CN217894382U - Tuning fork resonator production line - Google Patents

Abstract

The utility model discloses a tuning fork syntonizer production line, include following station according to the preface arranged along the direction of production: a production station for processing the wafer raw material into wafer pieces; a first measuring station; folding the tuning fork wafer on the wafer at a folding station; an assembling station, wherein the tuning fork wafer is solidified on the product base; a second measurement station; a packaging station for vacuum packaging the product; the vibration energy of the tuning fork wafer can be quickly consumed at the first measuring station, so that the vibration starting of the tuning fork wafer in the area is finished, the probe can directly measure when reaching the next tuning fork wafer to be measured, and the measuring efficiency is greatly improved; the utility model discloses can simulate encapsulation back vacuum environment at second survey station and measure product frequency and resistance to select the substandard product, reduce the defective percentage.

Description

Tuning fork resonator production line

Technical Field

The utility model relates to a semiconductor field specifically is a tuning fork syntonizer production line.

Background

Along with the technical progress and the change of market application in the 21 st century, quartz crystal resonators show the development trend of miniaturization, high precision and low power consumption. Secondly, quartz crystal resonators are developing towards higher precision and higher stability. The quartz crystal resonator is gradually miniaturized, flaked and sliced, and provides greater challenges for improving the precision and the stability of the quartz crystal resonator. From the market application perspective, the quartz crystal resonator provides stable clock frequency for electronic products, and the precision and the stability of the quartz crystal resonator have a crucial influence on the quality, the performance and the later maintenance cost of downstream products. Miniaturized, ultra-high frequency quartz crystal resonators are the technological development trend for future 5G applications.

The tuning fork-shaped quartz vibrating reed is one of the quartz vibrating reeds used by the crystal resonator, has wide market prospect, and can ensure the performance of a product through multiple measurements before the tuning fork resonator is produced; the method has the following difficulties in the prior production of the tuning fork resonator, one is that the wafer obtained by processing the wafer needs to carry out frequency measurement on the tuning fork wafer on the whole wafer, the frequency measurement needs to be carried out through a probe at present, after the probe applies vibration to the tuning fork wafer, vibration waves are generated to influence the vibration starting of adjacent products, the measurement needs to be carried out after the vibration starting of the adjacent products is finished, the measurement efficiency is extremely low, and meanwhile, the wafer is not easy to fix during measurement due to the extremely low thickness of the wafer; secondly, because the product packaging is carried out in vacuum, the tuning fork wafer is easy to start vibrating after packaging, but the product frequency and the resistance are difficult to accurately measure in the atmospheric environment before packaging, and the direct packaging and selling defective rate is high, so that a solution is urgently needed.

Disclosure of Invention

In order to avoid and overcome the technical problem that exists among the prior art, the utility model provides a tuning fork syntonizer production line. The utility model discloses the measurement of efficiency to the tuning fork wafer in the production process has been improved by a wide margin to can simulate accurate measurement to product frequency and resistance before the encapsulation.

In order to achieve the above purpose, the utility model provides a following technical scheme:

a tuning fork resonator production line comprises the following stations arranged in sequence along the production direction:

a production station for processing wafer raw materials into wafer sheets;

the first measuring station comprises a positioning platform, and a negative pressure pipeline communicated with a negative pressure source is arranged in the positioning platform; the wafer sheet is fixed on the positioning platform; the measuring system is arranged above the wafer, a probe of the measuring system is connected with the frequency meter, and the probe sequentially applies vibration to the root of each tuning fork wafer on the wafer; the negative pressure hole is formed in the positioning platform and communicated with the negative pressure pipeline, and the negative pressure hole corresponds to the tuning fork wafer; the negative pressure hole is closed when the probe applies vibration, and the negative pressure hole is opened after the probe leaves the tuning fork wafer;

folding the tuning fork wafer on the wafer at a folding station;

an assembly station, wherein the tuning fork wafer is solidified on the product base;

the second measuring station comprises a test board and a vacuum cover body fixed on the test board; the vacuum cover body and the test bench enclose to form a test cavity, and an unpackaged product to be tested is connected with an analyzer positioned in the test cavity; the vacuum pump is communicated with the test cavity through a vacuum port formed on the test board; the test board is also provided with a replacement port communicated with the test cavity, and the replacement port is communicated with an inactive gas source;

and a packaging station for vacuum packaging the product.

As a further scheme of the invention: set up the absorption hole with wafer piece surface laminating on the locating platform, the negative pressure pipeline reposition of redundant personnel form with the first negative pressure passageway of absorption hole intercommunication and with the second negative pressure passageway of negative pressure hole intercommunication, be provided with opening and close of solenoid valve in order to control the negative pressure hole on the second negative pressure passageway.

As a still further scheme of the invention: the positioning platform is characterized in that the surface of the positioning platform is convexly provided with positioning bulges which are abutted to the wafer sheet and distributed in an L shape, and the positioning bulges are matched with each other to form a positioning end for positioning the wafer sheet at a right angle.

As a still further scheme of the invention: an observation port positioned above the probe is formed in the measuring system, the CCD recognition system is fixed on the measuring system, and a detection port of the CCD recognition system faces the direction of the probe.

As a still further scheme of the invention: the positioning platform and the measuring system are both arranged on a fixed seat, the fixed seat is provided with an X-direction sliding table and a Y-direction sliding table which are vertically arranged, and the positioning platform is fixed on a mounting seat of the X-direction sliding table; and a Z-direction sliding table moving along the vertical direction is further fixed on the Y-direction sliding table, and the measuring system is clamped and fixed by a fixing arm on the Z-direction sliding table.

As a still further scheme of the invention: the vacuum cover body is fixed on a telescopic rod of the test bench so as to generate lifting action.

As a still further scheme of the invention: the vacuum port is connected with a vacuum pump through a vacuum pipeline, and the vacuum pipeline is also connected with a vacuum resistance gauge.

As a still further scheme of the invention: the inactive gas source is nitrogen or inert gas, and the test board is provided with an operation control board for controlling the opening and closing of the vacuum port and the replacement port.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses expose, develop, wet etching, sputter coating process to the wafer raw materials in proper order in the yellow light workshop, can obtain the wafer piece, when the wafer piece measures tuning fork wafer vibration frequency through first measurement process, the probe applys the vibration to the tuning fork wafer on the wafer piece in proper order, records vibration frequency through the frequency meter to accomplish the measurement process; in the process that the probe leaves the measured tuning fork wafer and moves to the next wafer, the negative pressure hole is opened to generate instant negative pressure, the negative pressure hole instantly sucks air flow, the air flow flowing fast forms gaseous damping, the vibration energy of the tuning fork wafer is consumed fast, and the vibration starting of the tuning fork wafer in the area is finished, so that the probe can directly measure when reaching the next measured tuning fork wafer, the measuring efficiency is greatly improved, and the probe can be strived for and cured on a product base after the measurement is finished to form an unpackaged tuning fork resonator product; the unpackaged tuning fork resonator product is sent to the test board, covered in the vacuum cover body and connected with the tester, and the positioning groove can position the position of the vacuum cover body; when the test is started, the replacement port and the vacuum pump are simultaneously started, so that air in the test cavity is replaced by inactive gas, and the replacement port is closed after the replacement is finished, so that the test cavity is pumped to a preset vacuum degree, the frequency and the resistance of a product can be measured by simulating a vacuum environment after the package, a defective product is selected, and the defective rate is reduced; after the test is finished, the replacement port is opened, the inactive gas is filled into the test cavity, and the negative pressure environment in the test cavity is broken, so that the vacuum cover body can be normally opened; and after the test is finished, the product can be subjected to vacuum packaging.

2. The utility model discloses a set up the absorption hole on the positioning platform surface, make it communicate with the negative pressure source, can adsorb fixedly to wafer piece negative pressure, wherein the negative pressure pipeline that communicates with the negative pressure source can divide the back and communicate with the absorption hole through first negative pressure passageway and communicate with the negative pressure hole through second negative pressure passageway respectively, the absorption hole can keep adsorbing fixedly to the continuity of wafer piece, prevent that rigid fixation from damaging extremely thin wafer piece; because the second negative pressure channel is provided with the electromagnetic valve, the flow rate of the sucked gas at the negative pressure hole can be controlled by controlling the opening degree of the electromagnetic valve; therefore, the wafer sheet can be adsorbed and fixed and the problem of vibration caused during measurement can be solved at the same time through a negative pressure source.

3. The utility model has the advantages that the positioning bulges distributed in the L shape are arranged on the positioning platform, so that the wafer sheet can be abutted against the positioning bulges to position, the operation is convenient, and the wafer sheet is not damaged during the positioning; the CCD recognition system is arranged above the measurement system, so that the detected tuning fork wafer can be amplified and observed, and measurement, positioning and observation for picking out defective products are facilitated; the X-direction sliding table, the Y-direction sliding table and the Z-direction sliding table are arranged in a matched mode, so that the positions of the measuring system and the wafer sheet can be adjusted accurately.

4. The utility model arranges the telescopic rod on the test board to drive the vacuum cover body to extend and retract up and down, which is convenient for controlling the opening and closing of the vacuum cover body; the vacuum pipeline is connected with a vacuum resistance gauge, so that vacuum degree information can be acquired in real time; the inactive gas is nitrogen or inert gas, which can replace the air in the original vacuum cover body, prevent the residual air in the vacuum cover body from influencing the measurement, and improve the accuracy of the measurement.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural diagram of a first measuring station.

Fig. 3 is a schematic structural diagram of the middle measuring system of the present invention.

Fig. 4 is a schematic structural diagram of the middle positioning platform of the present invention.

FIG. 5 is an enlarged view of a tuning fork wafer on a middle wafer of the present invention.

Fig. 6 is a schematic flow diagram of the negative pressure line.

Fig. 7 is a schematic view of a second measuring station.

Fig. 8 is a schematic structural view of another view angle of the second measuring station.

In the figure:

a1, a production station; a2, a first measuring station; a3, folding and taking a station;

a4, assembling stations; a5, a second measuring station; a6, packaging a station;

1. positioning the platform; 11. a negative pressure interface; 12. positioning the projection;

13. an adsorption hole; 14. a negative pressure hole; 15. a negative pressure pipeline;

151. a first negative pressure passage; 152. a second negative pressure passage; 153. an electromagnetic valve;

2. wafer slices; 21. a tuning fork wafer;

3. a measurement system; 31. a probe; 32. an observation port;

4. a CCD recognition system;

5. a fixed seat; 51. an X-direction sliding table;

52. a Z-direction sliding table; 521. a fixed arm;

53. a Y-direction sliding table; 531. a mounting seat;

6. a test bench; 61. a vacuum cover body; 611. a telescopic rod;

62. an analyzer; 63. a vacuum port; 64. a replacement port;

65. a console; 66. a vacuum pipeline.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 8, in an embodiment of the present invention, a tuning fork resonator production line, a first measurement station A2 includes a fixing base 5, an X-direction sliding table 51 and a Y-direction sliding table 53 are mounted on the fixing base 5, the Z-direction sliding table 52 is fixed on the Y-direction sliding table 53 and is vertically arranged, and the Z-direction sliding table 52 can slide along the length direction of the Y-direction sliding table 53.

A fixed arm 521 horizontally suspended is fixed on the sliding seat of the Z-direction sliding table 52, and the measuring system 3 and the CCD identification system 4 are both mounted at the arm end of the fixed arm 521. The measuring system 3 is plate-shaped, an observation port 32 is formed in the center of the measuring system, the probe 31 is fixed below the observation port 32, and the probe 31 is connected with the frequency meter through a line. After the probe 31 abuts on the root of the tuning fork wafer 21, the vibration frequency can be recorded by the frequency meter while applying vibration to the tuning fork wafer 21.

The CCD recognition system 4 is fixed above the measurement system 3 with its detection port facing the probe 31 for magnifying observation of the probe 31.

An installation seat 531 is fixed on the slide seat of the X-direction sliding table 51, and the positioning platform 1 is fixed on the installation seat 531. The X-direction sliding table 52, the Y-direction sliding table 53 and the Z-direction sliding table 52 can coarsely adjust the positions of the measuring module 3 and the positioning platform 1, and the mounting base 531 can drive the positioning platform 1 to finely adjust the position.

The positioning platform 1 is a square platform body horizontally arranged, the wafer sheet 2 is placed at the top of the positioning platform 1 and is abutted to the positioning protrusions 12 arranged at intervals at the top of the positioning platform 1, and therefore position positioning is achieved.

The positioning protrusions 12 are preferably distributed in an L shape, and form a right-angle positioning end after being matched with each other, so that the wafer piece 2 is positioned.

The top of the positioning platform 1 is further provided with an adsorption hole 13 corresponding to the wafer 2, and the top of the positioning platform 1 is further provided with a negative pressure hole 14 corresponding to the tuning fork wafer 21 on the wafer 2. The front end of the positioning platform 1 is provided with a negative pressure interface 11, a negative pressure source is communicated with a negative pressure pipeline 15 inside the positioning platform 1 through the negative pressure interface 11, and the negative pressure source is usually a vacuum pump. The negative pressure line 15 has two branches, a first negative pressure passage 151 communicating with the suction hole 13 and a second negative pressure passage 152 communicating with the negative pressure hole 14.

The opening and closing of all the negative pressure holes 14 are controlled by a set of electromagnetic valves 153 at each negative pressure hole 14, or the opening and closing of each negative pressure hole 14 are controlled by a set of electromagnetic valves 153 respectively. The first negative pressure channel 151 is opened and closed without valve control, and continuously adsorbs and fixes the wafer sheet 2. The second negative pressure channel 151 is controlled by the solenoid valve 153 to be opened and closed instantly after the probe 31 leaves the tuning fork wafer 21, thereby generating an instant negative pressure, so as to suck an air flow from the negative pressure hole 14, and consume the vibration energy of the tuning fork wafer 21 by the fast flowing air flow.

The first measuring station A5 comprises a test bench 6, and a groove matched with the vacuum cover body 61 in shape is formed in the surface of the test bench 6 and used for placing and positioning the vacuum cover body 61.

The table top of the test table 6 is fixed with a telescopic rod 611, and the telescopic rod 611 moves to drive the vacuum cover 61 to lift.

The analyzer 62 is fixed on the test bench 6 and covered by the vacuum cover 61, the vacuum cover 61 and the test bench 6 are matched to form a test cavity in an enclosing manner, and the opening of the vacuum cover 61 is provided with a silica gel ring or a rubber ring to improve the sealing performance.

The test bench 6 is provided with a vacuum port 63 communicated with the test cavity, the mouth of the vacuum port 63 is hermetically fixed with a tee joint, one outlet of the tee joint is connected with a vacuum pump, and the other outlet of the tee joint is connected with a vacuum resistance gauge so as to determine the vacuum degree in the test cavity.

The test bench 6 is also provided with a replacement port 64 communicated with the test cavity, and the replacement port 64 is communicated with an inactive gas source through a pipeline. The inert gas source can be nitrogen or inert gas, and nitrogen is preferred.

The replacement port 64 is first opened simultaneously with the vacuum pump at the start of the test to replace the air in the test chamber with the inert gas, and after the replacement is completed, the replacement port 64 is closed to draw the test chamber to a predetermined vacuum degree.

After the test is finished, the replacement port 64 is opened, inactive gas is filled into the test cavity, and the negative pressure environment in the test cavity is broken, so that the vacuum cover body 61 can be normally opened.

The test bench 6 is provided with a control bench 65 for controlling the opening and closing of each part on the test bench 6.

The production process comprises the following steps:

s1, placing a photoetching wafer raw material in a yellow light workshop of a production station A1, and sequentially carrying out exposure, development, wet etching and sputtering coating on the wafer to obtain a wafer 2;

s2, conveying the wafer sheet 2 to a positioning platform 1 of a first measuring station A2;

s21, enabling the wafer sheet 2 to be abutted against the positioning bulges 12, starting a negative pressure source to ensure that the wafer sheet 2 is adsorbed and fixed by negative pressure through the adsorption holes 13, and closing the electromagnetic valve 153 at the moment;

s22, adjusting the positions of the X-direction sliding table 51, the Y-direction sliding table 53 and the Z-direction sliding table 52 to enable the probe 31 to be abutted against the root part of the first group of tuning fork wafers 21, and enabling the CCD identification system 4 to carry out identification observation on the tuning fork wafers 21;

and directly marking and removing defective products during observation.

S23, the probe 31 applies vibration to the root of the tuning fork wafer 21, the frequency meter measures the vibration frequency of the tuning fork wafer 21, and after the measurement is finished, the probe 31 is driven to move to the root of the next tuning fork wafer 21 through the relative movement of the X-direction sliding table 51, the Y-direction sliding table 53 and the Z-direction sliding table 52;

s24, in step S23, when the probe 31 moves, the electromagnetic valve 153 is opened, negative pressure is applied to the area where the measured tuning fork wafer 21 is located through the negative pressure hole 14, and the electromagnetic valve 153 is closed before the probe 31 reaches the root of the next tuning fork wafer 21;

s25, after the probe 31 reaches the root of the next tuning fork wafer 21, repeating the steps S23 and S24 until the measurement of all the tuning fork wafers 21 is completed, closing the negative pressure source, taking out the wafer piece 2 and conveying the wafer piece to the folding station A3;

typically probe 31 measures in an S-shaped travel path.

S3, folding the tuning fork wafer 21 on the wafer 2, and conveying to an assembling station A4;

s4, assembling the tuning fork wafer 21 on a product base, curing the assembling point at a high temperature, and finely adjusting the thickness of the tuning fork wafer 21 through ion beam etching; the vibration frequency of the tuning fork wafer 21 is finely adjusted by adjusting the thickness.

S5, sending the unpackaged tuning fork resonator product to a test bed 6;

s51, lifting the vacuum cover body 61, connecting the tuning fork resonator product with an analyzer 62, and then lowering the vacuum cover body 61;

s52, opening the replacement port 64 to replace the air in the vacuum cover body 61, then closing the replacement port 64, pumping the vacuum cover body 61 to a preset vacuum degree by the vacuum pump,

s53, starting the analyzer 62 to analyze the product after the preset vacuum degree is reached;

s54, after the analysis is finished, opening the replacement port 64 to fill inert gas into the vacuum cover body 61, breaking the vacuum environment, lifting the vacuum cover body 61 and taking out the product;

and S6, carrying out vacuum packaging on the tuning fork resonator product to complete the whole production process.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. As used herein, the words "or" and "refer to, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, each component or step can be decomposed and/or re-combined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of example aspects and embodiments have been discussed above, those of skill in the art will recognize certain variations, modifications, alterations, additions and sub-combinations thereof.

Claims (8)

1. A tuning fork resonator production line is characterized by comprising the following stations arranged in sequence along the production direction:

a production station (A1) for processing the wafer raw material into wafer pieces (2);

the first measuring station (A2) comprises a positioning platform (1), and a negative pressure pipeline (15) communicated with a negative pressure source is arranged in the positioning platform; the wafer sheet (2) is fixed on the positioning platform (1); the measuring system (3) is arranged above the wafer (2), a probe (31) of the measuring system (3) is connected with the frequency meter, and the probe (31) sequentially applies vibration to the root of each tuning fork wafer (21) on the wafer (2); the negative pressure hole (14) is formed in the positioning platform (1) and communicated with the negative pressure pipeline (15), and the negative pressure hole (14) corresponds to the tuning fork wafer (21); when the probe (31) applies vibration, the negative pressure hole (14) is closed, and the negative pressure hole (14) is opened after the probe (31) leaves the tuning fork wafer (21);

a folding station (A3) for folding the tuning fork wafer (21) on the wafer (2);

an assembling station (A4) for solidifying the tuning fork wafer (21) on the product base;

the second measuring station (A5) comprises a test bench (6) and a vacuum cover body (61) fixed on the test bench (6); the vacuum cover body (61) and the test bench (6) are enclosed to form a test cavity, and an unpackaged product to be tested is connected with an analyzer (62) positioned in the test cavity; the vacuum pump is communicated with the test cavity through a vacuum port (63) arranged on the test board (6); the test bench (6) is also provided with a replacement port (64) communicated with the test cavity, and the replacement port (64) is communicated with an inactive gas source;

and a packaging station (A6) for vacuum packaging the product.

2. The tuning fork resonator production line of claim 1, wherein the positioning platform (1) is provided with an adsorption hole (13) attached to the surface of the wafer piece (2), the negative pressure pipeline (15) is divided into a first negative pressure channel (151) communicated with the adsorption hole (13) and a second negative pressure channel (152) communicated with the negative pressure hole (14), and the second negative pressure channel (152) is provided with an electromagnetic valve (153) to control the opening and closing of the negative pressure hole (14).

3. The tuning fork resonator production line according to claim 1, wherein the positioning platform (1) is convexly provided with positioning bulges (12) which abut against the wafer piece (2) and are distributed in an L shape, and after the positioning bulges (12) are matched with each other, a positioning end for positioning the wafer piece (2) at a right angle is formed.

4. The tuning fork resonator production line according to claim 1, wherein the measuring system (3) is provided with an observation port (32) located above the probe (31), the CCD recognition system (4) is fixed on the measuring system (3) and a detection port of the CCD recognition system (4) faces the direction of the probe (31).

5. A tuning fork resonator production line according to any one of claims 1-4, characterized in that the positioning platform (1) and the measuring system (3) are mounted on a fixed base (5), the fixed base (5) is provided with an X-direction sliding table (51) and a Y-direction sliding table (53) which are arranged perpendicularly to each other, and the positioning platform (1) is fixed on a mounting base (531) of the X-direction sliding table (51); and a Z-direction sliding table (52) moving along the vertical direction is also fixed on the Y-direction sliding table (53), and the measuring system (3) is clamped and fixed by a fixing arm (521) on the Z-direction sliding table (52).

6. A tuning fork resonator production line according to any one of claims 1 to 4, characterized in that the vacuum enclosure (61) is fixed on the telescopic rod (611) of the test bench (6) so as to generate a lifting action.

7. A tuning fork resonator production line according to any one of claims 1-4, characterized in that the vacuum port (63) is connected with a vacuum pump through a vacuum pipe (66), and a vacuum resistance gauge is further connected to the vacuum pipe (66).

8. The tuning fork resonator production line according to any one of claims 1 to 4, wherein the inactive gas source is nitrogen or inert gas, and the test platform (6) is provided with a control platform (65) for controlling the opening and closing of the vacuum port (63) and the replacement port (64).

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