CN107073654A - 激光加工方法及装置 - Google Patents

激光加工方法及装置 Download PDF

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Publication number
CN107073654A
CN107073654A CN201480082774.1A CN201480082774A CN107073654A CN 107073654 A CN107073654 A CN 107073654A CN 201480082774 A CN201480082774 A CN 201480082774A CN 107073654 A CN107073654 A CN 107073654A
Authority
CN
China
Prior art keywords
laser beam
optical system
laser
travel
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201480082774.1A
Other languages
English (en)
Chinese (zh)
Inventor
深堀秀则
伊藤健治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN107073654A publication Critical patent/CN107073654A/zh
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201480082774.1A 2014-11-06 2014-11-06 激光加工方法及装置 Pending CN107073654A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/079435 WO2016071986A1 (ja) 2014-11-06 2014-11-06 レーザ加工方法及び装置

Publications (1)

Publication Number Publication Date
CN107073654A true CN107073654A (zh) 2017-08-18

Family

ID=55908738

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480082774.1A Pending CN107073654A (zh) 2014-11-06 2014-11-06 激光加工方法及装置

Country Status (5)

Country Link
JP (1) JP5916962B1 (ja)
KR (1) KR101771885B1 (ja)
CN (1) CN107073654A (ja)
TW (1) TWI586468B (ja)
WO (1) WO2016071986A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480257A (zh) * 2019-07-12 2019-11-22 江苏长龄液压股份有限公司 一种油缸的制造工艺

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7496711B2 (ja) 2020-05-12 2024-06-07 株式会社ディスコ レーザー加工装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326394A (zh) * 1998-11-20 2001-12-12 美国3M公司 掩膜作轨道运动以形成激光烧蚀的特征物
JP2003285179A (ja) * 2002-03-26 2003-10-07 Sumitomo Heavy Ind Ltd レーザ加工方法及び加工装置
JP2004209508A (ja) * 2002-12-27 2004-07-29 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
JP3750388B2 (ja) * 1998-12-21 2006-03-01 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
JP2006082125A (ja) * 2004-09-17 2006-03-30 Mitsubishi Electric Corp 像転写式レーザー加工装置およびその加工方法
CN1761907A (zh) * 2003-03-24 2006-04-19 株式会社尼康 光学元件、光学系统、激光器装置、曝光设备、掩模检测装置和高分子晶体加工设备
CN101035646A (zh) * 2005-06-03 2007-09-12 三菱电机株式会社 激光加工方法以及激光加工装置
WO2014174565A1 (ja) * 2013-04-22 2014-10-30 三菱電機株式会社 レーザ加工装置およびレーザ加工方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3292058B2 (ja) * 1996-10-01 2002-06-17 三菱電機株式会社 レーザ光による配線基板の加工方法及びその装置
JP5062838B2 (ja) 2008-02-29 2012-10-31 パナソニック デバイスＳｕｎｘ株式会社 レーザマーキング装置
US20120187097A1 (en) * 2011-01-25 2012-07-26 Wu Jang-Yie Laser engraver capable of automatic defocusing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326394A (zh) * 1998-11-20 2001-12-12 美国3M公司 掩膜作轨道运动以形成激光烧蚀的特征物
JP3750388B2 (ja) * 1998-12-21 2006-03-01 三菱電機株式会社 レーザ加工方法及びレーザ加工装置
JP2003285179A (ja) * 2002-03-26 2003-10-07 Sumitomo Heavy Ind Ltd レーザ加工方法及び加工装置
JP2004209508A (ja) * 2002-12-27 2004-07-29 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工装置
CN1761907A (zh) * 2003-03-24 2006-04-19 株式会社尼康 光学元件、光学系统、激光器装置、曝光设备、掩模检测装置和高分子晶体加工设备
JP2006082125A (ja) * 2004-09-17 2006-03-30 Mitsubishi Electric Corp 像転写式レーザー加工装置およびその加工方法
CN101035646A (zh) * 2005-06-03 2007-09-12 三菱电机株式会社 激光加工方法以及激光加工装置
WO2014174565A1 (ja) * 2013-04-22 2014-10-30 三菱電機株式会社 レーザ加工装置およびレーザ加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110480257A (zh) * 2019-07-12 2019-11-22 江苏长龄液压股份有限公司 一种油缸的制造工艺
CN110480257B (zh) * 2019-07-12 2020-05-19 江苏长龄液压股份有限公司 一种油缸的制造工艺

Also Published As

Publication number Publication date
TWI586468B (zh) 2017-06-11
TW201620659A (zh) 2016-06-16
KR101771885B1 (ko) 2017-08-25
KR20170031781A (ko) 2017-03-21
WO2016071986A1 (ja) 2016-05-12
JP5916962B1 (ja) 2016-05-11
JPWO2016071986A1 (ja) 2017-04-27

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Application publication date: 20170818