CN207219264U - Anisotropy insulating heat-conductive pad - Google Patents
Anisotropy insulating heat-conductive pad Download PDFInfo
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- CN207219264U CN207219264U CN201721019395.5U CN201721019395U CN207219264U CN 207219264 U CN207219264 U CN 207219264U CN 201721019395 U CN201721019395 U CN 201721019395U CN 207219264 U CN207219264 U CN 207219264U
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- carbon fiber
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- conductive pad
- primer
- polymeric substrate
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Abstract
The utility model discloses a kind of anisotropy insulating heat-conductive pad, including：Heat cured insulation polymeric substrate and the carbon fiber in heat cured insulation polymeric substrate is implanted in by heat cure mode, the carbon fiber has the orientation perpendicular to polymeric substrate direction, and the bottom of carbon fiber does not penetrate the bottom of polymeric substrate.Due to the utility model using heat fixation insulating polymer as substrate, carbon fiber does not penetrate the substrate in implantation process, so that whole heat conductive pad has preferable insulating properties, the work of whole electrical equipment is not interfered with, and the carbon fiber of heat conductive pad has the orientation of vertical substrate in the utility model, vertical substrate direction heat conductivility more preferably.
Description
Technical field
It the utility model is related to heat conducting element technical field, and in particular to a kind of anisotropy insulating heat-conductive pad.
Background technology
Thermal interfacial material passes through the development of decades now, low from initial conduction oil, heat-conducting silicone grease, heat conduction silica gel cloth etc.
End product progressively develops into the high-end product such as heat-conducting pad, phase-transition material, thermally conductive gel and liquid metal, technology also by
Step gets a promotion, wherein it is with the fastest developing speed with heat-conducting pad, it is most widely used.
Traditional heat-conducting pad is substantially using silica gel or other high polymer materials as matrix material, is led by filling
Hot powder, makes composite have passage of heat, and so as to play the conduction of heat of material, the powder of filling is more, powder grain
Footpath collocation is more reasonable, and passage of heat is more, and corresponding material thermal conductivity is higher, but as packing material is more and more, production
The mechanical property of product, especially tensile strength and compressibility decline to a great extent, so as to be limited in many applications, together
When, the powder of filling is more, and the density of material is consequently increased, it is clear that with the current megatrend for pursuing lighting and user's physical examination
It is not inconsistent.
Although the carbon fiber of high thermal conductivity is turned into packing material by orientation in some heat conduction joint elements,
Carbon fiber stretches out in the upper and lower surface of bonding layer in its process, and such orientationization carbon fiber guiding heat pad is in practical application
It is middle to have the risk that conduction is contacted with associated electrical components on circuit board, so as to cause to influence the work of whole electrical equipment.
Utility model content
The utility model provides a kind of anisotropy insulating heat-conductive pad, to solve the above problems.
A kind of anisotropy insulating heat-conductive pad provided by the utility model, including：Heat cured insulation polymeric substrate and logical
Overheat curing mode is implanted in the carbon fiber in heat cured insulation polymeric substrate, and the carbon fiber has perpendicular to polymer-based
The orientation in plate direction, the bottom of carbon fiber do not penetrate the bottom of polymeric substrate.
Preferably, polymeric substrate includes insulation primer and is used for the face glue for infiltrating carbon fiber on primer, and carbon is fine
Dimension is implanted into primer in a manner of electrostatic spinning, and cladding is filled in the part that carbon fiber exposes to primer by face glue.
Preferably, the depth of carbon fiber implantation primer is primer thickness 3/4ths to a quarter.
Preferably, it is also coated with second layer primer on the glue of face, second layer primer is implanted into second layer carbon fiber, and second
Cladding is filled in the part that layer carbon fiber exposes to primer by the second aspect glue, forms the heat conductive pad of double thickness.
Preferably, the mutually isostructural heat conductive pad of two panels is fastened to the anisotropy insulating heat-conductive pad to form double-sided insulation.
Above-mentioned technical proposal can be seen that because the utility model is fine as substrate, carbon using heat fixation insulating polymer
Dimension does not penetrate the substrate in implantation process so that whole heat conductive pad has preferable insulating properties, does not interfere with whole electricity
The work of device, and the carbon fiber of heat conductive pad has the orientation of vertical substrate in the utility model, is led in the direction of vertical substrate
Hot property is more preferably.
Brief description of the drawings
, below will be to embodiment in order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, drawings in the following description are only
It is some embodiments of the utility model, for those of ordinary skill in the art, is not paying the premise of creative work
Under, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of heat conductive pad in the utility model embodiment 1；
Fig. 2 is the structural representation of heat conductive pad in the utility model embodiment 2；
Fig. 3 is the structural representation of double thickness heat conductive pad in the utility model embodiment 3；
Fig. 4 is the structural representation of double-sided insulation heat conductive pad in another embodiment of the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The all other embodiment obtained, belong to the scope of the utility model protection.
Embodiment 1：
The utility model embodiment provides a kind of anisotropy insulating heat-conductive pad, with reference to shown in Fig. 1, including：Thermosetting is exhausted
Edge polymeric substrate 1 and the carbon fiber 2 being implanted in by heat cure mode in heat cured insulation polymeric substrate 1, the carbon are fine
Dimension 2 has the orientation perpendicular to the direction of polymeric substrate 1, and the bottom of carbon fiber 2 does not penetrate the bottom of polymeric substrate 1.Absolutely
Edge polymeric substrate forms insulating barrier in bottom, and conduction suitable for the occasions such as electrical equipment, circuit board, will not occur, and should
Insulating barrier has certain anti-electric current breakdown capability, will not produce any interference to electric equipment products or the normal work of circuit board.
Heat conductivility is only considered and then in heat conductive pad from top to bottom all through Heat Conduction Material is set compared to existing heat conductive pad, so as to neglect
For the factor of slightly conductive interference, insulating barrier is set in bottom in the utility model, in the case where not influenceing heat conductivility, kept away
It is right to being disturbed by the work of radiating product to exempt from, and ensure that the safe and stable operation of product.
5~30 μm of the diameter control of carbon fiber described in the present embodiment, length are controlled at 100~1000 μm, can
It is easy to electrostatic implantation, and is easy to control the distribution of carbon fiber in process of production, improves production efficiency, carbon fiber is high-termal conductivity
Energy fiber, its thermal conductivity factor is 150~1500W/mk.Polymeric substrate can use and add fireproof powder and the silica gel of conductive powder
One or more in material, acrylic acid material, polyisobutene material or polyurethane elastomer material, ensureing heat conductivility
When, additionally it is possible to there is insulation effect, especially can be good at fixing carbon fiber, be advantageous to the electrostatic implantation of carbon fiber.Certainly,
Polymeric substrate can be with selected for the other materials with thermal conducting function and high insulating property.
Embodiment 2：
Further improvement is done for polymeric substrate in the present embodiment, as shown in Fig. 2 polymeric substrate 1 includes insulation
Primer 11 and it is used to infiltrate the face glue 12 of carbon fiber 2 on primer, carbon fiber 2 is implanted into primer 11 in a manner of electrostatic spinning,
The part that carbon fiber 2 exposes to primer cladding is filled by face glue 12.Primer uses and adds fireproof powder and the silica gel material of conductive powder
One or more in matter, acrylic acid material, polyisobutene material or polyurethane elastomer material, face glue can use and bottom
Glue identical material, face glue does not preferably add the silica gel material of fireproof powder and conductive powder, acrylic acid material, poly- different in the present embodiment
One or more in butylene material or polyurethane elastomer material, product can be reduced in the case where not influenceing function
Density, make heat conductive pad lightweight.
Embodiment 3：
The depth of carbon fiber implantation primer is primer thickness 3/4ths to a quarter in the utility model embodiment.
When the depth of carbon fiber implantation primer is the half of primer thickness, there is more preferable carbon fiber stationarity, and insulating properties
Can be more preferable, its breakdown voltage can be up to 1.5KV, when the depth of carbon fiber implantation primer is 3/4ths of primer, although
It is optimal to the stationarity of carbon fiber, but decreasing insulating, it is easily conductive by voltage breakdown, and carbon fiber implantation primer
When depth is a quarter of primer thickness, insulating properties are fine, but heat conductivility can be slightly inferior, and the stationarity of carbon fiber
It is not good enough.
In order to increase the thickness of whole heat conductive pad in the utility model embodiment, breach directly in each layer increase thickness
Existing thinking, as shown in figure 3, and be utilized on face glue 12 and be also coated with second layer primer 21, the interplantation of second layer primer 21
Enter second layer carbon fiber, the part that second layer carbon fiber exposes to primer fills cladding by the second aspect glue 22, forms double-thickness
The heat conductive pad of degree.Certainly, the heat conductive pad of the three times thickness to be formed or more times of thickness is adopted the structure when meeting thickness requirements,
Radiating effect is also unaffected.
In a further embodiment, as shown in figure 4, can fasten to form double-sided insulation by the mutually isostructural heat conductive pad of two panels
Anisotropy insulating heat-conductive pad.When in use, without distinguishing positive and negative, the exhausted of heat conductive pad can also be ensured in complicated occasion
Edge, it is two-sided to attach source of heat release.
A kind of anisotropy insulating heat-conductive pad provided above the utility model embodiment is described in detail, this
Apply specific case in text to be set forth principle of the present utility model and embodiment, the explanation of above example is
It is used to help understand core concept of the present utility model；Meanwhile for those of ordinary skill in the art, according to the utility model
Thought and method, there will be changes in specific embodiments and applications, in summary, this specification content is not
It is interpreted as to limitation of the present utility model.
Claims (5)
1. anisotropy insulating heat-conductive pad, it is characterised in that including：Heat cured insulation polymeric substrate and pass through heat cure mode
The carbon fiber being implanted in heat cured insulation polymeric substrate, the carbon fiber have the orientation perpendicular to polymeric substrate direction
Property, the bottom of carbon fiber does not penetrate the bottom of polymeric substrate.
2. anisotropy insulating heat-conductive pad as claimed in claim 1, it is characterised in that polymeric substrate include insulation primer and
It is used for the face glue for infiltrating carbon fiber on primer, carbon fiber is implanted into primer in a manner of electrostatic spinning, and carbon fiber exposes to bottom
Filled and coated by face glue in the part of glue.
3. anisotropy insulating heat-conductive pad as claimed in claim 2, it is characterised in that the depth of carbon fiber implantation primer is bottom
3/4ths of glue thickness are to a quarter.
4. anisotropy insulating heat-conductive pad as claimed in claim 2, it is characterised in that be also coated with the second layer on the glue of face
Primer, second layer primer are implanted into second layer carbon fiber, and the part that second layer carbon fiber exposes to primer is filled out by the second aspect glue
Cladding is filled, forms the heat conductive pad of double thickness.
5. anisotropy insulating heat-conductive pad as claimed in claim 2, it is characterised in that by the mutually isostructural heat conductive pad button of two panels
Close the anisotropy insulating heat-conductive pad for forming double-sided insulation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721019395.5U CN207219264U (en) | 2017-08-15 | 2017-08-15 | Anisotropy insulating heat-conductive pad |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721019395.5U CN207219264U (en) | 2017-08-15 | 2017-08-15 | Anisotropy insulating heat-conductive pad |
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| CN207219264U true CN207219264U (en) | 2018-04-10 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396610A (en) * | 2017-08-15 | 2017-11-24 | 深圳市鸿富诚屏蔽材料有限公司 | Anisotropy insulating heat-conductive pad and its manufacture method |
| CN110230187A (en) * | 2019-05-22 | 2019-09-13 | 深圳市鸿富诚屏蔽材料有限公司 | Carbon fiber of surface insulation cladding and preparation method thereof, heat-conducting pad and preparation method thereof |
| CN111410939A (en) * | 2020-04-09 | 2020-07-14 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN114833044A (en) * | 2022-04-24 | 2022-08-02 | 浙江大学 | Automatic production device of high-heat-conductivity flocking pad |
| CN114833043A (en) * | 2022-04-24 | 2022-08-02 | 浙江大学 | Preparation method of high-density high-orientation carbon fiber short fiber array and heat conducting pad |
-
2017
- 2017-08-15 CN CN201721019395.5U patent/CN207219264U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107396610A (en) * | 2017-08-15 | 2017-11-24 | 深圳市鸿富诚屏蔽材料有限公司 | Anisotropy insulating heat-conductive pad and its manufacture method |
| WO2019034063A1 (en) * | 2017-08-15 | 2019-02-21 | 深圳市鸿富诚屏蔽材料有限公司 | Anisotropic insulating thermally conductive pad and fabrication method thereof |
| CN107396610B (en) * | 2017-08-15 | 2020-08-18 | 深圳市鸿富诚屏蔽材料有限公司 | Anisotropic insulating thermal pad and method for manufacturing same |
| CN110230187A (en) * | 2019-05-22 | 2019-09-13 | 深圳市鸿富诚屏蔽材料有限公司 | Carbon fiber of surface insulation cladding and preparation method thereof, heat-conducting pad and preparation method thereof |
| CN111410939A (en) * | 2020-04-09 | 2020-07-14 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN111410939B (en) * | 2020-04-09 | 2021-10-22 | 清华大学深圳国际研究生院 | Heat-conducting phase-change energy storage sheet and preparation method thereof |
| CN114833044A (en) * | 2022-04-24 | 2022-08-02 | 浙江大学 | Automatic production device of high-heat-conductivity flocking pad |
| CN114833043A (en) * | 2022-04-24 | 2022-08-02 | 浙江大学 | Preparation method of high-density high-orientation carbon fiber short fiber array and heat conducting pad |
| CN114833044B (en) * | 2022-04-24 | 2023-01-13 | 浙江大学 | Automatic production device for high-heat-conductivity flocking pad |
| CN114833043B (en) * | 2022-04-24 | 2023-09-19 | 浙江大学 | Preparation method of high-density high-orientation carbon fiber short fiber array and heat conducting pad |
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Address after: 518103 floor 1, 2 and 3, building C, No. 7, Fuyong East Avenue, Fenghuang community, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen hongfucheng New Material Co.,Ltd. Address before: 518103 south, first floor, second and third floor, building C, zone 0a-04, Fenghuang third industrial zone, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee before: SHENZHEN HFC SHIELDING PRODUCTS Co.,Ltd. |