CN102277097A - Carbon black conducting resin and preparation method thereof - Google Patents
Carbon black conducting resin and preparation method thereof Download PDFInfo
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- CN102277097A CN102277097A CN2011102012315A CN201110201231A CN102277097A CN 102277097 A CN102277097 A CN 102277097A CN 2011102012315 A CN2011102012315 A CN 2011102012315A CN 201110201231 A CN201110201231 A CN 201110201231A CN 102277097 A CN102277097 A CN 102277097A
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- carbon black
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Abstract
The invention relates to carbon black conducting resin and a preparation method thereof. The conducting resin is prepared from the following raw materials in percentage by mass: 25 to 30 percent of carbon fiber powder, 5 to 10 percent of carbon powder, 45 to 50 percent of thermosetting resin, 3 to 6 percent of thinner, 0.1 to 1 percent of dispersing agent, 10 to 15 percent of curing agent and 0.2 to 1 percent of coupling agent. The preparation method for the carbon black conducting resin comprises the following steps of: weighing the carbon fiber powder, the carbon powder and the thermosetting resin, which serve as a main agent, as well as the thinner and the dispersing agent, and mixing fully in a stirrer to form a uniform mixed phase; weighing the curing agent and the coupling agent which serve as an aid, and mixing fully in the stirrer to obtain a uniform mixed phase; and mixing the main agent and the aid at normal temperature to obtain the carbon black conducting resin. In the carbon black conducting resin, the carbon fiber powder and the carbon powder are used as conducting fillers, so the carbon black conducting resin has the advantages of curing at the normal temperature along with high bonding strength, simplicity and convenience of operation. In addition, the formed bonded part has high hardness, crack resistance and wear resistance, and provides high connection between metals.
Description
Technical field
The present invention relates to a kind of carbon black conductive glue, particularly a kind of carbon black conductive glue and preparation method thereof.
Background technology
Conductive resin (glue), be a kind of can bonding effectively various materials, have the glue of conductivity again.Be mainly used to bonding thing, play effects such as conduction, repairing, shielding, heat conduction.Be used for the bonding of circuit chip to matrix; The electroconductibility that is used between electronic machine metal, pottery, glass is bonding; Perhaps be used for the assembling of some circuit and repair replacing soldering etc.Carbon black conductive glue is the conductive resin that forms as filler with carbon black materials.Because carbon black materials is good conductor, and cheap, carbon black conductive glue has cost advantage.
Summary of the invention
The object of the present invention is to provide a kind of good carbon black conductive glue, be applied to the bonding of intermetallic connection, particularly big conductive section.
Another object of the present invention is to provide a kind of preparation method of carbon black conductive glue.
The objective of the invention is to be achieved through the following technical solutions.
A kind of carbon black conductive glue is characterized in that, this conductive resin is formed by the host and the auxiliary agent feedstock production of following mass percentage content:
Host:
Auxiliary agent:
Solidifying agent 10-15%
Coupling agent 0.2-1%.
Further aspect of the present invention is:
Described carbon fiber length is 5-10 μ m, and length-to-diameter ratio is 2: 1-8: 1.
Described carbon dust radius is 0.1-25 μ m.
Described thermosetting resin is a Resins, epoxy.
Described thinner is a kind of in reactive thinner 500 thinners, 501 thinners and 512 thinners of Resins, epoxy.
Described dispersion agent is a DA type dispersion agent.
Described solidifying agent is selected a kind of in triethylene tetramine, tetraethylene pentamine or the polyethylene polyamine for use.
Described coupling agent is a kind of among silane coupling agent KH-580, KH-602 or the KH-792.
The present invention gives a kind of preparation method of carbon black conductive glue, and this method comprises:
The preparation of host: the DA type dispersion agent that with mass percent is a kind of and 0.1-1% in reactive thinner 500 thinners, 501 thinners and 512 thinners of Resins, epoxy, 3-6% of carbon dust, the 45-50% of carbon fiber powder, the 5-10% of 25-30%, thorough mixing in stirrer forms uniform mixed phase;
The preparation of auxiliary agent: be a kind of among KH-580, the KH-602 of a kind of and 0.2-1% in triethylene tetramine, tetraethylene pentamine or the polyethylene polyamine of 10-15% or the KH-792 with mass percent, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
The present invention has introduced carbon fiber powder in conductive resin, combine with carbon dust, and conductive filler material is compact more in conjunction with getting, and can improve conductivity.Carbon fiber powder can increase the physicals of Resins, epoxy simultaneously, as hardness, splitting resistance and the abrasion resistance properties etc. of goods, also can improve the dimensional stability of resin glue.Add coupling agent simultaneously, make powder and resin-bonded tightr, increased the ability that mutually combines of material, material is more firm.During use host and auxiliary agent are mixed, spread upon desired area and then can.
This conductive resin is made conductive filler material with carbon fiber powder and carbon dust, has multiple advantages such as self-vulcanizing, bonding strength height, easy operation.And the adhesive segment that forms has good hardness, splitting resistance and abrasion resistance properties.Provide good connection to intermetallic.
Embodiment
Below by specific embodiment the present invention is described in further detail.Need to prove that following embodiment only is used to illustrate the present invention, but be not limited to practical range of the present invention.
Unless otherwise indicated, the following raw material add-on that adopts of the present invention is mass percent.
Embodiment 1
Host:
Auxiliary agent:
Triethylene tetramine 10%
KH-580 0.5％
Host: (length is 5-10 μ m with above-mentioned carbon fiber powder, 1), the material finished of carbon dust (radius is 0.1-25 μ m), Resins, epoxy, 500 thinners (Shanghai Resin Factory's production) and the weighing of DA type dispersion agent length-to-diameter ratio is 2: 1-8:, thorough mixing in stirrer forms uniform mixed phase;
Auxiliary agent: with triethylene tetramine and KH-580 (energy Dehua, the Nanjing worker company limited produces) material that weighing is finished, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Embodiment 2
Host:
Auxiliary agent:
Tetraethylene pentamine 13%
KH-792 0.9％
Host: (length is 5-10 μ m with above-mentioned carbon fiber powder, 1), the material finished of carbon dust (radius is 0.1-25 μ m), Resins, epoxy, 501 thinners (Shanghai Resin Factory's production) and the weighing of DA type dispersion agent length-to-diameter ratio is 2: 1-8:, thorough mixing in stirrer forms uniform mixed phase;
Auxiliary agent: with above-mentioned tetraethylene pentamine and KH-792 (energy Dehua, the Nanjing worker company limited produces) material that weighing is finished, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Embodiment 3
Host:
Auxiliary agent:
Polyethylene polyamine 11%
KH-602 0.2％
Host: (length is 5-10 μ m with above-mentioned carbon fiber powder, 1), the material finished of carbon dust (radius is 0.1-25 μ m), Resins, epoxy, 512 thinners (the logical generation chemical industry company limited in Yantai produces) and the weighing of DA type dispersion agent length-to-diameter ratio is 2: 1-8:, thorough mixing in stirrer forms uniform mixed phase;
Auxiliary agent: with above-mentioned polyethylene polyamine and KH-602 (energy Dehua, the Nanjing worker company limited produces) material that weighing is finished, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Embodiment 4
Host:
Auxiliary agent:
Tetraethylene pentamine 15%
KH-792 0.5％
Host: (length is 5-10 μ m with above-mentioned carbon fiber powder, 1), the material finished of carbon dust (radius is 0.1-25 μ m), Resins, epoxy, 500 thinners and the weighing of DA type dispersion agent length-to-diameter ratio is 2: 1-8:, thorough mixing in stirrer forms uniform mixed phase;
Auxiliary agent: with the material that above-mentioned tetraethylene pentamine and KH-792 weighing are finished, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Embodiment 5
Host:
Auxiliary agent:
Polyethylene polyamine 12%
KH-602 1％
Host: (length is 5-10 μ m with above-mentioned carbon fiber powder, 1), the material finished of carbon dust (radius is 0.1-25 μ m), Resins, epoxy, 501 thinners and the weighing of DA type dispersion agent length-to-diameter ratio is 2: 1-8:, thorough mixing in stirrer forms uniform mixed phase;
Auxiliary agent: with the material that above-mentioned polyethylene polyamine and KH-602 weighing are finished, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Claims (9)
1. a carbon black conductive glue is characterized in that, this conductive resin is formed by the host and the auxiliary agent feedstock production of following mass percentage content:
Host:
Auxiliary agent:
Solidifying agent 10-15%
Coupling agent 0.2-1%.
2. a kind of carbon black conductive glue according to claim 1 is characterized in that, described carbon fiber powder, and length is 5-10 μ m, length-to-diameter ratio is 2: 1-8: 1.
3. a kind of carbon black conductive glue according to claim 1 is characterized in that, described carbon dust radius is 0.1-25 μ m.
4. a kind of carbon black conductive glue according to claim 1 is characterized in that described thermosetting resin is a Resins, epoxy.
5. a kind of carbon black conductive glue according to claim 1 is characterized in that, described thinner is a kind of in reactive thinner 500 thinners, 501 thinners and 512 thinners of Resins, epoxy.
6. a kind of carbon black conductive glue according to claim 1 is characterized in that, described dispersion agent is a DA type dispersion agent.
7. a kind of carbon black conductive glue according to claim 1 is characterized in that, described solidifying agent is selected a kind of in triethylene tetramine, tetraethylene pentamine or the polyethylene polyamine for use.
8. a kind of carbon black conductive glue according to claim 1 is characterized in that, described coupling agent is a kind of among silane coupling agent KH-580, KH-602 or the KH-792.
9. the preparation method of a carbon black conductive glue is characterized in that, this method comprises:
The preparation of host: the DA type dispersion agent that with mass percent is a kind of and 0.1-1% in reactive thinner 500 thinners, 501 thinners and 512 thinners of Resins, epoxy, 3-6% of carbon dust, the 45-50% of carbon fiber powder, the 5-10% of 25-30%, thorough mixing in stirrer forms uniform mixed phase;
The preparation of auxiliary agent: be a kind of among KH-580, the KH-602 of a kind of and 0.2-1% in triethylene tetramine, tetraethylene pentamine or the polyethylene polyamine of 10-15% or the KH-792 with mass percent, thorough mixing in stirrer forms uniform mixed phase;
Host and auxiliary agent are mixed at normal temperatures, promptly get carbon black conductive glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2011102012315A CN102277097A (en) | 2011-07-19 | 2011-07-19 | Carbon black conducting resin and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011102012315A CN102277097A (en) | 2011-07-19 | 2011-07-19 | Carbon black conducting resin and preparation method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103333473A (en) * | 2013-04-18 | 2013-10-02 | 邱献腾 | Composite material of carbon fibers or carbon fiber powder, and processing process thereof |
| CN105778816A (en) * | 2016-04-19 | 2016-07-20 | 西安思坦电气技术有限公司 | High-tenacity nano-carbon black/epoxy resin conductive adhesive and preparing method thereof |
| CN107189711A (en) * | 2017-07-11 | 2017-09-22 | 苏州城邦达力材料科技有限公司 | A kind of conductive adhesive and its methods for making and using same of nonmetallic system |
| CN107858131A (en) * | 2017-10-18 | 2018-03-30 | 山东大学 | A kind of heat conduction carbon fiber mending tape and its method |
| CN110295015A (en) * | 2018-03-23 | 2019-10-01 | 普乐士株式会社 | Stationery adhesive composition and laminated body |
| WO2019191414A1 (en) * | 2018-03-28 | 2019-10-03 | Zoltek Corporation | Electrically conductive adhesive |
| WO2021068319A1 (en) * | 2019-10-12 | 2021-04-15 | 宇石能源(南通)有限公司 | Conductive adhesive for bonding fuel cell bipolar plate and preparation method therefor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611841B2 (en) * | 1987-01-13 | 1994-02-16 | 矢崎総業株式会社 | Conductive epoxy resin composition |
-
2011
- 2011-07-19 CN CN2011102012315A patent/CN102277097A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0611841B2 (en) * | 1987-01-13 | 1994-02-16 | 矢崎総業株式会社 | Conductive epoxy resin composition |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103333473A (en) * | 2013-04-18 | 2013-10-02 | 邱献腾 | Composite material of carbon fibers or carbon fiber powder, and processing process thereof |
| CN105778816A (en) * | 2016-04-19 | 2016-07-20 | 西安思坦电气技术有限公司 | High-tenacity nano-carbon black/epoxy resin conductive adhesive and preparing method thereof |
| CN107189711A (en) * | 2017-07-11 | 2017-09-22 | 苏州城邦达力材料科技有限公司 | A kind of conductive adhesive and its methods for making and using same of nonmetallic system |
| CN107858131B (en) * | 2017-10-18 | 2020-12-01 | 山东大学 | Heat-conducting carbon fiber repairing belt and method thereof |
| CN107858131A (en) * | 2017-10-18 | 2018-03-30 | 山东大学 | A kind of heat conduction carbon fiber mending tape and its method |
| CN110295015A (en) * | 2018-03-23 | 2019-10-01 | 普乐士株式会社 | Stationery adhesive composition and laminated body |
| WO2019191414A1 (en) * | 2018-03-28 | 2019-10-03 | Zoltek Corporation | Electrically conductive adhesive |
| CN112272692A (en) * | 2018-03-28 | 2021-01-26 | 卓尔泰克公司 | Conductive adhesive |
| JP2021519832A (en) * | 2018-03-28 | 2021-08-12 | ゾルテック コーポレイション | Conductive adhesive |
| US11447666B2 (en) | 2018-03-28 | 2022-09-20 | Zoltek Corporation | Electrically conductive adhesive |
| CN112272692B (en) * | 2018-03-28 | 2023-02-17 | 卓尔泰克公司 | Conductive adhesive |
| JP7385588B2 (en) | 2018-03-28 | 2023-11-22 | ゾルテック コーポレイション | Spar cap and its manufacturing method |
| US11834593B2 (en) | 2018-03-28 | 2023-12-05 | Zoltek Corporation | Electrically conductive adhesive |
| WO2021068319A1 (en) * | 2019-10-12 | 2021-04-15 | 宇石能源(南通)有限公司 | Conductive adhesive for bonding fuel cell bipolar plate and preparation method therefor |
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Application publication date: 20111214 |