CN107004621B - 喷嘴唇口清洗装置及其狭缝式涂抹装置 - Google Patents

喷嘴唇口清洗装置及其狭缝式涂抹装置 Download PDF

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Publication number
CN107004621B
CN107004621B CN201580066153.9A CN201580066153A CN107004621B CN 107004621 B CN107004621 B CN 107004621B CN 201580066153 A CN201580066153 A CN 201580066153A CN 107004621 B CN107004621 B CN 107004621B
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China
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blade
nozzle lip
nozzle
head
unit
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CN201580066153.9A
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English (en)
Chinese (zh)
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CN107004621A (zh
Inventor
朴镐胤
金善勇
李忠翰
具滋贤
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DMS Co Ltd
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DMS Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B08B1/165—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
CN201580066153.9A 2014-12-04 2015-12-03 喷嘴唇口清洗装置及其狭缝式涂抹装置 Active CN107004621B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2014-0172646 2014-12-04
KR1020140172646A KR101578368B1 (ko) 2014-12-04 2014-12-04 노즐립 클리너 및 이를 이용한 슬릿 코터
PCT/KR2015/013149 WO2016089132A1 (ko) 2014-12-04 2015-12-03 노즐립 클리너 및 이를 이용한 슬릿 코터

Publications (2)

Publication Number Publication Date
CN107004621A CN107004621A (zh) 2017-08-01
CN107004621B true CN107004621B (zh) 2020-03-17

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CN201580066153.9A Active CN107004621B (zh) 2014-12-04 2015-12-03 喷嘴唇口清洗装置及其狭缝式涂抹装置

Country Status (3)

Country Link
KR (1) KR101578368B1 (ko)
CN (1) CN107004621B (ko)
WO (1) WO2016089132A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102324882B1 (ko) * 2014-12-08 2021-11-12 주식회사 디엠에스 노즐립 클리너 세정유닛
CN110124920B (zh) * 2019-05-30 2020-07-10 昆山国显光电有限公司 一种喷嘴清洁装置及涂布设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3835549B2 (ja) * 2003-03-07 2006-10-18 株式会社ミヤコシ 潜像保持体クリーニング装置
JP4324538B2 (ja) * 2004-10-04 2009-09-02 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4578381B2 (ja) * 2005-10-19 2010-11-10 東京エレクトロン株式会社 塗布方法及び塗布装置
WO2007099848A1 (ja) 2006-03-02 2007-09-07 Kabushiki Kaisha Toshiba クリーニング装置、クリーニング方法、パターン形成装置、およびパターン形成方法
JP4857193B2 (ja) * 2007-05-28 2012-01-18 大日本スクリーン製造株式会社 ノズル洗浄装置
KR100893670B1 (ko) * 2007-08-10 2009-04-20 주식회사 케이씨텍 노즐 세정장치 및 세정방법
KR100975129B1 (ko) * 2008-06-27 2010-08-11 주식회사 디엠에스 노즐 립 클리너를 구비한 슬릿 코터
JP5258811B2 (ja) * 2010-02-17 2013-08-07 東京エレクトロン株式会社 スリットノズル洗浄装置及び塗布装置
JP5258812B2 (ja) * 2010-02-17 2013-08-07 東京エレクトロン株式会社 スリットノズル清掃装置および塗布装置
KR101328730B1 (ko) * 2012-03-28 2013-11-11 주식회사 디엠에스 슬릿코터

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Publication number Publication date
KR101578368B1 (ko) 2015-12-18
CN107004621A (zh) 2017-08-01
WO2016089132A1 (ko) 2016-06-09

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