CN106929891A - Point plating appts - Google Patents
Point plating appts Download PDFInfo
- Publication number
- CN106929891A CN106929891A CN201710273032.2A CN201710273032A CN106929891A CN 106929891 A CN106929891 A CN 106929891A CN 201710273032 A CN201710273032 A CN 201710273032A CN 106929891 A CN106929891 A CN 106929891A
- Authority
- CN
- China
- Prior art keywords
- plating
- point
- mouth
- jube
- appts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
Abstract
One kind point plating appts, including be provided with lateral surface and medial surface matrix part, be opened in the lateral surface middle part fluting and some plate mouth from the point that is through to the medial surface and is formed of slotting, the point plating is intraoral to be provided with jube, and the point is plated mouth and is separated at least two runners by the jube.The application point plating appts electroplate uniform film thickness.
Description
Technical field
The application is related to field of electroplating, espespecially a kind of point plating appts.
Background technology
Electroplating technology is widely used in every profession and trade, and various materials need to carry out electroplating processes in different purposes, are such as
Increase electric conductivity, antirust, increase glossiness etc..
The species of plating is a lot, such as rack plating, point plating, when some noble metals are electroplated, to save noble metal, generally uses
Point plating mode is carried out, i.e., optionally the position for needing plating is electroplated, and remainder is covered.Point plating process
In, due to liquid medicine with selection plating area exchanges uneven the problems such as, can cause electroplate each region electrodeposited coating thickness difference
Different larger, i.e., thickness differs greatly, and does not meet the quality requirement of some accurate spare parts, will also result in waste.
The content of the invention
In consideration of it, being necessary to provide a kind of point plating appts, make the electrodeposited coating uniform film thickness of electroplated product.
In order to solve the above technical problems, this application provides one kind point plating appts, including lateral surface is provided with medial surface
Matrix part, the fluting for being opened in the lateral surface middle part and some it are through to the medial surface and formed from the fluting
Point plating mouth, point plating is intraoral to be provided with jube, and the point is plated mouth and is separated at least two runners by the jube.
Preferably, the medial surface correspondence in the described matrix portion point plating mouth is provided with some guiding gutters, and the guiding gutter is in loudspeaker
Shape structure, the opening of the opening less than the guiding gutter opposite side of the guiding gutter connection point plating mouth side.
Preferably, the jube extends positioned at described medial surface one end from the point plating mouth towards the fluting direction, institute
There is distance in the end and the face residing for the fluting for stating jube.
Preferably, the point plating mouth is integrated in the combination of described fluting one end, is not separated by the jube.
Preferably, the jube is located at the centre of the point plating mouth, and the two ends of the point plating mouth exist with the jube
Distance, point plating mouth combination at two ends is integrated, and is not separated by the jube.
Preferably, the periphery for being recessed at the point plating mouth is provided with some locating dowels.
Preferably, the point is plated mouth and is divided into two to form two runners by the jube in vertical direction.
Preferably, the point is plated mouth and is divided into two to form two runners by the jube in the vertical direction.
Preferably, the jube constitutes " ten " font structure, and it one minute is four four runners of formation that the point is plated into mouth.
Preferably, described plating appts are used for plated conductive terminal product, the conducting terminal include some butts and
The material strip that some butt are connected as one, the material strip is provided with location hole, and some butt are provided with and need
The plating area to be electroplated, the conducting terminal is covered in the fluting, and mouth position is plated in the plating area towards the point,
And buckle into the fluting to cover the another side of the conducting terminal by coating member.
The application point plating appts set jube by the point plating mouth, make to enter the point intraoral electroplating liquid medicine of plating
Contacted with the plating area of the conducting terminal positioned at the fluting side and be more uniformly distributed, at the same improve liquid medicine exchange situation and
The distribution of current density, makes the electrodeposited coating entirety uniform film thickness of plating area.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding of the present application, constitutes the part of the application, this Shen
Schematic description and description please does not constitute the improper restriction to the application for explaining the application.
Fig. 1 treats the schematic diagram of a plated product for the application；
Fig. 2 is the stereogram of the application point plating appts；
Fig. 3 is the side view of the application point plating appts；
Fig. 4 is the enlarged drawing of the side view of the application point plating appts；
Fig. 5 is the profile of the application point plating appts.
Specific embodiment
To make the purpose, technical scheme and advantage of the application clearer, below in conjunction with the application specific embodiment and
Corresponding accompanying drawing is clearly and completely described to technical scheme.Obviously, described embodiment is only the application one
Section Example, rather than whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of the application protection.
Refer to shown in Fig. 1, the application product to be electroplated is connector conducting terminal 10, the conducting terminal 10 includes
Some butt 11 and the material strip 12 for connecting as one some butt, the material strip 12 are provided with location hole 121.
Some butt 11 are provided with the plating area 13 for needing plating.
Refer to shown in Fig. 2 to Fig. 5, the application point plating appts 20 be cyclic structure, in a particular embodiment, or
List structure.Described plating appts 20 are including being provided with the matrix part 21 of lateral surface 22 and medial surface 23, being opened in the lateral surface
The fluting 24 of 22 middle parts, some guiding gutters 25 being opened on the medial surface 23 and 24 it is through to institute from the fluting
The point plating mouth 26 stated guiding gutter 25 and formed.The guiding gutter 25 is in horn-like setting, the one end being connected with the point plating mouth 26
Less than its other end.
Refering to shown in Fig. 4, the fluting 24 sets emphasis in some point plating mouths 26 of top correspondence of the point plating mouth 26
There are some locating dowels 29, the locating dowel 29 can also be located at the lower section of the point plating mouth 26, i.e., in the feelings of different product type
Under condition, the locating dowel 29 is capable of achieving same technique effect located at the point plating periphery of mouth 26；The fluting 24 is described
The screens 27 of the point plating deeper depression formed below of mouth 26.
Refering to shown in Fig. 5, the middle part of the point plating mouth 26 is provided with jube 28 to emphasis, and the jube 28 is in Vertical Square
It is divided into two to the point is plated into mouth 26, the Y-direction shown in the vertical direction corresponding diagram 1.The jube 28 can put plating mouth
26 electroplating liquid medicine more uniformly spreads.The jube 28 simultaneously plates mouth 26 not through the point, and the jube 28 is plated from the point
Mouth 26 is located at the one end of the guiding gutter 25 and extends towards 24 directions of the fluting, 24 institutes of the end of the jube 28 and the fluting
There is distance in the face at place, i.e., described point plating mouth 26 is integrated in 24 one end combinations of the fluting, not by 28 points of the jube
Every.In this way, making when the jube liquid medicine that both sides enter about 28 is at 24 ends of the fluting, to be extruded to centre respectively, make
Liquid medicine is evenly distributed.
In one embodiment, the jube 28 is located at the centre of the point plating mouth 26, the two ends of point plating mouth 26 with
There is distance in the jube 28, i.e., at two ends, combination is integrated described point plating mouth 26, is not separated by the jube 28.
In one embodiment, the jube 28 is arranged on vertical direction and extends to be formed, and described will put plating mouth 26 and be separated into
Two in the vertical directions runner arranged side by side.
In one embodiment, the jube 28 is arranged to " ten " font structure, described will put plating mouth 26 and be separated into four
Runner.
The operation principle of the application point plating appts is as follows：First the conducting terminal 10 is fitted in the fluting 24, institute
State plating area 13 to be attached on the point plating mouth 26, the location hole 121 on the material strip 12 snaps in determining in the fluting 24
The conducting terminal 10 is positioned on the post 29 of position.Then, it is pressed together in the fluting 24 by a coating member (not shown), institute
State coating member to be fastened in the screens 27, cover another side of the conducting terminal 10 relative to the plating area 13
Face, prevents another contacts side surfaces liquid medicine from electroplating and wasting noble metal.Liquid medicine enters institute from the guiding gutter 25 of the medial surface 23
A plating mouth 26 is stated, and is flowed towards the lateral surface 22 in two runners that the point plating mouth 26 is divided into by the jube 28
Dynamic, when close to the conducting terminal 10, the liquid medicine in two runners converges integrally and contacts the plating area 13 to be carried out
Plating.
By experimental verification, the product electrodeposited coating thickness electroplated out using the application point plating appts 20 is more uniformly distributed, extreme difference
It is small.Emphasis defines some butt and is respectively Pin1, Pin2 ... Pin5 refering to shown in Fig. 1 in X-direction, the son per butt
Plating area 13 Y direction selection on measuring point, middle measuring point and lower measuring point.10 groups are taken respectively by the application point plating appts electricity
The sample 1 of plating and the sample 2 electroplated by conventional point plating appts, sample 1, sample 2 require that minimum film thickness is not less than 30u, and respectively
Point extreme difference is small preferably, and conventional point plating appts do not have jube 28, and its thickness test result is as follows：
Table 1
Be can be seen that from the data of table 1, the overall thickness average of the sample 1 for using the application point plating appts 20 to electroplate is 32.6u ",
Than the 34.2u of sample 2 " thin 1.6u ", while making to reach minimum thickness, saved more noble metals.The extreme difference of sample 1 is only
It is the 2/3 of the extreme difference of sample 2, is more uniformly distributed the thickness of sample 1, more preferably, production controllability is stronger for product yield.
The application point plating appts 20 set jube 28 by the point plating mouth 26, make to enter in the point plating mouth 26
Electroplating liquid medicine is contacted with the plating area 13 of the conducting terminal 10 positioned at 24 sides of the fluting and is more uniformly distributed, while improving medicine
The distribution of water coke slurry situation and current density, makes the electrodeposited coating entirety uniform film thickness of plating area 13.
Also, it should be noted that term " including ", "comprising" or its any other variant be intended to nonexcludability
Comprising so that process, method, commodity or equipment including a series of key elements not only include those key elements, but also wrapping
Include other key elements being not expressly set out, or also include for this process, method, commodity or equipment is intrinsic wants
Element.In the absence of more restrictions, the key element limited by sentence "including a ...", it is not excluded that wanted including described
Also there is other identical element in process, method, commodity or the equipment of element.
Embodiments herein is the foregoing is only, the application is not limited to.For those skilled in the art
For, the application can have various modifications and variations.It is all any modifications made within spirit herein and principle, equivalent
Replace, improve etc., within the scope of should be included in claims hereof.
Claims (10)
1. it is a kind of to put plating appts, it is characterised in that including being provided with the matrix part of lateral surface and medial surface, being opened in the lateral surface
The fluting of middle part and some points for being through to the medial surface and being formed from the fluting plate mouth, and the point plating is intraoral to be set
There is jube, the point is plated mouth and is separated at least two runners by the jube.
2. it is as claimed in claim 1 to put plating appts, it is characterised in that the medial surface correspondence point plating mouth in described matrix portion sets
There are some guiding gutters, the guiding gutter is in horn-like structure, the opening of the guiding gutter connection point plating mouth side is less than institute
State the opening of guiding gutter opposite side.
3. it is as claimed in claim 2 to put plating appts, it is characterised in that the jube is located at the medial surface from the point plating mouth
One end extends towards the fluting direction, and the end of the jube has distance with the face residing for the fluting.
4. it is as claimed in claim 3 to put plating appts, it is characterised in that the point plates mouth and is in the combination of described fluting one end
Integrally, do not separated by the jube.
5. it is as claimed in claim 1 to put plating appts, it is characterised in that the jube is located at the centre of the point plating mouth, described
There is distance in the two ends of point plating mouth, point plating mouth combination at two ends is integrated with the jube, not by it is described every
Column separates.
6. it is as claimed in claim 1 to put plating appts, it is characterised in that the periphery for being recessed at the point plating mouth is provided with some
Locating dowel.
7. it is as claimed in claim 1 to put plating appts, it is characterised in that the point is plated mouth one by the jube in vertical direction
It is divided into two formation, two runners.
8. it is as claimed in claim 1 to put plating appts, it is characterised in that the point is plated mouth one by the jube in the vertical direction
It is divided into two formation, two runners.
9. it is as claimed in claim 1 to put plating appts, it is characterised in that the jube constitutes " ten " font structure, by the point
One point of plating mouth is four four runners of formation.
10. point plating appts as described in claim any one of 1-9, it is characterised in that described plating appts are used for plated conductive
Terminal product, the conducting terminal includes some butts and the material strip for connecting as one some butt, the material
Take and be provided with location hole, some butt are provided with the plating area for needing plating, and the conducting terminal is covered on described
In fluting, the plating area is buckled into described to cover in the fluting towards the point plating mouth position by coating member
The another side of conducting terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710273032.2A CN106929891B (en) | 2017-04-24 | 2017-04-24 | Point plating appts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710273032.2A CN106929891B (en) | 2017-04-24 | 2017-04-24 | Point plating appts |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106929891A true CN106929891A (en) | 2017-07-07 |
| CN106929891B CN106929891B (en) | 2019-04-02 |
Family
ID=59438036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710273032.2A Active CN106929891B (en) | 2017-04-24 | 2017-04-24 | Point plating appts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106929891B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046389A (en) * | 1983-08-24 | 1985-03-13 | Hitachi Cable Ltd | Partial plating apparatus of strip like conductive material |
| CN201212064Y (en) * | 2008-06-26 | 2009-03-25 | 铜陵丰山三佳微电子有限公司 | Rolling electroplating equipment for lead frame |
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN203999865U (en) * | 2014-06-17 | 2014-12-10 | 于长弘 | Electroplate jig |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
| CN206828654U (en) * | 2017-04-24 | 2018-01-02 | 深圳市长盈精密技术股份有限公司 | Point plating appts |
-
2017
- 2017-04-24 CN CN201710273032.2A patent/CN106929891B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6046389A (en) * | 1983-08-24 | 1985-03-13 | Hitachi Cable Ltd | Partial plating apparatus of strip like conductive material |
| CN201212064Y (en) * | 2008-06-26 | 2009-03-25 | 铜陵丰山三佳微电子有限公司 | Rolling electroplating equipment for lead frame |
| CN101514466A (en) * | 2008-11-17 | 2009-08-26 | 郑建国 | Selective plating device |
| CN203487256U (en) * | 2013-10-12 | 2014-03-19 | 普瑞迅金属表面处理（苏州）有限公司 | Spot plating wheel |
| CN203999865U (en) * | 2014-06-17 | 2014-12-10 | 于长弘 | Electroplate jig |
| CN205329183U (en) * | 2015-12-08 | 2016-06-22 | 厦门冠通电子科技有限公司 | Point of lead frame plates mechanism |
| CN206828654U (en) * | 2017-04-24 | 2018-01-02 | 深圳市长盈精密技术股份有限公司 | Point plating appts |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106929891B (en) | 2019-04-02 |
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