CN107858131B - Heat-conducting carbon fiber repairing belt and method thereof - Google Patents

Heat-conducting carbon fiber repairing belt and method thereof Download PDF

Info

Publication number
CN107858131B
CN107858131B CN201710969493.3A CN201710969493A CN107858131B CN 107858131 B CN107858131 B CN 107858131B CN 201710969493 A CN201710969493 A CN 201710969493A CN 107858131 B CN107858131 B CN 107858131B
Authority
CN
China
Prior art keywords
carbon fiber
conductive
fiber layer
epoxy resin
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201710969493.3A
Other languages
Chinese (zh)
Other versions
CN107858131A (en
Inventor
乔琨
朱波
蔡珣
虞军伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shandong University
Original Assignee
Shandong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shandong University filed Critical Shandong University
Priority to CN201710969493.3A priority Critical patent/CN107858131B/en
Publication of CN107858131A publication Critical patent/CN107858131A/en
Application granted granted Critical
Publication of CN107858131B publication Critical patent/CN107858131B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02Electrically-conducting adhesives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/0812Aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/08Metals
    • C08K2003/085Copper
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/06Elements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesive Tapes (AREA)

Abstract

The invention provides a conductive carbon fiber repairing tape, which comprises a bottom film, a carbon fiber layer and a top film; the carbon fiber layer is arranged between the bottom die and the top die, conductive colloid is dispersed in the carbon fiber layer, and chopped carbon fibers and/or metal fibers are dispersed in the thickness direction of the carbon fiber layer. The damaged conductive component can be repaired, the good mechanical property of the carbon fiber is exerted, the mechanical property of the damaged component is maintained or enhanced, and the conductive function of the component can be maintained. Simple steps, convenient operation and strong practicability.

Description

Heat-conducting carbon fiber repairing belt and method thereof
Technical Field
The invention relates to the field of carbon fiber repairing materials, in particular to the field of carbon fiber repairing materials needing electric conduction.
Background
Carbon fiber has many advantages of high strength, high modulus, light weight, etc., and is commonly used as a repair material. When the carbon fiber is used as a repairing material, the carbon fiber is required to be combined with resin, because the thermal conductivity of the resin is very low, and the thermal conductivity of the composite material after the carbon fiber is combined with the resin is also low, the carbon fiber repairing material is generally used under the condition that the heat conduction is not required, and the application field of the carbon fiber repairing material is limited.
Disclosure of Invention
In order to overcome the defects, the invention provides a heat-conducting carbon fiber repairing tape and a method thereof. The damaged conductive component can be repaired, the good mechanical property of the carbon fiber is exerted, the mechanical property of the damaged component is maintained or enhanced, and the conductive function of the component can be maintained.
In order to achieve the purpose, the invention adopts the following technical scheme:
a conductive carbon fiber repairing tape comprises a bottom film, a carbon fiber layer and a top film; the carbon fiber layer is arranged between the bottom die and the top die, conductive colloid is dispersed in the carbon fiber layer, and chopped carbon fibers and/or metal fibers are dispersed in the thickness direction of the carbon fiber layer.
Preferably, the length of the chopped carbon fiber is 1-3 times of the thickness of the carbon fiber layer, and the diameter of the chopped carbon fiber is less than 100 mu m.
Preferably, the metal fiber comprises one or more of silver fiber, copper fiber, aluminum fiber, gold fiber and other metal fibers.
Preferably, the conductive colloid consists of an adhesive and a conductive filler.
Preferably, the carbon fiber layer is one-way carbon fiber, two-dimensional carbon fiber cloth or three-dimensional woven carbon fiber tape.
Preferably, the adhesive is an epoxy resin system, the epoxy resin system is composed of epoxy resin, a curing agent and a modifier, wherein the epoxy resin is one or more of glycidyl ether epoxy resin, glycidyl amine epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin and the like, and the curing agent is a latent curing agent.
Preferably, the conductive filler is one or more of graphite powder, silver powder, copper powder, aluminum powder, gold powder and the like, and the average diameter of the conductive filler is 100 nm-100 mu m.
Preferably, the volume ratio of the conductive filler to the adhesive is 1: 9-4: 6.
Preferably, the bottom film and the top film are positioned at the bottom and the top of the carbon fiber layer and the conductive colloid and are not bonded with the epoxy resin.
The invention also provides a material repairing method, which comprises the following steps:
selecting any one of the conductive carbon fiber repairing tapes;
tearing off the bottom film, adhering the carbon fiber layer to or winding or filling the carbon fiber layer at the position needing to be repaired, then tearing off the top film, and finishing repairing after the adhesive is cured.
The invention has the advantages of
(1) The invention can repair the damaged conductive component, exert the good mechanical property of the carbon fiber, maintain or enhance the mechanical property of the damaged component and simultaneously maintain the conductive function of the component.
(2) The preparation method is simple, high in repair efficiency, strong in practicability and easy to popularize.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.
FIG. 1 is a view showing the structure of the apparatus of the present invention. Wherein, 1-basement membrane; 2-a carbon fiber layer; 3-chopped carbon fibers and/or metal fibers; 4-a conductive filler; 5-conductive colloid; 6-top film.
Detailed Description
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
A conductive carbon fiber repairing tape comprises a bottom film, a carbon fiber layer, a conductive colloid and a top film, wherein the bottom film is positioned at the bottom layer, the conductive colloid is dispersed in the carbon fiber layer and is positioned at the middle layer together with the carbon fiber layer, the top film is positioned at the top layer, and the bottom film and the top film are not bonded with the conductive colloid. The carbon fiber layer is one-way carbon fiber, two-dimensional carbon fiber cloth or three-dimensional woven carbon fiber belts, short carbon fiber and/or metal fiber are dispersed in the thickness direction of the carbon fiber layer, the fiber length is 1-3 times of the thickness of the carbon fiber layer, the fiber diameter is smaller than 100 mu m, and the metal fiber comprises one or more of metal fibers such as silver fiber, copper fiber, aluminum fiber and gold fiber. The conductive colloid is composed of an adhesive and a conductive filler, the adhesive is an epoxy resin system, the epoxy resin system is composed of epoxy resin, a curing agent and a modifying agent, wherein the epoxy resin is one or more of glycidyl ether epoxy resin, glycidyl amine epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin and other epoxy resins, the curing agent is a latent curing agent, the proportion of the epoxy resin to the curing agent is different according to the selected type, the modifying agent comprises a toughening agent, an accelerating agent and the like, the conductive filler is one or more of graphite powder, silver powder, copper powder, aluminum powder, gold powder and the like, the average diameter of the conductive filler is 100 nm-100 mu m, the volume ratio of the conductive filler to the adhesive is 10-40%, and the conductive colloid is uniformly dispersed in the carbon fiber layer.
The carbon fibers are conductive in the length direction, and the conductive colloid is distributed between the carbon fibers in the thickness direction, so that the adhesive in the conductive colloid is non-conductive, the conductive effect of the carbon fiber layer in the thickness direction needs to be improved, and the resistivity needs to be reduced. The carbon fiber layer is dispersed with conductive fibers such as chopped carbon fibers and metal fibers in the thickness direction of the carbon fiber layer, so that the contact of the conductive substance in the thickness direction of the carbon fiber layer can be improved, the resistivity can be reduced, if the length of the fibers is too short, the probability of contact with the conductive substance in the thickness direction is small, and if the length of the fibers is too long, the content of the fibers in the thickness direction is smaller as the length of the fibers is longer on the basis of the same carbon fiber content, so that the length of the chopped fibers is preferably 1-3 times of the thickness of the carbon. The larger the diameter of the chopped fiber, the smaller the electrical resistance, but the larger the diameter of the fiber, the harder the carbon fiber repair tape, so the diameter of the chopped fiber is preferably less than 100 μm. The conductive filler is added into the adhesive, so that the resistivity of the adhesive can be effectively reduced, the conductive filler is too little, the resistivity reduction effect is poor, the conductive filler is too high, the viscosity of the conductive colloid is high, the conductive colloid is not easy to use, and the volume ratio of the conductive filler to the adhesive in the conductive colloid is 1: 9-4: 6.
In the using process, the bottom film is torn off, the carbon fiber layer with the conductive filler is adhered to or wound or stuffed on a part needing to be repaired, then the top film is torn off, and the repaired part can be continuously used after the adhesive is cured.
In summary, the present invention can repair a damaged conductive member, and can maintain or enhance the mechanical properties of the damaged member while maintaining the conductive function of the member by utilizing the excellent mechanical properties of the carbon fiber.
Example 1
The utility model provides a conductive carbon fiber repairing tape, comprises basement membrane, carbon fiber layer, conductive colloid, apical membrane, and wherein the basement membrane is located the bottom, and conductive colloid disperses in carbon fiber layer, is located the intermediate level with carbon fiber layer together, and the apical membrane is located the top, and basement membrane and apical membrane do not bond with conductive colloid, can tear at any time. The carbon fiber layer is made of 12K-T300 unidirectional carbon fibers, the thickness of the carbon fiber layer is 0.5mm, chopped carbon fibers are woven into the carbon fiber layer, the length of the chopped carbon fibers is 1mm, and the mass of the chopped carbon fibers is 15% of that of the carbon fiber layer. The conductive colloid is composed of an adhesive and a conductive filler, the adhesive is an epoxy resin system and is composed of E51 epoxy resin, a dicyandiamide curing agent and a polysulfone toughening agent, the conductive filler is graphite powder, the average particle size of the graphite powder is 50 micrometers, the volume ratio of the graphite powder to the epoxy resin system is 2:8, and the conductive colloid is dispersed in the carbon fiber layer after being uniformly mixed by a three-roll grinder.
In the using process, the bottom film is torn off, the carbon fiber layer with the conductive filler is adhered to or wound or stuffed on a part needing to be repaired, then the top film is torn off, and after the adhesive is cured, the repaired part can be continuously used.
Example 2
A conductive carbon fiber repairing tape comprises a bottom film, a carbon fiber layer, a conductive colloid and a top film, wherein the bottom film is positioned at the bottom layer, the conductive colloid is dispersed in the carbon fiber layer and positioned at the middle layer together with the carbon fiber layer, the top film is positioned at the top layer, and the bottom film and the top film are not bonded with the conductive colloid. The carbon fiber layer is a three-dimensional woven carbon fiber belt of 3K carbon fibers, the thickness of the carbon fiber belt is 1.5mm, copper fibers are dispersed in the thickness direction of the carbon fiber layer, the fiber length is 1.5mm, the fiber diameter is 50 mu m, and the mass of the copper fibers is 10% of that of the three-dimensional carbon fibers. The conductive colloid is composed of an adhesive and a conductive filler, the adhesive is an epoxy resin system and is composed of glycidyl amine epoxy and DDS, the conductive filler is a mixture of copper powder and aluminum powder, the mass ratio of the copper powder to the aluminum powder is 1:1, the average diameter is 70 micrometers, the volume ratio of the conductive filler to the adhesive is 4:6, and the conductive colloid is uniformly dispersed in the carbon fiber layer.
In the using process, the bottom film is torn off, the carbon fiber layer with the conductive filler is adhered to or wound or stuffed on a part needing to be repaired, then the top film is torn off, and after the adhesive is cured, the repaired part can be continuously used.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (7)

1. The conductive carbon fiber repairing tape is characterized by comprising a bottom film, a carbon fiber layer and a top film; a carbon fiber layer is arranged between the bottom die and the top die, conductive colloid is dispersed in the carbon fiber layer, and short carbon fibers are dispersed in the thickness direction of the carbon fiber layer;
the length of the short carbon fiber is 1-3 times of the thickness of the carbon fiber layer, and the diameter of the short carbon fiber is less than 100 mu m;
the conductive colloid consists of an adhesive and a conductive filler;
the adhesive is an epoxy resin system, and the epoxy resin system consists of epoxy resin, a curing agent and a modifying agent.
2. The electrically conductive carbon fiber repair tape of claim 1, wherein the carbon fiber layer is a unidirectional carbon fiber, a two-dimensional carbon fiber cloth, or a three-dimensional woven carbon fiber tape.
3. The conductive carbon fiber repair tape according to claim 1, wherein the epoxy resin is one or more of glycidyl ether type epoxy resin, glycidyl amine type epoxy resin, alicyclic epoxy resin, heterocyclic epoxy resin, and the like, and the curing agent is a latent curing agent.
4. The conductive carbon fiber repair tape of claim 1, wherein the conductive filler is one or more of graphite powder, silver powder, copper powder, aluminum powder, or gold powder, and the conductive filler has an average diameter of 100nm to 100 μm.
5. The conductive carbon fiber repair tape of claim 1, wherein the volume ratio of the conductive filler to the adhesive is 1:9 to 4: 6.
6. The conductive carbon fiber repair tape of claim 1, wherein the bottom and top films are positioned on the bottom and top of the carbon fiber layer and the conductive gel and are not bonded with epoxy.
7. A method of repairing a material, comprising:
taking the conductive carbon fiber repairing tape of any one of claims 1-6;
tearing off the bottom film, adhering the carbon fiber layer to or winding or filling the carbon fiber layer at the position needing to be repaired, then tearing off the top film, and finishing repairing after the adhesive is cured.
CN201710969493.3A 2017-10-18 2017-10-18 Heat-conducting carbon fiber repairing belt and method thereof Active CN107858131B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710969493.3A CN107858131B (en) 2017-10-18 2017-10-18 Heat-conducting carbon fiber repairing belt and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710969493.3A CN107858131B (en) 2017-10-18 2017-10-18 Heat-conducting carbon fiber repairing belt and method thereof

Publications (2)

Publication Number Publication Date
CN107858131A CN107858131A (en) 2018-03-30
CN107858131B true CN107858131B (en) 2020-12-01

Family

ID=61696309

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710969493.3A Active CN107858131B (en) 2017-10-18 2017-10-18 Heat-conducting carbon fiber repairing belt and method thereof

Country Status (1)

Country Link
CN (1) CN107858131B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111100589A (en) * 2020-01-20 2020-05-05 厦门天源欧瑞科技有限公司 Glue, preparation method thereof and preparation method of unmanned aerial vehicle shell

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102277097A (en) * 2011-07-19 2011-12-14 彩虹集团公司 Carbon black conducting resin and preparation method thereof
CN102808334A (en) * 2012-08-17 2012-12-05 杭州玖合新材料有限公司 Thermosetting resin composite facing material and preparation method thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110132537A1 (en) * 2009-12-03 2011-06-09 3M Innovative Properties Company Composition, tape, and use thereof
US9108387B2 (en) * 2011-06-30 2015-08-18 The Boeing Company Electrically conductive structure

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102277097A (en) * 2011-07-19 2011-12-14 彩虹集团公司 Carbon black conducting resin and preparation method thereof
CN102808334A (en) * 2012-08-17 2012-12-05 杭州玖合新材料有限公司 Thermosetting resin composite facing material and preparation method thereof

Also Published As

Publication number Publication date
CN107858131A (en) 2018-03-30

Similar Documents

Publication Publication Date Title
CN107584843B (en) Improved composite material
CN101555393B (en) High-temperature resistant one-component isotropic conductive adhesive and preparation method thereof
TW200834947A (en) Solar battery cell connection method and solar battery module
JPS58168636A (en) Composition convertable to reinforced conductive structural element and products comprising same
WO2018006503A1 (en) Silver salt-doped conductive silver adhesive, and preparation method and use thereof
CN207219264U (en) Anisotropy insulating heat-conductive pad
JP2017135137A (en) Insulating high thermal conductive sheet, manufacturing method of the same, and laminate
WO2014083875A1 (en) Electroconductive film and electronic component package
CN105007704A (en) Composite heat-dissipation wave-absorbing film
CN107858131B (en) Heat-conducting carbon fiber repairing belt and method thereof
CN102227308B (en) The skin covering of the surface of composite construction
JP2017141328A (en) Transparent conductive adhesive, laminate, and substrate joining method
CN108300359A (en) High conductivity adhesive tape and preparation method thereof
CN107189103B (en) A kind of conductive filler, preparation method and the usage
JP2000151084A (en) Anisotropic conductive adhesive film
JP2012244861A (en) Insulation coil
CN102311713A (en) Nanometer conductive adhesive
CN205030030U (en) Ultra -thin nanometer thermal film material
KR20150050009A (en) Anisotropic conductive film and the semiconductor device using thereof
JP4175347B2 (en) Method for producing anisotropic conductive adhesive film
JP3753470B2 (en) Anisotropic conductive adhesive
JP4900396B2 (en) Conductive sheet material and electrical connection structure
CN213472439U (en) Light wood core material of composite material sandwich board
CN113150701A (en) Bonding process and display device
CN105185852B (en) The flexible solar battery pack and its preparation technology of aramid fiber support

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant