CN106928659A - 一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料及其制备方法 - Google Patents
一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料及其制备方法 Download PDFInfo
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- CN106928659A CN106928659A CN201710154232.6A CN201710154232A CN106928659A CN 106928659 A CN106928659 A CN 106928659A CN 201710154232 A CN201710154232 A CN 201710154232A CN 106928659 A CN106928659 A CN 106928659A
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- aryl ether
- epoxy acrylate
- composite material
- nano
- silica
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 103
- 239000002131 composite material Substances 0.000 title claims abstract description 41
- 239000000377 silicon dioxide Substances 0.000 title claims abstract description 36
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 7
- 238000002360 preparation method Methods 0.000 title claims description 24
- 235000012239 silicon dioxide Nutrition 0.000 title abstract description 20
- -1 bisphenol compound Chemical class 0.000 claims abstract description 45
- 229930185605 Bisphenol Natural products 0.000 claims abstract description 23
- 239000004593 Epoxy Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims abstract description 4
- 150000008378 aryl ethers Chemical class 0.000 claims description 42
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Natural products CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 41
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 39
- 238000000576 coating method Methods 0.000 claims description 36
- 238000010438 heat treatment Methods 0.000 claims description 25
- 239000002105 nanoparticle Substances 0.000 claims description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N 1,4-Benzenediol Natural products OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 21
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 18
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000002156 mixing Methods 0.000 claims description 18
- 238000000016 photochemical curing Methods 0.000 claims description 18
- 239000002904 solvent Substances 0.000 claims description 17
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical group CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 16
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 15
- 239000003999 initiator Substances 0.000 claims description 15
- 150000001875 compounds Chemical class 0.000 claims description 14
- 238000001035 drying Methods 0.000 claims description 12
- 238000005406 washing Methods 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 238000005299 abrasion Methods 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000002798 polar solvent Substances 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- 238000002390 rotary evaporation Methods 0.000 claims description 7
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 claims description 6
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- HKCNCNXZAZPKDZ-UHFFFAOYSA-N (4,4-difluorocyclohexa-1,5-dien-1-yl)-phenylmethanone Chemical compound C1=CC(F)(F)CC=C1C(=O)C1=CC=CC=C1 HKCNCNXZAZPKDZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000012024 dehydrating agents Substances 0.000 claims description 5
- 239000003112 inhibitor Substances 0.000 claims description 5
- 238000003760 magnetic stirring Methods 0.000 claims description 5
- 238000009210 therapy by ultrasound Methods 0.000 claims description 5
- HIXDQWDOVZUNNA-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-hydroxy-7-methoxychromen-4-one Chemical compound C=1C(OC)=CC(O)=C(C(C=2)=O)C=1OC=2C1=CC=C(OC)C(OC)=C1 HIXDQWDOVZUNNA-UHFFFAOYSA-N 0.000 claims description 4
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 claims description 4
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 4
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 4
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 4
- 150000001555 benzenes Chemical class 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 4
- 238000009835 boiling Methods 0.000 claims description 4
- 238000001704 evaporation Methods 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- PCILLCXFKWDRMK-UHFFFAOYSA-N naphthalene-1,4-diol Chemical compound C1=CC=C2C(O)=CC=C(O)C2=C1 PCILLCXFKWDRMK-UHFFFAOYSA-N 0.000 claims description 4
- 239000003960 organic solvent Substances 0.000 claims description 4
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 4
- 150000003457 sulfones Chemical class 0.000 claims description 4
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 claims description 3
- ZXDDPOHVAMWLBH-UHFFFAOYSA-N 2,4-Dihydroxybenzophenone Chemical compound OC1=CC(O)=CC=C1C(=O)C1=CC=CC=C1 ZXDDPOHVAMWLBH-UHFFFAOYSA-N 0.000 claims description 3
- 239000012295 chemical reaction liquid Substances 0.000 claims description 3
- 238000001723 curing Methods 0.000 claims description 3
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 claims description 3
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 claims description 3
- 239000012279 sodium borohydride Substances 0.000 claims description 3
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 3
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims description 3
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 claims description 2
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 claims description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 claims description 2
- DZZAHLOABNWIFA-UHFFFAOYSA-N 2-butoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCCCC)C(=O)C1=CC=CC=C1 DZZAHLOABNWIFA-UHFFFAOYSA-N 0.000 claims description 2
- LRWZZZWJMFNZIK-UHFFFAOYSA-N 2-chloro-3-methyloxirane Chemical compound CC1OC1Cl LRWZZZWJMFNZIK-UHFFFAOYSA-N 0.000 claims description 2
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 claims description 2
- LOSLJXKHQKRRFN-UHFFFAOYSA-N 2-trimethoxysilylethanethiol Chemical compound CO[Si](OC)(OC)CCS LOSLJXKHQKRRFN-UHFFFAOYSA-N 0.000 claims description 2
- CTZNQVLWPQTTLU-UHFFFAOYSA-N 3-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenol Chemical compound OC1=CC=CC(C(C(F)(F)F)C(F)(F)F)=C1 CTZNQVLWPQTTLU-UHFFFAOYSA-N 0.000 claims description 2
- MPWGZBWDLMDIHO-UHFFFAOYSA-N 3-propylphenol Chemical compound CCCC1=CC=CC(O)=C1 MPWGZBWDLMDIHO-UHFFFAOYSA-N 0.000 claims description 2
- LKJWDWUXGCKFPN-UHFFFAOYSA-N 4-(1,1,1,3,3,3-hexafluoropropan-2-yl)phenol Chemical compound OC1=CC=C(C(C(F)(F)F)C(F)(F)F)C=C1 LKJWDWUXGCKFPN-UHFFFAOYSA-N 0.000 claims description 2
- LMAFAQBMCIYHQS-UHFFFAOYSA-N 4-trimethoxysilylbutane-1-thiol Chemical compound CO[Si](OC)(OC)CCCCS LMAFAQBMCIYHQS-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 238000005336 cracking Methods 0.000 claims description 2
- 238000006356 dehydrogenation reaction Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
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- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 claims description 2
- 239000003495 polar organic solvent Substances 0.000 claims description 2
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- 239000001294 propane Substances 0.000 claims description 2
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 2
- QJOOZNCPHALTKK-UHFFFAOYSA-N trimethoxysilylmethanethiol Chemical compound CO[Si](CS)(OC)OC QJOOZNCPHALTKK-UHFFFAOYSA-N 0.000 claims description 2
- 229910000288 alkali metal carbonate Inorganic materials 0.000 claims 1
- 150000008041 alkali metal carbonates Chemical class 0.000 claims 1
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 claims 1
- 125000003944 tolyl group Chemical group 0.000 claims 1
- 239000005543 nano-size silicon particle Substances 0.000 abstract description 18
- 239000000126 substance Substances 0.000 abstract description 4
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- 125000005396 acrylic acid ester group Chemical group 0.000 abstract 1
- 239000012675 alcoholic extract Substances 0.000 abstract 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 1
- 238000006467 substitution reaction Methods 0.000 abstract 1
- 125000003396 thiol group Chemical group [H]S* 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 26
- 239000000047 product Substances 0.000 description 19
- 239000003822 epoxy resin Substances 0.000 description 16
- 229920000647 polyepoxide Polymers 0.000 description 16
- 239000000843 powder Substances 0.000 description 13
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
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- 239000007788 liquid Substances 0.000 description 7
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- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 6
- 0 Cc(cc1)ccc1OCC1CCCC[*+](CC(CO*(*=C)=O)[N+]([O-])=O)CCCC1 Chemical compound Cc(cc1)ccc1OCC1CCCC[*+](CC(CO*(*=C)=O)[N+]([O-])=O)CCCC1 0.000 description 5
- 238000010907 mechanical stirring Methods 0.000 description 5
- 239000012074 organic phase Substances 0.000 description 5
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- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 3
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- BSDQITJYKQHXQR-UHFFFAOYSA-N methyl prop-2-eneperoxoate Chemical compound COOC(=O)C=C BSDQITJYKQHXQR-UHFFFAOYSA-N 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- DECHJJJXDGPZHY-UHFFFAOYSA-N 3-tripropoxysilylpropane-1-thiol Chemical compound CCCO[Si](CCCS)(OCCC)OCCC DECHJJJXDGPZHY-UHFFFAOYSA-N 0.000 description 1
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
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- 239000007806 chemical reaction intermediate Substances 0.000 description 1
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- 239000007822 coupling agent Substances 0.000 description 1
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- 125000005442 diisocyanate group Chemical group 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
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- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 239000000543 intermediate Substances 0.000 description 1
- BUZRAOJSFRKWPD-UHFFFAOYSA-N isocyanatosilane Chemical class [SiH3]N=C=O BUZRAOJSFRKWPD-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
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- 238000001308 synthesis method Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
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Abstract
本发明公开了一种芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料及其制备方法和用途。基于取代反应合成芳醚酮链段的双酚化合物,经羰基的还原、酚羟基环氧丙烯酸化、醇羟基的异氰酸酯基桥接,制备出四官能度的环氧丙烯酸酯化合物,再混入巯基改性的纳米二氧化硅粒子,紫外光固化制备得到一种芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料;本发明的方法操作简单,方便易行。与纯丙烯酸酯材料相比,该复合材料紫外光固化后具有高耐磨性、高硬度和优异热/化学稳定性等优点,有着广阔的工业应用前景。
Description
技术领域
本发明属于无机/有机高分子复合材料领域,具体涉及到一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料及其制备方法。
背景技术
随着社会的发展以及电子电器等高端市场需求的提升,现有环氧丙烯酸光固化树脂表现出的硬度偏低、表面容易被刮擦、耐磨损性差、易吸水和耐溶剂性能差等缺点日益凸显,为此,亟需研发出一系列耐高温耐磨等高性能光固化树脂,以满足高端市场需求。由于纳米材料具有较为特殊的性能,在涂料中加入无机纳米粒子后可大幅度提高涂层的耐磨性,还可显著提高材料的耐热性、抗氧化性等性能,其应用前景十分广阔。但是纳米粒子在涂料中存在容易出现团聚,不易分散,难以稳定等问题,因此通过有机-无机杂化方式来提高纳米粒子与树脂的相容性,同时提高涂料的耐热耐磨性能,颇具吸引力。李宏涛等[紫外光固化涂料耐磨性的研究。河北化工,2005,4,42]通过向聚氨酯丙烯酸酯中添加纳米二氧化硅提高涂料的耐磨性,当二氧化硅含量增加到10%以后,二氧化硅颗粒开始团聚,导致涂料的耐磨性减弱。FrankBauera等[Trialkoxysilane graftingontonanoparticles forthe preparation of clear coat polyacrylate systems with excellent scratchperformance.Progress in Organic Coatings,2003,47,147]通过纳米二氧化硅与含硅甲氧基丙烯酸酯单体反应制备改性二氧化硅纳米粒子,与常规聚氨酯型丙烯酸酯低聚物有良好的相容性,其复合涂层当杂化纳米二氧化硅质量分数为35%时,涂膜磨损量从68mg降低到20mg。R.D.Toker等[UV-curable nano-silver containing polyurethane basedorganic–inorganic hybrid coatings.Progress in Organic Coatings,2013,76,1243]使用HEPMPO改性异氰酸酯基硅烷制得有机无机杂化甲氧基硅烷MSTPOU,以聚氨酯丙烯酸酯为主低聚物,使用三甲氧基乙烯基硅烷(MPTMS)和制备的有机无机杂化硅烷为偶联剂制备光固化树脂,以纳米银粉为耐磨粒子,结果表明加入硅烷偶联剂可提高涂膜的硬度、耐磨性和耐热性,加入纳米银粉也可以提高涂膜的硬度和耐磨性。目前,已见于报道的主要为杂化硅烷改性的丙烯酸酯单体,涂料的耐磨性能虽有所改善,但耐热性能和综合性能还有待进一步提升。迄今为止,本发明的一种耐磨可光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料其结构和制备方法,尚未见公开出版报道。
发明内容
本发明的第一个目的是在于提供一种新型结构、具有优异耐磨性能和良好热稳定性和化学稳定性的芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料。
本发明的第二个目的是在于提供一种可光固化的芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料。
本发明的第三个目的是在于提供一种步骤简单、操作便捷制备芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的方法。
本发明的第四个目的是在于提供所述芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料在耐磨涂层方面的应用,涂层硬度大、耐磨损性优,可重复使用,具有广泛应用前景。
本发明提供了一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,包含具有式I结构四官能度芳醚基环氧丙烯酸酯低聚物:
其中,-X-表示结构单元: 中任意一种;
其中,为结构单元 中一种或几种;
本发明提供的一种耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,还包含具有式II结构的巯基改性二氧化硅纳米粒子:
其中,-R-为结构单元-CH2-、-CH2-CH2-、-CH2-CH2-CH2-、-CH2-CH2-CH2-CH2-中的一种;其中,表示二氧化硅纳米粒子;
本发明提供的一种耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,所述的纳米二氧化硅粒子尺寸为10~200纳米。
本发明还提供了一种耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,具体是;
第一步:将摩尔比为2:1的芳香双酚单体、4,4-二氟二苯甲酮,加入催化剂混合均匀,并加入高沸点溶剂和共沸脱水剂,于150~200℃下进行溶液缩聚反应,聚合1~8h后,将溶液沉降到水中,经过滤、研磨、洗涤和干燥制得具有如下结构的酚羟基封端的芳醚酮化合物;
使用的芳香双酚单体是对苯二酚、间苯二酚、1,4-萘二酚、1,5-萘二酚、2,6-萘二酚、3,3’-联苯二酚、4,4’-联苯二酚、3,3’-二羟基二苯醚、4,4’-二羟基二苯醚、3,3’-二羟基二苯硫醚、4,4’-二羟基二苯硫醚、3,3’-二羟基二苯酮、4,4’-二羟基二苯酮、3,3’-二羟基二苯甲烷、4,4’-二羟基二苯甲烷、2,2–双(3-羟基苯基)丙烷、2,2-双(4-羟基苯基)丙烷、3,3’-二羟基二苯砜、4,4’-二羟基二苯砜、2,2’-双(3-羟基苯基)六氟丙烷和2,2’-双(4-羟基苯基)六氟丙烷中的任意一种或几种;
使用的催化剂为无水的碱金属或碱土金属碳酸盐;其中的高沸点溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)或环丁砜等非质子型极性有机溶剂,优选为N,N-二甲基乙酰胺;使用的共沸脱水剂为卤代苯或烷基苯等与水不互溶的有机溶剂,优选为甲苯;
第二步:将(1)制备的羟基封端的芳醚酮化合物溶解于极性溶剂,加入等摩尔量NaBH4在搅拌下加热升温至100~150℃,反应2~12h。反应液经萃取、洗涤,旋蒸除去溶剂、干燥制得具有如下结构的酚羟基封端的芳醚醇化合物;
其中,为结构单元 中一种或几种;
第三步:将(2)制备的酚羟基封端的芳醚醇化合物和计量比的环氧氯丙烷混合均匀,滴入1~2倍摩尔量的氢氧化钠溶液(质量分数40%),40~60℃下反应2~20h。反应液经萃取、洗涤、旋蒸除去溶剂、干燥制得具有如下结构的环氧基封端的芳醚醇化合物;
其中,为结构单元、 中一种或几种;
第四步:将(3)制备的环氧基封端的芳醚醇化合物,芳香二异氰酸酯NCO-X-CNO,按摩尔比2:1混合均匀,升温至60~120℃,反应5-12h,制备得具有如下结构的四官能度的芳醚基环氧树脂;
其中,-X-表示结构单元: 中任意一种;其中的芳香二异氰酸酯NCO-X-CNO单体是对苯二异氰酸酯、2,6-萘二异氰酸酯、4,4’-联苯二异氰酸酯、4,4’-二异氰酸酯二苯醚、4,4’-二异氰酸酯二苯硫醚、4,4’-二异氰酸酯二苯酮、4,4’-二异氰酸酯二苯甲烷和2,2’-双(4-异氰酸酯苯基)丙烷中的任意一种或几种;
第五步:将(4)制备的四官能度的芳醚基环氧低聚物,混入极性溶剂中,滴加丙烯酸,催化剂和阻聚剂,升温至60~80℃,反应2-12h,制得具有如下结构的四官能度芳醚基环氧丙烯酸酯树脂:
第六步:将纳米二氧化硅粒子(10~200纳米)与巯烷基三甲氧基硅烷混合均匀,加入极性溶剂和带水剂,加热到80~120℃反应2~20h,产物经过滤、洗涤、干燥后制得具有如下结构的巯基改性二氧化硅纳米粒子:
其中,-R-为结构单元-CH2-、-CH2-CH2-、-CH2-CH2-CH2-、-CH2-CH2-CH2-CH2-中的一种;其中,表示二氧化硅纳米粒子;
其中的巯烷基三甲氧基硅烷是巯甲基三甲氧基硅烷、巯乙基三甲氧基硅烷、巯丙基三甲氧基硅烷和巯丁基三甲氧基硅烷中的任意一种;其中的极性溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)或二甲基亚砜(DMSO)中任意一种;其中的带水剂为卤代苯或烷基苯等与水不互溶的有机溶剂,优选为甲苯;
第七步:将(5)制备的四官能度芳醚基环氧丙烯酸酯低聚物、和(6)制备的巯基改性二氧化硅纳米粒子和紫外光引发剂用磁搅混合均匀,至紫外光引发剂溶解,再在超声振荡器中超声2~8h至二氧化硅纳米粒子分散均匀,经紫外光固化制得耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料。
本发明所提供的耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,所述的紫外光引发剂为裂解型自由基引发剂或夺氢型自由基引发剂,包括安息香双甲醚、安息香乙醚、安息香异丙醚、安息香丁醚、二苯甲酮、2,4-二羟基二苯甲酮、米蚩酮、硫代丙氧基硫杂蒽酮、异丙基硫杂蒽酮的一种或几种;
本发明提供的耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,其组成按如下重量比例,四官能度芳醚基环氧丙烯酸酯低聚物70~90%,巯基改性二氧化硅纳米粒子1~10%和自由基紫外光引发剂1~5%。
本发明的有益效果在于本发明首次通过分子设计,在环氧丙烯酸酯骨架上引入高热稳定性的芳醚酮单元,同时利用酮的还原再采用双异氰酸酯来偶联,制备获得新型的具有高紫外光固化活性、四官能度的环氧丙烯酸酯低聚物,并在紫外光作用下与巯基改性二氧化硅纳米粒子反应,制得一类光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料。
本发明的光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,芳醚链段和巯基改性纳米二氧化硅的引入可提高涂层的交联度,与商品环氧丙烯酸酯等传统孔材料相比,具有相对较高的热化学稳定性和耐摩擦磨损性能,可重复安全利用。
本发明的有益效果在于通过化学键合的方法引入纳米二氧化硅复合材料,可以有效提高无机纳米粒子的相容性,有效避免相分离,进而提高其增强改性效果。
本发明的有益效果还在于该芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料具有高的疏水性和附着力,可广泛应用于耐磨涂层、疏水涂料等诸多领域,特别适合于金属、光学器件和木质地板等的保护和修复。
本发明的另外一个有益效果在于本发明的耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料合成方法步骤简单,方便可行,可工业化应用。
附图说明
【图1】为实施例1中光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料及其中间体的红外光谱图。其中,PDMS-OH代表实施例1中基于对苯二酚的含芳醚醇双酚;PDMS-epoxy代表实施例1中基于对苯二酚的含芳醚醇双环氧化合物;PDMS-NCO代表实施例1中聚氨酯桥接含芳醚环氧树脂;PDMS-acrylate代表实施例1中聚氨酯桥接的含芳醚环氧丙烯酸酯树脂)
【图2】为实施例1中光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的扫描电镜SEM图。
表1实施例涂层的附着力和硬度
具体实施方式
以下实施例是对本发明内容的进一步说明,而不是限制本发明的保护范围。
本发明具体实施方式反应中间产物结构测试在下列仪器上进行:在Nicolet-20DXB型红外光谱仪上进行FT-IR测试,用KBr压片法制样;形貌观察在FEI Quanta-200型扫描电镜(SEM)上进行,分辨率:3nm,扫描电压为10KV;测试前先对样品进行喷金处理。
实施例1对苯二酚型光固化环氧丙烯酸酯/纳米二氧化硅复合材料
(1)基于对苯二酚的含芳醚酮双酚的制备:在配有冷凝管,分水器,机械搅拌和N2导管的干燥三口烧瓶中,加入对苯二酚160mmol,4,4-二氟二苯甲酮80mmol,碳酸钾192mmol,160mLDMSO和20mL甲苯。在N2的保护下加热至反应物溶解,于150℃下回流脱水2h,后蒸出带水剂,在175℃下反应10h。产物沉降于1000mL蒸馏水中、过滤后经60℃下真空干燥48h,得到黄白色粉末状含芳醚酮链段的双酚,产率为96%。
(2)基于对苯二酚的含芳醚醇双酚的制备:在干燥三口烧瓶中,加入50mL DMAc,120mmol NaBH4,装配冷凝管,克莱森接头,机械搅拌和N2导入管,在搅拌下加热升温至120℃,后逐滴加入80mmol含芳醚酮链段的双酚的DMAc溶液,反应12h。反应结束后,在冷却至室温的反应物溶液中加入200mL甲醇得浑浊液,过滤同时用含少量盐酸的蒸馏水500mL洗涤,经60℃下真空干燥48h,得到棕黄色粉末状羟基化改性产物(PDMS-OH),产率为94%。
(3)基于对苯二酚的含芳醚醇双环氧化合物的制备:在干燥烧瓶中,将80mmol基于对苯二酚的含芳醚醇双酚和200mL环氧氯丙烷混合均匀,升温至48℃,恒压滴入12mL新制NaOH水溶液(质量分数为40%)。升温至53℃,反应12h。产物用少量氯仿和适量蒸馏水萃取三次,取有机相,在90℃下旋蒸除去溶剂,经60℃下真空干燥48h,得淡黄色粉末环氧树脂(PDMS-epoxy),产率为96%。
(4)聚氨酯桥接含芳醚环氧树脂的制备:在干燥三口烧瓶中加入溶剂二氧六环(干燥,质量分数为总反应物的50%),对苯二异氰酸酯和基于对苯二酚的含芳醚醇双环氧化合物(摩尔比NCO:OH=1:1),装配回流管,机械搅拌和N2导入管,后缓慢升温至80℃,反应12h。得淡黄色聚氨酯改性的环氧树脂(PDMS-NCO)。反应终点可通过二正丁胺法测定异氰酸酯基含量不变来判断。
(5)基于对苯二酚的含芳醚醇双环氧丙烯酸酯的制备:在干燥三口烧瓶中,加入上述环氧树脂10g,二氧六环20mL,升温至100℃至粉末溶解,后降温至60℃,用恒压滴液漏斗滴加丙烯酸(摩尔数为环氧基的1.05倍),催化剂(四丁基溴化铵,质量为环氧封端低聚物的2%),阻聚剂(对羟基苯甲醚,质量为环氧封端低聚物的0.5%)的混合液体,后升温至100℃,反应24h,得淡黄色粘稠状丙烯酸酯液体(PDMS-acrylate)。
(6)10g二氧化硅粒子(直径15nm)在110℃下真空干燥15h后放入干燥三口烧瓶中,加入200mL甲苯(干燥除水)和15mL巯丙基三甲氧基硅烷,后回流反应20h,产物经过滤后用大量甲苯冲洗,洗去未反应的巯丙基三甲氧基硅烷后于真空110℃下干燥24h得白色粉末产物。
(7)将上述基于对苯二酚的含芳醚醇双环氧丙烯酸酯90g与光引发剂2,4-二羟基二苯甲酮(质量分数为2%)和10g的巯基功能化二氧化硅纳米粒子用磁搅混合均匀,至引发剂溶解,再超声2h至纳米二氧化硅分散均匀。后用线性涂布器在玻璃板或铁板上进行涂布制备湿涂层,湿涂层在紫外灯(主波长:365nm,功率:1000W,湿涂层和紫外灯之间的距离为10cm)下照射3分钟,聚合形成固态涂层;
实施例2双酚A型光固化环氧丙烯酸酯/纳米二氧化硅复合材料
(1)基于双酚A的含芳醚酮双酚的制备:在装配有回流式冷凝管,分水器,机械搅拌和N2导入管的干燥三口烧瓶中,加入双酚A 160mmol,4,4-二氟二苯甲酮80mmol,碳酸钾200mmol,160mL DMSO和120mL甲苯。在N2的保护下加热至反应物溶解,于150℃下回流脱水2h,后蒸出带水剂,在175℃下反应10h。产物沉降于1000mL蒸馏水中、过滤后经60℃下真空干燥48h,得到白色粉末状含芳醚酮链段的双酚,产率为94%。
(2)基于双酚A的含芳醚醇双酚的制备:120mmol NaBH4加入到50mLDMAc中,搅拌混合均匀。加热升温至120℃,滴入80mmol含芳醚酮链段的双酚的DMAc溶液,反应12h。结束后冷却至室温,将反应物溶液沉降于200mL甲醇中,过滤同时用含几滴盐酸的蒸馏水500mL洗涤,经60℃下真空干燥48h,得到黄色粉末状羟基化改性产物,产率为94%。
(3)基于双酚A的含芳醚醇双环氧化合物的制备:在干燥烧瓶中,将80mmol基于双酚A的含芳醚醇双酚和200mL环氧氯丙烷混合均匀,升温至50℃,恒压滴入12mL新制NaOH水溶液(质量分数为40%)。升温至60℃,反应10h。产物用少量氯仿和适量蒸馏水萃取三次,取有机相,在90℃下旋蒸除去溶剂,经60℃下真空干燥48h,得浅黄色粉末环氧树脂,产率为96%。
(4)聚氨酯桥接含芳醚环氧树脂的制备:在干燥三口烧瓶中加入溶剂二氧六环(干燥,质量分数为总反应物的50%),摩尔比为1:1的4,4’-二异氰酸酯二苯醚和4,4’-二异氰酸酯二苯甲烷,以及基于双酚A的含芳醚醇双环氧化合物(控制摩尔比NCO:OH=1:1),装配回流管,机械搅拌和N2导入管,后缓慢升温至80℃,反应12h。得淡黄色1聚氨酯改性的环氧树脂。反应终点可通过二正丁胺法测定异氰酸酯基含量不变来判断。
(5)基于双酚A的含芳醚醇双环氧丙烯酸酯的制备:在干燥三口烧瓶中,加入上述环氧树脂10.2g,二氧六环20mL,升温至100℃至粉末溶解,后降温至60℃,用恒压滴液漏斗滴加丙烯酸(摩尔数为环氧基的1.05倍),催化剂(四丁基溴化铵,质量为环氧封端低聚物的2%),阻聚剂(对羟基苯甲醚,质量为环氧封端低聚物的0.5%)的混合液体,后升温至100℃,反应24h,得淡黄色粘稠状丙烯酸酯液体。
(6)10g二氧化硅粒子(直径15nm)在110℃下真空干燥15h后放入干燥三口烧瓶中,加入150mL甲苯(干燥除水)和15mL巯丙基三乙氧基硅烷,后回流反应20h,产物经过滤后用大量甲苯冲洗,洗去未反应的巯丙基三甲氧基硅烷后于真空110℃下干燥24h得白色粉末产物。
(7)将上述基于双酚A的含芳醚醇双环氧丙烯酸酯90g与光引发剂安息香异丙醚(质量分数为1.5%)和10g的巯基功能化二氧化硅纳米粒子用磁搅混合均匀,至引发剂溶解,再超声2h至纳米二氧化硅分散均匀。后用线性涂布器在玻璃板或铁板上进行涂布制备湿涂层,湿涂层在紫外灯(主波长:365nm,功率:1000W,湿涂层和紫外灯之间的距离为10cm)下照射5分钟,聚合形成固态涂层;
实施例3基于联苯二酚和双酚S型光固化环氧丙烯酸酯/纳米二氧化硅复合材料
(1)基于联苯二酚和双酚S的含芳醚酮双酚的制备:在干燥三口烧瓶中,加入联苯二酚80mmol和双酚S 80mmol,4,4-二氟二苯甲酮80mmol,碳酸钾200mmol,160mLDMSO和120mL甲苯混合均匀,在N2的保护下加热至反应物溶解,于150℃下回流脱水2h,后升温至175℃蒸出带水剂甲苯,并在175℃下反应10h。产物用少量氯仿和适量蒸馏水萃取三次,取有机相,在60℃下旋蒸除去溶剂,后在60℃下真空干燥48h,得到白色固体粉末含芳醚酮链段的双酚单体,产率为96%。
(2)基于联苯二酚和双酚S的含芳醚醇双酚的制备:在干燥三口烧瓶中,加入适量DMAc,120mmol NaBH4,装配冷凝管,克莱森接头,恒压滴液漏斗,机械搅拌和N2导入管,在搅拌下加热升温至120℃,后用恒压滴液漏斗逐滴加入含有80mmol含芳醚酮链段的双酚的DMAc溶液,反应12h。在冷至室温的反应物溶液中加少量氯仿分液,再用含适量蒸馏水(含有少量盐酸)洗涤,取有机相旋蒸除去溶剂。在60℃下真空干燥48h,得到棕黄色粉末状羟基化改性产物,产率为94%。
(3)基于联苯二酚和双酚S的含芳醚醇双环氧化合物的制备:在干燥三口烧瓶中,加入80mmol羟基化改性双酚单体和过量环氧氯丙烷200ml,装配回流管,机械搅拌和恒压滴液漏斗,配制质量分数为40%的含有8gNaOH(摩尔数为双酚的2.5倍)的水(体积12ml)溶液,倒入恒压滴液漏斗中。在缓慢搅拌下升温至48℃,后逐滴滴入NaOH水溶液,调节温度至53℃,反应12h。产物用少量氯仿和适量蒸馏水萃取三次,取下层有机相,在90℃下旋蒸除去溶剂,后在60℃下真空干燥48h,得淡黄色粉末环氧树脂,产率为96%。
(4)聚氨酯桥接含芳醚环氧树脂的制备:在干燥三口烧瓶中加入溶剂二氧六环(干燥,质量分数为总反应物的50%),4,4’-二异氰酸酯二苯硫醚和含芳醚醇链段的环氧树脂(摩尔比NCO:OH=1:1),装配回流管,机械搅拌和N2导入管,后缓慢升温至80℃,反应12h。得淡黄色有机硅聚氨酯改性的环氧树脂。反应终点可通过二正丁胺法测定异氰酸酯基含量不变来判断。
(5)基于联苯二酚和双酚S的含芳醚醇双环氧丙烯酸酯的制备:在干燥三口烧瓶中,加入上述制备的环氧树脂,二氧六环(质量等于环氧树脂的质量),装配回流管,机械搅拌和恒压滴液漏斗,升温至100℃至固体粉末溶解,后降温至60℃,用恒压滴液漏斗滴加丙烯酸(摩尔数为环氧基的1.05倍),催化剂(四丁基溴化铵,质量为环氧封端低聚物的2%),阻聚剂(对羟基苯甲醚,质量为环氧封端低聚物的0.5%)的混合液体,后升温至100℃,反应24h,得淡黄色粘稠状丙烯酸酯液体。
(6)10g二氧化硅粒子(直径15nm)在110℃下真空干燥15h后放入干燥三口烧瓶中,加入150mL甲苯(干燥除水)和15mL巯丙基三丙氧基硅烷,后回流反应20h,产物经过滤后用大量甲苯冲洗,洗去未反应的巯丙基三甲氧基硅烷后于真空110℃下干燥24h得白色粉末产物。
(7)将上述基于联苯二酚和双酚S的含芳醚醇双环氧丙烯酸酯90g与光引发剂硫代丙氧基硫杂蒽酮(质量分数为1.5%)和10g的巯基功能化二氧化硅纳米粒子用磁搅混合均匀,至引发剂溶解,再超声2h至纳米二氧化硅分散均匀。后用线性涂布器在玻璃板或铁板上进行涂布制备湿涂层,湿涂层在紫外灯(主波长:365nm,功率:1000W,湿涂层和紫外灯之间的距离为10cm)下照射5分钟,聚合形成固态涂层。
Claims (8)
1.一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,其特征在于,包含具有式I结构的芳醚基环氧丙烯酸酯:
其中,-X-表示结构单元: 中任意一种;
其中,为结构单元 中的一种或几种。
2.如权利要求1所述的一种高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,其特征在于,还包含具有式II结构的巯基改性二氧化硅纳米粒子:
其中,-R-为结构单元-CH2-、-CH2-CH2-、-CH2-CH2-CH2-、-CH2-CH2-CH2-CH2-中的一种;其中,表示二氧化硅纳米粒子。
3.如权利要求2所述的高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料,其特征在于,所述的纳米二氧化硅粒子尺寸为10~200纳米。
4.一种如权利要求1~3任一所述的高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,其特征在于,包含如下步骤;
(1):将摩尔比为2:1的芳香双酚单体、4,4-二氟二苯甲酮,加入催化剂混合均匀,并加入高沸点溶剂和共沸脱水剂,于150~200℃下进行溶液缩聚反应,聚合1~8小时后,将溶液沉降到水中,经过滤、研磨、洗涤和干燥制得具有如下结构的酚羟基封端的芳醚酮化合物:
所述芳香双酚单体是对苯二酚、间苯二酚、1,4-萘二酚、1,5-萘二酚、2,6-萘二酚、3,3’-联苯二酚、4,4’-联苯二酚、3,3’-二羟基二苯醚、4,4’-二羟基二苯醚、3,3’-二羟基二苯硫醚、4,4’-二羟基二苯硫醚、3,3’-二羟基二苯酮、4,4’-二羟基二苯酮、3,3’-二羟基二苯甲烷、4,4’-二羟基二苯甲烷、2,2–双(3-羟基苯基)丙烷、2,2-双(4-羟基苯基)丙烷、3,3’-二羟基二苯砜、4,4’-二羟基二苯砜、2,2’-双(3-羟基苯基)六氟丙烷和2,2’-双(4-羟基苯基)六氟丙烷中的任意一种或几种;
所述催化剂为无水的碱金属碳酸盐或碱土金属碳酸盐;所述高沸点溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)、二甲基亚砜(DMSO)、N-甲基吡咯烷酮(NMP)或环丁砜非质子型极性有机溶剂;所述共沸脱水剂为卤代苯或烷基苯与水不互溶的有机溶剂;
(2):将(1)制备的羟基封端的芳醚酮化合物溶解于极性溶剂,加入等摩尔量NaBH4在搅拌下加热升温至100~150℃,反应2~12h;反应液经萃取、洗涤,旋蒸除去溶剂、干燥制得具有如下结构的酚羟基封端的芳醚醇化合物:
其中,为结构单元 中一种或几种;
(3):将(2)制备的酚羟基封端的芳醚醇化合物和计量比的环氧氯丙烷混合均匀,滴入1~2倍摩尔量质量分数为40%的氢氧化钠溶液,40~60℃下反应2~20h;反应液经萃取、洗涤、旋蒸除去溶剂、干燥制得具有如下结构的环氧基封端的芳醚醇化合物:
其中,为结构单元、 中一种或几种;
(4):将(3)制备的环氧基封端的芳醚醇化合物,芳香二异氰酸酯NCO-X-CNO,按摩尔比2:1混合均匀,升温至60~120℃,反应5-12h,制备得具有如下结构的四官能度的芳醚基环氧化合物:
其中,-X-表示结构单元: 中任意一种;其中的芳香二异氰酸酯NCO-X-CNO单体选自对苯二异氰酸酯、2,6-萘二异氰酸酯、4,4’-联苯二异氰酸酯、4,4’-二异氰酸酯二苯醚、4,4’-二异氰酸酯二苯硫醚、4,4’-二异氰酸酯二苯酮、4,4’-二异氰酸酯二苯甲烷和2,2’-双(4-异氰酸酯苯基)丙烷中的任意一种或几种;
(5):将(4)制备的四官能度的芳醚基环氧低聚物,混入极性溶剂中,滴加丙烯酸,催化剂和阻聚剂,升温至60~80℃,反应2-12h,制得具有如下结构的四官能度芳醚基环氧丙烯酸酯化合物:
(6):将纳米二氧化硅粒子与巯烷基三甲氧基硅烷混合均匀,加入极性溶剂和带水剂,加热到80~120℃反应2~20h,产物经过滤、洗涤、干燥后制得具有如下结构的巯基改性二氧化硅纳米粒子:
其中,-R-为结构单元-CH2-、-CH2-CH2-、-CH2-CH2-CH2-、-CH2-CH2-CH2-CH2-中的一种;其中,表示二氧化硅纳米粒子;
所述的巯烷基三甲氧基硅烷选自巯甲基三甲氧基硅烷、巯乙基三甲氧基硅烷、巯丙基三甲氧基硅烷和巯丁基三甲氧基硅烷中的任意一种;所述的极性溶剂为N,N-二甲基甲酰胺(DMF)、N,N-二甲基乙酰胺(DMAc)或二甲基亚砜(DMSO)中任意一种;所述的带水剂为卤代苯或烷基苯等与水不互溶的有机溶剂;
(7):将(5)制备的四官能度芳醚基环氧丙烯酸酯低聚物、和(6)制备的巯基改性二氧化硅纳米粒子和紫外光引发剂用磁搅混合均匀,至紫外光引发剂溶解,再在超声振荡器中超声2~8h至二氧化硅纳米粒子分散均匀,经紫外光固化制得高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料。
5.如权利要求4所述的高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,其特征在于:步骤(1)中的催化剂优选为N,N-二甲基乙酰胺,共沸脱水剂优选为甲苯;步骤(6)中的带水剂优选为甲苯。
6.如权利要求4所述高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,其特征在于,所述的紫外光引发剂为裂解型自由基引发剂或夺氢型自由基引发剂,选自安息香双甲醚、安息香乙醚、安息香异丙醚、安息香丁醚、二苯甲酮、2,4-二羟基二苯甲酮、米蚩酮、硫代丙氧基硫杂蒽酮、异丙基硫杂蒽酮的一种或几种。
7.如权利要求4所述高耐磨光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料的制备方法,其特征在于,组成按如下重量比例,四官能度芳醚基环氧丙烯酸酯低聚物70~90%,巯基改性二氧化硅纳米粒子1~10%和自由基紫外光引发剂1~5%,其中重量比例是基于复合材料的总重量计。
8.如权利要求1~3任一所述的一种高耐磨可光固化芳醚基环氧丙烯酸酯/纳米二氧化硅复合材料在耐磨涂层方面的应用。
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