CN107079589B - 连接体的制造方法、电子部件的连接方法、连接体 - Google Patents

连接体的制造方法、电子部件的连接方法、连接体 Download PDF

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Publication number
CN107079589B
CN107079589B CN201580052796.8A CN201580052796A CN107079589B CN 107079589 B CN107079589 B CN 107079589B CN 201580052796 A CN201580052796 A CN 201580052796A CN 107079589 B CN107079589 B CN 107079589B
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China
Prior art keywords
adhesive
electronic component
circuit
film
bonding step
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CN201580052796.8A
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Chinese (zh)
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CN107079589A (zh
Inventor
浅羽康佑
林慎一
田中雄介
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Dexerials Corp
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Dexerials Corp
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Publication of CN107079589A publication Critical patent/CN107079589A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
CN201580052796.8A 2014-10-16 2015-10-13 连接体的制造方法、电子部件的连接方法、连接体 Active CN107079589B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014212108A JP6609406B2 (ja) 2014-10-16 2014-10-16 接続体の製造方法、電子部品の接続方法、接続体
JP2014-212108 2014-10-16
PCT/JP2015/078867 WO2016060098A1 (ja) 2014-10-16 2015-10-13 接続体の製造方法、電子部品の接続方法、接続体

Publications (2)

Publication Number Publication Date
CN107079589A CN107079589A (zh) 2017-08-18
CN107079589B true CN107079589B (zh) 2020-06-09

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ID=55746644

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CN201580052796.8A Active CN107079589B (zh) 2014-10-16 2015-10-13 连接体的制造方法、电子部件的连接方法、连接体

Country Status (5)

Country Link
JP (1) JP6609406B2 (ko)
KR (1) KR102476432B1 (ko)
CN (1) CN107079589B (ko)
TW (1) TWI688176B (ko)
WO (1) WO2016060098A1 (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018133331A (ja) * 2017-02-15 2018-08-23 デクセリアルズ株式会社 異方性導電接続構造体、異方性導電接続構造体の製造方法、異方性導電フィルム、及び異方性導電ペースト
CN109389903B (zh) * 2017-08-04 2021-01-29 京东方科技集团股份有限公司 柔性基板及其加工方法、加工系统
JPWO2019050006A1 (ja) * 2017-09-11 2020-08-20 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
JP6619783B2 (ja) * 2017-09-21 2019-12-11 株式会社タムラ製作所 電極の接続方法および電子基板の製造方法
US11178764B2 (en) 2018-01-15 2021-11-16 Pi-Crystal Incorporation Flexible substrate, electronic device, and method for manufacturing electronic device
CN109739037B (zh) * 2018-11-23 2023-12-15 深圳市新盈恒科技有限公司 一种方便维修的液晶显示屏
US20220418058A1 (en) * 2020-02-10 2022-12-29 Pioneer Corporation Electronic device and method for manufacturing electronic device
CN111526669B (zh) * 2020-05-07 2021-07-23 深圳市晶泓科技有限公司 一种透明电路板及透明led显示屏的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234017A (ja) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd 回路接続材料とその接続材料を用いた回路の接続方法
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
JP2012178441A (ja) * 2011-02-25 2012-09-13 Sekisui Chem Co Ltd 接続構造体の製造方法及び接続構造体
WO2012169497A1 (ja) * 2011-06-06 2012-12-13 デクセリアルズ株式会社 接続方法、接続体の製造方法、接続体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005026577A (ja) 2003-07-04 2005-01-27 Matsushita Electric Ind Co Ltd 電子部品の実装方法
JP5690648B2 (ja) * 2011-04-28 2015-03-25 デクセリアルズ株式会社 異方性導電フィルム、接続方法及び接続構造体
JP5721593B2 (ja) * 2011-09-12 2015-05-20 積水化学工業株式会社 接続構造体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003234017A (ja) * 1993-07-29 2003-08-22 Hitachi Chem Co Ltd 回路接続材料とその接続材料を用いた回路の接続方法
JP2012124504A (ja) * 2005-02-02 2012-06-28 Sony Chemical & Information Device Corp 電気部品の実装方法
JP2012178441A (ja) * 2011-02-25 2012-09-13 Sekisui Chem Co Ltd 接続構造体の製造方法及び接続構造体
WO2012169497A1 (ja) * 2011-06-06 2012-12-13 デクセリアルズ株式会社 接続方法、接続体の製造方法、接続体

Also Published As

Publication number Publication date
JP2016082070A (ja) 2016-05-16
TW201633638A (zh) 2016-09-16
TWI688176B (zh) 2020-03-11
CN107079589A (zh) 2017-08-18
KR102476432B1 (ko) 2022-12-09
KR20170069962A (ko) 2017-06-21
JP6609406B2 (ja) 2019-11-20
WO2016060098A1 (ja) 2016-04-21

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