CN107068635B - 半导体热电偶和传感器 - Google Patents

半导体热电偶和传感器 Download PDF

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Publication number
CN107068635B
CN107068635B CN201710055694.2A CN201710055694A CN107068635B CN 107068635 B CN107068635 B CN 107068635B CN 201710055694 A CN201710055694 A CN 201710055694A CN 107068635 B CN107068635 B CN 107068635B
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layer
conductive
conductive layer
conduction
conduction path
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Chinese (zh)
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CN107068635A (zh
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D·T·特瑞福诺夫
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Texas Instruments Inc
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Texas Instruments Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • G01K7/028—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples using microstructures, e.g. made of silicon
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N19/00—Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00

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  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
CN201710055694.2A 2010-03-30 2010-12-23 半导体热电偶和传感器 Active CN107068635B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/750,408 2010-03-30
US12/750,408 US8304851B2 (en) 2010-03-30 2010-03-30 Semiconductor thermocouple and sensor
CN2010800659377A CN102823005A (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Related Parent Applications (1)

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CN2010800659377A Division CN102823005A (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

Publications (2)

Publication Number Publication Date
CN107068635A CN107068635A (zh) 2017-08-18
CN107068635B true CN107068635B (zh) 2020-05-05

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CN201710055694.2A Active CN107068635B (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器
CN2010800659377A Pending CN102823005A (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

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CN2010800659377A Pending CN102823005A (zh) 2010-03-30 2010-12-23 半导体热电偶和传感器

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US (2) US8304851B2 (https=)
JP (1) JP6038771B2 (https=)
CN (2) CN107068635B (https=)
WO (1) WO2011126530A1 (https=)

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* Cited by examiner, † Cited by third party
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FR2973164B1 (fr) * 2011-03-25 2013-04-26 Commissariat Energie Atomique Capteur differentiel de temperature et ses capacites en technologie cmos/bicmos
US10529641B2 (en) * 2016-11-26 2020-01-07 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US10672969B2 (en) 2017-06-29 2020-06-02 Taiwan Semiconductor Manufacturing Co., Ltd. Thermocouple device
US11312621B2 (en) 2018-08-06 2022-04-26 Invensense, Inc. Sensing thermal gradients within a microelectromechanical device
AU2019384823A1 (en) * 2018-11-21 2021-06-03 Mark DERZON Radiation powered high dose rate and high dose radiation sensor
US11635334B2 (en) * 2020-06-30 2023-04-25 Apple Inc. Miniature external temperature sensing device for estimating subsurface tissue temperatures
US11408778B2 (en) 2020-07-21 2022-08-09 Apple Inc. Temperature gradient sensing in portable electronic devices
US11771329B2 (en) 2020-09-24 2023-10-03 Apple Inc. Flexible temperature sensing devices for body temperature sensing
US12575739B2 (en) 2021-09-21 2026-03-17 Apple Inc. Distributed sensor network for measurement of biometric parameter
US12460976B2 (en) * 2022-06-06 2025-11-04 Microchip Technology Incorporated Integrated thermocouple

Citations (2)

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JPS6140523A (ja) * 1984-08-01 1986-02-26 Matsushita Electric Ind Co Ltd 熱電堆型赤外検出素子
CN1463674A (zh) * 2002-06-25 2003-12-31 祥群科技股份有限公司 温度传感器及其运用该温度传感器的指纹辨识晶片

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US3393328A (en) 1964-09-04 1968-07-16 Texas Instruments Inc Thermal coupling elements
US5343064A (en) 1988-03-18 1994-08-30 Spangler Leland J Fully integrated single-crystal silicon-on-insulator process, sensors and circuits
US5059543A (en) 1990-09-21 1991-10-22 The Board Of Regents Acting For And On Behalf Of The University Of Michigan Method of manufacturing thermopile infrared detector
US5689087A (en) 1994-10-04 1997-11-18 Santa Barbara Research Center Integrated thermopile sensor for automotive, spectroscopic and imaging applications, and methods of fabricating same
US5909004A (en) 1996-04-17 1999-06-01 General Electric Company Thermocouple array and method of fabrication
JP2001208606A (ja) * 2000-01-27 2001-08-03 Alps Electric Co Ltd 赤外線センサ
JP2001349787A (ja) 2000-06-06 2001-12-21 Seiko Epson Corp 赤外線検出素子および測温計
JP4009046B2 (ja) 2001-04-10 2007-11-14 浜松ホトニクス株式会社 赤外線センサ
US6531899B1 (en) 2001-12-27 2003-03-11 Texas Instruments Incorporated Integrated differential current comparator with input to output electrical isolation
US6793389B2 (en) 2002-02-04 2004-09-21 Delphi Technologies, Inc. Monolithically-integrated infrared sensor
US6828172B2 (en) 2002-02-04 2004-12-07 Delphi Technologies, Inc. Process for a monolithically-integrated micromachined sensor and circuit
JP2004033610A (ja) * 2002-07-05 2004-02-05 Lightuning Technology Inc 温度差検出セル及びそれを応用した指紋サーモグラフ読み取り装置
US6987223B2 (en) 2002-08-28 2006-01-17 Delphi Technologies, Inc. Heat sink for silicon thermopile
US7042690B2 (en) 2002-12-19 2006-05-09 Texas Instruments Incorporated Power-line, differential, isolation loss detector
US7406185B2 (en) * 2003-04-16 2008-07-29 Ligh Tuning Technology Inc. Thermoelectric sensor for fingerprint thermal imaging
EP1671261A2 (en) * 2003-09-05 2006-06-21 Authentec, Inc. Multi-biometric finger sensor using different biometrics having different selectivities and associated methods
JP2005241457A (ja) * 2004-02-26 2005-09-08 Hamamatsu Photonics Kk 赤外線センサ及びその製造方法
US20070095381A1 (en) 2005-10-28 2007-05-03 Taiwan Semiconductor Manufacturing Co., Ltd. Stacked thermoelectric device for power generation
ATE468615T1 (de) * 2006-07-24 2010-06-15 Fiat Ricerche Vorrichtung zur wandlung von elektromagnetischer strahlung in elektrische energie und korrespondierende wandlungsverfahren
JP2009210289A (ja) * 2008-02-29 2009-09-17 Panasonic Electric Works Co Ltd 赤外線検出システム
US7902625B2 (en) 2008-04-21 2011-03-08 International Business Machines Corporation Metal-gate thermocouple

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6140523A (ja) * 1984-08-01 1986-02-26 Matsushita Electric Ind Co Ltd 熱電堆型赤外検出素子
CN1463674A (zh) * 2002-06-25 2003-12-31 祥群科技股份有限公司 温度传感器及其运用该温度传感器的指纹辨识晶片

Also Published As

Publication number Publication date
CN107068635A (zh) 2017-08-18
US8304851B2 (en) 2012-11-06
JP2013524506A (ja) 2013-06-17
US8802476B2 (en) 2014-08-12
CN102823005A (zh) 2012-12-12
WO2011126530A1 (en) 2011-10-13
JP6038771B2 (ja) 2016-12-07
US20130040413A1 (en) 2013-02-14
US20110241155A1 (en) 2011-10-06

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