CN107001694A - 具有负光弹性常数的聚合材料 - Google Patents
具有负光弹性常数的聚合材料 Download PDFInfo
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- CN107001694A CN107001694A CN201580067469.XA CN201580067469A CN107001694A CN 107001694 A CN107001694 A CN 107001694A CN 201580067469 A CN201580067469 A CN 201580067469A CN 107001694 A CN107001694 A CN 107001694A
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- Prior art keywords
- polymeric material
- polymer
- compound
- organic compound
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- 239000000463 material Substances 0.000 title claims abstract description 61
- 229920000642 polymer Polymers 0.000 claims abstract description 37
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 35
- 238000009835 boiling Methods 0.000 claims abstract description 33
- -1 polycyclic compound Chemical class 0.000 claims abstract description 13
- KGIGUEBEKRSTEW-UHFFFAOYSA-N 2-vinylpyridine Chemical compound C=CC1=CC=CC=N1 KGIGUEBEKRSTEW-UHFFFAOYSA-N 0.000 claims abstract description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 9
- 239000002904 solvent Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 15
- 125000001424 substituent group Chemical group 0.000 claims description 14
- 125000004432 carbon atom Chemical group C* 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 150000002148 esters Chemical group 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- 239000003960 organic solvent Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 150000002016 disaccharides Chemical class 0.000 claims description 7
- LPQOADBMXVRBNX-UHFFFAOYSA-N ac1ldcw0 Chemical compound Cl.C1CN(C)CCN1C1=C(F)C=C2C(=O)C(C(O)=O)=CN3CCSC1=C32 LPQOADBMXVRBNX-UHFFFAOYSA-N 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 150000002195 fatty ethers Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 125000001309 chloro group Chemical group Cl* 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 150000004043 trisaccharides Chemical class 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 abstract 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 38
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 12
- ZFOZVQLOBQUTQQ-UHFFFAOYSA-N Tributyl citrate Chemical compound CCCCOC(=O)CC(O)(C(=O)OCCCC)CC(=O)OCCCC ZFOZVQLOBQUTQQ-UHFFFAOYSA-N 0.000 description 12
- 230000035882 stress Effects 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 229920003228 poly(4-vinyl pyridine) Polymers 0.000 description 7
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 7
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 229910052799 carbon Inorganic materials 0.000 description 6
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 239000003607 modifier Substances 0.000 description 6
- 229920001223 polyethylene glycol Polymers 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical group CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000012528 membrane Substances 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000006467 substitution reaction Methods 0.000 description 5
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 4
- 125000002619 bicyclic group Chemical group 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 3
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000013557 residual solvent Substances 0.000 description 3
- ALKCLFLTXBBMMP-UHFFFAOYSA-N 3,7-dimethylocta-1,6-dien-3-yl hexanoate Chemical compound CCCCCC(=O)OC(C)(C=C)CCC=C(C)C ALKCLFLTXBBMMP-UHFFFAOYSA-N 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 2
- 230000000916 dilatatory effect Effects 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical group CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 229940116333 ethyl lactate Drugs 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 125000003367 polycyclic group Chemical group 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000007764 slot die coating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- OOIBFPKQHULHSQ-UHFFFAOYSA-N (3-hydroxy-1-adamantyl) 2-methylprop-2-enoate Chemical class C1C(C2)CC3CC2(O)CC1(OC(=O)C(=C)C)C3 OOIBFPKQHULHSQ-UHFFFAOYSA-N 0.000 description 1
- DKDKCSYKDZNMMA-UHFFFAOYSA-N (3-hydroxy-1-adamantyl) prop-2-enoate Chemical class C1C(C2)CC3CC1(O)CC2(OC(=O)C=C)C3 DKDKCSYKDZNMMA-UHFFFAOYSA-N 0.000 description 1
- RGCVYEOTYJCNOS-UHFFFAOYSA-N (4-cyano-2-methylphenyl)boronic acid Chemical compound CC1=CC(C#N)=CC=C1B(O)O RGCVYEOTYJCNOS-UHFFFAOYSA-N 0.000 description 1
- BPIUIOXAFBGMNB-UHFFFAOYSA-N 1-hexoxyhexane Chemical compound CCCCCCOCCCCCC BPIUIOXAFBGMNB-UHFFFAOYSA-N 0.000 description 1
- IAAASXBHFUJLHW-UHFFFAOYSA-N 3,5-diethyl-1-phenyl-2-propyl-2h-pyridine Chemical compound C1=C(CC)C=C(CC)C(CCC)N1C1=CC=CC=C1 IAAASXBHFUJLHW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- DRUKNYVQGHETPO-UHFFFAOYSA-N Nonanedioic acid dimethyl ester Natural products COC(=O)CCCCCCCC(=O)OC DRUKNYVQGHETPO-UHFFFAOYSA-N 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- YENIOYBTCIZCBJ-UHFFFAOYSA-N acetic acid;1-methoxypropan-2-ol Chemical class CC(O)=O.COCC(C)O YENIOYBTCIZCBJ-UHFFFAOYSA-N 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- SYDJVRWZOWPNNO-UHFFFAOYSA-N sucrose-benzoate Natural products OCC1OC(OC2(COC(=O)c3ccccc3)OC(CO)C(O)C2O)C(O)C(O)C1O SYDJVRWZOWPNNO-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N tetraethylene glycol Chemical compound OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- 238000003878 thermal aging Methods 0.000 description 1
- 238000002411 thermogravimetry Methods 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/012—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials adapted for magnetic entropy change by magnetocaloric effect, e.g. used as magnetic refrigerating material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/095—Carboxylic acids containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/15—Heterocyclic compounds having oxygen in the ring
- C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/10—Homopolymers or copolymers of methacrylic acid esters
- C09D133/12—Homopolymers or copolymers of methyl methacrylate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D139/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Coating compositions based on derivatives of such polymers
- C09D139/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C09D139/08—Homopolymers or copolymers of vinyl-pyridine
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B30/00—Heat pumps
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/13363—Birefringent elements, e.g. for optical compensation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
- H10N15/20—Thermomagnetic devices using thermal change of the magnetic permeability, e.g. working above and below the Curie point
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/002—Details of machines, plants or systems, using electric or magnetic effects by using magneto-caloric effects
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Abstract
一种具有负光弹性常数的聚合材料。所述聚合材料包含:(a)聚合物,所述聚合物包含2‑乙烯基吡啶聚合单元、4‑乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)C9‑C25脂肪族多环化合物;以及(c)有机化合物,所述有机化合物具有至少200C的沸点。
Description
技术领域
本发明涉及具有负光弹性常数的聚合材料。
背景技术
LCD装置包含如下形成的LC(液晶)单元:布置一对透明衬底,其中提供透明电极以便面向彼此,随后将液晶围封在该对衬底之间。LCD装置已经广泛用于便携式电话、便携式信息终端等,其中期望亮度增强和图像显示质量改进,以及使得LCD装置更轻且更薄。当LCD装置(如智能电话和平板计算机)在完全黑暗的状态下使用时,易于发生漏光,尤其是拐角和边缘周围。一个重要的促成原因怀疑是在LC单元的薄玻璃中应力诱导的双折射。由于附接到显示器的安装结构或由于内部显示器结构,液晶显示器的部分可经受应力。一般来说,玻璃具有正光弹性常数,或Cp。因此,为了补偿玻璃衬底的应力诱导的双折射,需要具有负Cp值的材料作为补偿膜。然而,已知很少材料具有负Cp值,并且已知没有用于设计具有负光弹性特性的材料的原理。在文献中已经有一些研究来检验塑化剂对Cp的影响,例如J.H.Lamble等人,《英国应用物理杂志(Brit.J.Appl.Phys.)》,第9卷,388。然而,此参考文献仅教示由于并入塑化剂而导致的Cp的正改变。
发明内容
本发明提供聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)C9-C25脂肪族多环化合物;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体,其中所述有机化合物不是C9-C25脂肪族多环化合物。
本发明进一步提供聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)式(II)化合物;
其中G表示选自由氟基和氯基组成的群组的1-5个取代基;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体,其中所述有机化合物不是式(II)化合物。
本发明进一步提供聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)具有四到十一个芳香族酯取代基的单糖、二糖或三糖;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体。
本发明进一步提供聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)式(III)化合物;
其中R3和R4独立地表示氢或C1-C6烷基;R5、R6、R7、R8、R9、R10、R11和R12独立地表示氢、羟基、氰基、卤基、C(O)R13或C(O)OR13,其中R13是C1-C6烷基,其条件是R5、R6、R7、R8、R9、R10、R11和R12中的至少一个不是氢;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体。
具体实施方式
除非另外规定,否则百分比是重量百分比(wt%)并且温度以℃为单位。除非另外规定,否则在室温(20℃至25℃)下执行操作。在常压(101kPa)下测量沸点。有机化合物是包含碳原子和氢原子的化合物。优选地,有机化合物包含碳原子、氢原子和氧原子。有机溶剂是包含碳原子和氢原子的化合物,并且所述有机溶剂在20℃下是液体。
通过材料的光弹性常数(Cp)和施加到材料的应力的量(σ)确定光弹性效应诱导的双折射率。通过计算应力诱导的双折射率与在所施加的应力仅诱导材料中小程度弹性变形的条件下在玻璃状材料上施加的应力量值的比率,确定光弹性常数。材料的光弹性双折射率不同于所述材料的本征双折射率(Δn0)。本征双折射率是指当材料完全在一个方向上定向(例如,通过在一个方向上单向地拉伸材料)时材料所展现的双折射的量。正本征双折射率的材料在x方向(材料完全沿其定向)上的折射率(nx)大于在另外两个方向y和z上的折射率ny和折射率nz,其中x、y、z表示彼此相互正交的三个不同的方向。相反,负本征双折射率的材料在x方向(材料完全沿其定向)上的折射率小于在另外两个方向y和z上的折射率。正本征双折射率类型的材料总倾向于是正光弹性类型,然而对于负双折射率类型的材料,它们可是负光弹性类型或正光弹性类型。
光弹性常数是每种材料的本征特性且可具有正值或负值。因此,将材料划分成两组:具有正光弹性常数的一组和具有负光弹性常数的另一组。当具有正光弹性常数的材料沿x方向经受小程度的单向张应力时,所述材料倾向于展现正双折射率(即,nx>ny)。相反,当具有负光弹性常数的材料沿x方向经受小程度的单向张应力时,所述材料将展现负双折射率(即,nx<ny)。
延迟是薄片材料中双折射率的度量。其被定义为Δn与薄片的厚度的乘积,其中Δn是nx与ny之间的差值的绝对值。
优选地,C9-C25脂肪族多环化合物仅含有碳原子、氢原子和氧原子;优选地不超过六个氧原子,优选地不超过四个。优选地,C9-C25脂肪族多环化合物是桥连多环化合物;优选地双环化合物、三环化合物或四环化合物;这些化合物可被烷基、烷氧基或羟基(优选地甲基和/或羟基)取代;或其可未被取代。优选地,脂肪族多环化合物具有10到20个碳原子。优选地,C9-C25脂肪族多环化合物包含键结到C2-C8非环状脂肪族取代基的C6-C20脂肪族多环取代基。优选地,C2-C8非环状脂肪族取代基包含一到四个氧原子;优选地至少两个,优选地不超过三个。优选地,非环状脂肪族取代基具有三到六个碳原子。优选地,非环状脂肪族取代基具有至少一个酯基。优选地,脂肪族多环取代基通过酯氧键结到非环状脂肪族取代基。优选地,脂肪族多环取代基具有8到12个碳原子。优选地,脂肪族多环取代基是桥连多环取代基,优选地双环取代基、三环取代基或四环取代基。优选地,C9-C25脂肪族多环化合物是式(I)化合物
其中R1是氢或甲基,并且R2是未被取代的或具有丙烯酸酯或甲基丙烯酸酯取代基的C6-C20脂肪族多环取代基。优选地,R2是C7-C15脂肪族多环取代基,优选地,R2是C8-C12脂肪族多环取代基。优选地,R2是桥连多环取代基;优选地双环取代基、三环取代基或四环取代基。R2的优选的结构包括例如金刚烷、双环[2,2,1]烷烃、双环[2,2,2]烷烃、双环[2,1,1]烷烃;这些结构可被烷基、烷氧基或羟基(优选地甲基和/或羟基)取代。金刚烷和双环[2,2,1]烷烃是尤其优选的。优选地,R1是甲基。优选地,R2未被取代。
优选地,式(II)中的G表示两到四个取代基,优选地两个或三个,优选地三个。优选地,G表示氟基或氯基,优选地氟基。
优选地,具有四到十一个芳香族酯取代基的单糖、二糖或三糖是单糖或二糖,优选地二糖。优选地,单糖或二糖具有三到八个芳香族酯取代基,优选地五到八个,优选地六到八个。优选地,单糖具有三个或四个芳香族酯取代基,优选地四个。优选地,芳香族芳香族取代基具有7到20个碳原子,优选地7到15个,优选地7到10个。优选地,芳香族酯取代基是可被取代或未被取代的苯甲酸酯取代基;被取代的苯甲酸酯可被C1-C4烷基、羟基或C1-C4烷氧基取代。
优选地,R3和R4独立地表示氢或C1-C4烷基;优选地氢、甲基或乙基;优选地氢或甲基。优选地,R5、R6、R7、R8、R9、R10、R11和R12独立地表示氢、羟基或氰基。
优选地,通过自由基溶液聚合制备共聚物。全部基于聚苯乙烯当量分子量,共聚物的重均分子量(Mw)大于50,000g/mol,优选地大于75,000g/mol,甚至更优选地大于100,000g/mol。Mw小于50,000g/mol的共聚物太脆以致于不能实际地用于许多光学应用。
优选地,具有至少200℃的沸点的有机化合物仅含有碳原子、氢原子和氧原子。优选地,有机化合物是脂肪族醚或脂肪族酯。优选地,脂肪族醚具有至少一个羟基,优选地一个或两个。优选地,有机化合物具有4到40个碳原子;优选地至少5个,优选地至少6个;优选地至少7个;优选地不超过35个,优选地不超过30个,优选地不超过25个,优选地不超过20个,优选地不超过15个。优选地,当有机化合物具有超过20个碳原子时,其也具有超过10个氧原子;优选地至少8个氧原子存在于醚键中;优选地有机化合物是乙二醇的寡聚物。当脂肪族醚是例如乙二醇的寡聚物时,碳原子的数目是寡聚物中的平均数目。优选地,脂肪族醚具有2到12个氧原子,优选地2到10个,优选地3到6个,所述氧原子可作为醚氧、酯氧或羟基存在。尤其优选的有机化合物包括柠檬酸三正丁酯TnBC、己基卡比醇、己基溶纤剂、三乙二醇(TEG)、四乙二醇和具有200到800的数均分子量的聚乙二醇(例如,CARBOWAX聚乙二醇)。优选地,有机化合物具有至少200℃的沸点;优选地不大于350℃,优选地不大于320℃。优选地,有机化合物在80℃下是液体,优选地在60℃下是液体,优选地在40℃下是液体,优选地在30℃下是液体。优选地,聚合材料中有机化合物的量为至少3wt%,优选地至少4wt%,优选地至少5wt%,优选地至少6wt%,优选地至少7wt%;优选地不超过12wt%,优选地不超过11wt%,优选地不超过10wt%,优选地不超过9wt%。优选地,聚合材料中共聚物的量为至少70wt%,优选地至少75wt%,优选地至少80wt%;优选地不超过97wt%,优选地不超过96wt%,优选地不超过95wt%,优选地不超过94wt%,优选地不超过93wt%。在本发明的一个优选的实施例中,有机化合物是有机溶剂。
优选地,通过将共聚物和添加剂分子(即,组分(b))与极性低沸点的溶剂和前述具有至少200℃的沸点的(一种或多种)有机化合物掺合制备聚合材料。优选地,低沸点的溶剂具有35℃到140℃的沸点,优选地45℃到120℃,优选地50℃到110℃。优选地,低沸点的溶剂是酒精、酯或酮。优选的低沸点的溶剂包括乙醇、1-丁醇、环戊酮和乳酸乙酯。优选地,共聚物、添加剂分子和溶剂(低沸点的溶剂和具有bp>200℃的有机化合物)的混合物包含2wt%到20wt%的具有至少200℃的沸点的有机化合物和30wt%到75wt%的低沸点的溶剂,优选地3wt%到10wt%的具有至少200℃的沸点的有机溶剂和35wt%到70wt%的低沸点的溶剂优选地,在流延之后湿膜干燥,优选地在50℃到120℃的温度下干燥。
优选地,对于至少部分的干燥时间,湿膜处于真空下,以促进低沸点溶剂的去除。优选地,去除低沸点的溶剂的初始量的至少90%,优选地至少95%,优选地至少98%,优选地至少99%。
通过使用本领域中熟知的任何合适的涂布工艺,可将共聚物和溶剂的混合物涂布到玻璃衬底(例如,液晶显示器(LCD)单元的表面)上以抑制漏光。举例来说,可以通过浸渍涂布、旋转涂布或狭缝模具式涂布将聚合材料涂布到玻璃上。狭缝模具式涂布工艺因其涂布面积、涂布厚度和均一性相对容易控制而更优选。聚合材料层的厚度的优选范围是小于100μm,优选地小于50μm,优选地小于25μm;优选地大于1μm,优选地大于5μm,甚至更优选地大于10μm。因为消费者偏好较薄的电子装置,所以当此类聚合材料的厚度大于100μm时是不期望的。相反,当涂层的厚度小于1μm时,其在应力下光学补偿玻璃双折射率的效应非常有限。
玻璃薄片的厚度的优选的范围是0.1mm到0.7mm,优选地0.2mm到0.5mm。当玻璃衬底的厚度大于0.7mm时,光学涂层的效应可不够强并且这还将增加装置的厚度。当玻璃衬底小于0.1mm时,其物理刚性对于装置制造是有问题的。
实例
聚(2-乙烯基吡啶)、聚(4-乙烯基吡啶)、柠檬酸三正丁酯(TnBC)、磷酸三苯酯、邻苯二甲酸二乙酯、邻苯二甲酸二己酯、邻苯二甲酸二(2-乙基己基)酯、邻苯二甲酸二环己酯、癸二酸二(2-乙基己基)酯、壬二酸二(2-乙基己基)酯、壬二酸二甲酯、己二酸二异癸酯、顺丁烯二酸二(2-乙基己基)酯得自科学聚合物产品公司(Scientific PolymerProducts)。3-羟基-1-金刚烷基甲基丙烯酸酯(HAMA)得自出光兴产(Idemitsu)。异冰片基甲基丙烯酸酯(IBOMA)、1-丁醇、乳酸乙酯、环己酮、环戊酮、甲醇、乙醇(EtOH)、丙二醇甲醚乙酸酯(PGMEA)购自西格玛-阿尔德里奇公司(Sigma-Aldrich)。1-甲氧基-2-丙醇(PGME)、己基溶纤剂、己基卡比醇、三乙二醇得自陶氏化学公司(The Dow Chemical Company)。
通过使用byko-drive自动涂膜器利用拖拉杆以典型的10mm/sec的拖拉速度将溶液流延在玻璃衬底上的剥离纸上来制备膜。为基于其固体wt%的不同的调配物和目标干膜厚度调节杆间隙。对于制备独立式膜样品,在Warren Universal Patent剥离纸上拖拉液体调配物涂层,并且在涂层完全干燥后将膜剥离。
由作为流延溶剂的环戊酮和1-丁醇制备包含80wt%聚(2-乙烯基吡啶)(P2VP)和20wt%HAMA(1-羟基-3-金刚烷基甲基丙烯酸酯)的两组复合膜。通过在用PDMS-brush聚合物(材料源)预处理的2×6英寸(5.1×15.2cm)和0.5mm厚的玻璃板上拖拉24密耳厚的溶液制备膜。一组材料在真空下75摄氏度烘烤19hr,并且另一组经受在95摄氏度下72hr的附加的烘烤以进一步去除膜样品中的残余溶剂。
在大约1"×3"(2.54×7.62cm)大小的干膜样本上进行光弹性特性测量。膜样本安装在附接到EXICOR 150AT双折射率测量系统(Hinds Instruments)的定制单向抗张拉伸平台上。在同时拉伸膜时,在546纳米(nm)的波长下在膜的中间区域附近测量作为单向拉伸力的函数的膜的光学迟延。手动地控制力并且通过连接到样品安装夹具中的一个的力转换器(OMEGA DFG41-RS)记录力。施加到测试样本的最大力为大约10牛顿至15牛顿。通过用测量的迟延除膜厚度获得膜双折射率。光弹性常数或应力光学系数Cp等于根据线性拟合作为单向张应力的函数的测量的双折射率确定的斜率并且以Pa-1为单位报道。以下示出结果(在整个实例中使用Brewster单位;1Br=10-12Pa-1)。在去除膜中的残余溶剂后,发现在约8.4Brewster单位下此P2VP-HAMA膜的Cp值接近纯P2VP的Cp值。
在热老化之后,所观测到的光弹性特性从负向正的改变是不期望的。然而,发现并入具有较高沸点的有机化合物对在高温下烘烤之后保持材料的大的负Cp特性出人意料地有效。溶剂体系包含更容易去除溶剂的低沸点的高相对蒸发速率(RER)占多数的溶剂,以及将大部分保留在最终膜中的高沸点的低RER占少数的溶剂。具有78℃的沸点和150的RER(相对于乙酸正丁酯)的乙醇用作占多数的溶剂。三种高沸点溶剂:己基溶纤剂(乙二醇单正己基醚)、己基卡比醇(二乙二醇单正己基醚)和三乙二醇用作占少数的溶剂。
使用利用24密耳杆(106μm的理论FT)的拖拉杆涂布机制备独立式膜。将膜在75℃下烘烤过夜,随后在真空下在95℃再烘烤3小时,以去除乙醇共溶剂。对在包括高沸点溶剂的溶剂体系中制备的P2VP-20wt%HAMA膜测量光弹性常数或Cp。作为参考点,由纯乙醇流延成的P2VP-20wt%HAMA具有+8.42Br的Cp,所述Cp值非常接近纯P2VP的Cp。三组分体系的Cp在以下列表作为复合膜Tg的函数和膜中残余溶剂的量的函数(通过热解重量分析确定)。并入三乙二醇(TEG)导致在-597.57Br.下最大的Cp减小。
实例1至实例5和对比实例C1
(注意:表1中的数据表明并入高沸物TEG作为聚合物改性剂对P2VP聚合物的光弹性特性和Tg的影响)
表1.关于P2VP聚合物的光弹性特性的具有和不具有聚合物改性剂的调配物的实例
实例6至实例9和对比实例C2
如实例1至实例5和C1中所示的完成,但是利用不同的基质聚合物(P4VP)。结果概括在表2中,其示出并入聚合物改性剂TEG产生具有负光弹性特性的膜。
表2.关于P4VP聚合物的光弹性特性的具有和不具有聚合物改性剂的调配物的实例
实例10至实例11和对比实例C3至对比实例C8
如实例1至实例5和C1中所示的完成,但是利用不同基质聚合物(P4VP)和聚合物改性剂。结果概括在表3中,其示出并入聚合物改性剂和光弹性(PE)添加剂可在S-r-2VP共聚物、S-r-MMA共聚物中产生负光弹性性能,但是不在PMMA均聚物中产生负光弹性性能,表明基质聚合物优选地需要具有大生色团,如挂在聚合物链的侧基上的苯或吡啶环。
表3.关于各种聚合物的光弹性特性的具有和不具有聚合物改性剂的调配物的实例
此结果指示通过适当地挑选构成比率,可调整复合物体系的Cp和Tg性能。由3组分体系提供的调配物的灵活性允许大的设计空间,以在大的负Cp和在高温下的良好的热稳定性之间寻找合宜的平衡。
将其它化合物和溶剂并入膜中,如以下表中所示:
1. 1-羟基-3-金刚烷基丙烯酸酯
对于此表中的所有样品,聚合物+添加剂=35份数,并且全部溶剂=65份数
“蔗糖苯甲酸酯”是具有八个苯甲酸取代基的蔗糖
聚合物 | 份数 | 添加剂化合物 | 份数 | 溶剂,在聚合物中的wt% | Cp |
P4VP | 80 | HAMA | 20 | EtOH/CW 200,5 | -52.6 |
P4VP | 80 | HAMA | 20 | EtOH/CW 400,5 | -61.5 |
P4VP | 80 | HAMA | 20 | EtOH/CW 600,5 | -54.3 |
P2VP | 80 | HAMA | 20 | EtOH/TnBC,10 | -23.0 |
P2VP | 90 | HAMA | 10 | EtOH/TnBC,20 | -83.1 |
P2VP | 80 | HAMA | 20 | EtOH/Hex Carb,10 | -427.2 |
P2VP | 80 | HAMA | 20 | EtOH/Hex Cell,10 | -254.2 |
CW=CARBOWAX聚乙二醇;Hex Carb=己基卡比醇;Hex Cell=己基溶纤剂。
Claims (9)
1.一种聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)C9-C25脂肪族多环化合物;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点。在100℃下是液体
2.根据权利要求1所述的聚合材料,其中R2是桥连多环取代基。
3.一种聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)式(II)化合物;
其中G表示选自由氟基和氯基组成的群组的1至5个取代基;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体,其中所述有机化合物不是式(II)化合物。
4.根据权利要求3所述的聚合材料,其中G表示氟基。
5.一种聚合材料,所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)具有四到十一个芳香族酯取代基的单糖、二糖或三糖;以及(c)有机溶剂,所述有机溶剂具有至少200℃的沸点,在100℃下是液体。
6.根据权利要求5所述的聚合材料,其中组分(b)是二糖。
7.根据权利要求2所述的聚合材料,其中所述共聚物包含75wt%到85wt%的2-乙烯基吡啶聚合单元和15wt%到25wt%的式(I)化合物聚合单元。
8.根据权利要求7所述的聚合材料,其中所述有机溶剂是具有5到15个碳原子和2到5个氧原子的脂肪族醚。
9.一种用于生产具有负光弹性常数的聚合材料的方法;所述聚合材料包含:(a)聚合物,所述聚合物包含2-乙烯基吡啶聚合单元、4-乙烯基吡啶聚合单元、甲基丙烯酸甲酯聚合单元或其组合;(b)C9-C25脂肪族多环化合物;以及(c)有机化合物,所述有机化合物具有至少200℃的沸点,在100℃下是液体;所述方法包含以下步骤:(i)将所述聚合物和所述C9-C25脂肪族多环化合物与具有35℃到140℃的沸点的第一溶剂和具有至少200℃的沸点的前述有机溶剂掺合以生产湿聚合材料;(b)将所述湿聚合材料涂布在玻璃衬底上;以及(c)加热到50℃到120℃的温度以去除至少90%的所述第一溶剂。
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US11233254B2 (en) | 2016-02-22 | 2022-01-25 | Battelle Memorial Institute | Process for delivering liquid H2 from an active magnetic regenerative refrigerator H2 liquefier to a liquid H2 vehicle dispenser |
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