CN107093558A - 无机薄膜晶体管的制作方法、柔性显示装置 - Google Patents

无机薄膜晶体管的制作方法、柔性显示装置 Download PDF

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CN107093558A
CN107093558A CN201710296914.0A CN201710296914A CN107093558A CN 107093558 A CN107093558 A CN 107093558A CN 201710296914 A CN201710296914 A CN 201710296914A CN 107093558 A CN107093558 A CN 107093558A
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梁博
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Wuhan China Star Optoelectronics Technology Co Ltd
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    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
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Abstract

本发明提供了一种无机薄膜晶体管的制作方法,其包括:在硬质基板上依次形成P型半导体层和N型半导体层;在P型半导体层中形成贯穿N型半导体层的凹槽;在N型半导体层上形成分别位于凹槽两侧的源极和漏极;通过翻转转移的方式将P型半导体层、N型半导体层、源极和漏极转移到柔性基板上;在P型半导体层上依次形成栅极绝缘层和栅极;在栅极绝缘层上形成覆盖栅极的平坦层。本发明还提供了一种由所述制作方法制作的无机薄膜晶体管的柔性显示装置。本发明通过纳米压印的方法制备适于柔性显示制程且有良好电学性能的无机薄膜晶体管,通过设计无机薄膜晶体管的结构,获得窄沟道无机薄膜晶体管器件,并降低制程要求,节约成本。

Description

无机薄膜晶体管的制作方法、柔性显示装置
技术领域
本发明属于显示技术领域,具体地讲,涉及一种用于柔性显示装置的无机薄膜晶体管的制作方法、柔性显示装置。
背景技术
无机薄膜晶体管(Thin-film transistor,简称TFT)在电性性能的多个方面都优于有机薄膜晶体管,但基于无机薄膜晶体管的柔性电子学制程较为繁琐,成本高昂,且器件稳定性较差。结合纳米压印和转印技术的无机薄膜晶体管,既能保证较高的电子迁移率和饱和速度,又能带来接近有机薄膜晶体管的柔性和耐弯折稳定性。
因此,有必要提供一种利用纳米压印和转印技术制作无机薄膜晶体管的方法。
发明内容
本发明提供了一种利用纳米压印和转印技术的用于柔性显示装置的无机薄膜晶体管的制作方法、柔性显示装置。
本发明提供了一种无机薄膜晶体管的制作方法,包括:在硬质基板上依次形成P型半导体层和N型半导体层;在所述P型半导体层中形成贯穿所述N型半导体层的凹槽;在所述N型半导体层上形成分别位于所述凹槽两侧的源极和漏极;通过翻转转移的方式将所述P型半导体层、所述N型半导体层、所述源极和所述漏极转移到柔性基板上;在所述P型半导体层上依次形成栅极绝缘层和栅极;在所述栅极绝缘层上形成覆盖所述栅极的平坦层。
可选地,在硬质基板上依次形成P型半导体层和N型半导体层的方法包括:在所述硬质基板上沉积形成半导体层;对所述半导体层依次进行离子注入、结晶和热退火处理,以形成所述P型半导体层和所述N型半导体层。
可选地,在所述P型半导体层中形成贯穿所述N型半导体层的凹槽的方法包括:在所述N型半导体层上涂布压印光阻;利用压印模具对所述压印光阻进行热压印成型,以在所述压印光阻中形成暴露所述N型半导体层的通孔;将暴露出的所述N型半导体层刻蚀去除,并在所述P型半导体层中刻蚀形成所述凹槽;将剩余的所述压印光阻去除。
可选地,利用干刻的方式对暴露出的所述N型半导体层和所述P型半导体层进行刻蚀。
可选地,在翻转转移之前,在所述柔性基板上形成粘合层;在翻转转移完成之后,所述粘合层填充于所述源极和所述柔性基板之间、所述漏极和所述柔性基板之间、所述N型半导体层和所述柔性基板之间以及所述凹槽中。
可选地,所述硬质基板为玻璃基板。
可选地,所述柔性基板采用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚酰亚胺中的至少一种制成。
根据本发明的另一方面,还提供了一种具有由上述的制作方法制作的无机薄膜晶体管的柔性显示装置。
可选地,所述柔性显示装置为柔性有机电致发光显示装置。
本发明的有益效果:通过纳米压印的方法制备适于柔性显示制程且有良好电学性能的无机薄膜晶体管,通过对无机薄膜晶体管的结构的设计,获得窄沟道无机薄膜晶体管器件,并降低制程要求,节约成本。此外,可以将无机薄膜晶体管器件规模化转移到柔性基底,适于规模化制备用于柔性显示装置的无机薄膜晶体管。
附图说明
通过结合附图进行的以下描述,本发明的实施例的上述和其它方面、特点和优点将变得更加清楚,附图中:
图1A至图1F是根据本发明的实施例的制作无机薄膜晶体管的方法流程图;
图2A至图2D是根据本发明的实施例的形成凹槽的流程图。
具体实施方式
以下,将参照附图来详细描述本发明的实施例。然而,可以以许多不同的形式来实施本发明,并且本发明不应该被解释为限制于这里阐述的具体实施例。相反,提供这些实施例是为了解释本发明的原理及其实际应用,从而使本领域的其他技术人员能够理解本发明的各种实施例和适合于特定预期应用的各种修改。
在附图中,为了清楚展示器件结构,夸大了层和区域的厚度。相同的标号在整个说明书和附图中表示相同的元器件。
将理解的是,当诸如层、膜、区域或基底的元件被称作“在”另一元件“上”时,该元件可以直接在所述另一元件上,或者也可以存在中间元件。可选择地,当元件被称作“直接在”另一元件“上”时,不存在中间元件。
图1A至图1F是根据本发明的实施例制作无机薄膜晶体管的方法流程图。应当说明的是,根据本发明实施例制备的无机薄膜晶体管可很好地应用于柔性显示装置中,诸如柔性有机电致发光显示装置。
根据本发明的实施例的无机薄膜晶体管的制作方法包括:
步骤一:参照图1A,在硬质基板100上依次形成P型半导体层210和N型半导体层220。
硬质基板100可以采用玻璃、陶瓷或金属制成。在本实施例中,硬质基板100优选地采用玻璃制成。
实现步骤一的具体方法包括:
首先,在硬质基板100上沉积形成半导体层。这里可以采用化学气相沉积法(CVD)在硬质基板100上形成Si层,即所述半导体层。
其次,对所述半导体层进行IMP离子注入、ELA结晶或高温热退火处理,以形成P型半导体层210和N型半导体层220。
步骤二:参照图1B,在P型半导体层210中形成贯穿N型半导体层220的凹槽230。
图2A至图2D是根据本发明的实施例的形成凹槽的流程图。
根据本发明的实施例的形成凹槽230的具体方法包括:
首先,参照图2A,在N型半导体层220上涂布压印光阻1000。
接着,参照图2B,利用压印模具2000对压印光阻1000进行热压印成型,以在压印光阻1000中形成暴露所述N型半导体层220的通孔1010。
接着,参照图2C,将暴露出的N型半导体层220刻蚀去除,并在P型半导体层210中刻蚀形成凹槽230。
这里,进一步地,利用干刻的方式对暴露出的N型半导体层220和P型半导体层210进行刻蚀。
最后,参照图2D,将剩余的压印光阻1000去除。
步骤三:参照图1C,在N型半导体层220上形成分别位于凹槽230两侧的源极310和漏极320。
步骤四:参照图1D,通过翻转转移的方式将P型半导体层210、N型半导体层220、源极310和漏极320转移到柔性基板400上。
这里,进一步地,在翻转转移之前,在柔性基板400上形成粘合层500;在翻转转移完成之后,粘合层500填充于源极310和柔性基板400之间、漏极320和柔性基板400之间、N型半导体层220和柔性基板400之间以及凹槽230中。
需要说明的是,作为本发明的另一实施方式,粘合层500不设置也可以,这样可以节省一道制程,从而简化制作流程。
此外,柔性基板400可以采用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚酰亚胺等中的至少一种制成。
步骤五:参照图1E,在P型半导体层210上依次形成栅极绝缘层600和栅极700。需要说明的是,在形成栅极绝缘层600和栅极700之前,可根据实际需求对P型半导体层210进行图案化处理,获取需要的有源层结构。
步骤六:参照图1F,在栅极绝缘层600上形成覆盖栅极700的平坦层800。
综上所述,根据本发明的实施例,通过纳米压印的方法制备适于柔性显示制程且有良好电学性能的无机薄膜晶体管,通过对无机薄膜晶体管的结构的设计,获得窄沟道无机薄膜晶体管器件,并降低制程要求,节约成本。此外,可以将无机薄膜晶体管器件规模化转移到柔性基底,适于规模化制备用于柔性显示的无机薄膜晶体管。
虽然已经参照特定实施例示出并描述了本发明,但是本领域的技术人员将理解:在不脱离由权利要求及其等同物限定的本发明的精神和范围的情况下,可在此进行形式和细节上的各种变化。

Claims (9)

1.一种无机薄膜晶体管的制作方法,其特征在于,包括:
在硬质基板上依次形成P型半导体层和N型半导体层;
在所述P型半导体层中形成贯穿所述N型半导体层的凹槽;
在所述N型半导体层上形成分别位于所述凹槽两侧的源极和漏极;
通过翻转转移的方式将所述P型半导体层、所述N型半导体层、所述源极和所述漏极转移到柔性基板上;
在所述P型半导体层上依次形成栅极绝缘层和栅极;
在所述栅极绝缘层上形成覆盖所述栅极的平坦层。
2.根据权利要求1所述的制作方法,其特征在于,在硬质基板上依次形成P型半导体层和N型半导体层的方法包括:
在所述硬质基板上沉积形成半导体层;
对所述半导体层依次进行离子注入、结晶和热退火处理,以形成所述P型半导体层和所述N型半导体层。
3.根据权利要求1所述的制作方法,其特征在于,在所述P型半导体层中形成贯穿所述N型半导体层的凹槽的方法包括:
在所述N型半导体层上涂布压印光阻;
利用压印模具对所述压印光阻进行热压印成型,以在所述压印光阻中形成暴露所述N型半导体层的通孔;
将暴露出的所述N型半导体层刻蚀去除,并在所述P型半导体层中刻蚀形成所述凹槽;
将剩余的所述压印光阻去除。
4.根据权利要求3所述的制作方法,其特征在于,利用干刻的方式对暴露出的所述N型半导体层和所述P型半导体层进行刻蚀。
5.根据权利要求1所述的制作方法,其特征在于,在翻转转移之前,在所述柔性基板上形成粘合层;
在翻转转移完成之后,所述粘合层填充于所述源极和所述柔性基板之间、所述漏极和所述柔性基板之间、所述N型半导体层和所述柔性基板之间以及所述凹槽中。
6.根据权利要求1所述的制作方法,其特征在于,所述硬质基板为玻璃基板。
7.根据权利要求1所述的制作方法,其特征在于,所述柔性基板采用聚对苯二甲酸乙二醇酯、聚萘二甲酸乙二醇酯、聚酰亚胺中的至少一种制成。
8.一种具有由权利要求1至7中任一项所述的制作方法制作的无机薄膜晶体管的柔性显示装置。
9.根据权利要求8所述的柔性显示装置,其特征在于,所述柔性显示装置为柔性有机电致发光显示装置。
CN201710296914.0A 2017-04-28 2017-04-28 无机薄膜晶体管的制作方法、柔性显示装置 Pending CN107093558A (zh)

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