CN108943910A - A kind of preparation method of heat-conducting type copper-clad plate - Google Patents
A kind of preparation method of heat-conducting type copper-clad plate Download PDFInfo
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- CN108943910A CN108943910A CN201810762774.6A CN201810762774A CN108943910A CN 108943910 A CN108943910 A CN 108943910A CN 201810762774 A CN201810762774 A CN 201810762774A CN 108943910 A CN108943910 A CN 108943910A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
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Abstract
The invention discloses a kind of preparation methods of heat-conducting type copper-clad plate, belong to Heat Conduction Material technical field.The present invention mixes modified glass-fiber with polyacrylonitrile fibre, and silicon nitride fiber is added, and obtains composite fibre material, and by composite fibre material through shredding, combing cuts after lapping and needle thorn, modified glass-fiber plate is made；By phenolic resin, low-melting alloy, curing agent, antioxidant is stirred, and obtains composite adhesive；Composite adhesive is coated on copper foil, single sided board is obtained, after single sided board drying, single sided board must be pre-processed, two pieces of pretreatment single sided boards are fitted on modified glass-fiber plate respectively relatively with composite adhesive, obtain blank, blank is pressed under high temperature to get heat-conducting type copper-clad plate.Heat-conducting type copper-clad plate provided by the invention has excellent heating conduction and mechanical property.
Description
Technical field
The invention discloses a kind of preparation methods of heat-conducting type copper-clad plate, belong to Heat Conduction Material technical field.
Background technique
As printed wiring board (PCB) is towards high density, the continuous development in multiple stratification direction, component carries on PCB,
The space of installation is greatly decreased, and complete machine electronic product is higher and higher to the power requirement of power component.Small space is high-power not
More heat aggregations are generated avoidablely, and the decline of component electric property is caused even to damage.In addition, need to be in high heat resistance environment
Application market of the PCB of long-term work such as LED substrate, novel power supply module, automotive electronics, high integration IC package substrate etc. exists
Constantly promptly expand.For carrying component and the substrate of the circuit between them is connected, its high-cooling property is assigned
This new function then requires its baseplate material not only to have high thermal conductivity, also to there is high-insulativity and electric breakdown strength.
Heat-conductive copper-clad plate be specialized in for the low capacity of heat transmission disadvantage of common copper-clad plate, a kind of novel having of develop
The copper-clad plate of certain thermal conductivity.The heat-conducting type copper-clad plate to grow up on the basis of common copper-clad plate can be broadly divided into thermally conductive gold
Belong to base and 2 class of resin base heat-conductive copper-clad plate, in structure and common copper-clad plate has no significant difference, is to retain electrical insulation capability
On the basis of improve its capacity of heat transmission.Heat-conductive copper-clad plate also has high thermal reliability, height in addition to the general performance with copper-clad plate
The performances such as dimensional stability and high electrical insulating properties.Metal-based copper-clad plate is most common, and dosage is maximum a kind of at present thermally conductive covers
Copper sheet assigns the insulating resin adhesive layer of common metal base copper-clad plate to certain thermal conductivity and just obtains the copper-clad plate of heat-conducting type metal.Gold
Belong to substrate often make substrate with metals such as aluminium, copper, iron, the most commonly used is aluminium base heat-conductive copper-clad plates, but its insulation performance can because
The addition of Metal Substrate reduces.
Therefore, how to improve traditional copper-clad plate heating conduction, the bad disadvantage of mechanical property, to obtain more high combination property
Copper-clad plate, be its promote and application, meet industrial production demand urgent problem to be solved.
Summary of the invention
The present invention solves the technical problem of: it is asked for traditional copper-clad plate heating conduction and mechanical property are bad
Topic, provides a kind of preparation method of heat-conducting type copper-clad plate.
In order to solve the above-mentioned technical problem, the technical scheme adopted by the invention is that:
(1) glass fibre and hydrofluoric acid solution 1:20~1:30 in mass ratio are stirred, are filtered, washing is dry to get pre-
Handle glass fibre；
(2) according to parts by weight, by 20~30 parts of pretreated glass fibers, 10~20 parts of starch, 3~5 parts of biogas slurries, 20~30 parts
Water mixed fermentation is subsequently added into copper nitrate solution, filters, dry, and pressure maintaining charing obtains modified glass-fiber；
(3) modified glass-fiber is mixed with polyacrylonitrile fibre 1:2~1:3 in mass ratio, and modified glass-fiber matter is added
The silicon nitride fiber of 0.5~0.6 times of amount, obtains composite fibre material, and by composite fibre material through shredding, combing is cut out after lapping and needle thorn
It cuts, modified glass-fiber plate is made；
(4) according to parts by weight, 30~40 parts of phenolic resin are successively weighed, 8~10 parts of low-melting alloys, 3~5 parts of curing agent, 2
~3 parts of antioxidant are stirred, and obtain composite adhesive；
(5) composite adhesive is coated on copper foil, obtains single sided board, after single sided board drying, pretreatment single sided board is obtained, by two pieces
Pretreatment single sided board is fitted on modified glass-fiber plate respectively relatively with composite adhesive, blank is obtained, by blank under high temperature
Pressing is to get heat-conducting type copper-clad plate.
Step (2) starch is cornstarch, any one in potato starch or soybean starch.
Step (4) phenolic resin is phenolic resin 2123, any in phenolic resin 2127 or phenolic resin 2130
It is a kind of.
Step (4) low-melting alloy is bismuth tin alloy, sodium alloy, any one in indium alloy or gallium alloy.
Step (4) curing agent is ethylenediamine, tetra-methylenedimine, in hexamethylene diamine or ten dimethylene diamines
Any one.
Step (4) antioxidant is antioxidant 1010, any one in antioxidant 1076 or antioxidant CA.
Step (3) the modified glass-fiber plate with a thickness of 4~6 μm.
The beneficial effects of the present invention are:
The present invention is by addition modified glass fibre peacekeeping low-melting alloy, in glass fibre modifying process, firstly, glass fibre
By hydrofluoric acid solution immersion treatment, so that defect or pit occurs in fiberglass surfacing, while making fiberglass surfacing living
Property group is able to abundant exposure, then, by by pretreated glass fiber, starch, biogas slurry and water mixed fermentation, due to glass fibers
Surface active groups are tieed up sufficiently to expose, glass fibre can non-adsorbed starch, and nutrient source of the starch as bacterium, so that carefully
Bacterium breeds in fiberglass surfacing, can then be inhaled by the way that copper nitrate solution is added dropwise since bacterium surface cell wall is negatively charged
Draw and articulated system in copper ion be then passed through charing so that copper ion is largely gathered in fiberglass surfacing so that copper from
Son is reduced into elemental copper, meanwhile, the organic matter charing of fiberglass surfacing, and tar is generated, under an increased pressure, tar obtains
Tar exudation to be retained in carbonaceous layer, during high-temperature laminating, in the carbonaceous layer of modified glass-fiber surface, on the one hand,
Tar can improve the compatibility of glass fibre and phenolic resin, so that the mechanical property of system gets a promotion, it is on the other hand, burnt
Oil exudation simultaneously carry the elemental copper in the carbonaceous layer of modified glass-fiber surface floating, simultaneously as low-melting alloy with compared with
Low fusing point, has just melted before phenolic resin curing, and alloy ion good can disperse after melting and surround list
Matter copper particle after alloy graining, can make to form metallurgical bonding between simple substance copper particle, reduce between phenolic resin and glass fibre with
And the thermal contact resistance between glass fibre and glass fibre, so that the heating conduction of system is further promoted, together
When the mechanical property of system is got a promotion.
Specific embodiment
Hydrofluoric acid solution 1:20~1:30 in mass ratio that glass fibre and mass fraction are 30~40% is placed in reaction kettle
In, under the conditions of revolving speed is 300~500r/min, after being stirred 5~10min, mixed liquor is obtained, then filters mixed liquor,
Filter residue is obtained, is then neutrality by ammonia scrubbing to the cleaning solution that filter residue is 20~30% with mass fraction, then you will be after washings
Filter residue is placed in baking oven, and under the conditions of temperature is 105~110 DEG C, drying is to constant weight to get pretreated glass fiber；By weight
Number meter, by 20~30 parts of pretreated glass fibers, 10~20 parts of starch, 3~5 parts of biogas slurries, 20~30 parts of water are placed in fermentation cauldron
In, it is 30~35 DEG C in temperature, under the conditions of revolving speed is 200~300r/min, mixed fermentation 3~5 days, then adds into fermentation cauldron
Enter the copper nitrate solution that mass fraction is 10~20%, under the conditions of revolving speed is 300~500r/min, it is stirred 40~
60min obtains mixed serum, then mixed serum is filtered, and obtains filter cake, then filter cake is placed in baking oven, in temperature be 105~
It is dry to obtain dry cake to constant weight, then filter cake is placed in retort under the conditions of 110 DEG C, and with 90~120mL/min speed
Rate is filled with nitrogen into furnace, is 550~850 DEG C in temperature, under the conditions of pressure is 15MPa, after pressure maintaining carbonizes 2~3h, drops with furnace
To room temperature, modified glass-fiber is obtained；Modified glass-fiber is mixed with polyacrylonitrile fibre 1:2~1:3 in mass ratio, and is added
The silicon nitride fiber that 0.5~0.6 times of modified glass-fiber quality is stirred under conditions of revolving speed is 150~200r/min
20~40min obtains composite fibre material, and by composite fibre material through shredding, combing cuts after lapping and needle thorn, modified glass is made
Fiberboard；According to parts by weight, 30~40 parts of phenolic resin are successively weighed, 8~10 parts of low-melting alloys, 3~5 parts of curing agent, 2
~3 parts of antioxidant are placed in batch mixer, under the conditions of revolving speed is 300~500r/min, is stirred 40~60min, is obtained compound
Adhesive；Composite adhesive is moved into coating machine, is coated on copper foil with 4~8 μm of thickness, obtains single sided board, by single sided board
It moves into baking oven, after handling 4~12min under conditions of being 160~180 DEG C in temperature, obtains pretreatment single sided board, by two pieces of pre- places
Reason single sided board is fitted on modified glass-fiber plate respectively relatively with composite adhesive, obtains blank, blank is moved into vacuum pressure
It is 300~350 DEG C in temperature, under conditions of pressure is 5~8MPa, compression moulding is to get heat-conducting type copper-clad plate in machine.It is described
Starch is cornstarch, any one in potato starch or soybean starch.The phenolic resin is phenolic resin 2123, phenol
Any one in urea formaldehyde 2127 or phenolic resin 2130.The low-melting alloy be bismuth tin alloy, sodium alloy, indium alloy or
Any one in gallium alloy.The curing agent is ethylenediamine, tetra-methylenedimine, hexamethylene diamine or ten dimethylenes two
Any one in amine.The antioxidant is antioxidant 1010, any one in antioxidant 1076 or antioxidant CA.The modification
Glass mat with a thickness of 4~6 μm.
Example 1
The hydrofluoric acid solution 1:30 in mass ratio that glass fibre and mass fraction are 40% is placed in reaction kettle, is in revolving speed
Under the conditions of 500r/min, after being stirred 10min, mixed liquor is obtained, then filters mixed liquor, obtained filter residue, then use filter residue
The ammonia scrubbing that mass fraction is 30% to cleaning solution is neutrality, and then the filter residue after washing is placed in baking oven by you, is in temperature
Under the conditions of 110 DEG C, drying is to constant weight to get pretreated glass fiber；According to parts by weight, by 30 parts of pretreated glass fibers,
20 parts of starch, 5 parts of biogas slurries, 30 parts of water are placed in fermentation cauldron, are 35 DEG C in temperature, under the conditions of revolving speed is 300r/min, mixing is sent out
Ferment 5 days, the copper nitrate solution that mass fraction is 20% is then added into fermentation cauldron, under the conditions of revolving speed is 500r/min, stirring
Mix 60min, obtain mixed serum, then mixed serum is filtered, obtain filter cake, then filter cake is placed in baking oven, in temperature be 110
It is dry to constant weight under the conditions of DEG C, dry cake is obtained, then filter cake is placed in retort, and with 120mL/min rate into furnace
It is filled with nitrogen, is 850 DEG C in temperature, under the conditions of pressure is 15MPa, after pressure maintaining carbonizes 3h, is down to room temperature with furnace, obtains modified glass
Fiber；Modified glass-fiber is mixed with polyacrylonitrile fibre 1:3 in mass ratio, and is added 0.6 times of modified glass-fiber quality
Silicon nitride fiber, in revolving speed be 200r/min under conditions of be stirred 40min, composite fibre material is obtained, by composite fibre material
Through shredding, combing cuts after lapping and needle thorn, modified glass-fiber plate is made；According to parts by weight, 40 parts of phenol are successively weighed
Urea formaldehyde, 10 parts of low-melting alloys, 5 parts of curing agent, 3 parts of antioxidant are placed in batch mixer, under the conditions of revolving speed is 500r/min,
It is stirred 60min, obtains composite adhesive；Composite adhesive is moved into coating machine, is coated on copper foil with 8 μm of thickness,
Single sided board is obtained, single sided board is moved into baking oven, after handling 12min under conditions of being 180 DEG C in temperature, obtains pretreatment single sided board,
Two pieces of pretreatment single sided boards are fitted on modified glass-fiber plate respectively relatively with composite adhesive, blank is obtained, blank is moved
Enter in vacuum press, is 350 DEG C in temperature, under conditions of pressure is 8MPa, compression moulding is to get heat-conducting type copper-clad plate.Institute
Stating starch is cornstarch.The phenolic resin is phenolic resin 2123.The low-melting alloy is bismuth tin alloy.The solidification
Agent is ethylenediamine.The antioxidant is antioxidant 1010.The modified glass-fiber plate with a thickness of 6 μm.
Example 2
The hydrofluoric acid solution 1:30 in mass ratio that glass fibre and mass fraction are 40% is placed in reaction kettle, is in revolving speed
Under the conditions of 500r/min, after being stirred 10min, mixed liquor is obtained, then filters mixed liquor, obtained filter residue, then use filter residue
The ammonia scrubbing that mass fraction is 30% to cleaning solution is neutrality, and then the filter residue after washing is placed in baking oven by you, is in temperature
Under the conditions of 110 DEG C, drying is to constant weight to get pretreated glass fiber；Pretreated glass fiber and polyacrylonitrile fibre are pressed into matter
Amount is mixed than 1:3, and 0.6 times of modified glass-fiber quality of silicon nitride fiber is added, under conditions of revolving speed is 200r/min
It is stirred 40min, obtains composite fibre material, by composite fibre material through shredding, combing cuts after lapping and needle thorn, is made and is modified
Glass mat；According to parts by weight, 40 parts of phenolic resin, 10 parts of low-melting alloys, 5 parts of curing agent, 3 parts of antioxygens are successively weighed
Agent is placed in batch mixer, under the conditions of revolving speed is 500r/min, is stirred 60min, is obtained composite adhesive；By composite adhesive
Move into coating machine in, be coated on copper foil with 8 μm of thickness, obtain single sided board, by single sided board move into baking oven in, in temperature be 180
After handling 12min under conditions of DEG C, pretreatment single sided board is obtained, two pieces of pretreatment single sided boards are pasted respectively relatively with composite adhesive
Together on modified glass-fiber plate, blank is obtained, blank is moved into vacuum press, is 350 DEG C in temperature, pressure is 8MPa's
Under the conditions of, compression moulding is to get heat-conducting type copper-clad plate.The starch is cornstarch.The phenolic resin is phenolic resin
2123.The low-melting alloy is bismuth tin alloy.The curing agent is ethylenediamine.The antioxidant is antioxidant 1010.It is described
Modified glass-fiber plate with a thickness of 6 μm.
Example 3
The hydrofluoric acid solution 1:30 in mass ratio that glass fibre and mass fraction are 40% is placed in reaction kettle, is in revolving speed
Under the conditions of 500r/min, after being stirred 10min, mixed liquor is obtained, then filters mixed liquor, obtained filter residue, then use filter residue
The ammonia scrubbing that mass fraction is 30% to cleaning solution is neutrality, and then the filter residue after washing is placed in baking oven by you, is in temperature
Under the conditions of 110 DEG C, drying is to constant weight to get pretreated glass fiber；According to parts by weight, by 30 parts of pretreated glass fibers,
20 parts of starch, 5 parts of biogas slurries, 30 parts of water are placed in fermentation cauldron, are 35 DEG C in temperature, under the conditions of revolving speed is 300r/min, mixing is sent out
Ferment 5 days, the copper nitrate solution that mass fraction is 20% is then added into fermentation cauldron, under the conditions of revolving speed is 500r/min, stirring
Mix 60min, obtain mixed serum, then mixed serum is filtered, obtain filter cake, then filter cake is placed in baking oven, in temperature be 110
It is dry to constant weight under the conditions of DEG C, dry cake is obtained, then filter cake is placed in retort, and with 120mL/min rate into furnace
It is filled with nitrogen, is 850 DEG C in temperature, under the conditions of pressure is 15MPa, after pressure maintaining carbonizes 3h, is down to room temperature with furnace, obtains modified glass
Fiber；Modified glass-fiber is mixed with polyacrylonitrile fibre 1:3 in mass ratio, and is added 0.6 times of modified glass-fiber quality
Silicon nitride fiber, in revolving speed be 200r/min under conditions of be stirred 40min, composite fibre material is obtained, by composite fibre material
Through shredding, combing cuts after lapping and needle thorn, modified glass-fiber plate is made；According to parts by weight, 40 parts of phenol are successively weighed
Urea formaldehyde, 5 parts of curing agent, 3 parts of antioxidant are placed in batch mixer, under the conditions of revolving speed is 500r/min, are stirred 60min,
Obtain composite adhesive；Composite adhesive is moved into coating machine, is coated on copper foil with 8 μm of thickness, obtains single sided board, by single side
Plate moves into baking oven, after handling 12min under conditions of being 180 DEG C in temperature, pretreatment single sided board is obtained, by two pieces of pretreatment single sides
Plate is fitted on modified glass-fiber plate respectively relatively with composite adhesive, obtains blank, and blank is moved into vacuum press, in
Temperature is 350 DEG C, and under conditions of pressure is 8MPa, compression moulding is to get heat-conducting type copper-clad plate.The starch is cornstarch.
The phenolic resin is phenolic resin 2123.The curing agent is ethylenediamine.The antioxidant is antioxidant 1010.The modification
Glass mat with a thickness of 6 μm.
Comparative example: the copper-clad plate of Jiangyin insulating materials Co., Ltd production.
1 to 3 gained copper-clad plate of example and comparative example product are subjected to performance detection, the specific detection method is as follows:
Mechanical property: test specimen tensile strength is detected according to GB/T 3354；
Heating conduction: test specimen is tested using LW9090IR Conduction Coefficient Detector Basing.
Specific testing result is as shown in table 1:
Table 1: performance detection table
| Detection project | Example 1 | Example 2 | Example 3 | Comparative example |
| Tensile strength/MPa | 119.75 | 98.46 | 93.82 | 63.84 |
| Thermal conductivity/W/(mK) | 2.66 | 2.14 | 1.98 | 1.32 |
By 1 testing result of table it is found that present invention gained heat-conducting type copper-clad plate has excellent heating conduction and mechanical property.
Claims (7)
1. a kind of preparation method of heat-conducting type copper-clad plate, it is characterised in that specific preparation process is as follows:
(1) glass fibre and hydrofluoric acid solution 1:20~1:30 in mass ratio are stirred, are filtered, washing is dry to get pre-
Handle glass fibre；
(2) according to parts by weight, by 20~30 parts of pretreated glass fibers, 10~20 parts of starch, 3~5 parts of biogas slurries, 20~30 parts
Water mixed fermentation is subsequently added into copper nitrate solution, filters, dry, and pressure maintaining charing obtains modified glass-fiber；
(3) modified glass-fiber is mixed with polyacrylonitrile fibre 1:2~1:3 in mass ratio, and modified glass-fiber matter is added
The silicon nitride fiber of 0.5~0.6 times of amount, obtains composite fibre material, and by composite fibre material through shredding, combing is cut out after lapping and needle thorn
It cuts, modified glass-fiber plate is made；
(4) according to parts by weight, 30~40 parts of phenolic resin are successively weighed, 8~10 parts of low-melting alloys, 3~5 parts of curing agent, 2
~3 parts of antioxidant are stirred, and obtain composite adhesive；
(5) composite adhesive is coated on copper foil, obtains single sided board, after single sided board drying, pretreatment single sided board is obtained, by two pieces
Pretreatment single sided board is fitted on modified glass-fiber plate respectively relatively with composite adhesive, blank is obtained, by blank under high temperature
Pressing is to get heat-conducting type copper-clad plate.
2. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (2) described starch
Any one for cornstarch, in potato starch or soybean starch.
3. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (4) described phenolic aldehyde
Resin is phenolic resin 2123, any one in phenolic resin 2127 or phenolic resin 2130.
4. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (4) described eutectic
Point alloy is bismuth tin alloy, sodium alloy, any one in indium alloy or gallium alloy.
5. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (4) described solidification
Agent is ethylenediamine, tetra-methylenedimine, any one in hexamethylene diamine or ten dimethylene diamines.
6. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (4) described antioxygen
Agent is antioxidant 1010, any one in antioxidant 1076 or antioxidant CA.
7. a kind of preparation method of heat-conducting type copper-clad plate according to claim 1, it is characterised in that: step (3) described modification
Glass mat with a thickness of 4~6 μm.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110077088A (en) * | 2019-03-11 | 2019-08-02 | 常州讯宛德电子有限公司 | A kind of preparation method of composite heat-conducting copper-clad plate |
| CN112720981A (en) * | 2020-11-30 | 2021-04-30 | 上海复合材料科技有限公司 | Premix low-pressure integrated compression molding method for ablation-resistant spray pipe with thin-wall metal piece |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
-
2018
- 2018-07-12 CN CN201810762774.6A patent/CN108943910A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110077088A (en) * | 2019-03-11 | 2019-08-02 | 常州讯宛德电子有限公司 | A kind of preparation method of composite heat-conducting copper-clad plate |
| CN112720981A (en) * | 2020-11-30 | 2021-04-30 | 上海复合材料科技有限公司 | Premix low-pressure integrated compression molding method for ablation-resistant spray pipe with thin-wall metal piece |
| CN112720981B (en) * | 2020-11-30 | 2022-12-23 | 上海复合材料科技有限公司 | Premix low-pressure integrated compression molding method for ablation-resistant spray pipe with thin-wall metal piece |
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Application publication date: 20181207 |
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