CN106935734B - The control method of check device, decompression dry device and decompression dry device - Google Patents
The control method of check device, decompression dry device and decompression dry device Download PDFInfo
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- CN106935734B CN106935734B CN201610881393.0A CN201610881393A CN106935734B CN 106935734 B CN106935734 B CN 106935734B CN 201610881393 A CN201610881393 A CN 201610881393A CN 106935734 B CN106935734 B CN 106935734B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/70—Testing, e.g. accelerated lifetime tests
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/861—Repairing
Abstract
The present invention provides a kind of check device, the control method of decompression dry device and decompression dry device, is capable of the drying regime of the area of application in early detection substrate coated with organic material.A kind of check device of embodiment includes shoot part and drying regime test section.Shoot part shoots the area of application that organic material is coated in substrate.Drying regime test section detects the drying regime of the area of application based on the colour saturation of the area of application captured by shoot part.
Description
Technical field
Embodiments of the present invention are related to the control method of check device, decompression dry device and decompression dry device.
Background technique
In the prior art it is known that it is luminous that organic EL (Electroluminescence: electroluminescent) is utilized
Light emitting diode, that is, Organic Light Emitting Diode (OLED:Organic Light Emitting Diode).Organic light emission is used
Not only slim light weight and the low power consumption of the organic el display of diode, but also have in response speed and visual angle and contrast side
The advantage that face is excellent.Therefore, it attracts attention in recent years as follow-on flat-panel monitor (FPD).
Organic Light Emitting Diode has the construction that organic EL layer is clipped between the anode and cathode on substrate.Organic EL layer
Such as hole injection layer, hole transporting layer, luminescent layer, electron supplying layer, electron injecting layer and shape are stacked gradually from anode-side
At.In such stepped construction, for example, hole injection layer, hole transporting layer and luminescent layer respectively by substrate to spray
Mode applies organic material, and makes the drying substrates coated with organic material under reduced pressure atmosphere to be formed (referring for example to patent
Document 1).
But the above-mentioned drying time completed up to drying is for example according to the type for the organic material for being applied to substrate
With amount, substrate the various factors such as surface state and change.Thus, for example the volume production Organic Light Emitting Diode the case where
Under, need to be previously set the work of optimal drying time.
In the prior art, a large amount of sample is made while for example, the withering time is bit by bit changed
Product measure the film thickness and optical characteristics of each layer of made sample.Then, the sample of good measurement result is being obtained
In the case of, it predicates and has been reliably completed drying, the time of the drying process carried out to such sample is set as best
Drying time.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2000-181079 bulletin
Summary of the invention
Invention technical problem to be solved
But in the prior art, because by measuring film thickness and optical characteristics after sample is made into, the dry of substrate is detected
Dry state, so needing the more time.Therefore, in the prior art, in terms of the drying regime of early detection substrate
There are also rooms for improvement.
The purpose of one mode of embodiment is that providing one kind can be in early detection in the organic material of coating of substrates
Check device, the control method of decompression dry device and decompression dry device of the drying regime of the area of application of material.
For solving the technical solution of technical problem
The check device of one mode of embodiment has shoot part and drying regime test section.Shoot part is shot in base
The area of application of organic material is coated in plate.Drying regime test section is based on the above-mentioned the area of application shot by above-mentioned shoot part
Colour saturation detect the drying regime of above-mentioned the area of application.
Invention effect
According to embodiment mode, the area of application in substrate coated with organic material can be gone out in early detection
Drying regime.
Detailed description of the invention
Fig. 1 is the schematic section for indicating the overview of composition of Organic Light Emitting Diode.
Fig. 2 is the schematic plan view for indicating the summary of the composition of dike of Organic Light Emitting Diode.
Fig. 3 is the flow chart for indicating the main step of manufacturing method of Organic Light Emitting Diode.
Fig. 4 is the schematic plan view for indicating the summary of the composition of base plate processing system of present embodiment.
Fig. 5 A is the schematic section for indicating the substrate coated with the organic material for being used to form hole injection layer.
Fig. 5 B is the schematic section for indicating to be depressurized the substrate after drying in decompression dry device.
Fig. 6 A is the schematic section for indicating the substrate coated with the organic material for being used to form hole transporting layer.
Fig. 6 B is the schematic section for indicating to be depressurized the substrate after drying in decompression dry device.
Fig. 7 A is the schematic section for indicating the substrate coated with the organic material for being used to form luminescent layer.
Fig. 7 B is the schematic section for indicating to be depressurized the substrate after drying in decompression dry device.
Fig. 8 is the schematic plan view for indicating the composition of decompression dry device of present embodiment.
Fig. 9 is the IX-IX line schematic section for indicating Fig. 8.
Figure 10 is the block diagram for indicating control device.
Figure 11 is the signal enlarged drawing that amplification indicates a part of shooting image captured by shoot part.
Figure 12 is the chart for indicating to be dried under reduced pressure the colour saturation as measured by colour saturation measurement portion in processing.
Figure 13 is to set the processing of drying time in the decompression dry device for the check device for indicating to have present embodiment
Process flow flow chart.
Figure 14 is the chart for indicating the G colour saturation of the area of application of the area of application and central portion of peripheral portion.
Figure 15 is the signal amplification sectional view near the shoot part for the shooting unit for indicating second embodiment.
Description of symbols
11,311 shoot part
12,312 illumination portion
21 the area of application
100 base plate processing systems
121c, 122c, 123c decompression dry device
140 control devices
141 control units
141a lighting control section
141b shooting control part
141c image acquiring section
141d colour saturation measurement portion
141e judging part
141f drying regime test section
141g Decompression Controlling portion
141h elevating control portion
160 substrate holding mechanisms
161 maintaining parts
163 lifting units
170 mechanisms of decompressor
200 check devices
400 polarizing filters
G substrate.
Specific embodiment
Hereinafter, based on attached drawing the present invention will be described in detail disclosed check device, decompression dry device and being dried under reduced pressure dress
The embodiment for the control method set.In addition, the present invention is not limited to embodiments as shown below.
(first embodiment)
<compositions and manufacturing method of 1. Organic Light Emitting Diodes>
Firstly, being illustrated using overview and its manufacturing method of the FIG. 1 to FIG. 3 to the composition of Organic Light Emitting Diode.Fig. 1
It is the schematic sectional view for indicating the overview of composition of Organic Light Emitting Diode 500.Fig. 2 is to indicate Organic Light Emitting Diode 500
Dike (bank) 540 composition outline schematic plan view.Fig. 3 is the manufacturing method for indicating Organic Light Emitting Diode 500
Key step flow chart.
As shown in Figure 1, Organic Light Emitting Diode 500 has on the glass substrate G (hereinafter referred to as " substrate G ") as substrate
There is the construction that organic EL layer 530 is clipped between anode 510 and cathode 520.
Organic EL layer 530 is by stacking gradually hole injection layer 531, hole transporting layer 532, luminescent layer from 510 side of anode
533, electron supplying layer 534 and electron injecting layer 535 and formed.
Specifically, firstly, forming anode 510 on substrate G in anode formation processing (the step S101 of Fig. 3).Sun
Pole 510 is for example formed using vapour deposition method.In addition, in anode 510 for example using by ITO (Indium Tin Oxide: indium oxide
Tin) constitute transparent electrode.
Then, in dike formation processing (the step S102 of Fig. 3), dike 540 is formed on anode 510.Dike 540 for example passes through
Pattern as defined in photoetching treatment or etching process etc. are patterned.
As shown in Fig. 2, dike 540 be formed on line direction and column direction it is multiple.Also, in the inside of dike 540, such as hereinafter
It is described, organic EL layer 530 and cathode 520 is laminated and forms pixel.In dike 540, such as use photonasty polyimide resin.
Then, organic EL layer 530 is formed on the anode 510 of dike 540.Specifically, being handled in hole injection layer formation
In (the step S103 of Fig. 3), hole injection layer 531 is formed on anode 510.Then, (Fig. 3 is handled in hole transporting layer formation
Step S104) in, on hole injection layer 531 formed hole transporting layer 532.
Then, in luminescent layer formation processing (the step S105 of Fig. 3), luminescent layer is formed on hole transporting layer 532
533.In addition, including R color luminescent layer (red light emitting layer), G color luminescent layer (green light emitting layer) and B color hair in luminescent layer 533
Photosphere (blue light-emitting layer).
Then, in electron supplying layer formation processing (the step S106 of Fig. 3), electron transport is formed on luminescent layer 533
Layer 534 forms electron injecting layer on electron supplying layer 534 in electron injecting layer formation processing (the step S107 of Fig. 3)
535。
In the present embodiment, it is defeated that hole injection layer 531, hole are respectively formed in aftermentioned base plate processing system 100
Send layer 532 and luminescent layer 533.In base plate processing system 100, at the coating that successively carries out the organic material based on spraying method
Reason, organic material be dried under reduced pressure processing, the firing of organic material processing, form these hole injection layers 531, hole transporting layer
532 and luminescent layer 533.In addition, about hole injection layer 531, hole transporting layer 532 and luminescent layer 533 formation using Fig. 4~
Fig. 7 B etc. is described.
In addition, electron supplying layer 534 and electron injecting layer 535 are for example formed using vapour deposition method respectively.
Also, in cathode formation processing (the step S108 of Fig. 3), cathode 520 is formed on electron injecting layer 535.Yin
Pole 520 is for example formed using vapour deposition method.In addition, being for example able to use aluminium in cathode 520.
Also, it is right in order to which the moisture etc. that will be formed by via step S101~S108 in lit-par-lit structure and atmosphere obstructs
It is sealed processing (the step S109 of Fig. 3).
In via Organic Light Emitting Diode 500 manufactured by such film formation step~sealing step, by anode
Apply voltage between 510 and cathode 520, in the hole for the specified quantity that hole injection layer 531 is injected via hole transporting layer
532 are transported to luminescent layer 533.
In addition, the electronics of the specified quantity injected in electron injecting layer 535 is transported to hair via electron supplying layer 534
Photosphere 533.Also, in conjunction with the molecule for forming excitation state, luminescent layer 533 shines for hole and electronics in luminescent layer 533.
<compositions of 2. base plate processing systems>
Then, the base plate processing system of the check device for having present embodiment and decompression dry device is illustrated referring to Fig. 4
100 composition.Fig. 4 is the schematic plan view for indicating the outline of the composition of base plate processing system 100 of present embodiment.This
Outside, for ease of understanding check device 200 is indicated in Fig. 4, the schematic table of check device 200 is smeared with defined pattern
Show.
In addition, hereinafter, in order to define positional relationship, it is specified that mutually orthogonal X-direction, Y direction and Z axis side
To being set as Z axis positive direction to above vertical direction.
As shown in figure 4, move in substrate G to base plate processing system 100, substrate G be in advance via anode formed processing and
Dike formation handles the substrate G that anode 510 and dike 540 are formd (referring to the step S101 and S102 of Fig. 3).Then, at substrate
In reason system 100, carry out it is corresponding to step S103~S105 of Fig. 3 everywhere in manage, on substrate G formation hole injection layer 531,
After hole transporting layer 532 and luminescent layer 533, handles to electron supplying layer formation and moved out (referring to the step S106 of Fig. 3).
It is connected as one as shown in figure 4, base plate processing system 100 has to move in station 110, treating stations 120 and move out station 130
Composition.It moves in station 110 to move in multiple substrate G with brilliant box C unit from outside, and from the substrate G before brilliant box C taking-up processing.
Treating stations 120 include: to carry out the hole injection layer formation module 121 that hole injection layer forms processing to substrate G;With
Treated substrate G is formed to hole injection layer to carry out hole input layer and form the hole input layer of processing forming module 122.This
Outside, treating stations 120, which have, forms treated substrate G to hole input layer and carries out luminescent layer and form the luminescent layer of processing forming mould
Block 123.
Move out that station 130 will treated that substrate G is accommodated in brilliant box C, and by multiple substrate G with brilliant box C unit to outside
It moves out.
Move in station 110, hole injection layer forms module 121, hole transporting layer forms module 122, luminescent layer forms module
123 are sequentially being arranged configuration according to this from X-axis negative direction to X-axis positive direction with station 130 is moved out.
Moving in station 110 includes brilliant box mounting table 111, transfer path 112 and substrate conveying body 113.Brilliant box mounting table 111 will
Multiple crystalline substance box C freely load Cheng Yilie in the Y-axis direction.
Transfer path 112 is set as extending in the Y-axis direction.Substrate conveying body 113 is configured to logical in above-mentioned conveying
It moves and Z-direction and can move about the z axis on road 112, substrate G is transported between brilliant box C and treating stations 120.
In addition, substrate conveying body 113 is for example transported while absorption keeps substrate G.
In treating stations 120, it includes applying device 121a, buffer unit 121b, decompression that hole injection layer, which forms module 121,
Drying device 121c, annealing device 121d and temperature-adjusting device 121e.
Applying device 121a is to be used to form the organic of hole injection layer 531 to being formed on the anode 510 of substrate G coating
The device of material.Fig. 5 A is the schematic cross-section for indicating the substrate G coated with the organic material for being used to form hole injection layer 531
Figure.
As shown in Figure 5A, the inside of defined position, that is, dike 540 by applying device 121a with spraying method on substrate G
Apply organic material.The organic material be will be used to form hole injection layer 531 defined material dissolution in organic solvent
Solution.
Buffer unit 121b shown in Fig. 4 is the device of the multiple substrate G temporarily stored.Decompression dry device 121c be by
The device that the organic material as coated by applying device 121a is dried under reduced pressure.
Fig. 5 B is the schematic section for indicating to be depressurized the substrate G after drying in decompression dry device 121c.From Fig. 5 A
Comparison with Fig. 5 B is removed solvent it is found that the organic material coated by the inside of dike 540 passes through to be dried under reduced pressure, and thus becomes
The state of uniform film thickness or substantially uniform hole injection layer 531 has been laminated on anode 510.
Annealing device 121d shown in Fig. 4 is using the organic material after being dried by decompression dry device 121c as heat
Manage the device being fired.For example, annealing device 121d has the chamber that can store substrate G and configuration in the indoor heat of chamber
Plate (illustration omitted) carries out the firing of organic material using the heat from hot plate.
Temperature-adjusting device 121e be by by annealing device 121d heat treatment after substrate G be adjusted to defined temperature,
Such as the device of room temperature.In addition, applying device 121a, buffer unit 121b in hole injection layer formation module 121, decompression are done
The configuration of dry device 121c, annealing device 121d and temperature-adjusting device 121e and number can be selected arbitrarily.
In addition, hole injection layer forms module 121 there is substrate to transport region CR1~CR3 and connection device TR1~TR3.
It is, for example, to transport mechanical arm that substrate, which transports region CR1~CR3, and substrate G is transported to each device being disposed adjacent respectively.
Specifically, substrate, which transports region CR1, is transported to substrate G the applying device adjacent with substrate conveying region CR1
121a and buffer unit 121b.In addition, substrate, which transports region CR2, is transported to substrate G that region CR2 is adjacent subtracts with substrate conveying
Press drying device 121c.
In addition, substrate, which transports region CR3, is transported to substrate G the annealing device adjacent with substrate conveying region CR3
121d and temperature-adjusting device 121e.In addition, substrate G to be transported to the substrate conveying dress of substrate conveying region CR1~CR3 respectively
Install be set in the horizontal direction, vertical direction and moved freely around vertical axle.
Connection device TR1~TR3 be in turn arranged in respectively move between station 110 and substrate conveying region CR1, substrate removes
It send between region CR1 and CR2, between substrate conveying region CR2 and CR3, carries out the handover of substrate G between them.
Hole transporting layer formed module 122 include applying device 122a, buffer unit 122b, decompression dry device 122c,
Annealing device 122d and temperature-adjusting device 122e.Applying device 122a is applied on the hole injection layer 531 for being formed in substrate G
It is applied to form the organic material of hole transporting layer 532.Fig. 6 A is to indicate to be coated with to be used to form the organic of hole transporting layer 532
The schematic section of the substrate G of material.
As shown in Figure 6A, defined position, the i.e. dike 540 by applying device 122a with spraying method on substrate G
Inside apply organic material.The organic material be the defined material for being used to form hole transporting layer 532 is dissolved in it is organic
Solution made of solvent.
About buffer unit 122b shown in Fig. 4 and decompression dry device 122c, due to buffer unit 121b and decompression
Drying device 121c is substantially same structure, so omitting detailed description.
Fig. 6 B is the schematic section for indicating to be depressurized the substrate G after drying in decompression dry device 122c.From Fig. 6 A
Comparison with Fig. 6 B is removed solvent it is found that the organic material coated by the inside of dike 540 passes through to be dried under reduced pressure, and thus becomes
The state of uniform film thickness or substantially uniform hole transporting layer 532 has been laminated on hole injection layer 531.
In addition, since annealing device 122d and temperature-adjusting device 122e are also and annealing device 121d and temperature tune
Regulating device 121e roughly the same composition, so omitting detailed description.But it is formed in module 122 in hole transporting layer, heat
Hypoxemia and low dew point atmosphere are maintained inside processing unit 122d and temperature-adjusting device 122e.
Here, so-called hypoxic atmosphere refers to the atmosphere that oxygen concentration is low compared with atmosphere, and e.g. oxygen concentration is 10ppm or less
Atmosphere.In addition, so-called low dew point atmosphere refers to the atmosphere that dew-point temperature is low compared with atmosphere, e.g. dew-point temperature is -10
DEG C atmosphere below.In addition, such hypoxemia and the use of low the dew point atmosphere inactive gas such as nitrogen maintain.
It is formed in module 122 in hole transporting layer, these applying devices 122a, buffer unit 122b, decompression dry device
The quantity and configuration of 122c, annealing device 122d and temperature-adjusting device 122e can be selected arbitrarily.
In addition, hole transporting layer formed module 122 include substrate conveying region CR4~CR6 and connection device TR5 and
TR6.Connect in addition, being formed between module 121 and hole transporting layer formation module 122 in hole injection layer via connection device TR4
It connects.
Here, since substrate transports region CR4~CR6 and connection device TR5 and TR6 are to transport area with above-mentioned substrate
Domain CR1~CR3 and connection device TR1~TR3 roughly the same composition, so omitting detailed description.
But as described above, the inside of annealing device 122d and temperature-adjusting device 122e are maintained hypoxemia and low
Dew point atmosphere, therefore the inside of substrate conveying region CR6 is also maintained hypoxemia and low dew point atmosphere.
In addition, the connection device TR6 for connecting above-mentioned substrate conveying region CR6 and substrate conveying region CR5 is configured to, temporarily
When storage substrate G and allow hand over internal atmosphere, be designed to be able to switch hypoxemia and low dew point atmosphere and air atmosphere
Blocking device.
It includes applying device 123a, buffer unit 123b, decompression dry device 123c, Re Chu that luminescent layer, which forms module 123,
Manage device 123d and temperature-adjusting device 123e.
Applying device 123a is that coating is used to form having for luminescent layer 533 on the hole transporting layer 532 for be formed in substrate G
The device of machine material.Fig. 7 A is the schematic section for indicating the substrate G coated with the organic material for being used to form luminescent layer 533.
As shown in fig. 7, in applying device 123a, with defined position of the spraying method on substrate G, i.e. dike 540
Inside coating organic material.Such organic material be the defined material for being used to form luminescent layer 533 is dissolved in it is organic molten
Solution made of in agent.In addition, in fig. 7, shining in the R color luminescent layer attached drawings label 533R of luminescent layer 533, in G color
Layer attached drawings label 533G, 533B is marked in B color luminescent layer attached drawings.
About buffer unit 123b shown in Fig. 4 and decompression dry device 123c, due to being and above-mentioned buffer unit
122b and decompression dry device 122c roughly the same composition, so detailed description will be omitted.
Fig. 7 B is the schematic section for indicating to be depressurized the substrate G after drying in decompression dry device 123c.From Fig. 7 A
Comparison with Fig. 7 B is removed solvent it is found that the organic material of the inside coated in dike 540 passes through to be dried under reduced pressure, and thus becomes
The state of uniform film thickness or substantially uniform luminescent layer 533 has been laminated on hole transporting layer 532.
The inspection of the drying regime of detection substrate G is respectively arranged in above-mentioned decompression dry device 121c, 122c, 123c
Look into device 200.These decompression dry devices 121c, 122c, 123c and check device 200 is described further below referring to Fig. 8, Fig. 9
Detailed composition.
Then the explanation of Fig. 4, about buffer unit 123b and decompression dry device 123c, due to also with buffer unit 122b
It is substantially same composition with decompression dry device 122c, so omitting detailed description.
Luminescent layer formed module 123 in, these applying devices 123a, buffer unit 123b, decompression dry device 123c,
The quantity and configuration of annealing device 123b and temperature-adjusting device 123e can be selected arbitrarily.
It includes that substrate transports region CR7~CR9 and connection device TR8~TR10 that luminescent layer, which forms module 123,.In addition, empty
Cave transfer layer forms module 122 and luminescent layer is formed between module 123 via connection device TR7 connection.
Here, substrate transports region CR7~CR9 and connection device TR7~TR9, due to transporting region with above-mentioned substrate
CR4~CR6 and connection device TR4~TR6 is roughly the same composition, therefore omits detailed description.
Connection device TR10 setting transports region CR9 in substrate and moves out between station 130, joins substrate G between them.
In addition, connection device TR10 is preferably configured as, temporarily stores substrate G and allow hand over internal atmosphere, be designed to be able to cut
Change the blocking device of hypoxemia and low dew point atmosphere and air atmosphere.
Moving out station 130 includes brilliant box mounting table 131, transfer path 132 and substrate conveying body 133.Brilliant box mounting table 131 will
Multiple crystalline substance box C freely load Cheng Yilie in the Y-axis direction.
Transfer path 132 is set as extending in the Y-axis direction.Substrate conveying body 133 is configured in the transfer path
It moves and can be moved freely in Z-direction and about the z axis on 132, transport substrate G between treating stations 120 and brilliant box C.This
Outside, substrate conveying body 133 is for example transported while absorption keeps substrate G.In addition, the inside of transport station 130 preferably by
It is maintained hypoxemia and low dew point atmosphere.
In addition, base plate processing system 100 has control device 140.Control device 140 is, for example, computer, including control
Portion 141 and storage unit 142.The journey for the various processing that control executes in base plate processing system 100 is preserved in storage unit 142
Sequence.Control unit 141 is, for example, CPU (Central Processing Unit: central processing unit), is stored in storage by reading
Program and execution in portion 142 carry out control base board processing system 100.
In addition, the program is recorded on the program in the storage medium that can be read by computer, it is also possible to from it
Storage medium is stored in the program in the storage unit 142 of control device 140.It is situated between as the storage that can be read by computer
Matter, such as have hard disk (HD), floppy disk (FD), CD (CD), disk (MO) and storage card etc..In addition, control unit 141 is also possible to
It is only made of hard disk without using program.In addition, the specific composition about control device 140,0 is described below referring to Fig.1.
But in above-mentioned decompression dry device 121c, 122c, 123c, until the dry drying time completed is for example
According to the therefore hair of the type of the organic material coated on substrate G and amount, the surface state of substrate G, the type of layer of formation etc.
Changing.Thus, for example in the case where volume production Organic Light Emitting Diode 500, it is necessary to which realization carries out setting optimal drying
The operation of time.
In the prior art, by making a large amount of sample, film thickness and the optics for measuring each layer of made sample are special
Property, optimal drying time is set, therefore be to need to spend the time in setting operation.
But in decompression dry device 121c, 122c, 123c of present embodiment, it is configured to have in substrate G
The check device 200 that the drying regime of the area of application coated with organic material is detected.Also, such check device
In 200, the colour saturation of captured the area of application is measured while shooting to the area of application of substrate G, based on measured
Colour saturation detect the drying regime of the area of application.
Like this, there is press-dying arrangements 121c, 122c, 123c the colour saturation based on the area of application to detect drying regime
Check device, thus, it is possible to the drying regimes in early detection the area of application.In addition, it is optimal thus also to can be realized setting
The high efficiency of the operation of drying time.
<compositions of 3. check devices and decompression dry device>
Referring to Fig. 8, Fig. 9 to decompression dry device 121c, 122c with check device 200 of present embodiment,
The composition of 123c is illustrated.Fig. 8 is the schematic plan view for indicating the composition of decompression dry device 123c of present embodiment, figure
9 be the IX-IX line schematic section for indicating Fig. 8.
In addition, be illustrated by taking decompression dry device 123c as an example here, but due to decompression dry device 121c,
122c, 123c are roughly the same compositions, so the following description is also suitable for decompression dry device 121c, 122c.
As shown in Figure 8 and Figure 9, decompression dry device 123c include chamber 150, substrate holding mechanism 160 (referring to Fig. 9),
The mechanism of decompressor 170 (referring to Fig. 9) and check device 200.
Chamber 150 is can be by the process container of internal closed substantially rectangular parallelepiped.As shown in figure 9, in chamber 150
It is accommodated with the substrate G etc. kept by substrate holding mechanism 160.In addition, being provided with opening portion 151 and window portion in chamber 150
152.Specifically, multiple opening portions 151 are arranged in the top 150a of chamber 150, window is respectively set in these opening portions 151
Portion 152.
Window portion 152 is that have that (aftermentioned) the shooting chamber 150 of shoot part 11a~11c can be utilized from the outside of chamber 150
The glass of the translucency of the degree of internal substrate G.In addition, window portion 152 is for example formed by quartz glass, but it is not limited to
This.In addition, the quantity and configuration of opening portion 151 and window portion 152 can be selected arbitrarily.
Substrate holding mechanism 160 includes maintaining part 161, column sections 162 and lifting unit 163.Maintaining part 161 is mounting table.
Specifically, maintaining part 161 has multiple flat components, loads and keep substrate G.In addition, in example shown in Fig. 9,
Indicate that flat component is 5, but not limited to this.In addition, the flat component for constituting maintaining part 161 is also possible to
1.
Column sections 162 are the component extended in the vertical direction, and base end part is connect with lifting unit 163, will be protected in front end
Portion 161 is held horizontally to support.Lifting unit 163 is, for example, the driving source of electronic electrode etc., and column sections 162 and maintaining part 161 is made to exist
It is gone up and down in vertical direction.The substrate G for being maintained at maintaining part 161 as a result, can be gone up and down.In addition, lifting unit 163 and maintaining part 161
It for same number, is connect respectively with multiple maintaining parts 161, but in Fig. 9, it is for the simplification of diagram, lifting unit 163 is schematic
Ground is expressed as 1 module.
In addition, the lifting of the maintaining part 161 based on lifting unit 163, the progress when being dried under reduced pressure as described later, but can also be with
It is carried out in the carrying-in/carrying-out of substrate G.That is, for example in substrate G by from substrate conveying region CR8 (referring to Fig. 4) to being dried under reduced pressure
In the case that device 123c is moved in, lifting unit 163 make first multiple maintaining parts 161 a part (such as keep substrate G center
The maintaining part 161 positioned at two sides of the maintaining part 161 in portion) decline.
Then, the fork (not shown) for having loaded the base board delivery device of substrate G is inserted into the maintaining part 161 having dropped
Top space, fork is lowered later, and substrate G is positioned in the maintaining part 161 not declined.Then, fork is extracted, is risen
Drop portion 163 makes the maintaining part having dropped 161 rise to original position, keeps as shown in figure 9, becoming substrate G maintained portion 161
State.
The mechanism of decompressor 170 is connect with chamber 150, and the internal atmosphere of chamber 150 is depressurized to such as 1Pa or less.In addition, making
For the mechanism of decompressor 170, such as the vacuum pump for being able to use dry pump, mechanical booster pump, turbomolecular pump etc..
Check device 200 includes first shooting unit 210a, second shooting unit 210b and third shooting unit 210c.This
Outside, the quantity of shooting unit is not limited to illustrate, and can be 2 or less or 4 or more.
First~third shooting unit 210a~210b is configured near window portion 152 and in the outside of chamber 150.Specifically
For, first, third shooting unit 210a, 210c configuration positioned at substrate G peripheral portion top window portion 152 near,
Second shooting unit 210b configuration is near the window portion 152 positioned at the top of the central portion of substrate G.
Hereinafter, be illustrated by taking first shooting unit 210a as an example, but first~third shooting unit 210a~210c
It is roughly the same composition, therefore, the following description is also suitable for second, third shooting unit 210b, 210c.This
Outside, about the constituent element of second, third shooting unit 210b, 210c in Fig. 8, Fig. 9, for first shooting unit 210a phase
Same constituent element marks identical serial number but only changes the appended drawing reference of the letter at end, detailed description will be omitted.
First shooting unit 210a includes shoot part 11a, illumination portion 12a and focus adjustment section 13a.Shoot part 11a is located at
The top of window portion 152 shoots substrate G, and the coating region that organic material is coated in substrate G is specifically shot via window portion 152
Domain (aftermentioned).It like this,, can be from chamber although simply constituting by the way that window portion 152 for shooting is arranged in chamber 150
Substrate G in the outside shooting chamber 150 of room 150.
In addition, the optical axis that shoot part 11a is configured to shoot part 11a is vertical with the interarea of substrate G.In addition, as shooting
Portion 11a, such as be able to use CCD (Charge Coupled Device: the charge-coupled device) image with long focus lens and pass
Sensor camera, but it's not limited to that.
Illumination portion 12a has light source (not shown), is mounted on the side of shoot part 11a.Illumination portion 12a is from the light source to base
Plate G irradiates light for shooting.Specifically, shoot part 11a have self installation in future the illumination portion 12a of side light downwards
The half-reflecting mirror (not shown) of reflection.Also, the light from illumination portion 12a reflected by half-reflecting mirror is with substrate G's
In other words the vertical direction of interarea is the incidence on the direction of the light shaft coaxle with shoot part 11a, be irradiated to subject
The area of application.Like this, illumination portion 12a is configured to so-called coaxial-illuminating, and but not limited to this, for example, it is also possible to relatively
In substrate G the area of application from inclined direction irradiation light.
Focus adjustment section 13a includes main part 14a and sliding part 15a.Main part 14a is fixed on the top of chamber 150
150a.In addition, in the inside of main part 14a, the driving source (not shown) of storage driving sliding part 15a.As the driving source, example
Such as it is able to use motor.
Sliding part 15a pacifies in such a way that base end part can slide on the direction (Z-direction) vertical with the interarea of substrate G
Mounted in main part 14a.In addition, shoot part is fixed on the front end of sliding part 15a.
Control device 140 is connected with (referring to figure by cable (not shown) in focus adjustment section 13a formed as described above
4).Also, control device 140 by control main part 14a driving source, make sliding part 15a and shoot part 11a with substrate G
The vertical square upward sliding of interarea, thus, it is possible to suitably adjust the focus of shoot part 11a.
As described above, first~third shooting unit 210a~210c is substantially same composition.Therefore, hereinafter, for
Shoot part 11a and illumination portion 12a omits end in the case where not distinguishing first~third shooting unit particularly sometimes
The letter of tail and be recorded as " shoot part 11 " and " illumination portion 12 ".
Above-mentioned shoot part 11, illumination not 12, lifting unit 163 and decompression substrate 170 also through not shown cable and control
Device 140 (referring to Fig. 4) connection processed, is controlled respective movement.
<compositions of 4. control devices>
0 composition for explaining above-mentioned control device 140 in detail referring to Fig.1.Figure 10 is the block diagram of control device 140.In addition,
In Figure 10, the feature of the check device 200 and decompression dry device 123c that illustrate present embodiment is represented with functional block
The record for general constituent element is omitted in necessary constituent element.
In other words, each component illustrated in Figure 10 is to indicate the content of concept of function, might not physically such as
It is constituted like that shown in figure.For example, the specific form of the dispersion of each functional module, integration be not limited to it is as shown in the figure interior
Hold, all or part can be according to various loads and behaviour in service etc., with arbitrary unit by function or physically
Dispersed, integrated and constituted.
In addition, managing function everywhere in the progress of each functional module, all or arbitrary a part can pass through CPU etc.
Processor and the program being analyzed and executed by the processor realize, alternatively, being also possible to as based on the hard of hard wired logic
Part is come the function realized.
Firstly, as described above, control device 140 includes control unit 141 and storage unit 142.The reading of control unit 141 is stored in
Program and execution in storage unit 142 are functioned as each work module 141a~141h for example shown in Fig. 10 as a result,.It connects
, these each functional module 141a~141h are illustrated.
As shown in Figure 10, control unit 141 include lighting control section 141a, shooting control part 141b, image acquiring section 141c,
Colour saturation measurement portion 141d, judging part 141e, drying regime test section 141f, Decompression Controlling portion 141g, elevating control portion 141h.
In addition, storage unit 142 for example stores shooting image information 142a, pattern/location information 142b, prescribed limit information 142c and does
Dry status information 142d.
Lighting control section 141a controls illumination portion 12, and the light from illumination portion 12 is irradiated to substrate G.Shooting control part
141b controls shoot part 11, and shoot part 11 is made to shoot the substrate G being dried under reduced pressure in processing.
Image acquiring section 141c obtains shooting image captured by shoot part 11, arrives as shooting image information 142a storage
Storage unit 142.Figure 11 is an example that image 20 is shot captured by shoot part 11, is a part of amplification table that will shoot image 20
The schematic expanded view shown.
As shown in figure 11, shoot part 11 shoots the dike 540 of substrate G and the neighboring area of dike 540.In addition, scheming
In 11, a dike 540 is merely illustrated, but shoot part 11 can also shoot multiple dikes 540.
In addition, indicating the shooting G color luminescent layer being formed in the luminescent layer 533 of substrate G in example as shown in figure 11
Shooting image 20 obtained from 533G (referring to Fig. 7 A, Fig. 7 B).That is, Figure 11 indicates that luminescent layer, which is arranged in, forms subtracting for module 123
Press shooting image 20 captured by the shoot part 11 of drying device 123c.In addition, hereinafter, the painting formed with G color luminescent layer 533g
It applies for region 21 and is illustrated, but the following description is for being formed with the coating of R color luminescent layer 533R or B color luminescent layer 533B
Region 21 is also to be suitble to.
In the inside of dike 540, as described above, this is had coated with the organic solvent for forming G color luminescent layer 533G
The region of machine material is indicated as " the area of application 21 " in Figure 11 with the closed curve of dotted line.Like this, shoot part 11 is to substrate G
The area of application 21 shot.
Back to the explanation of Figure 10, colour saturation measurement portion 141d reads shooting image information 142a, measurement from storage unit 142
Pass through the colour saturation of the area of application 21 captured by shoot part 11.Here, so-called colour saturation is by captured the area of application 21
The numerical value indicated respectively with 0~225 grey value about red, green and blue this three primary colors.
In addition, in the present embodiment, red, green and blue three primary colors are respectively pressed 0~225 gray scale (8 bit)
Numeralization and the numerical value indicated are as colour saturation, but the respective gray scale of three primary colors can also be according to the performance of image sensing camera
By 65536 gray scales (16 bit) or the grey value more than it, as colour saturation come using.
In addition, shoot part 11 shoots multiple dikes 540, it is multiple in the area of application 21 for being formed with G color luminescent layer 533G
In the case of, colour saturation measurement portion 141d can also for example measure the average value of the colour saturation of multiple the area of application 21.Above-mentioned is flat
Mean value is able to use the various average values such as simple average or weighted average.In addition, in the coating for being formed with G color luminescent layer 533G
In the case that region 21 is multiple, it is not limited to measure the example of above-mentioned average value, such as can also be with colour saturation measurement portion
141d selects the area of application 21 represented from multiple the area of application 21, measures the colour saturation of the area of application 21.
In addition, colour saturation measurement portion 141d other than the measurement of colour saturation, also carries out pattern retrieval process and position letter
Cease acquirement processing.The retrieval of pattern retrieval process is the shape and formation with the pattern of dike 540 of captured the area of application 21
The consistent processing of shape of which pattern in the pattern of substrate G.It obtains in addition, location information obtains processing by retrieval
Reason is judged as the processing of the location information of the substrate G of consistent pattern.
Specifically, being previously stored with as pattern/location information 142b in storage unit 142 and being dried under reduced pressure processing in fact
The pattern form (hereinafter referred to as " storage pattern form ") for the dike 540 in substrate G applied, the organic EL layer 530 for being formed in dike 540
Type, the location information of dike 540 etc..
In addition, the information of the type of the organic EL layer 530 stored among the above is such as hole injection layer 531, cavity conveying
The information of layer 532 and luminescent layer 533 etc..In addition, the information of the type of organic EL layer 530, in the case where luminescent layer 533,
Include whether be R color luminescent layer 533R, G color luminescent layer 533G and B color luminescent layer 533B the information of any one.In addition, dike 540
Location information be, for example, the XY coordinate for indicating the relative position of dike 540 of the opposite datum mark (origin) being set on substrate G,
But not limited to this.
In pattern retrieval process, colour saturation measurement portion 141d is by the figure of the dike 540 with captured the area of application 21
Case shape retrieves consistent storage pattern form compared with storage pattern form.Also, colour saturation measurement portion 141d, passes through
Retrieval is above-mentioned by the type of organic EL layer 530 of the dike 540 with consistent storage pattern form and the information of position and expression
The information of measured colour saturation is associated, and the information is exported to judging part 141e.
For judging part 141e based on the information exported from colour saturation measurement portion 141d, calculating indicates that the color of the area of application 21 is dense
The value of the variation of degree, the specifically change rate of colour saturation.In addition, in above-mentioned judging part 141e, as expression colour saturation
The value of variation calculate change rate, but it's not limited to that, such as the others of variable quantity for being also possible to colour saturation etc.
Value.
Here, about the drying regime of the area of application 21 of the variation and substrate G for the colour saturation being dried under reduced pressure in processing
Relationship 2 is illustrated referring to Fig.1.Figure 12 is to indicate to be dried under reduced pressure the color as measured by colour saturation measurement portion 141d in processing
The chart of concentration.
In addition, Cong Shangqi is followed successively by Figure 12, and the graph representation " red-color concentration 30R " of dotted line, dashdotted graphics table
Show " green concentration 30G ", the graph representation " blue intensity 30B " of double dot dash line.In addition, the chart of realization is chamber in Figure 12
Pressure value 31 in room 150.In addition, from starting to be dried under reduced pressure processing after moment T0, being opened in the example shown in Figure 12
The measurement of beginning colour saturation.
Inventors have found the area of application when carrying out the measurement of colour saturation to the area of application 21 being dried under reduced pressure in processing
There is correlativity between 21 colour saturation and the drying regime of the area of application 21.It illustrates, such as shown in figure 12, when opening
When beginning is dried under reduced pressure processing and passes through moment Ta, the variation of pressure value 21 disappears, and maintains to be depressurized as authorized pressure in chamber 150
State.
In the area of application 21, before being depressurized to authorized pressure and when just starting dry, colour saturation compares
Big variation, but have passed through moment Ta, with time going by, in other words, with close to the dry state completed, colour saturation by
It is gradually stable.Also, such as in green concentration 30G, in moment Tb, value is stablized, and becomes what the drying of the area of application 21 completed
State.
This is because, the amount for the solvent being removed and being dried under reduced pressure is with time going by the area of application 21
It gradually decreases, the variation of colour saturation also disappears.Like this, it is known that the colour saturation of the area of application 21 and the drying shape of the area of application 21
There are correlativities between state.
Therefore, in the decompression dry device 123c for the check device 200 for having present embodiment, the area of application is calculated
The change rate of 21 colour saturation detects the drying regime of the area of application 21 based on change rate calculated.
Specifically, judging part 141e shown in Fig. 10, calculates the change rate of colour saturation, the calculated colour saturation of institute is judged
Change rate whether within the specified scope, in other words, about colour saturation judge variation whether disappear and become stable value.This
Outside, the variation that above-mentioned prescribed limit is redefined for the colour saturation of the progress with drying, which becomes smaller, to be judged as
Stable value is stored in storage unit 142 as prescribed limit information 142c.Judging part 141e is by judging result to dry shape
State test section 141f output.
Drying regime test section 141f detects the drying regime of the area of application 21, specifically, base based on judging result
The drying regime of the area of application 21 is detected in the colour saturation of the area of application 21 shot by shoot part 11.More specifically, exist
Within the scope of the regulations drying regime test section 141f detection is judged by the calculated change rates of judging part 141e institute
The area of application 21 has become the state dried out.
Drying regime test section 141f will be from starting to be dried under reduced pressure processing to detecting to have become the state dried
Time (being here, for example, moment Tb) is set as " drying time ", is stored in the drying time as drying regime information 142d
In storage unit 142.
In addition, drying regime test section 141f, other than above-mentioned drying time, it will also be formed with to become and dry
The type of the organic EL layer 530 of the dike 540 of the area of application 21 of state and location information etc. are deposited as drying regime information 142d
Storage is in storage unit 142.
Like this, in the case where there is drying regime test section 141f, by the colour saturation using the area of application 21, with system
The technology for making a large amount of sample is compared, and can detect the drying regime of the area of application 21 early.
In addition, as described above, the inspection for detecting the drying regime of the area of application 21 is arranged in decompression dry device 123c
Device 200 is looked into, the drying regime based on the area of application 21 detected sets drying time.As a result, for example in the organic hair of volume production
In the case where the operation for carrying out setting optimal drying time before optical diode 500, do not need to make a large amount of sample, it can
Realize the high efficiency of setting operation.
In addition, not needing in the case where there is above-mentioned drying regime test section 141f to by colour saturation measurement portion
The drying regime of whole detection the area of application 21 of colour saturation measured by 141d.That is, drying regime test section 141f such as root
At least one colour saturation is selected from red-color concentration, green concentration and blue intensity according to the type of the area of application 21.
It explains in detail, colour saturation includes red-color concentration, green concentration and blue intensity as described above.These three colour saturations
Variation as time goes by mode it is respectively different according to the type of the area of application 21, the variation of these colour saturations also with companion
Variation with the progress of drying regime is corresponding.
Therefore, experiment etc. is first passed through in advance and finds out the colour saturation for showing the variation of the progress with drying regime significantly, is done
Dry state detecting section 141f selects at least one from red-color concentration, green concentration and blue intensity according to the type of the area of application 21
Kind colour saturation.
Also, drying regime test section 141f can also detect drying regime based on selected colour saturation.Like this, it does
Dry state detecting section 141f can be examined correctly by using the colour saturation of the easy variation for showing the progress with drying regime
Survey the drying regime of the area of application 21.In addition, can be set by the quantity of the colour saturation of drying regime test section 141f selection
To be arbitrarily worth.
Then the explanation of Figure 10 is carried out, Decompression Controlling portion 141g controls the mechanism of decompressor 170, carries out being dried under reduced pressure processing.Tool
For body, after setting operation of the Decompression Controlling portion 141g in drying time terminates, in set drying time or set
Drying time on plus the stipulated time time in carry out being dried under reduced pressure processing.
141h control lifting unit 163 in elevating control portion goes up and down maintaining part 161.In addition, elevating control portion 141h is in drying
What the setting operation of time carried out after completing is dried under reduced pressure in processing, in other words, in volume production Organic Light Emitting Diode 500 into
Capable is dried under reduced pressure in processing, controls lifting unit 163 according to the drying regime of the area of application 21, later to this reference attached drawing 14
Narration.
<the specific movements of 5. check devices and decompression dry device>
Then, the place that the decompression dry device 123c of 3 pairs of check devices 200 with present embodiment is executed referring to Fig.1
Reason content is illustrated.
Figure 13 is indicated in the decompression dry device 123c of the check device 200 with present embodiment, and drying is set
The flow chart of the processing sequence of the processing of time.In addition, Figure 13 is indicated for example before volume production Organic Light Emitting Diode 500, use
In the processing sequence for setting optimal drying time.Therefore, in the example shown in Figure 13, the area of application 21 is being preset
Drying regime the detection processing time in persistently detected, the detection processing time warp after set drying time.It is above-mentioned
The detection processing time be set as than being predicted as the time that become time of state for having dried sufficiently long of the area of application 21.
It is executed in addition, making sequence everywhere in shown in Figure 13 in order according to the control of the control unit 141 of control device 140.
It is described in detail following, as shown in figure 13, the shooting control part 141b of control unit 141 is shot in substrate G
The area of application 21 (step S10) coated with organic material.In addition, making the light from illumination portion 12 before shooting processing
For the light irradiated to substrate G.
Then, colour saturation measurement portion 141d has the dike 540 of the area of application 21 in captured shooting image
The shape of pattern retrieves consistent storage pattern form (step S11) compared with storage pattern form.Then, colour saturation is surveyed
Amount portion 141d obtains the type with the organic EL layer 530 of dike 540 of consistent storage pattern form and position by retrieval process
(step S12) such as confidence breaths.
Then, colour saturation measurement portion 141d measures the colour saturation (step of the area of application 21 in captured shooting image
S13).Next, it is determined that portion 141e calculates the change rate (step S14) of the colour saturation of the area of application 21, judge that institute is calculated
(step S15) within the specified scope whether the change rate of colour saturation.
Judging part 141e is judged as the change rate of colour saturation within the scope of the regulations (step S15, yes), calculates
From starting to be dried under reduced pressure processing up to being judged as the time of the change rate of colour saturation within the specified scope as " drying time " (step
Rapid S16).
Moreover, it is judged that portion 141e be judged as the change rate of colour saturation not within the scope of the regulations (step S15,
It is no), that is, in the case where being judged as that bigger variation occurs for colour saturation, skip the processing of step S16.
Then, drying regime test section 141f is for example being judged as change rate within the limits prescribed by judging part 141e
In the case where, detect the case where the area of application 21 becomes the state dried, output indicates to become the shape dried
Storage unit 142 (step S17) is arrived in the information of the case where state, storage.In addition, drying regime test section 141f no matter judging part 141e
Judging result how, all by the type of the organic EL layer 530 of acquired dike 540 and location information, measured coating region
The colour saturation in domain 21 etc. arrives storage unit 142 as the information output for indicating drying regime, storage.
Then, drying regime test section 141f judges whether to have already been through the above-mentioned detection processing time (step S18).
Drying regime test section 141f be judged as also without the detection processing time in the case where (step S18, no), repeat step S10
The processing of~S17.
On the other hand, drying regime test section 141f is judged as have passed through the detection processing time in the case where (step S18,
It is), it sets drying time (step S19).Here the drying time set is with institute's calculated drying time in step s 16
Identical value.
In this way, complete for example before volume production Organic Light Emitting Diode 500 in order to set optimal drying time
A series of processing.Also, although not shown, but for example in the case where volume production Organic Light Emitting Diode 500, depressurizing
In drying device 123c, it is configured to the drying time set by step S19 or on set drying time plus rule
It carries out being dried under reduced pressure processing in the time fixed time.In addition, among the above, on drying time plus the stipulated time be in order to,
Such as even if the progress of the drying of the area of application 21 latens because of environmental condition in the case where, when absorbing latened by the stipulated time
Between, it is reliably completed the drying of the area of application 21.
In addition, carrying out the area of application 21 when setting the operation of drying time in above-mentioned decompression dry device 123c
Drying regime detection.But in decompression dry device 123c, the detection of the drying regime of the area of application 21 is not limited
In above content.
That is, being for example also configured to also carry out coating region in setting the decompression dry device 123c after drying time
The detection of the drying regime in domain 21.For example, as described later, in the area of application 21 of substrate G, substrate G peripheral portion and
Central portion, dry speed are different.Therefore, in the present embodiment, the area of application 21 and the painting of central portion of peripheral portion are detected
The drying regime for applying region 21 goes up and down substrate G based on testing result, is achieved in dry promotion.
This 4 is illustrated referring to Fig.1.Figure 14 is the area of application 21 for indicating the area of application 21 and central portion of peripheral portion
G colour saturation chart.In addition, in Figure 14, for coating region captured by the shoot part 11a as first shooting unit 210a
The G colour saturation in domain 21 marks appended drawing reference 41.In addition, in Figure 14, for the shoot part 11b institute by second shooting unit 210b
The G colour saturation of the area of application 21 of shooting marks appended drawing reference 42, and the shoot part 11c by third shooting unit 210c is clapped
The G colour saturation of the area of application 21 taken the photograph marks appended drawing reference 43.That is, G colour saturation 41,43 is the G of the area of application 21 of peripheral portion
Colour saturation, G colour saturation 42 are the G colour saturations of the area of application 21 of central portion.
It as shown in figure 14, is to start to be dried under reduced pressure after moment T0 is passed through in processing sharply about G colour saturation 41~43
Ground switchs to reduce after increasing.Also, in three G colour saturations 41~43, about G colour saturation 41,43, in moment T1, reduce
Value reversion and increase, about G colour saturation 42, T2 at the time of slower than moment T1, the value that reduces occurs to invert and increase.
Such reversion as shown in Figure 7 A, be the luminescent layer 533 that is swelled upwards than the upper surface of dike 540 due to dry and
The phenomenon that reducing, being observed when becoming upper surface state (referring to Fig. 7 B) on the lower than dike 540.In addition, and then
The area of application 21 after becoming state shown in Fig. 7 B is not the state being completely dried.
At the time of as described previously for being inverted in G colour saturation 41~43, in the G colour saturation of the area of application 21 of central portion
It is slow at the time of at the time of reversion in 42 than being inverted in the G colour saturation 41,43 of the area of application 21 of peripheral portion.I.e., it is known that central portion
The area of application 21 than peripheral portion the area of application 21 slow drying speed, it is difficult to it is dry.
In addition, generating air-flow in chamber 150 by the mechanism of decompressor 170 and existing due to the direction etc. of the air-flow in chamber
In 150 there is the case where position being easily dried in the area of application 21.
It therefore, can also be for example according to the drying of the area of application 21 in the decompression dry device 123c of present embodiment
State control lifting unit 163 goes up and down maintaining part 161, adjusts the height of substrate G.
Specifically, elevating control portion 141h is inverted in the G colour saturation 41,43 of the area of application 21 of peripheral portion
In the case where, control lifting unit 163 goes up and down maintaining part 161, is located in chamber 150 with the area of application 21 of central portion and is easy to
The mode at dry position adjusts the height of substrate G.Thereby, it is possible to realize the promotion of the drying of the area of application 21 of central portion.
In addition, the rate of drying of the area of application 21 of central portion can be made close to peripheral portion by constituting as described above
The area of application 21 rate of drying, thus, it is possible to inhibit the phenomenon that in substrate G because position difference due to generate uneven drying.
As constituted as described above, the check device 200 of first embodiment includes that shoot part 11 and drying regime are examined
Survey portion 141f.Shoot part 11 shoots the area of application 21 that organic material is coated in substrate G.Drying regime test section
141f detects the drying regime of the area of application 21 based on the colour saturation of the area of application 21 as captured by shoot part 11.As a result,
The drying regime of the area of application 21 coated with organic material can be detected early in substrate G.
In addition, the colour saturation at a position of the drying regime test section 141f based on the area of application 21 detects among the above
The drying regime of the area of application 21, but not limited to this.That is, drying regime test section 141f for example can also be as in Figure 11
Represented by imaginary line, the colour saturation of the point 22 based on multiple positions in the area of application 21 detects drying regime.
It is dense to be for example able to carry out color in the point 22 at multiple positions in the area of application 21 by drying regime test section 141f as a result,
Whether the comparison of degree is able to confirm that in the area of application 21 uniformly dry.
In addition, the difference of the colour saturation due to the point 22 that can also calculate multiple positions in the area of application 21, energy
Enough film thickness distributions speculated in the area of application 21 according to the difference, as a result, the drying regime of opposite the area of application 21 can be analyzed
Film thickness variation.
(second embodiment)
Then, the decompression dry device 123c of the check device 200 with second embodiment is illustrated.In addition,
In the following description, to it is stated that part similarly partially mark with it is stated that the same appended drawing reference in part, province
Slightly repeat description.
In the embodiment of Fig. 2, the configuration of shoot part is changed.Figure 15 is the shooting unit for indicating second embodiment
Signal amplification sectional view near 310 shoot part 311.
As shown in figure 15, in this second embodiment, shoot part 311 is configured to the optical axis of shoot part 311 relative to substrate G
Interarea inclination.In addition, the illumination portion 312 as shooting unit 310, same as first embodiment to be able to use coaxial-illuminating
Illumination portion.
In addition, shooting unit 310 can also further have floor light portion 320.Floor light portion 320 for example configures
The top of subject, that is, the area of application 21 irradiates light for shooting to substrate G.In addition, in Figure 15, for the ease of reason
Solution, schematically shows the area of application 21 with the closed curve of dotted line.
In this second embodiment, same as first embodiment by the way that by shoot part 311, mode is configured as described above
Ground can go out the drying regime of the area of application 21 in early detection.In addition, in this second embodiment, by with side as described above
Formula configures shoot part 311, by shooting from oblique upper to the area of application 21.The area of application 21 captured by the oblique upper
Colour saturation can be more accurately sometimes as drying is indicated out bigger variation, therefore in this second embodiment
Detect the drying regime of the area of application 21.
In addition, in this second embodiment, also it is configured to acquire the body of the area of application 21 captured by the oblique upper
Product analyzes the variation etc. of the volume of the drying regime of opposite the area of application 21.
(third embodiment)
Then, the decompression dry device 123c of the check device 200 with third embodiment is illustrated.In third
In embodiment, as in Fig. 9 with represented by imaginary line have polarizing filter 400.Thereby, it is possible to more accurately measure coating region
The colour saturation in domain 21, as a result, being capable of detecting when accurate drying regime.
It is described in detail below, polarizing filter 400 configures the 21 (reference of the area of application in shoot part 11 and substrate G
Between Figure 11).In addition, for the simplification of diagram, illustrating only configuration between shoot part 11a and the area of application 21 in Fig. 9
Polarizing filter 400, the figure for configuring polarizing filter 400 between shoot part 11b, 11c and the area of application 21 is omitted
Show.
But the illumination of illumination portion 12 is mapped to the area of application 21, reflects in the area of application 21.From the area of application
21 reflected light include reach the area of application 21 inside substrate G upper surface reflect " internal reflected light " and do not reach
On the surface of the area of application 21 irreflexive " surface reflection " occurs for the inside of the area of application 21.Surface after the diffusing reflection is anti-
Penetrate light becomes the principal element of noise (interference), therefore not light as far as possible for shoot part 11.
Therefore, in polarizing filter 400, the light of the phase for the internal reflected light for having above-mentioned is made to pass through the light of shoot part 11
The central part that axis passes through, so that the light of the orthogonal phase with the surface reflection after diffusing reflection in the direction of polarisation is not passed through encirclement should
The peripheral portion of central part.
As a result, in shoot part 11, the light of the surface reflection after diffusing reflection can reduce by polarizing filter 400,
It is able to suppress the influence of surface reflection.Therefore, in the third embodiment, the color of the area of application 21 can more accurately be measured
Concentration, as a result, being capable of detecting when accurate drying regime.
(first variation)
Then, the decompression dry device 123c of the check device 200 with first variation is illustrated.
In the decompression dry device 123c of first variation, as shown in the imaginary line of Figure 10, there is notification unit 410.And
And in decompression dry device 123c, drying regime test section 141f is for example, the change rate in colour saturation is converged in prescribed limit
After interior, in the case where deviating from prescribed limit, thus it is speculated that for what exception be likely to occur in decompression dry device 123c, lead to
Notification unit 410 is crossed to inform the user.
It is able to use display or buzzer etc. as notification unit 410, is occurred in being speculated as decompression dry device 123c
In the case where what exception, such as indicate that the display occurred extremely carries out display or buzzer carries out buzzing.It uses as a result,
It family can be in the exception for recognizing decompression dry device 123c in early days.
In addition, in the decompression dry device 123c of first variation, as in Figure 10 as shown in imaginary line, it is possible to have
Photo-detector 420.The setting of photo-detector 420 measures the light quantity of illumination portion 12 in illumination portion 12.
Indicate that the information of the light quantity measured by photo-detector 420 is output to lighting control section 141a.Lighting control section
141a, for example, illumination portion 12 light quantity reduce, in the case where detecting the deterioration of illumination portion 12, by notification unit 410 to
Family notice.
As a result, for example, due to illumination portion 12 the colour saturation for deteriorating year in year out and cannot correctly measuring the area of application 21 it
Before, user can be urged to safeguard illumination portion 12.That is, the deterioration year in year out due to illumination portion 12 can be avoided in advance and cannot
The case where correctly colour saturation of measurement the area of application 21, the detection accuracy of the drying regime of the area of application 21 reduces.
(the second variation)
Then, the second variation is illustrated.In the decompression dry device 123c of the second variation, according to measured
The type of colour saturation change the wavelength of light irradiated from illumination portion 12 to the area of application 21.
Specifically, there is the value of colour saturation of the area of application 21 by surveying measurement of concetration portion 141d measurement according to from photograph
The case where wavelength for the light that bright portion 12 is irradiated changes.Therefore, in the second variation, lighting control section 141a is according to will survey
The type of the colour saturation of the area of application 21 of amount selects the wave for being easy the variation of the colour saturation of progress of the performance with drying regime
It is long, the light of selected wavelength is irradiated to the area of application 21.In addition, for example can by the wavelength that lighting control section 141a is selected
It is that value appropriate is exported by experiment etc. in advance, the value being stored in storage unit 142 etc..
Drying regime test section 141f can accurately grasp the change of the colour saturation of the progress with drying regime as a result,
Change, as a result, the drying regime of the area of application 21 can be correctly detected out.In addition, passing through the wave of change light as described above
It is long, it also can reduce the damage to the ink of coating, can also obtain the shooting image more easily observed.
(third variation)
Then, third variation is illustrated.In the decompression dry device 123c of third variation, 11 structure of shoot part
As the infrared view sensing camera with the long focus lens as made by the relatively high material of the transmissivity of infrared ray.Separately
Outside, in this case, the material that window portion 152 also uses the transmissivity of infrared ray relatively high.
In the 3rd variation, can using infrared view sensing camera (infrared thermal camera etc.) measure from as
The intensity for the infrared ray that the area of application 21 of the substrate G of measure object discharges observes the Temperature Distribution, hygrogram of the area of application 21
Picture.In addition, can be carried out at high speed and non-contactly by utilizing infrared view sensing camera (infrared thermal camera etc.)
Temperature measuring.
Also, if being stored in storage unit for the temperature of the area of application 21 measured as drying regime information 142d
In 142, then the temperature change of the area of application 21 of the drying regime of opposite the area of application 21 can be analyzed.
In addition, above-mentioned first embodiment to third embodiment and first variation distinguishes institute into third variation
Each composition illustrated also can be appropriately combined.That is, for example first variation can also be combined in the composition of first embodiment
Notification unit 410 and change the second variation illumination portion 12 light wavelength lighting control section 141a.
In addition, in the above content, the top 150a of chamber 150 is rectangle when looking down, by window portion 152 and the first~the
Three shooting unit 210a~210c are along the diagonal configuration of top 150a, and but not limited to this.That is, for example can also be by window
Portion 152 and first~third shooting unit 210a~210c are configured relative to top 150a along X-direction or Y direction.
In addition, including indicating that the dry of the area of application 21 carries out in shooting image information 142a in above-mentioned composition
Process continuous shooting image.As a result, for example, being dried under reduced pressure place in setting decompression dry device 121c, 122c, 123c
When the drying proposal of reason, by parsing continuous shooting image, optimization can be efficiently realized.
More effects and variation can be readily derived by practitioner.Therefore, more modes of the invention are simultaneously
It is not limited to indicated above and described specific detailed content and representative embodiment.Therefore, as long as not
It is detached from recapitulative invention thought and range defined in the range of the attached claims and its range of equalization, it will be able into
The various changes of row.
Claims (9)
1. a kind of check device characterized by comprising
The shoot part that the area of application that organic material is coated in substrate is shot;
Drying regime test section detects the coating based on the colour saturation of the described the area of application shot by the shoot part
The drying regime in region;With
Judging part calculates the value for indicating the variation of colour saturation of described the area of application, and judges that the calculated value is
It is no in preset prescribed limit,
In the case where being judged as that the calculated value is in the prescribed limit by the judging part, the drying regime inspection
Survey portion detects that described the area of application has become the state dried.
2. check device as described in claim 1, it is characterised in that:
The colour saturation includes red-color concentration, green concentration and blue intensity,
The drying regime test section selects the red-color concentration, the green concentration and institute according to the type of described the area of application
At least one of blue intensity colour saturation is stated, the drying regime is detected based on the selected colour saturation.
3. check device as claimed in claim 1 or 2, it is characterised in that:
The drying regime test section detects the drying regime based on the colour saturation at multiple positions in described the area of application.
4. check device as claimed in claim 1 or 2, it is characterised in that:
The shoot part is configured to its optical axis and tilts relative to described the area of application.
5. check device as claimed in claim 1 or 2, it is characterised in that:
Including the polarizing filter being configured between the shoot part and described the area of application of the substrate.
6. a kind of decompression dry device characterized by comprising
Check device according to any one of claims 1 to 5;
For storing the chamber of the substrate;With
To the mechanism of decompressor depressurized in the chamber.
7. decompression dry device as claimed in claim 6, it is characterised in that:
Window portion including the chamber is arranged in,
The shoot part shoots described the area of application across the window portion.
8. decompression dry device as claimed in claim 6 characterized by comprising
Keep the maintaining part of the substrate;
Make the lifting unit of the maintaining part lifting;With
The lifting unit is controlled according to the drying regime detected to make the elevating control portion of the maintaining part lifting.
9. a kind of control method of decompression dry device characterized by comprising
The shooting step that the area of application that organic material is coated in substrate is shot;
The drying of described the area of application is detected based on the colour saturation of captured described the area of application in the shooting step
The drying regime detecting step of state;With
Drying time setting procedure, based on the detected drying regime in the drying regime detecting step, setting
The drying time that the chamber indoor pressure-reducing for storing the substrate is dried.
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CN201910830977.9A CN110544752B (en) | 2015-10-09 | 2016-10-09 | Substrate processing system and control method of substrate processing system |
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JP2015200869A JP2017073338A (en) | 2015-10-09 | 2015-10-09 | Inspection device, reduced-pressure drying device, and method for controlling reduced-pressure drying device |
JP2015-200869 | 2015-10-09 |
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JP7040871B2 (en) * | 2017-07-28 | 2022-03-23 | 株式会社Screenホールディングス | Board processing equipment and parts inspection method for substrate processing equipment |
KR102010329B1 (en) * | 2017-08-04 | 2019-10-15 | 주식회사 디엠에스 | Substrate processing apparatus and in line type substrate processing system using the same |
JP2022092958A (en) | 2020-12-11 | 2022-06-23 | 東京エレクトロン株式会社 | Observation device, under vacuum drying device, display method and storage medium |
CN116571416A (en) * | 2023-04-21 | 2023-08-11 | 哈尔滨工业大学 | Temperature and pressure cooperative control equipment suitable for functional coating microstructure molding |
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JP2000181079A (en) * | 1998-12-16 | 2000-06-30 | Tokyo Electron Ltd | Substrate treating device |
CN1924515A (en) * | 2005-09-02 | 2007-03-07 | 松下电器产业株式会社 | Device and method for measuring film, coating device and method |
CN101183224A (en) * | 2006-11-15 | 2008-05-21 | 东京毅力科创株式会社 | Decompression drying device |
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JP2002273308A (en) * | 2001-03-15 | 2002-09-24 | Matsushita Electric Ind Co Ltd | Dry state measuring device and coating film dryer equipped with the device |
JP2003075294A (en) * | 2001-09-05 | 2003-03-12 | Toray Ind Inc | Method for inspecting substrate |
JP2009076228A (en) * | 2007-09-19 | 2009-04-09 | Seiko Epson Corp | Drying method and drying device |
US8216666B2 (en) * | 2008-02-29 | 2012-07-10 | The Procter & Gamble Company | Substrates having improved crockfastness |
JP2010073602A (en) * | 2008-09-22 | 2010-04-02 | Seiko Epson Corp | Method of manufacturing organic el device |
KR101509830B1 (en) * | 2009-09-07 | 2015-04-06 | 도쿄엘렉트론가부시키가이샤 | Decompression drier and decompression dry method |
JP4859968B2 (en) * | 2009-09-07 | 2012-01-25 | 東京エレクトロン株式会社 | Vacuum drying apparatus and vacuum drying method |
JP2011216268A (en) * | 2010-03-31 | 2011-10-27 | Toppan Printing Co Ltd | Manufacturing method of organic el element substrate |
JP6183044B2 (en) * | 2012-10-18 | 2017-08-23 | Jsr株式会社 | Curable composition, cured film and display element |
KR20150011239A (en) * | 2013-07-22 | 2015-01-30 | 삼성디스플레이 주식회사 | Low pressure drying apparatus and manufactruing display apparatus using the same |
JP2015069783A (en) * | 2013-09-27 | 2015-04-13 | 株式会社日立ハイテクノロジーズ | Power storage device manufacturing apparatus, power storage device, and method for manufacturing the same |
CN103613990B (en) * | 2013-11-07 | 2015-03-04 | 昆山大世界油墨涂料有限公司 | Printing ink for polypropylene material and preparation method thereof |
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- 2016-09-27 KR KR1020160124004A patent/KR20170042470A/en not_active Application Discontinuation
- 2016-10-09 CN CN201610881393.0A patent/CN106935734B/en active Active
- 2016-10-09 CN CN201910830977.9A patent/CN110544752B/en active Active
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JP2000181079A (en) * | 1998-12-16 | 2000-06-30 | Tokyo Electron Ltd | Substrate treating device |
CN1924515A (en) * | 2005-09-02 | 2007-03-07 | 松下电器产业株式会社 | Device and method for measuring film, coating device and method |
CN101183224A (en) * | 2006-11-15 | 2008-05-21 | 东京毅力科创株式会社 | Decompression drying device |
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CN110544752A (en) | 2019-12-06 |
CN110544752B (en) | 2022-01-07 |
JP2017073338A (en) | 2017-04-13 |
KR20170042470A (en) | 2017-04-19 |
CN106935734A (en) | 2017-07-07 |
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