CN107089840B - 一种高强度仿生竹壁结构的陶瓷砖及其制备方法 - Google Patents
一种高强度仿生竹壁结构的陶瓷砖及其制备方法 Download PDFInfo
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Abstract
本发明公开了一种高强度仿生竹壁结构的陶瓷砖,包括陶瓷基体和覆于陶瓷基体上的釉面层,陶瓷基体是由多孔或实心陶芯和包绕陶芯的仿竹壁结构陶瓷组成,本发明的陶瓷砖载荷能力极强,其结构变化可控,较之传统的多孔陶瓷砖强度更高,产品的应用范围内更广,且制备方法简单,便于大规模生产应用。
Description
技术领域
本发明涉及陶瓷砖技术领域,尤其涉及一种高强度仿生竹壁结构的陶瓷砖及其制备方法。
背景技术
陶瓷砖在日常生活中随处可见,是一种重要的建筑材料,是由粘土和其他无机非金属原料,经成型、烧结等工艺生产的板状或块状陶瓷制品,用于装饰与保护建筑物、构筑物的墙面和地面,通常在室温下通过干压、挤压或其他成型方法成型,然后干燥,在一定温度下烧成。由于瓷砖自重大,粘贴在墙面上时龙骨受力后容易变形、移位,时间一长就会导致空鼓、掉落等问题,不仅影响美观还存在安全隐患,为此轻质高强度的瓷砖越来越受到市场欢迎。目前轻质高强度瓷砖的生产研发主要集中在从配方和烧结工艺上改善,极大的提高了生产成本。近年来涌现了仿生结构陶瓷的研制,从改变陶瓷体内部结构着手,应用前景良好。
竹子是自然界存在的一种典型的、具有良好力学性能的生物体,具有强度高、弹性好、性能稳定、密度小的优点,按照比强度计算,竹材的比强度甚至比钢材还要高出3-4倍。竹材的这一特殊性能是由其独特的结构决定的,竹壁的独特组织构造是竹材优良力学性能的物质基础。竹壁的组织细胞分为呈圆形薄壁结构的基本组织细胞和以纤维管束为主体的厚壁细胞,其中厚壁细胞被基本组织细胞包围着,起着承载的作用;此外竹杆中维管束的形状、大小以及密度在竹壁中的分布均存在规律性变化,由外而内,维管束的体积由小变大,到接近竹黄时又略变小,而密度则是由密到疏,近竹黄面时又略变密。正是竹材独特的组织结构对竹材力学性能有重大贡献,支撑其稳定的生长到很高的高度。
发明内容
本发明为了弥补已有技术的缺陷,提供一种高强度仿生竹壁结构的陶瓷砖及其制备方法。
本发明是通过以下技术方案实现的:
一种高强度仿生竹壁结构的陶瓷砖,包括陶瓷基体和覆于陶瓷基体上的釉面层,所述的陶瓷基体是由多孔或实心陶芯和包绕陶芯的仿竹壁结构陶瓷组成。
所述的一种高强度仿生竹壁结构的陶瓷砖的制备方法包括以下步骤:
(1)配制陶瓷浆料:
将陶瓷骨料与分散剂、粘结剂、水按照100:1:1-5:20-50的配比混合均匀后球磨处理,制成陶瓷浆料1备用;
将陶瓷骨料与分散剂、粘结剂、球状造孔剂、水按照100:1:1-5:5-20:20-50的配比混合均匀后球磨处理,制得陶瓷浆料2备用;
将陶瓷骨料与分散剂、粘结剂、纤维状造孔剂、水按照100:1:1-5:10-35:20-50的配制混合均匀后球磨处理,制得陶瓷浆料3备用;
(2)冷冻造型:
将陶瓷浆料1注入模具中,制成所需尺寸的陶芯,然后送入冷源中冷冻处理,得到冷冻陶芯1;
取出冷冻陶芯1,固定在模具的中心位置,所述模具的尺寸大于陶芯,然后将陶瓷浆料2注满模具空白间歇中,浇注完毕后送入冷源中冷冻处理,得冷冻陶瓷体2;
取出完全冷冻的陶瓷体2,放入模具的中心位置,所述的模具尺寸大于陶瓷体2,然后将陶瓷浆料3注满模具空白间隙中,浇注完毕后送入冷源冷冻处理,得冷冻陶瓷体3;
取出冷冻陶瓷体3,再次放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体3,然后将陶瓷浆料2注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷体4;
取出冷冻陶瓷体4,放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体4,然后将陶瓷浆料1注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷基体;
(3)施釉:将釉料喷施与冷冻陶瓷基体表面;
(4)烧结:将施釉后的冷冻陶芯基体送入电炉中通过程序升温工艺烧结处理后出料,即得所述的仿生结构陶瓷砖。
所述的球状造孔剂为有机树脂微球、淀粉、花粉或形貌为球形的物质。
所述的纤维状造孔剂为纸纤维、聚乙烯醇纤维、碳纳米纤维或形貌为纤维状的物质。
所述步骤(2)中冷冻温度为-5--20℃。
所述的一种高强度仿生竹壁结构的陶瓷砖的制备方法中冷冻陶瓷芯1与冷冻陶瓷体2的半径差控制在0.1-5mm;冷冻陶瓷体2与冷冻陶瓷体3的半径差控制在0.5-5mm;冷冻陶瓷体3与冷冻陶瓷体4的半径差控制在0.1-1mm;冷冻陶瓷体4与冷冻陶瓷基体的半径差控制在1-5mm。
所述的成型升温工艺为先以8-10℃/min的升温速率升温至90-100℃,保温20-25min,然后以5-8℃/min的升温速率升温至180-250℃,保温10-15min,然后再以相同的升温速率升温至400-500℃,保温5-12min,然后再升温至850-900℃,保温5-8min,最后升温至1200-1500℃,保温烧结1-5h。
本发明借鉴竹壁的结构,利用注浆和冷冻成型工艺,以不含造孔剂的陶瓷浆料作为陶芯,然后在陶芯外层包绕一定厚度的含有球状造孔剂的陶瓷浆料,然后接着在外层包绕含有纤维状造孔剂的陶瓷浆料,再接着在外层包绕含球状造孔剂的陶瓷浆料,最后再包绕一层不含造孔剂的陶瓷浆料,冷冻成型的陶瓷基体坯表面施釉后进行高温烧结,得到了这种仿生竹壁结构的陶瓷砖,这种陶瓷砖载荷能力极强,其结构变化可控,较之传统的多孔陶瓷砖强度更高,产品的应用范围内更广,且制备方法简单,便于大规模生产应用。
具体实施方式
一种高强度仿生竹壁结构的陶瓷砖,包括陶瓷基体和覆于陶瓷基体上的釉面层,所述的陶瓷基体是由多孔或实心陶芯和包绕陶芯的仿竹壁结构陶瓷组成。
所述的一种高强度仿生竹壁结构的陶瓷砖的制备方法,包括以下步骤:
(1)配制陶瓷浆料:
将陶瓷骨料与分散剂、粘结剂、水按照100:1:1:20的配比混合均匀后球磨处理,制成陶瓷浆料1备用;
将陶瓷骨料与分散剂、粘结剂、球状造孔剂、水按照100:1:1:5:20的配比混合均匀后球磨处理,制得陶瓷浆料2备用;
将陶瓷骨料与分散剂、粘结剂、纤维状造孔剂、水按照100:1:1:10:20的配制混合均匀后球磨处理,制得陶瓷浆料3备用;
(2)冷冻造型:
将陶瓷浆料1注入模具中,制成所需尺寸的陶芯,然后送入冷源中冷冻处理,得到冷冻陶芯1;
取出冷冻陶芯1,固定在模具的中心位置,所述模具的尺寸大于陶芯,然后将陶瓷浆料2注满模具空白间歇中,浇注完毕后送入冷源中冷冻处理,得冷冻陶瓷体2;
取出完全冷冻的陶瓷体2,放入模具的中心位置,所述的模具尺寸大于陶瓷体2,然后将陶瓷浆料3注满模具空白间隙中,浇注完毕后送入冷源冷冻处理,得冷冻陶瓷体3;
取出冷冻陶瓷体3,再次放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体3,然后将陶瓷浆料2注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷体4;
取出冷冻陶瓷体4,放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体4,然后将陶瓷浆料1注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷基体;
(3)施釉:将釉料喷施与冷冻陶瓷基体表面;
(4)烧结:将施釉后的冷冻陶芯基体送入电炉中通过程序升温工艺烧结处理后出料,即得所述的仿生结构陶瓷砖。
所述的球状造孔剂为聚乙烯树脂微球。
所述的纤维状造孔剂为纸纤维。
所述步骤(2)中冷冻温度为-5℃。
所述的一种高强度仿生竹壁结构的陶瓷砖的制备方法中冷冻陶瓷芯1与冷冻陶瓷体2的半径差控制在0.1mm;冷冻陶瓷体2与冷冻陶瓷体3的半径差控制在0.5mm;冷冻陶瓷体3与冷冻陶瓷体4的半径差控制在0.1mm;冷冻陶瓷体4与冷冻陶瓷基体的半径差控制在1mm。
所述的成型升温工艺为先以8℃/min的升温速率升温至90℃,保温20min,然后以5℃/min的升温速率升温至180℃,保温15min,然后再以相同的升温速率升温至400℃,保温12min,然后再升温至850℃,保温8min,最后升温至1200℃,保温烧结5h。
Claims (1)
1.一种高强度仿生竹壁结构的陶瓷砖,包括陶瓷基体和覆于陶瓷基体上的釉面层,其特征在于,所述的陶瓷基体是由多孔或实心陶芯和包绕陶芯的仿竹壁结构陶瓷组成;
制备方法包括以下步骤:
(1)配制陶瓷浆料:
将陶瓷骨料与分散剂、粘结剂、水按照100:1:1-5:20-50的配比混合均匀后球磨处理,制成陶瓷浆料1备用;
将陶瓷骨料与分散剂、粘结剂、球状造孔剂、水按照100:1:1-5:5-20:20-50的配比混合均匀后球磨处理,制得陶瓷浆料2备用;
将陶瓷骨料与分散剂、粘结剂、纤维状造孔剂、水按照100:1:1-5:10-35:20-50的配制混合均匀后球磨处理,制得陶瓷浆料3备用;
(2)冷冻造型:
将陶瓷浆料1注入模具中,制成所需尺寸的陶芯,然后送入冷源中冷冻处理,得到冷冻陶芯1;
取出冷冻陶芯1,固定在模具的中心位置,所述模具的尺寸大于陶芯,然后将陶瓷浆料2注满模具空白间隙中,浇注完毕后送入冷源中冷冻处理,得冷冻陶瓷体2;
取出完全冷冻的陶瓷体2,放入模具的中心位置,所述的模具尺寸大于陶瓷体2,然后将陶瓷浆料3注满模具空白间隙中,浇注完毕后送入冷源冷冻处理,得冷冻陶瓷体3;
取出冷冻陶瓷体3,再次放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体3,然后将陶瓷浆料2注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷体4;
取出冷冻陶瓷体4,放入模具的中心位置,所述的模具尺寸大于冷冻陶瓷体4,然后将陶瓷浆料1注入模具空白间隙中,浇注完毕后模具送入冷源中冷冻处理,得冷冻陶瓷基体;
(3)施釉:将釉料喷施于冷冻陶瓷基体表面;
(4)烧结:将施釉后的冷冻陶芯基体送入电炉中通过程序升温工艺烧结处理后出料,即得所述的仿生结构陶瓷砖;
所述的球状造孔剂为有机树脂微球、淀粉、花粉;
所述的纤维状造孔剂为纸纤维、聚乙烯醇纤维、碳纳米纤维;
所述步骤(2)中冷冻温度为-5--20℃;
冷冻陶瓷芯1与冷冻陶瓷体2的半径差控制在0.1-5mm;冷冻陶瓷体2与冷冻陶瓷体3的半径差控制在0.5-5mm;冷冻陶瓷体3与冷冻陶瓷体4的半径差控制在0.1-1mm;冷冻陶瓷体4与冷冻陶瓷基体的半径差控制在1-5mm;
所述的成型升温工艺为先以8-10℃/min的升温速率升温至90-100℃,保温20-25min,然后以5-8℃/min的升温速率升温至180-250℃,保温10-15min,然后再以相同的升温速率升温至400-500℃,保温5-12min,然后再升温至850-900℃,保温5-8min,最后升温至1200-1500℃,保温烧结1-5h。
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