CN110144188A - A kind of microelectronics Packaging epoxy resin-matrix conducting resinl - Google Patents
A kind of microelectronics Packaging epoxy resin-matrix conducting resinl Download PDFInfo
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- CN110144188A CN110144188A CN201910462381.8A CN201910462381A CN110144188A CN 110144188 A CN110144188 A CN 110144188A CN 201910462381 A CN201910462381 A CN 201910462381A CN 110144188 A CN110144188 A CN 110144188A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0837—Bismuth
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
The invention discloses a kind of microelectronics Packaging epoxy resin-matrix conducting resinls, belong to technical field of polymer materials.The present invention according to parts by weight, by 20~30 parts of sisal fibers, 3~5 parts of Bacillus pasteuriis, 1~2 part of glycerol, 2~3 portions of sucrose, 30~50 parts of water mixed fermentations, then 0.2~0.3 times of sisal fiber quality of copper nitrate solution is added dropwise, then sodium hydroxide solution is added dropwise and adjusts pH to 8.6~8.9, is stirred, filters, it is dry, charing cools down to get modified filler；By epoxy resin, diluent, modified filler, curing agent, promotor, coupling agent, tar, plants essential oil and low-melting alloy are stirred to get microelectronics Packaging epoxy resin-matrix conducting resinl.Microelectronics Packaging provided by the invention is had good conductive property with epoxy resin-matrix conducting resinl.
Description
Technical field
The invention discloses a kind of microelectronics Packaging epoxy resin-matrix conducting resinls, belong to technical field of polymer materials.
Background technique
Common tradition Pb-Sn solder has the history of decades, wetability low with fusing point in microelectronics Packaging
The features such as good, easy processing, electrical property and excellent in mechanical performance.However, with the continuous development of microelectric technique, electronic component
The development trends such as miniaturization, printed circuit board Highgrade integration, so that the minimum pitch of Pb-Sn welding 0.65mm has been unable to meet
The actual demand of Electronic Packaging, and that there is also creep-resistant properties is poor, density is big, owes with organic material wellability for Pb-Sn solder
Good, the disadvantages of welding temperature is higher and lead contamination is serious, therefore its application space is extremely restricted.
Conducting resinl will be used wider and wider, and day as a kind of novel green microelectronics Packaging interconnection material
Benefit is valued by people.Conducting resinl is a kind of extraordinary adhesive with conducting function.It, can be in following electronics industry
As the substitute of tin-lead welding technique, and the benefit for having tin-lead welding rod no.Firstly, conducting resinl is more than tin-lead welding rod
Environmental protection.Eutectic tin-lead solder is the widest interconnection material applied at present, but lead is for the harm people institute of human body and environment
Know altogether, so promulgating corresponding laws and regulations one after another to reduce this harm.Conducting resinl is with lower than conventional tin-lead solders
A kind of conductive crystal-bonding adhesive of solidification temperature and simpler curing process has received the extensive of academia and business circles in recent years
Concern.Currently, conducting resinl starts to gradually replace conventional tin-lead solders in fields such as SMT, SMD and PCD.Conducting resinl is mainly
It is made of nonconducting resin and conductive filler, the resin studied at present has epoxy resin and phenolic resin etc..Due to epoxy
Resin has excellent mechanical performance and hot property, low shrinking percentage, good cementability, resistance to mechanical impact and thermal shock energy
Power, at the same it is strong to the resistivity of humidity, solvent and chemical reagent the advantages that, therefore the research of epoxy resin system conductive is most
It is more.
Conducting resinl replaces traditional Pb-Sn solder to have become as a kind of novel green microelectronics Packaging interconnection material
For inexorable trend.In recent years, information industry rapid development, the miniaturization of electronic product and Highgrade integration etc., are conducting resinl
Provide wide development space.Currently, a kind of conducting resinl can replace completely Pb-Sn solder in every field not yet, because
And it studies conducting resinl and is of great immediate significance.The research of conducting resinl, which is not focusing only on, improves its electric conductivity and reliability side
Face, but also to continually develop new conductive filler, new curing process (such as photocuring, UV solidify) and new matrix tree
Rouge, and also constantly to reduce its cost.The comprehensive performance of conducting resinl still has deficiency, it is necessary to use for reference advanced experience, actively study
Novel, high-performance, high stability and low cost conducting resinl, to improve the competitiveness of Electronic Packaging industry.
Summary of the invention
The present invention solves the technical problem of: it can not be further for conventional epoxies base conducting resinl electric conductivity
The problem of raising, provides a kind of microelectronics Packaging epoxy resin-matrix conducting resinl.
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that:
A kind of microelectronics Packaging epoxy resin-matrix conducting resinl, is made of the raw material of following parts by weight:
20~30 parts of epoxy resin
20~30 parts of diluent
10~20 parts of modified filler
5~8 parts of curing agent
3~5 parts of promotor
3~5 parts of coupling agent
2~3 parts of tar
3~5 parts of plants essential oil
5~8 parts of low-melting alloy
The configuration process of microelectronics Packaging epoxy resin-matrix conducting resinl are as follows: each raw material is weighed by raw material composition, by epoxy
Resin, diluent, modified filler, curing agent, promotor, coupling agent, tar, plants essential oil and low-melting alloy are stirred,
Up to microelectronics Packaging epoxy resin-matrix conducting resinl.
The epoxy resin is any one in bisphenol-A liquid epoxy resin or bisphenol-f type liquid epoxies.
The diluent is diepoxy propane ethylether, any one in dimethylbenzene or acetone.
The preparation process of the modified filler are as follows: according to parts by weight, by 20~30 parts of sisal fibers, 3~5 parts of Pasteur's buds
Sisal fiber quality 0.2~0.3 is then added dropwise in spore bacillus, 1~2 part of glycerol, 2~3 portions of sucrose, 30~50 parts of water mixed fermentations
Copper nitrate solution again is then added dropwise sodium hydroxide solution and adjusts pH to 8.6~8.9, is stirred, filters, dry, carbonizes,
Cooling is to get modified filler.
The curing agent is vinyl triamine, any one in ethylenediamine or ethylenediamine tetra-acetic acid.
The promotor is imidazoles promotor, any one in amine type accelerator or phenol.
The coupling agent is aluminate coupling agent, any one in silane coupling agent or titanate coupling agent.
The tar is any one in coalite tar or medium temperature coal tar.
The plants essential oil be Rosemary Oil, Lavender, rose ethereal oil, jasmine essential oil, camellia essential oil or
Any one in saussurea involucrata essential oil.
The low-melting alloy is bismuth tin alloy, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for
30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).
The beneficial effects of the present invention are:
(1) present invention is by addition modified filler and low-melting alloy, in modified filler preparation process, firstly, by sisal hemp fibre
It is organic to decompose the part in sisal fiber using Bacillus pasteurii for dimension, Bacillus pasteurii, glycerol, sucrose, water mixed fermentation
Matter so that the absorption property of sisal fiber gets a promotion, enables low-melting alloy so that the hole in fiber gets a promotion
More enter fibrous inside, then, by the way that copper nitrate solution is added dropwise, since Bacillus pasteurii cell surface is negatively charged,
It can be enriched with positively charged copper ion, so that copper ion is gathered in sisal fiber, then by the way that sodium hydroxide solution is added dropwise, made
Copper ion precipitating, then during high temperature carbonization, Kocide SD dehydration in system generates copper oxide precipitating, copper oxide
Precipitating deposition in the fibre, continues to increase, the carbonaceous in system makes the copper oxide in system be reduced into simple substance with temperature
Copper, in heat curing process, low-melting alloy fusing, and flow near the elemental copper around modified filler, in low melting point
After alloy solidification, so that metallurgical bonding is formed between modified filler, so that the interface resistance between the filler of system further decreases,
Conductive network is formed in system, so that the mechanical property of system is further promoted, while in carbonization process, it can
Tar is generated, the addition of tar can improve the interfacial combined function between matrix resin and modified filler, while the exudation of tar
Can the elemental copper in carrying system be distributed at the interface cohesion between matrix resin and modified filler so that matrix resin with change
Property filler between interface resistance reduce so that the electric conductivity of system is further promoted；
(2) present invention is by addition modified filler, plants essential oil and low-melting alloy, and in use, plants essential oil can
It penetrates into modified filler, in heat curing process, the heated volatilization of plants essential oil in volatilization process, can carry system
In low-melting alloy and modified filler in elemental copper spread in system so that can adequately form eutectic between each filler
Point alloy, so that the interface resistance between filler is further decreased, so that the electric conductivity of system obtains further
It is promoted.
Specific embodiment
According to parts by weight, by 20~30 parts of sisal fibers, 3~5 parts of Bacillus pasteuriis, 1~2 part of glycerol, 2~3 parts
Sucrose, 30~50 parts of water are placed in fermentation cauldron, are 30~35 DEG C in temperature, under the conditions of revolving speed is 400~600r/min, stirring is mixed
Fermentation 3~5 days is closed, the nitric acid that 0.2~0.3 times of mass fraction of sisal fiber quality is 10~20% is then added dropwise into fermentation cauldron
Copper solution, then into fermentation cauldron be added dropwise mass fraction be 20~30% sodium hydroxide solution adjust pH to 8.6~8.9, in turn
Under the conditions of speed is 300~500r/min, it is stirred 40~60min, mixed serum is obtained, then filters mixed serum, must be filtered
Filter residue is then placed in baking oven by slag, dry to constant weight under the conditions of temperature is 105~110 DEG C, is obtained dry filter residue, then will
Dry filter residue is placed in retort, under the conditions of temperature is 1050~1150 DEG C, after carbonizing 2~3h, with furnace be down to room temperature to get
Modified filler；According to parts by weight, by 20~30 parts of epoxy resin, 20~30 parts of diluents, 10~20 parts of modified fillers, 5~8
Part curing agent, 3~5 parts of promotors, 3~5 parts of coupling agents, 2~3 parts of tar, 3~5 parts of plants essential oils and 5~8 parts of low melting points are closed
Gold is placed in batch mixer, under the conditions of revolving speed is 400~600r/min, is stirred 40~60min to get microelectronics Packaging use
Epoxy resin-matrix conducting resinl.The epoxy resin is any in bisphenol-A liquid epoxy resin or bisphenol-f type liquid epoxies
It is a kind of.The diluent is diepoxy propane ethylether, any one in dimethylbenzene or acetone.The curing agent is vinyl
Any one in triamine, ethylenediamine or ethylenediamine tetra-acetic acid.The promotor is imidazoles promotor, amine type accelerator or phenol
In any one.The coupling agent is aluminate coupling agent, any one in silane coupling agent or titanate coupling agent.It is described
Tar is any one in coalite tar or medium temperature coal tar.The plants essential oil be Rosemary Oil, Lavender,
Any one in rose ethereal oil, jasmine essential oil, camellia essential oil or saussurea involucrata essential oil.The low-melting alloy is the conjunction of bismuth tin
Gold, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).
Example 1
According to parts by weight, by 30 parts of sisal fibers, 5 parts of Bacillus pasteuriis, 2 parts of glycerol, 3 portions of sucrose, 50 parts of water are placed in hair
In ferment kettle, it is 35 DEG C in temperature, under the conditions of revolving speed is 600r/min, is stirred fermentation 5 days, sword is then added dropwise into fermentation cauldron
The hydrogen that mass fraction is 30% is then added dropwise in the copper nitrate solution that 0.3 times of mass fraction of flaxen fiber quality is 20% into fermentation cauldron
Sodium hydroxide solution adjusts pH to 8.9, under the conditions of revolving speed is 500r/min, is stirred 60min, obtains mixed serum, then will
Mixed serum filtering, obtains filter residue, then filter residue is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains dry
Dry filter residue is then placed in retort by dry filter residue, under the conditions of temperature is 1150 DEG C, after carbonizing 3h, is down to room temperature with furnace,
Up to modified filler；According to parts by weight, by 30 parts of epoxy resin, 30 parts of diluents, 20 parts of modified fillers, 8 parts of curing agent, 5
Part promotor, 5 parts of coupling agents, 3 parts of tar, 5 parts of plants essential oils and 8 parts of low-melting alloys are placed in batch mixer, are in revolving speed
Under the conditions of 600r/min, 60min is stirred to get microelectronics Packaging epoxy resin-matrix conducting resinl.The epoxy resin is
Bisphenol-A liquid epoxy resin.The diluent is diepoxy propane ethylether.The curing agent is vinyl triamine.It is described
Promotor is imidazoles promotor.The coupling agent is aluminate coupling agent.The tar is coalite tar.The plant essence
Oil is Rosemary Oil.The low-melting alloy is bismuth tin alloy, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%
(ω), tin account for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).
Example 2
According to parts by weight, by 30 parts of epoxy resin, 30 parts of diluents, 8 parts of curing agent, 5 parts of promotors, 5 parts of coupling agents, 3 parts
Tar, 5 parts of plants essential oils and 8 parts of low-melting alloys are placed in batch mixer, under the conditions of revolving speed is 600r/min, are stirred
60min is to get microelectronics Packaging epoxy resin-matrix conducting resinl.The epoxy resin is bisphenol-A liquid epoxy resin.It is described
Diluent is diepoxy propane ethylether.The curing agent is vinyl triamine.The promotor is imidazoles promotor.It is described
Coupling agent is aluminate coupling agent.The tar is coalite tar.The plants essential oil is Rosemary Oil.The low melting point
Alloy is bismuth tin alloy, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω),
Indium accounts for 11%(ω).
Example 3
According to parts by weight, by 30 parts of sisal fibers, 5 parts of Bacillus pasteuriis, 2 parts of glycerol, 3 portions of sucrose, 50 parts of water are placed in hair
In ferment kettle, it is 35 DEG C in temperature, under the conditions of revolving speed is 600r/min, is stirred fermentation 5 days, sword is then added dropwise into fermentation cauldron
The hydrogen that mass fraction is 30% is then added dropwise in the copper nitrate solution that 0.3 times of mass fraction of flaxen fiber quality is 20% into fermentation cauldron
Sodium hydroxide solution adjusts pH to 8.9, under the conditions of revolving speed is 500r/min, is stirred 60min, obtains mixed serum, then will
Mixed serum filtering, obtains filter residue, then filter residue is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains dry
Dry filter residue is then placed in retort by dry filter residue, under the conditions of temperature is 1150 DEG C, after carbonizing 3h, is down to room temperature with furnace,
Up to modified filler；According to parts by weight, by 30 parts of epoxy resin, 30 parts of diluents, 20 parts of modified fillers, 8 parts of curing agent, 5
Part promotor, 5 parts of coupling agents, 5 parts of plants essential oils and 8 parts of low-melting alloys are placed in batch mixer, in revolving speed be 600r/min item
Under part, 60min is stirred to get microelectronics Packaging epoxy resin-matrix conducting resinl.The epoxy resin is bisphenol-A liquid
Epoxy resin.The diluent is diepoxy propane ethylether.The curing agent is vinyl triamine.The promotor is imidazoles
Class promotor.The coupling agent is aluminate coupling agent.The plants essential oil is Rosemary Oil.The low-melting alloy is bismuth
Tin alloy, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%
(ω).
Example 4
According to parts by weight, by 30 parts of sisal fibers, 5 parts of Bacillus pasteuriis, 2 parts of glycerol, 3 portions of sucrose, 50 parts of water are placed in hair
In ferment kettle, it is 35 DEG C in temperature, under the conditions of revolving speed is 600r/min, is stirred fermentation 5 days, sword is then added dropwise into fermentation cauldron
The hydrogen that mass fraction is 30% is then added dropwise in the copper nitrate solution that 0.3 times of mass fraction of flaxen fiber quality is 20% into fermentation cauldron
Sodium hydroxide solution adjusts pH to 8.9, under the conditions of revolving speed is 500r/min, is stirred 60min, obtains mixed serum, then will
Mixed serum filtering, obtains filter residue, then filter residue is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains dry
Dry filter residue is then placed in retort by dry filter residue, under the conditions of temperature is 1150 DEG C, after carbonizing 3h, is down to room temperature with furnace,
Up to modified filler；According to parts by weight, by 30 parts of epoxy resin, 30 parts of diluents, 20 parts of modified fillers, 8 parts of curing agent, 5
Part promotor, 5 parts of coupling agents, 3 parts of tar and 8 parts of low-melting alloys are placed in batch mixer, under the conditions of revolving speed is 600r/min,
60min is stirred to get microelectronics Packaging epoxy resin-matrix conducting resinl.The epoxy resin is bisphenol-A liquid epoxy
Resin.The diluent is diepoxy propane ethylether.The curing agent is vinyl triamine.The promotor is imidazoles rush
Into agent.The coupling agent is aluminate coupling agent.The tar is coalite tar.The low-melting alloy is bismuth tin alloy,
Each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%(ω), indium accounts for 11%(ω).
Example 5
According to parts by weight, by 30 parts of sisal fibers, 5 parts of Bacillus pasteuriis, 2 parts of glycerol, 3 portions of sucrose, 50 parts of water are placed in hair
In ferment kettle, it is 35 DEG C in temperature, under the conditions of revolving speed is 600r/min, is stirred fermentation 5 days, sword is then added dropwise into fermentation cauldron
The hydrogen that mass fraction is 30% is then added dropwise in the copper nitrate solution that 0.3 times of mass fraction of flaxen fiber quality is 20% into fermentation cauldron
Sodium hydroxide solution adjusts pH to 8.9, under the conditions of revolving speed is 500r/min, is stirred 60min, obtains mixed serum, then will
Mixed serum filtering, obtains filter residue, then filter residue is placed in baking oven, dry to constant weight under the conditions of temperature is 110 DEG C, obtains dry
Dry filter residue is then placed in retort by dry filter residue, under the conditions of temperature is 1150 DEG C, after carbonizing 3h, is down to room temperature with furnace,
Up to modified filler；According to parts by weight, by 30 parts of epoxy resin, 30 parts of diluents, 20 parts of modified fillers, 8 parts of curing agent, 5
Part promotor, 5 parts of coupling agents, 3 parts of tar, 5 parts of plants essential oils are placed in batch mixer, under the conditions of revolving speed is 600r/min, are stirred
Mixing 60min is mixed to get microelectronics Packaging epoxy resin-matrix conducting resinl.The epoxy resin is bisphenol-A liquid asphalt mixtures modified by epoxy resin
Rouge.The diluent is diepoxy propane ethylether.The curing agent is vinyl triamine.The promotor is imidazoles promotion
Agent.The coupling agent is aluminate coupling agent.The tar is coalite tar.The plants essential oil is Rosemary Oil.
Example 1 to 5 gained microelectronics Packaging epoxy resin-matrix conducting resinl and comparative example product are subjected to performance detection, had
Body detecting method is as follows:
According to the resistivity of GJB548A detection conducting resinl.Specific testing result is as shown in table 1:
Table 1
| Detection content | Resistivity/× 10-4Ω·cm |
| Example 1 | 2.8 |
| Example 2 | 5.8 |
| Example 3 | 6.3 |
| Example 4 | 7.3 |
| Example 5 | 11.8 |
| Comparative example | 20 |
By 1 testing result of table it is found that present invention gained microelectronics Packaging has excellent electric conductivity with epoxy resin-matrix conducting resinl
Energy and shear strength.
Claims (10)
1. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl, it is characterised in that: be made of the raw material of following parts by weight:
20~30 parts of epoxy resin
20~30 parts of diluent
10~20 parts of modified filler
5~8 parts of curing agent
3~5 parts of promotor
3~5 parts of coupling agent
2~3 parts of tar
3~5 parts of plants essential oil
5~8 parts of low-melting alloy
The configuration process of microelectronics Packaging epoxy resin-matrix conducting resinl are as follows: each raw material is weighed by raw material composition, by epoxy
Resin, diluent, modified filler, curing agent, promotor, coupling agent, tar, plants essential oil and low-melting alloy are stirred,
Up to microelectronics Packaging epoxy resin-matrix conducting resinl.
2. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the asphalt mixtures modified by epoxy resin
Rouge is any one in bisphenol-A liquid epoxy resin or bisphenol-f type liquid epoxies.
3. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the diluent
Any one for diepoxy propane ethylether, in dimethylbenzene or acetone.
4. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the modification is filled out
The preparation process of material are as follows: according to parts by weight, by 20~30 parts of sisal fibers, 3~5 parts of Bacillus pasteuriis, 1~2 part of glycerol,
0.2~0.3 times of sisal fiber quality of copper nitrate solution is then added dropwise, then in 2~3 portions of sucrose, 30~50 parts of water mixed fermentations
Sodium hydroxide solution is added dropwise and adjusts pH to 8.6~8.9, is stirred, filters, dry, charing cools down to get modified filler.
5. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the curing agent
For vinyl triamine, any one in ethylenediamine or ethylenediamine tetra-acetic acid.
6. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the promotor
Any one for imidazoles promotor, in amine type accelerator or phenol.
7. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the coupling agent
For aluminate coupling agent, any one in silane coupling agent or titanate coupling agent.
8. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the tar is
Any one in coalite tar or medium temperature coal tar.
9. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the plant essence
Oil is Rosemary Oil, Lavender, rose ethereal oil, and jasmine essential oil is any one in camellia essential oil or saussurea involucrata essential oil
Kind.
10. a kind of microelectronics Packaging epoxy resin-matrix conducting resinl according to claim 1, it is characterised in that: the eutectic
Point alloy is bismuth tin alloy, each component mass content in bismuth tin alloy are as follows: bismuth accounts for 51%(ω), tin accounts for 30%(ω), lead accounts for 8%
(ω), indium account for 11%(ω).
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113004830A (en) * | 2021-03-05 | 2021-06-22 | 常州烯奇新材料有限公司 | Weather-resistant high-thermal-conductivity graphene-based epoxy resin adhesive and preparation method thereof |
| CN113337231A (en) * | 2021-06-01 | 2021-09-03 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008108625A (en) * | 2006-10-26 | 2008-05-08 | Tatsuta System Electronics Kk | Conductive adhesive |
| CN106883805A (en) * | 2017-04-14 | 2017-06-23 | 中国科学院深圳先进技术研究院 | A kind of thermal conductivity glue and its production and use |
| CN108997894A (en) * | 2018-09-17 | 2018-12-14 | 佛山皖和新能源科技有限公司 | A kind of conductive coating |
| CN109266130A (en) * | 2018-09-20 | 2019-01-25 | 胡果青 | A kind of preparation method of conductive coating |
-
2019
- 2019-05-30 CN CN201910462381.8A patent/CN110144188A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008108625A (en) * | 2006-10-26 | 2008-05-08 | Tatsuta System Electronics Kk | Conductive adhesive |
| CN106883805A (en) * | 2017-04-14 | 2017-06-23 | 中国科学院深圳先进技术研究院 | A kind of thermal conductivity glue and its production and use |
| CN108997894A (en) * | 2018-09-17 | 2018-12-14 | 佛山皖和新能源科技有限公司 | A kind of conductive coating |
| CN109266130A (en) * | 2018-09-20 | 2019-01-25 | 胡果青 | A kind of preparation method of conductive coating |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113004830A (en) * | 2021-03-05 | 2021-06-22 | 常州烯奇新材料有限公司 | Weather-resistant high-thermal-conductivity graphene-based epoxy resin adhesive and preparation method thereof |
| CN113337231A (en) * | 2021-06-01 | 2021-09-03 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
| CN113337231B (en) * | 2021-06-01 | 2022-10-04 | 中国科学院合肥物质科学研究院 | Epoxy composite material with heterostructure and preparation method thereof |
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