CN106883805A - A kind of thermal conductivity glue and its production and use - Google Patents
A kind of thermal conductivity glue and its production and use Download PDFInfo
- Publication number
- CN106883805A CN106883805A CN201710244142.6A CN201710244142A CN106883805A CN 106883805 A CN106883805 A CN 106883805A CN 201710244142 A CN201710244142 A CN 201710244142A CN 106883805 A CN106883805 A CN 106883805A
- Authority
- CN
- China
- Prior art keywords
- thermal conductivity
- conductivity glue
- mixture
- glue
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
The present invention relates to a kind of thermal conductivity glue and its production and use, the thermal conductivity glue includes following component in mass ratio：Epoxy resin 5%~20%；Low-melting alloy filler 75%~90%；Curing agent 1%~10%；Accelerator 0.1%~3%；Diluent 0.1%~10%, can also include film forming agent and thixotropic agent；Mixed by by each component, the mixture for obtaining obtains uniform pasty masses, as thermal conductivity glue through 3~5min of Vacuum Mixture.The thermal conductivity glue that the present invention is provided completes solidification and is capable of achieving good metallurgical interconnection at low temperature, therefore thermal conductivity glue of the invention not only has good Weldability, and with good thermal conductivity and conductivity.
Description
Technical field
The present invention relates to ic chip package field of material technology, and in particular to a kind of thermal conductivity glue and its preparation
Method and purposes, more particularly to a kind of low-melting alloy powder stuffing thermal conductivity glue and its production and use.
Background technology
It is physics mainly using the thermal conductivity powder stuffing such as argent, copper, between powder in traditional Electronic Packaging
Contact, has that thermal contact resistance and resistance are big, causes glue thermal conductivity and electrical conductivity not high, it is impossible to realize that excellent height is led
Conductance hot property.
Epoxy resin has excellent physical and mechanical properties and adhesive property, while it also has solidification temperature wide ranges,
Crosslink density is easily controllable, good electrical property, the characteristics of processing performance is good.But after epoxy resin cure the resistance to elevated temperatures of product compared with
Difference, is difficult to be used in hot environment, therefore hot setting is still a problem.
IC chip is often with tin cream, heat-conducting glue, conductive silver glue as brazing material.Current common lead-free tin cream material
In material, using halogen salt compounds as activating agent, welding activity is preferable, but the corrosivity of halogen is stronger, and easily makes resin
Oxidation stain at high temperature, makes welding residue color burn, and using organic acids such as succinic acid, solder wettability is poor, welding
Tin ball is more, and welding temperature is higher, is unsuitable for chip package；Heat-conducting glue thermal conductivity is small, and heat conductivility is poor；Conductive silver glue price
Expensive and easily light influence.
Thermal conductivity glue is the adhesive with certain conductive and heat conductivility after a kind of solidification, and it is generally filled out by conduction
The composition such as material, resin matrix and auxiliary agent.Resin matrix mainly plays bonding, and filler is used for forming conductive path.Matrix tree
Fat is mainly heat cured bisphenol A type epoxy resin, bisphenol F type resin and dicyclopentadiene-phepoxy epoxy resin etc..
Thermal conductivity glue plays heat conduction and the effect of conduction as the interconnection material in microelectronics Packaging field.Microelectronics is sealed
There is substantial amounts of miniature solder joint in dress, these solder joints affect the conductive interconnection between electronic component and base material.In welding process
In, conducting resinl plays a part of the fixation of electronic component, forms reliable solder joint.Improve the performance of conducting resinl to realizing component
High density, high accuracy, high reliability assembling have important effect.Therefore developing a class high heat-conductivity conducting glue meets electronics material
The active demand in market is expected, as scientific circles and industrial quarters all unusual concerns.
In order to solve the problems, such as the conductive interconnection poor performance that thermal conductivity glue is present, current some researchers have using increasing
The method of filled content greatly improves heat conductivility, but filer content high will bring cost higher；Resin matrix
Play a part of bonding in conducting resinl, therefore the content of increase filler will reduce resin content, so as to influence conducting resinl
Solderability；The increase of conductive adhesiveness can be caused simultaneously, the phenomenon such as can trail in high speed dispensing there may be wire drawing, be unfavorable for
The application of conducting resinl.These all limit the application of conducting resinl.
Therefore how researching and developing one kind can solidify so as to realize metallurgical interconnection and noresidue at a lower temperature, and have it
There is good electrical and thermal conductivity, the thermal conductivity glue for having preferable stability at room temperature has turned into the current focus studied.
The content of the invention
In order to solve the above technical problems, object of the present invention is to provide a kind of thermal conductivity glue and preparation method thereof and
Purposes, specifically provides a kind of thermal conductivity glue containing low-melting alloy powder stuffing and its production and use.
It is up to this purpose, present invention employs following technical scheme：
In a first aspect, the invention provides a kind of thermal conductivity glue, it includes following component in mass ratio：
Thermal conductivity glue of the invention completes solidification and is capable of achieving good metallurgical interconnection at low temperature, solves conventional pilot
It is main using thermal conductivity powder stuffings such as argent, copper in hot glue, simply physical contact, thermal contact resistance and resistance between powder
Big problem, therefore thermal conductivity glue of the invention not only has good Weldability, and with good thermal conductivity
Performance；Low-melting alloy powder stuffing thermal conductivity glue of the invention can keep desirable viscosity stability at room temperature.
In the present invention, mass ratio shared by the epoxy resin is 5%~20%, such as 5%, 6%, 8%, 10%,
11%th, 12%, 15%, 16%, 18% or 20%, preferably 8%~18%.
In the present invention, mass ratio shared by the low-melting alloy filler is 75%~90%, such as 75%, 76%,
78%th, 80%, 81%, 82%, 85%, 86%, 88% or 90%, preferably 78%~88%.
In the present invention, mass ratio shared by the curing agent is 1%~10%, such as 1%, 2%, 3%, 4%, 5%,
6%th, 7%, 8%, 9% or 10%, preferably 2%~6%.
In the present invention, mass ratio shared by the accelerator is 0.1%~3%, such as 0.1%, 0.2%, 0.3%,
0.5%th, 1%, 1.5%, 1.8%, 2%, 2.5% or 3%, preferably 0.15%~2.5%.
In the present invention, mass ratio shared by the diluent is 0.1%~10%, such as 0.1%, 0.2%, 0.3%,
0.5%th, 1%, 1.5%, 1.8%, 2%, 2.5%, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%,
7.2%th, 8.5%, 9% or 10%, preferably 0.2%~8%.
Preferably, the epoxy resin be bisphenol A type epoxy resin, bisphenol f type epoxy resin, aliphatic epoxy resin,
In acrylic modified epoxy resin or modifying epoxy resin by organosilicon any one or at least two mixture, wherein typical case
But nonrestrictive mixture is：Bisphenol A type epoxy resin and bisphenol f type epoxy resin；Aliphatic epoxy resin and acrylic acid
Modified epoxy.
After low-melting alloy powder stuffing thermal conductivity glue welding of the invention, epoxy resin completes solidification, forms thermosetting
Property solder joint, welding residue solves the problems, such as traditional tin cream film of flux residue；Low-melting alloy powder of the invention is filled out
After the glue welding of material thermal conductivity, epoxy resin has good mechanical performance, i.e., preferable shearing force and shearing after completing solidification
Intensity.
Preferably, the low-melting alloy filler at least contains SnBi, SnBiAg, SnBiCu, SnIn or SnInBi powder
In filler any one or at least two mixture, wherein typical but non-limiting mixture is：SnBi and SnBiAg；
SnBiAg and SnBiCu；SnIn and SnInBi, when being mixed using two of which alloy packing, preferably by its mass ratio control
System is 4:1~1:1, such as 4:1、4:2、4:3、1:1 etc., such as when the mixture using SnBi and SnBiAg, the matter of the two
Amount ratio can be 4:1、4:2、4:3、1:1；When the mixture using SnBiAg and SnBiCu, the mass ratio of the two is 4:1、4:
2、4:3、1:1 etc..
By introducing low-melting alloy or being mixed with the filler of low-melting alloy in the present invention, conventional pilot thermal conductivity is advantageously implemented
The metallurgical interconnection that electric glue cannot be realized, thermal contact resistance and resistance cause glue heat conduction to be led greatly between solution thermal conductivity glue filler
Problem electrically not high.
In addition to containing above-mentioned low-melting alloy filler, in filler can also contain Cu and/or Ag, but not as necessity into
Point.
Preferably, the particle diameter of the low-melting alloy filler be 2~50 μm, such as 2 μm, 5 μm, 8 μm, 10 μm, 15 μm, 22
μm, 25 μm, 28 μm, 30 μm, 32 μm, 35 μm, 40 μm, 42 μm, preferably 45 μm or 50 μm, 5~40 μm.
Preferably, the curing agent is imidazoles methyl hexahydrophthalic anhydride, 2-ethyl-4-methylimidazole, 2- undecyl miaows
In azoles or amine curing agent any one or at least two mixture, wherein typical but non-limiting mixture is：First
Base HHPA and 2-ethyl-4-methylimidazole；2-ethyl-4-methylimidazole and 2- undecyl imidazoles；2- ethyl -4- methyl
Imidazoles and 2- undecyl imidazoles or amine curing agent.
The present invention of content in to(for) curing agent is optimized, and is controlled in the range of 2%~6%, compared to it
During its content, its curing proceeding that can accelerate thermal conductivity glue, so as to help to realize curing reaction at low temperature.
Preferably, the accelerator is any one in triethylamine or diethyl tetramethyl imidazoles or two kinds of mixing
Thing, wherein typical but non-limiting mixture is：Imidazoles and triethylamine；Triethylamine and diethyl tetramethyl imidazoles.
Preferably, the diluent is BDO glycidol ether, neopentyl glycol glycidol ether, 1,6- hexylene glycols
Any one in diglycidyl ether, diethylene glycol glycidol ether or poly- hexanediol diglycidyl ether or at least two
Mixture, wherein typical but non-limiting mixture is：1,4- butanediols glycidol ether and neopentyl glycol glycidol ether；
Neopentyl glycol glycidol ether and 1,6 hexanediol diglycidylether；Diethylene glycol glycidol ether and poly- hexylene glycol two shrink
Glycerin ether.
Preferably, the thermal conductivity glue can also include thixotropic agent.
Preferably, the thixotropic agent be that rilanit special, ethylene be double stearic, in polyamides any one or at least
Two kinds of mixture, wherein typical but non-limiting mixture is：Rilanit special and ethylene are double stearic；Ethylene it is double stearic and
Polyamide；The double stearic and polyamides of rilanit special, ethylene.
Preferably, the mass ratio shared by the thixotropic agent be 0.1%~2%, such as 0.1%, 0.2%, 0.3%,
0.5%th, 1%, 1.5%, 1.8% or 2%, preferably 0.12%~1.8%.
Preferably, the thermal conductivity glue can also include film forming agent.
Preferably, the film forming agent is hydrogenated rosin, maleic rosin, newtrex, the modified maleic rosin of acrylic resin
In ester gum any one or at least two mixture, wherein typical but non-limiting mixture is：Hydrogenation
Rosin and maleic rosin；Maleic rosin and newtrex；Newtrex and the modified maleic rosin of acrylic resin.
Preferably, the mass ratio shared by the film forming agent be 0.1%~2%, such as 0.1%, 0.2%, 0.3%,
0.5%th, 1%, 1.5%, 1.8% or 2%, preferably 0.12%~1.8%.
Second aspect, present invention also offers a kind of preparation method of thermal conductivity glue as described in relation to the first aspect, its bag
Include following steps：
(1) by the epoxy resin of formula ratio, curing agent, accelerator and diluent and alternatively thixotropic agent and film forming agent with
Low-melting alloy filler mixes；
(2) by mixture through 3~5min of Vacuum Mixture, uniform pasty masses, as thermal conductivity glue are obtained.
The third aspect, present invention also offers a kind of purposes of thermal conductivity glue as described in relation to the first aspect, the purposes
It is to be used to the thermal conductivity glue encapsulate IC chip.
The thermal conductivity glue that the present invention is provided solidifies the metallurgical interconnection of realization and noresidue at a lower temperature, with good
Electrical and thermal conductivity performance, have preferable stability at room temperature, improve reliability, manufacturability and the thermal conductivity of conducting resinl
Property.
When the thermal conductivity glue is used to encapsulate IC chip, its solidification temperature is 160~180 DEG C.
Compared with prior art, the present invention at least has the advantages that：
(1) it is advantageously implemented conventional pilot by introducing low-melting alloy or being mixed with the filler of low-melting alloy in the present invention
The metallurgical interconnection that thermal conducting glue cannot be realized, thermal contact resistance and resistance cause glue to be led greatly between solution thermal conductivity glue filler
Electrical conductivity problem not high, it can be such that the thermal conductivity of the electrically and thermally conductive adhesive reaches more than 14.5W/ (mK), and resistivity exists
1.95×10-6Below；
(2) after low-melting alloy powder stuffing thermal conductivity glue welding of the invention, epoxy resin completes solidification, forms heat
Solidity solder joint, welding residue solves the problems, such as traditional tin cream film of flux residue；Low-melting alloy powder of the invention
After the welding of filler thermal conductivity glue, epoxy resin has good mechanical performance after completing solidification, and its shear strength is in 3.8MPa
More than, i.e., with preferable shearing force and shear strength.
Specific embodiment
For ease of understanding the present invention, it is as follows that the present invention enumerates embodiment.Those skilled in the art are it will be clearly understood that the implementation
Example is only to aid in understanding the present invention, is not construed as to concrete restriction of the invention.
Embodiment 1
A kind of thermal conductivity glue, it is made up of 85 parts of 15 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix is shunk by bisphenol A diglycidyl ether, methyl hexahydrophthalic anhydride, amine curing agent, neopentyl glycol
Glycerin ether, 1,6 hexanediol diglycidylether, rilanit special, diethyl tetramethyl imidazoles, newtrex and acrylic acid tree
The modified maleic rosin of fat compares 100 according to weight:80:2:1:1:2:1:1:1 mixes；Low-melting alloy filler be Cu, Ag,
SnBi, SnBiAg, SnBiCu and SnInBi filler powder compare 1 according to weight:1:80:20:5:5 mix.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, low-melting alloy filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform；
Slurry after step 3, batch mixing is gained thermal conductivity glue.
Embodiment 2
A kind of thermal conductivity glue, it is made up of 88 parts of 12 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix is by bisphenol A diglycidyl ether, methyl hexahydrophthalic anhydride, neopentyl glycol glycidol ether, 1,6-
Hexanediol diglycidyl ether, diethylene glycol glycidol ether, rilanit special, ethylene double tristearin, imidazoles, hydrogenated rosin, horses
It is 100 to carry out rosin according to weight ratio:85:2:1:1:2:1:2:1:1 mixes；Low-melting alloy filler be Cu, Ag, SnBi,
SnBiCu and SnIn filler powders compare 1 according to weight:1:60:20:5 mix.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform；
Slurry after step 3, batch mixing is gained thermal conductivity glue.
Embodiment 3
A kind of thermal conductivity glue, it is made up of 90 parts of 10 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix is by bisphenol f type epoxy resin, aliphatic epoxy resin, 2-ethyl-4-methylimidazole, 2- 11
Alkyl imidazole, 1,4- butanediols glycidol ether, neopentyl glycol glycidol ether, rilanit special, triethylamine, maleic rosin are pressed
It is 85 according to weight ratio:15:70:10:2:3:2:2:3 mix；Low-melting alloy filler be Cu, Ag, SnBiAg, SnBiCu and
SnIn filler powders compare 1 according to weight:1:75:25:5 mix.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform；
Slurry after step 3, batch mixing is gained conducting resinl.
Embodiment 4
A kind of thermal conductivity glue, it is made up of 82 parts of 18 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix shrinks sweet by modifying epoxy resin by organosilicon, methyl hexahydrophthalic anhydride, dicyandiamide, 1,4- butanediols
Oily ether, rilanit special, triethylamine, hydrogenated rosin are 100 according to weight ratio:75:2:2:2:1:1 mixes；Low melting point is closed
Golden filler compares 1 for Cu, Ag, SnBi, SnBiAg, SnBiCu and SnIn filler powder according to weight:1:80:20:5:5 conjunctions are formed.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform.
Slurry after step 3, batch mixing is gained thermal conductivity glue.
Embodiment 5
A kind of thermal conductivity glue, it is made up of 80 parts of 20 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix is by bisphenol f type epoxy resin, aliphatic epoxy resin, methyl hexahydrophthalic anhydride, 2- undecyls
Imidazoles, dicyandiamide, neopentyl glycol glycidol ether, rilanit special, diethyl tetramethyl imidazoles, newtrex are according to weight ratio
It is 80:20:75:2:1:2:3:1:2 mix；Low-melting alloy filler is Cu, Ag, SnBi, SnBiAg, SnBiCu and SnIn
Filler powder compares 1 according to weight:1:60:40:5:5 mix.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform；
Slurry after step 3, batch mixing is gained thermal conductivity glue.
Embodiment 6
A kind of thermal conductivity glue, it is made up of 82 parts of 8 parts of resin matrix and low-melting alloy filler according to the mass fraction；
Wherein resin matrix is by bisphenol f type epoxy resin, aliphatic epoxy resin, methyl hexahydrophthalic anhydride, 2- undecyls
Imidazoles, dicyandiamide, neopentyl glycol glycidol ether, rilanit special, diethyl tetramethyl imidazoles, newtrex are according to weight ratio
It is 80:20:75:2:1:2:3:1:2 mix；Low-melting alloy filler is SnBi and SnBiAg filler powders according to weight ratio
4:1 mixes.
The preparation method of the thermal conductivity glue, comprises the following steps：
Step one, filler and resin matrix are proportionally mixed；
Step 2, that mixing tank is put into batch mixer Vacuum Mixture is uniform；
Slurry after step 3, batch mixing is gained thermal conductivity glue.
Comparative example 1
Compared with Example 1, in addition to filler is only with Cu, other are same as Example 1.
Comparative example 2
Compared with Example 1, in addition to filler is only with Ag, other are same as Example 1.
Comparative example 3
Compared with Example 1, except filler compares 4 using Cu and Ag according to weight:The 1 mixing beyond the region of objective existence for obtaining, other and implementation
Example 1 is identical.
To embodiment 1~6 and obtained in comparative example 1~3, thermal conductivity glue carries out performance test, and its result is as shown in table 1.
Table 1
Be can be seen that in the present invention by introducing low-melting alloy or being mixed with low melting point by above-described embodiment and comparative example
The filler of alloy, is advantageously implemented the metallurgical interconnection that conventional thermal conductive conducting resinl cannot be realized, between solution thermal conductivity glue filler
Thermal contact resistance and resistance cause glue thermal conductivity and electrical conductivity problem not high greatly；Low-melting alloy powder stuffing of the invention
After the welding of thermal conductivity glue, epoxy resin completes solidification, forms thermosetting solder joint, and welding residue solves traditional tin cream
The problem of film of flux residue；After low-melting alloy powder stuffing thermal conductivity glue welding of the invention, epoxy resin completes solid
There is good mechanical performance, i.e., preferable shearing force and shear strength after change.
Applicant states that the present invention illustrates detailed process equipment of the invention and technological process by above-described embodiment,
But the invention is not limited in above-mentioned detailed process equipment and technological process, that is, do not mean that the present invention has to rely on above-mentioned detailed
Process equipment and technological process could be implemented.Person of ordinary skill in the field it will be clearly understood that any improvement in the present invention,
Addition, the selection of concrete mode to the equivalence replacement and auxiliary element of each raw material of product of the present invention etc., all fall within of the invention
Within the scope of protection domain and disclosure.
Claims (10)
1. a kind of thermal conductivity glue, it is characterised in that in mass ratio including following component：
2. thermal conductivity glue as claimed in claim 1, it is characterised in that the epoxy resin is bisphenol A type epoxy resin, double
It is any one in phenol F types epoxy resin, aliphatic epoxy resin, acrylic modified epoxy resin or modifying epoxy resin by organosilicon
Kind or at least two mixture；
Preferably, the mass ratio shared by the epoxy resin is 8%~18%.
3. thermal conductivity glue as claimed in claim 1 or 2, it is characterised in that the low-melting alloy filler at least contains
In SnBi, SnBiAg, SnBiCu, SnIn or SnInBi powder filler any one or at least two mixture；
Preferably, the low-melting alloy filler also contains Cu and/or Ag；
Preferably, the particle diameter of the low-melting alloy filler is 2~50 μm；
Preferably, the mass ratio shared by the low-melting alloy filler is 78%~88%.
4. the thermal conductivity glue as described in one of claim 1-3, it is characterised in that the curing agent is imidazole curing agent 2-
It is any one in ethyl -4-methylimidazole, 2- undecyl imidazoles, acid anhydride type curing agent methyl hexahydrophthalic anhydride or amine curing agent
Kind or at least two mixture；
Preferably, the mass ratio shared by the curing agent is 2%~6%.
5. the thermal conductivity glue as described in one of claim 1-4, it is characterised in that the accelerator is triethylamine or diethyl
The mixture of any one or two kinds in tetramethyl imidazoles；
Preferably, the mass ratio shared by the accelerator is 0.15%~2.5%.
6. the thermal conductivity glue as described in one of claim 1-5, it is characterised in that the diluent is that BDO shrinks
Glycerin ether, neopentyl glycol glycidol ether, 1,6 hexanediol diglycidylether, diethylene glycol glycidol ether or poly- hexylene glycol
In diglycidyl ether any one or at least two mixture；
Preferably, the mass ratio shared by the diluent is 0.2%~8%.
7. the thermal conductivity glue as described in one of claim 1-6, it is characterised in that the thermal conductivity glue also includes thixotroping
Agent；
Preferably, the thixotropic agent be that rilanit special, ethylene be double stearic, in polyamides any one or at least two
Mixture；
Preferably, the mass ratio shared by the thixotropic agent is 0.1%~2%；
Preferably, the thermal conductivity glue also includes film forming agent；
Preferably, the film forming agent is hydrogenated rosin, maleic rosin, newtrex, acrylic resin modified maleic rosin or pine
In fragrant glyceride any one or at least two mixture；
Preferably, the mass ratio shared by the film forming agent is 0.1%~2%.
8. the preparation method of the thermal conductivity glue as described in one of claim 1-7, it is characterised in that comprise the following steps：
(1) by epoxy resin, curing agent, accelerator and diluent and alternatively, thixotropic agent and film forming agent and low-melting alloy are filled out
Material mixing；
(2) by mixture through 3~5min of Vacuum Mixture, uniform pasty masses, as thermal conductivity glue are obtained.
9. the purposes of the thermal conductivity glue as described in one of claim 1-7, it is characterised in that be used for the thermal conductivity glue
Encapsulation IC chip.
10. purposes as claimed in claim 9, it is characterised in that be used to the thermal conductivity glue encapsulate IC chip
When, its solidification temperature is 160~180 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710244142.6A CN106883805A (en) | 2017-04-14 | 2017-04-14 | A kind of thermal conductivity glue and its production and use |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710244142.6A CN106883805A (en) | 2017-04-14 | 2017-04-14 | A kind of thermal conductivity glue and its production and use |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106883805A true CN106883805A (en) | 2017-06-23 |
Family
ID=59183302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710244142.6A Pending CN106883805A (en) | 2017-04-14 | 2017-04-14 | A kind of thermal conductivity glue and its production and use |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106883805A (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107825001A (en) * | 2017-11-22 | 2018-03-23 | 张家港市东大工业技术研究院 | Tin bismuth spray printing soldering paste that a kind of silver powder particles are modified and preparation method thereof |
| CN107999992A (en) * | 2017-12-05 | 2018-05-08 | 张家港市东大工业技术研究院 | Spray printing lead-free solder paste that a kind of organic polymer is modified and preparation method thereof |
| CN109054477A (en) * | 2018-07-12 | 2018-12-21 | 杨帮燕 | A kind of epoxy resin-matrix anti-static coatings |
| CN109273137A (en) * | 2018-09-30 | 2019-01-25 | 东莞市银屏电子科技有限公司 | A kind of solar energy HIT battery low-temperature conductive silver paste and preparation method thereof |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
| CN109929235A (en) * | 2019-03-03 | 2019-06-25 | 姜丽丽 | A kind of electric-conductivity heat-conductivity high carbon nano-complex and preparation method thereof |
| CN110144188A (en) * | 2019-05-30 | 2019-08-20 | 刘勇 | A kind of microelectronics Packaging epoxy resin-matrix conducting resinl |
| CN110964461A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Thermosetting anisotropic conductive adhesive and preparation method thereof |
| CN110964459A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Electron irradiation curing anisotropic conductive adhesive and preparation method thereof |
| CN110964469A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Anisotropic conductive adhesive and preparation method thereof |
| CN111040691A (en) * | 2019-11-29 | 2020-04-21 | 扬州富威尔复合材料有限公司 | Multi-component metal conductive adhesive based on different melting points and preparation method thereof |
| CN112080238A (en) * | 2020-09-07 | 2020-12-15 | 江苏矽时代材料科技有限公司 | Heat-conducting filling adhesive and preparation method and application thereof |
| CN112877039A (en) * | 2021-03-05 | 2021-06-01 | 江苏晶河电子科技有限公司 | High-performance single-component organic silicon modified epoxy heat conduction material and preparation method thereof |
| CN113337231A (en) * | 2021-06-01 | 2021-09-03 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
| CN114986019A (en) * | 2022-07-19 | 2022-09-02 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102144432A (en) * | 2008-09-05 | 2011-08-03 | 住友电木株式会社 | Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal |
| CN105081600A (en) * | 2015-07-24 | 2015-11-25 | 深圳市福英达工业技术有限公司 | Tin base brazing solder for packaging inverted LED chip and preparation method thereof |
| CN105473276A (en) * | 2013-08-06 | 2016-04-06 | 千住金属工业株式会社 | Conductive bonding agent and soldered joint |
-
2017
- 2017-04-14 CN CN201710244142.6A patent/CN106883805A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102144432A (en) * | 2008-09-05 | 2011-08-03 | 住友电木株式会社 | Electroconductive connecting material, method for connecting terminals to each other using the electroconductive connecting material, and method for manufacturing connecting terminal |
| CN105473276A (en) * | 2013-08-06 | 2016-04-06 | 千住金属工业株式会社 | Conductive bonding agent and soldered joint |
| CN105081600A (en) * | 2015-07-24 | 2015-11-25 | 深圳市福英达工业技术有限公司 | Tin base brazing solder for packaging inverted LED chip and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 潘江桥 等: "《航天电子互联技术》", 31 December 2015, 中国宇航出版社 * |
Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107825001A (en) * | 2017-11-22 | 2018-03-23 | 张家港市东大工业技术研究院 | Tin bismuth spray printing soldering paste that a kind of silver powder particles are modified and preparation method thereof |
| CN107825001B (en) * | 2017-11-22 | 2020-05-12 | 张家港市东大工业技术研究院 | Silver powder particle modified tin-bismuth jet printing soldering paste and preparation method thereof |
| CN107999992A (en) * | 2017-12-05 | 2018-05-08 | 张家港市东大工业技术研究院 | Spray printing lead-free solder paste that a kind of organic polymer is modified and preparation method thereof |
| CN109054477A (en) * | 2018-07-12 | 2018-12-21 | 杨帮燕 | A kind of epoxy resin-matrix anti-static coatings |
| CN109337625B (en) * | 2018-09-28 | 2022-04-22 | 北京理工大学珠海学院 | Low-temperature curing copper alloy conductive adhesive and preparation method thereof |
| CN109337625A (en) * | 2018-09-28 | 2019-02-15 | 北京理工大学珠海学院 | A kind of low-temperature setting copper alloy conducting resinl and preparation method thereof |
| CN110964459A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Electron irradiation curing anisotropic conductive adhesive and preparation method thereof |
| CN110964461A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Thermosetting anisotropic conductive adhesive and preparation method thereof |
| CN110964469A (en) * | 2018-09-29 | 2020-04-07 | 北京梦之墨科技有限公司 | Anisotropic conductive adhesive and preparation method thereof |
| CN109273137A (en) * | 2018-09-30 | 2019-01-25 | 东莞市银屏电子科技有限公司 | A kind of solar energy HIT battery low-temperature conductive silver paste and preparation method thereof |
| CN109929235A (en) * | 2019-03-03 | 2019-06-25 | 姜丽丽 | A kind of electric-conductivity heat-conductivity high carbon nano-complex and preparation method thereof |
| CN110144188A (en) * | 2019-05-30 | 2019-08-20 | 刘勇 | A kind of microelectronics Packaging epoxy resin-matrix conducting resinl |
| CN111040691A (en) * | 2019-11-29 | 2020-04-21 | 扬州富威尔复合材料有限公司 | Multi-component metal conductive adhesive based on different melting points and preparation method thereof |
| CN112080238A (en) * | 2020-09-07 | 2020-12-15 | 江苏矽时代材料科技有限公司 | Heat-conducting filling adhesive and preparation method and application thereof |
| CN112877039A (en) * | 2021-03-05 | 2021-06-01 | 江苏晶河电子科技有限公司 | High-performance single-component organic silicon modified epoxy heat conduction material and preparation method thereof |
| CN113337231A (en) * | 2021-06-01 | 2021-09-03 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
| CN113337231B (en) * | 2021-06-01 | 2022-10-04 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
| CN114986019A (en) * | 2022-07-19 | 2022-09-02 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
| CN114986019B (en) * | 2022-07-19 | 2023-09-29 | 深圳市聚峰锡制品有限公司 | Solder flux, preparation method thereof and solder |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106883805A (en) | A kind of thermal conductivity glue and its production and use | |
| CN107771354A (en) | Engineering polymers electron-like material | |
| CN102634313B (en) | Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof | |
| CN105081600A (en) | Tin base brazing solder for packaging inverted LED chip and preparation method thereof | |
| CN106281171B (en) | A kind of epoxy resin soldering flux, preparation method and application | |
| CN105684138B (en) | The manufacturing method of semiconductor component and semiconductor mounted article | |
| CN102086364A (en) | Conductive silver paste for microelectronic packaging and preparation method thereof | |
| CN100488704C (en) | Leadless alloy tin solder paste and manufacturing method thereof | |
| CN105255385B (en) | A kind of one-component high-performance conductive silver paste and preparation method thereof | |
| KR100953579B1 (en) | No flow underfill composition | |
| CN106624452A (en) | Solder paste and soldering flux, and mounted structure using same | |
| CN102002336A (en) | Solvent-free high-performance conductive adhesive | |
| WO2016148121A1 (en) | Method for manufacturing flip chip package, flip chip package, and resin composition for pre-application type underfills | |
| JP2023029875A (en) | Resin composition for reinforcement and electronic component device | |
| JP2013256584A (en) | Thermosetting resin composition, flux composition, and semiconductor apparatus using the same | |
| JP5571730B2 (en) | Thermosetting resin composition and semiconductor device | |
| JP2003082064A (en) | Liquid epoxy resin composition for sealing filler | |
| JP2020163404A (en) | Solder paste and mounting structure | |
| CN113649727A (en) | Resin flux paste and mounting structure | |
| KR101692668B1 (en) | Composition for epoxy flux paste having best chikso-quality | |
| JP2003305588A (en) | Bonding material | |
| CN106190008A (en) | A kind of preparation technology of LED high heat conductance conducting resinl | |
| JP2004277572A (en) | Non-solvent liquid silver paste formulation and semiconductor device using it | |
| JP2020089897A (en) | Solder paste and mounting structure | |
| CN108456501A (en) | Conductive adhesive composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170623 |