CN106976172B - Intelligent silicon ingot cutting system - Google Patents
Intelligent silicon ingot cutting system Download PDFInfo
- Publication number
- CN106976172B CN106976172B CN201710339815.6A CN201710339815A CN106976172B CN 106976172 B CN106976172 B CN 106976172B CN 201710339815 A CN201710339815 A CN 201710339815A CN 106976172 B CN106976172 B CN 106976172B
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- driving
- cutting
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- take
- driving piece
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention discloses an intelligent silicon ingot cutting system which comprises a plurality of silicon ingot cutting machines, intelligent mechanical arms, a raw material and waste material conveying line and a finished product conveying line, wherein the silicon ingot cutting machines are regularly or irregularly distributed, and the intelligent mechanical arms, the raw material and waste material conveying line and the finished product conveying line are arranged in the center of the silicon ingot cutting machines.
Description
Technical Field
the invention relates to the field of silicon ingot cutting equipment, in particular to an intelligent silicon ingot cutting system.
Background
When a silicon rod grown from single crystal silicon is changed into a silicon wafer, both ends of the silicon ingot are required to be uneven by cutting and processing the silicon rod into a cubic body, so that both ends of the silicon ingot need to be cut and leveled by an intelligent silicon ingot cutting system. When the intelligent silicon ingot cutting system is used for cutting the silicon ingot at present, lines to be cut need to be drawn on the silicon ingot in advance, the silicon ingot is sequentially placed on the working platform by an operator, then cutting lines on the intelligent silicon ingot cutting system are aligned, then the intelligent silicon ingot cutting system is used for cutting, and after one end of the silicon ingot is cut, the operator adjusts the silicon ingot and aligns the cutting lines on the intelligent silicon ingot cutting system for cutting. The existing silicon ingot cutting machine has the following defects:
1. Each time the intelligent silicon ingot cutting system cuts silicon ingots, the intelligent silicon ingot cutting system needs to be replaced by operators, and the efficiency is low;
2. an operator aligns the cutting line on the intelligent silicon ingot cutting system opposite to the line drawn on the silicon ingot, and the silicon ingot is easily out of plumb after being cut due to manual operation;
3. Silicon ingots are very heavy, and physical strength is very high when operators move the silicon ingots.
Disclosure of Invention
In order to solve the problems, the invention aims to provide an intelligent silicon ingot cutting system which is reasonable in structure, high in working efficiency, high in yield, time-saving, labor-saving and high in automation degree.
According to one aspect of the invention, an intelligent silicon ingot cutting system is provided and comprises a silicon ingot cutting machine, a plurality of intelligent mechanical arms, a raw material and waste material conveying line and a finished product conveying line, wherein the silicon ingot cutting machine is regularly or irregularly distributed, the intelligent mechanical arms, the raw material and waste material conveying line and the finished product conveying line are arranged in the center of the silicon ingot cutting machine, the silicon ingot cutting machine comprises a rack and a take-up and pay-off device arranged on the rack, the winding and unwinding device is connected with the cutting device through a cutting line, the cutting device is arranged right above the rotary working platform, the rotary working platform comprises a body, a lifting driving mechanism, a connecting mechanism and a rotary driving mechanism, a clamp is arranged on the upper end face of the body, the lifting driving mechanism is arranged on the lower end face of the body, and the lifting driving mechanism is connected with the rotary driving mechanism through the connecting mechanism;
The lifting driving mechanism comprises a first driving piece, a second driving piece and a rotating shaft, the first driving piece drives the second driving piece to ascend or descend, the second driving piece is connected with the body, the rotating shaft penetrates through the first driving piece and is fixedly connected with the second driving piece, the rotating shaft is connected with the rotating driving mechanism, and the ascending of the body is convenient to realize through the first driving piece;
The axis of rotation drives the second driving piece rotatory after first driving piece drive second driving piece lifting, after first driving piece drive second driving piece descends, first driving piece and second driving piece block are guaranteed that the second driving piece is static fixed, cut when lifting actuating mechanism rises, the silicon ingot of opposite side can be through changing of manual work or manipulator when the cutting, one side cuts off the silicon ingot that finishes the opposite side and has changed through rotatory actuating mechanism rotation 180, connect production efficiency height like this, save time.
In some embodiments, the two end sleeves of the rotating shaft are provided with the connecting mechanism, the connecting mechanism comprises a first bearing and a second bearing, the first bearing is fixed on the first driving piece, the rotating shaft is fixed through the two groups of bearings, so that the rotating shaft is more stable, and the driving body is driven to rotate more labor-saving.
In some embodiments, the take-up and pay-off device comprises a first take-up and pay-off mechanism and a second take-up and pay-off mechanism, the first take-up and pay-off mechanism and the second take-up and pay-off mechanism are connected with a cutting device through a cutting line, the first take-up and pay-off mechanism and the second take-up and pay-off mechanism are identical in structure, and the cutting line is driven to cut a silicon ingot through the simultaneous forward and reverse rotation of the two sets of take-up and pay-off mechanisms.
In some embodiments, the first take-up and pay-off mechanism includes a first motor, a take-up and pay-off roller, a linear rail, a lead screw nut seat, a second motor, a first mounting seat and a slider, the first motor is connected with the take-up and pay-off roller, the first motor and the take-up and pay-off roller are fixed on the first mounting seat, the slider is sleeved on the linear rail, the lead screw is installed in the lead screw nut seat, the lead screw is connected with the second motor, the first mounting seat is installed on the lead screw nut seat and the slider, the second motor drives the first mounting seat to do linear reciprocating motion on the linear rail, the take-up and pay-off roller is driven to move by the second motor, the cutting lines are prevented from being stacked.
In some embodiments, the cutting device comprises a lifting component, a cutting frame and a wire wheel, the lifting component drives the cutting frame to move up and down above the rotary working platform, the wire wheel is installed on the cutting frame and connected with the first wire winding and unwinding mechanism and the second wire winding and unwinding mechanism through a cutting wire, and the lifting component drives the cutting wire to move up and down to cut the silicon ingot.
In some embodiments, the rotation driving mechanism includes a third motor, a second mounting seat, a first driving wheel, a second driving wheel and a driving chain, the third motor is fixed on the second mounting seat, the first driving wheel is connected to an output shaft of the third motor, the second driving wheel is sleeved on the rotation shaft, the driving chain is connected with the first driving wheel and the second driving wheel, and the rotation of the body for 180 ° is realized through the rotation driving mechanism.
In some embodiments, the two groups of clamps are arranged, so that 2 groups of silicon ingots can be clamped simultaneously, and the improvement of the production efficiency is facilitated.
In some embodiments, the robotic arm includes a manipulator, a rotation mechanism, and an image contrast mechanism capable of driving the manipulator and the rotation mechanism to grasp semi-finished products from the raw and waste conveyor lines, place them on the rotating work platform, and grasp finished products onto the finished product conveyor line, and the manipulator is capable of grasping waste onto the raw and waste conveyor lines.
Drawings
Fig. 1 is a schematic structural diagram of an intelligent silicon ingot cutting system according to the present invention;
FIG. 2 is a schematic structural diagram of a silicon ingot cutting machine of the intelligent silicon ingot cutting system of the present invention;
Fig. 3 is a perspective view showing the construction of a silicon ingot cutter of the intelligent silicon ingot cutting system according to the present invention;
FIG. 4 is a schematic structural diagram of a rotary working platform of the intelligent silicon ingot cutting system of the present invention;
FIG. 5 is a sectional view taken along line A-A of FIG. 4;
Fig. 6 is a schematic structural diagram of a robot arm of the intelligent silicon ingot cutting system according to the present invention.
Detailed Description
The present invention will be further described with reference to the following embodiments.
As shown in fig. 1, the intelligent silicon ingot cutting system according to the present invention includes a silicon ingot cutting machine 1, an intelligent mechanical arm 2, a raw material and waste material conveying line 3 and a finished product conveying line 4, wherein the silicon ingot cutting machine 1 is provided with a plurality of silicon ingot cutting machines 1, the silicon ingot cutting machines 1 are regularly or irregularly distributed, and the intelligent mechanical arm 2, the raw material and waste material conveying line 3 and the finished product conveying line 4 are provided in the center of the silicon ingot cutting machine 1.
As shown in fig. 2, the silicon ingot cutting machine 1 includes a frame 11, and a take-up and pay-off device 12, a cutting device 13 and a rotary work platform 14 which are mounted on the frame 11, wherein the take-up and pay-off device 12 is connected with the cutting device 13 through a cutting line 15, and the cutting device 13 is disposed right above the rotary work platform 14. The cutting line 15 is used for cutting the silicon ingot by using a diamond wire, and the purpose of cutting is achieved by forming a relative grinding motion between the diamond wire and the cut object.
as shown in fig. 3, the take-up and pay-off device 12 includes a first take-up and pay-off mechanism 121 and a second take-up and pay-off mechanism 122, the first take-up and pay-off mechanism 121 and the second take-up and pay-off mechanism 122 are connected to the cutting device 13 through the cutting line 15, the first take-up and pay-off mechanism 121 and the second take-up and pay-off mechanism 122 have the same structure, and the two sets of take-up and pay-off mechanisms rotate forward and backward at the same time to drive the cutting line to cut.
The first wire winding and unwinding mechanism 121 comprises a first motor 1211, a wire winding and unwinding roller 1212, a wire rail 1213, a lead screw 1214, a lead screw nut seat 1215, a second motor 1216, a first mounting seat 1217 and a slider 1218, wherein the first motor 1211 is connected with the wire winding and unwinding roller 1212, the first motor 1211 and the wire winding and unwinding roller 1212 are fixed on the first mounting seat 1217, the slider 1218 is sleeved on the wire rail 1213, the lead screw 1214 is mounted in the lead screw nut seat 1215, the lead screw 1214 is connected with the second motor 1216, the first mounting seat 1217 is mounted on the lead screw nut seat 1215 and the slider 1218, the second motor 1216 drives the first mounting seat 1217 to perform linear reciprocating motion on the wire rail 1213, the wire winding and unwinding roller is driven by the second motor 1216 to move, the cutting wires 15 are prevented from being stacked, and the diamond wire chamber bonds diamond wires to the diamond wires, and the stacking can cause diamond grains 5 on the cutting wires to fall to affect.
The cutting device 13 includes a lifting member 131, a cutting frame 132 and a wire guide wheel 133, wherein the lifting member 131 drives a screw rod through a motor, and further drives a slider to move on a linear rail to realize up-and-down reciprocating movement. The lifting component 131 drives the cutting frame 132 to move up and down above the rotary working platform 14, the cutting frame 132 is provided with a plurality of wire guiding wheels 133, the wire guiding wheels 133 are connected with the first take-up and pay-off mechanism 121 and the second take-up and pay-off mechanism 122 through the cutting wire 15, and the lifting component 131 drives the cutting wire 15 to move up and down to cut the silicon ingot.
As shown in fig. 4, the rotary working platform 14 includes a body 141, a lifting driving mechanism 142, a connecting mechanism 143, and a rotary driving mechanism 144, where the upper end surface of the body 141 is provided with two sets of clamps 1411, and the clamps 1411 are convenient to clamp 2 sets of silicon ingots simultaneously, and each set of clamps 1411 clamps 4 to 8 silicon ingots, which is beneficial to improving the production efficiency. The lifting driving mechanism 142 is installed on the lower end face of the body 141, the lifting driving mechanism 142 is connected with the rotating driving mechanism 144 through the connecting mechanism 143, cutting is conducted when the lifting driving mechanism 142 descends, silicon ingots on the other side can be replaced manually or through a mechanical arm while cutting is conducted, the silicon ingots on the other side are cut off on one side, the silicon ingots on the other side are replaced, the silicon ingots are rotated by 180 degrees through the rotating driving mechanism, production efficiency is high, and time is saved.
As shown in fig. 5, the lifting driving mechanism 142 includes a first driving member 1421, a second driving member 1424 and a rotating shaft 1422, the first driving member 1421 drives the second driving member 1424 to ascend or descend, the second driving member 1424 is connected to the body 141, the rotating shaft 1422 passes through the first driving member 1421 and is fixedly connected to the second driving member 1424, the rotating shaft 1422 is connected to the rotating driving mechanism 144, and the first driving member 1421 facilitates the ascending of the body. The first driving member 1421 may adopt a pneumatic or hydraulic driving mechanism, which may be determined according to whether the intelligent silicon ingot cutting system adopts a pneumatic system or a hydraulic system, and the first driving member 1421 drives the second driving member 1424 to be lifted, and then the second driving member 1424 may be driven to rotate by the rotating shaft 1422; after the first driving member 1421 drives the second driving member 1424 to descend, the first driving member 1421 and the second driving member 1424 are engaged to ensure that the second driving member 1424 is stationary and fixed.
The axis of rotation 1422 both ends cover is equipped with coupling mechanism 143, and coupling mechanism 143 includes first bearing 1423 and second bearing 1431, and first bearing 1423 is fixed on first driving piece 1421, is convenient for make axis of rotation 1422 more stable through the fixed axis of rotation 1422 of two sets of bearings, and it is more laborsaving to drive the body rotation simultaneously.
The rotary driving mechanism 144 includes a third motor 1441, a second mounting seat 1442, a first driving wheel 1443, a second driving wheel 1444 and a driving chain 1445, the third motor 1441 is fixed on the second mounting seat 1442, an output shaft of the third motor 1441 is connected with the first driving wheel 1443, the second driving wheel 1444 is sleeved on the rotating shaft 1422, the driving chain 1445 is connected with the first driving wheel 1443 and the second driving wheel 1444, and the rotation of the body 1 by 180 ° is realized by the rotary driving mechanism 144. The 180 ° rotation of the body 141 can be achieved by providing a proximity switch on the rotation shaft 1422, and the 180 ° rotation of the body 141 can also be achieved by providing the third motor 1441 as a servo motor through the quasi-stop of the spindle.
As shown in fig. 6, the robot arm 2 includes a robot arm 21, a rotation mechanism 22, and an image comparison mechanism 23, the image comparison mechanism 23 can drive the robot arm 21 and the rotation mechanism 22 to grasp the semi-finished products from the raw material and waste material conveying line 3, place the semi-finished products on the rotary work platform 14, and grasp the finished products to the finished product conveying line 4, and the robot arm 21 can grasp the waste materials to the raw material and waste material conveying line 3. The image contrasting means 23 is able to identify the manually drawn lines on the ingot and control the robot arm 21 to place the semifinished ingot on the rotary work platform 14 and to align the cutting lines 15. Meanwhile, for the silicon ingot which is cut and processed, the mechanical arm 21 grabs the finished product to the finished product conveying line 4 to convey the waste raw material and the waste material conveying line 3, and automation of the whole set of procedures is realized.
When the cutting machine is specifically implemented, firstly, silicon ingots with drawn lines are sequentially arranged on the raw material and waste material conveying line 3 by an operator, the image contrast mechanism 23 can identify lines manually drawn on the silicon ingots, the manipulator 21 is controlled to place semi-finished silicon ingots on the rotary working platform 14 and align with the cutting line 15, the first take-up and pay-off mechanism 121 and the second take-up and pay-off mechanism 122 drive the cutting line 15 to rotate, the lifting component 131 drives the cutting frame 132 to descend to drive the cutting line 15 to move downwards to cut the silicon ingots, after the cutting is completed, the lifting component 131 drives the cutting frame 132 to ascend to drive the cutting line 15 to move upwards, the first driving component 1421 drives the body 141 to ascend, the third motor 1441 drives the first driving wheel 1443 to rotate, the second driving wheel 1444 and the rotating shaft 1422 to rotate, and finally the body 141 is rotated by; finally, after the body 141 rotates 180 °, the first driving member 1421 drives the body 141 to descend, and then the silicon ingot is cut by the cutting line 15, and so on. Make full use of intelligence silicon bulk cutting system adjusts or changes the silicon bulk at the time to the silicon bulk cutting, finally reaches work efficiency height, yield height, labour saving and time saving's beneficial effect.
The foregoing describes only some embodiments of the present invention and modifications and variations thereof will be apparent to those skilled in the art without departing from the spirit and scope of the invention.
Claims (8)
1. Intelligence silicon bulk cutting system, its characterized in that, including silicon bulk cutter (1), intelligent arm (2), raw materials and waste material transfer chain (3) and finished product transfer chain (4), silicon bulk cutter (1) is equipped with a plurality ofly, silicon bulk cutter (1) rule or irregular distribution, silicon bulk cutter (1) central authorities are equipped with intelligent arm (2), raw materials and waste material transfer chain (3) and finished product transfer chain (4), silicon bulk cutter (1) is including frame (11) and install receive and release line device (12), cutting device (13) and rotatory work platform (14) on frame (11), receive and release line device (12) and be connected with cutting device (13) through line of cut (15), cutting device (13) set up directly over rotatory work platform (14), rotatory work platform (14) include body (141), The lifting mechanism comprises a lifting driving mechanism (142), a connecting mechanism (143) and a rotating driving mechanism (144), wherein a clamp (1411) is arranged on the upper end face of the body (141), the lifting driving mechanism (142) is arranged on the lower end face of the body (141), and the lifting driving mechanism (142) is connected with the rotating driving mechanism (144) through the connecting mechanism (143);
the lifting driving mechanism (142) comprises a first driving piece (1421), a second driving piece (1424) and a rotating shaft (1422), the first driving piece (1421) drives the second driving piece (1424) to ascend or descend, the second driving piece (1424) is connected with the body (141), the rotating shaft (1422) penetrates through the first driving piece (1421) and is fixedly connected with the second driving piece (1424), and the rotating shaft (1422) is connected with the rotating driving mechanism (144);
The first driving piece (1421) drives the second driving piece (1424) to be lifted, then the rotating shaft (1422) drives the second driving piece (1424) to rotate, after the first driving piece (1421) drives the second driving piece (1424) to be descended, the first driving piece (1421) and the second driving piece (1424) are clamped to ensure that the second driving piece (1424) is fixed statically.
2. The system for cutting off the intelligent silicon ingot according to claim 1, wherein a connecting mechanism (143) is sleeved on two ends of the rotating shaft (1422), the connecting mechanism (143) comprises a first bearing (1423) and a second bearing (1431), and the first bearing (1423) is fixed on the first driving member (1421).
3. The system for cutting off the intelligent silicon ingot according to claim 1, wherein the take-up and pay-off device (12) comprises a first take-up and pay-off mechanism (121) and a second take-up and pay-off mechanism (122), the first take-up and pay-off mechanism (121) and the second take-up and pay-off mechanism (122) are connected with the cutting device (13) through a cutting line (15), and the first take-up and pay-off mechanism (121) and the second take-up and pay-off mechanism (122) are identical in structure.
4. The system of claim 3, wherein the first take-up and pay-off mechanism (121) comprises a first motor (1211), a take-up and pay-off roller (1212), a wire track (1213), a lead screw (1214), a lead screw nut seat (1215), a second motor (1216), a first mounting seat (1217) and a slider (1218), the first motor (1211) is connected with the wire receiving and releasing roller (1212), the first motor (1211) and the wire receiving and releasing roller (1212) are fixed on the first mounting seat (1217), the slide block (1218) is sleeved on the line rail (1213), a screw rod (1214) is arranged in the screw rod nut seat (1215), the screw rod (1214) is connected with a second motor (1216), the first mounting seat (1217) is mounted on a screw rod nut seat (1215) and a sliding block (1218), the second motor (1216) drives the first mounting seat (1217) to do linear reciprocating motion on the linear rail (1213).
5. The intelligent silicon ingot cutting system according to claim 4, wherein the cutting device (13) comprises a lifting component (131), a cutting frame (132) and a wire guide wheel (133), the lifting component (131) drives the cutting frame (132) to move up and down above the rotary working platform (14), the cutting frame (132) is provided with a plurality of wire guide wheels (133), and the wire guide wheel (133) is connected with the first take-up and pay-off mechanism (121) and the second take-up and pay-off mechanism (122) through a cutting wire (15).
6. the system for cutting off a smart silicon ingot as set forth in claim 1, wherein the rotary driving mechanism (144) comprises a third motor (1441), a second mounting seat (1442), a first driving wheel (1443), a second driving wheel (1444) and a driving chain (1445), the third motor (1441) is fixed on the second mounting seat (1442), the output shaft of the third motor (1441) is connected with the first driving wheel (1443), the second driving wheel (1444) is sleeved on the rotating shaft (1422), and the driving chain (1445) is connected with the first driving wheel (1443) and the second driving wheel (1444).
7. the intelligent silicon ingot slicing system as set forth in claim 1, wherein the clamps (1411) are provided in two groups.
8. the system for slicing silicon ingots according to claim 1, wherein the mechanical arm (2) comprises a mechanical arm (21), a rotating mechanism (22) and an image comparison mechanism (23), the image comparison mechanism (23) can drive the mechanical arm (21) and the rotating mechanism (22) to grab semi-finished products from the raw material and waste material conveying line (3) to place the semi-finished products on the rotating work platform (4) and grab finished products to the finished product conveying line (4), and the mechanical arm (21) can grab waste materials to the raw material and waste material conveying line (3).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710339815.6A CN106976172B (en) | 2017-05-15 | 2017-05-15 | Intelligent silicon ingot cutting system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710339815.6A CN106976172B (en) | 2017-05-15 | 2017-05-15 | Intelligent silicon ingot cutting system |
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| CN106976172A CN106976172A (en) | 2017-07-25 |
| CN106976172B true CN106976172B (en) | 2019-12-10 |
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| CN201710339815.6A Active CN106976172B (en) | 2017-05-15 | 2017-05-15 | Intelligent silicon ingot cutting system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109421177B (en) * | 2017-09-01 | 2023-11-28 | 隆基绿能科技股份有限公司 | Workpiece processing production system |
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| CN103921360A (en) * | 2014-04-24 | 2014-07-16 | 上海日进机床有限公司 | Diamond wire squaring machine |
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| JP3739603B2 (en) * | 1999-07-15 | 2006-01-25 | 株式会社日平トヤマ | Wire saw |
| JP2015205354A (en) * | 2014-04-17 | 2015-11-19 | 住友金属鉱山株式会社 | Cutting method by wire saw and positioning jig group used in this method |
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| US6234159B1 (en) * | 1997-09-11 | 2001-05-22 | WACKER SILTRONIC GESELLSCHAFT FüR HALBLEITERMATERIALIEN AG | Wire saw and process for cutting off shaped articles |
| CN103921360A (en) * | 2014-04-24 | 2014-07-16 | 上海日进机床有限公司 | Diamond wire squaring machine |
| CN105858187A (en) * | 2015-01-23 | 2016-08-17 | 营口金辰自动化有限公司 | Multi-axis manipulator carrying mechanism |
| CN205021839U (en) * | 2015-08-13 | 2016-02-10 | 浙江昀丰新能源科技有限公司 | Multiplex bit line butt machine |
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