layer deposition on a microsystem technology wager |
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CN105483638A (en) * | 2015-12-16 | 2016-04-13 | 昆山国显光电有限公司 | Positioning device of evaporation equipment |
CN205152315U (en) * | 2015-12-01 | 2016-04-13 | 中国电子科技集团公司第二十六研究所 | Integral type crystal mask |
CN206692715U (en) * | 2017-04-28 | 2017-12-01 | 东晶锐康晶体(成都)有限公司 | A kind of calibrating installation of quartz oscillator vacuum sputtering coating mask plate |
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2017
- 2017-04-28 CN CN201710294714.1A patent/CN107099768B/en not_active Expired - Fee Related
Patent Citations (7)
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CN1279629C (en) * | 2001-12-10 | 2006-10-11 | 伊斯曼柯达公司 | Mask for producing organic LED device by calibrating multiple madk sections for assembly |
WO2008152150A1 (en) * | 2007-06-14 | 2008-12-18 | X-Fab Semiconductor Foundries Ag | Production of adjustment structures for a structured layer deposition on a microsystem technology wager |
CN101101458A (en) * | 2007-08-03 | 2008-01-09 | 上海微电子装备有限公司 | Optical etching device aligning method and system |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111254389A (en) * | 2020-04-13 | 2020-06-09 | 柯学 | Calibration device for vacuum sputtering coating mask plate of quartz crystal oscillator |
CN112645716A (en) * | 2020-12-22 | 2021-04-13 | 西安鑫垚陶瓷复合材料有限公司 | Deposition sizing tool and method for ceramic matrix composite part |
CN117646183A (en) * | 2023-12-29 | 2024-03-05 | 武汉中科先进材料科技有限公司 | High-yield glass surface metallization mask clamp |
CN117646183B (en) * | 2023-12-29 | 2024-08-20 | 武汉中科先进材料科技有限公司 | High-yield glass surface metallization mask clamp |
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