CN111662435A - Insulating substrate and preparation method and application thereof - Google Patents

Insulating substrate and preparation method and application thereof Download PDF

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Publication number
CN111662435A
CN111662435A CN202010549211.6A CN202010549211A CN111662435A CN 111662435 A CN111662435 A CN 111662435A CN 202010549211 A CN202010549211 A CN 202010549211A CN 111662435 A CN111662435 A CN 111662435A
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parts
insulating substrate
resin composition
copper
resin
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胡革
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Premier New Materials Chengdu Co ltd
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Premier New Materials Chengdu Co ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/02—Halogenated hydrocarbons
    • C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C08K7/20—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/02—Coating on the layer surface on fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/308—Heat stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B32B2307/7265—Non-permeable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/11—Homopolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/10—Definition of the polymer structure
    • C08G2261/12—Copolymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2261/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G2261/40—Polymerisation processes
    • C08G2261/41—Organometallic coupling reactions
    • C08G2261/418—Ring opening metathesis polymerisation [ROMP]

Abstract

The invention provides an insulating substrate and a preparation method and application thereof, belonging to the field of electronic materials. The insulating substrate is obtained by coating or impregnating a reinforcing material with a resin composition; the resin composition is prepared from the following raw materials in parts by weight: 9000-10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 0.1-10 parts of ruthenium carbene catalyst. The invention adopts the specific resin composition to prepare the insulating substrate and further prepare the copper-clad plate, thereby not only effectively improving the glass transition temperature, but also effectively reducing the dielectric loss when in use and meeting the application requirement of high-frequency high-speed communication. Meanwhile, the prepared insulating substrate or copper-clad plate has good combustion resistance and dip soldering resistance, is not easy to absorb water, and is more suitable for preparing electronic materials. In addition, the preparation method is safe and environment-friendly. The resin composition disclosed by the invention is used for preparing the insulating substrate, and the prepared copper-clad plate can be used for high-frequency high-speed communication, particularly 5G communication, and has a good application prospect.

Description

Insulating substrate and preparation method and application thereof
Technical Field
The invention belongs to the field of electronic materials, and particularly relates to an insulating substrate, and a preparation method and application thereof.
Background
In many electronic products, a Printed Circuit Board (PCB) functions as a circuit interconnection and is an indispensable main part of the electronic products. Printed Circuit Boards (PCBs) are manufactured by etching a copper clad laminate (CCL, copper clad laminate for short) to obtain the associated circuitry. A Copper Clad Laminate (CCL) is a plate-like material formed by impregnating a reinforcing material with a resin, coating one or both surfaces with a copper foil, and performing hot pressing, and is a basic material for manufacturing a Printed Circuit Board (PCB).
In the production of a conventional single-sided or double-sided PCB, a series of operations (e.g., etching, plating, drilling, etc.) are performed on the copper-clad plate to form the desired conductive pattern circuit. In the process of manufacturing the multilayer printed circuit board, the unprocessed copper clad laminate is used as a base material to be manufactured into a conductive pattern circuit, and is directly pressed and molded by a hot press after being alternately pressed with a Bonding sheet (Bonding sheet) to be bonded together, so that more than three pattern circuit layers, namely the multilayer printed circuit board, are manufactured.
The aforementioned copper clad laminate for single-sided or double-sided PCB, as well as the copper clad laminate for multi-layer PCB and prepreg (insulating substrate) are all PCB-based materials, and are all the fields of copper clad laminate manufacturing industry technology. In the current production of Printed Circuit Boards (PCB), a copper clad laminate prepared from a glass fiber epoxy prepreg is mainly applied, thermosetting resin such as epoxy resin is dissolved in organic solvent such as toluene or butanone to form glue solution, then glass fiber cloth is immersed in the glue solution, and the solvent in the glue solution is volatilized through high-temperature heating to obtain the prepreg; and (3) pressing the prepreg and the copper foil together through a high-pressure high-temperature pressing machine, and finally obtaining the copper-clad plate through the complicated and high-energy-consumption process steps.
According to the traditional technology for preparing the copper-clad plate by using the solvent method, a large amount of organic solvent is consumed, the environmental pollution is caused, meanwhile, a large amount of heat is consumed in the solvent volatilization and solidification processes, the process is high in energy consumption, the performances such as dip-soldering resistance, peeling strength and the like are influenced due to the fact that the solvent cannot be completely volatilized, meanwhile, the epoxy resin material has the defects of high dielectric constant, high dielectric loss and the like, and the requirements of the high-frequency high-speed copper-clad plate in the current 5G communication cannot be met.
Patent CN107417864 discloses a polyphenylene ether prepolymer and a preparation method thereof, and also discloses a composition containing the polyphenylene ether prepolymer, and the resin composition is made into a prepreg, a laminated board or a printed circuit board. The polyphenyl ether prepolymer is obtained by reacting dicyclopentadiene monomer and vinyl-containing polyphenyl ether under a ruthenium catalyst. The prepolymer preparation process is relatively complicated and also requires the use of large amounts of organic solvents.
Disclosure of Invention
The invention aims to provide an insulating substrate and a preparation method and application thereof.
The invention provides an insulating substrate, which is obtained by coating or impregnating a reinforcing material with a resin composition; the resin composition is prepared from the following raw materials in parts by weight: 9000-10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 0.1-10 parts of ruthenium carbene catalyst.
Further, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-6 parts of ruthenium carbene catalysts;
preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-4 parts of ruthenium carbene catalysts;
more preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 2 parts of ruthenium carbene catalyst.
Further, the resin composition also comprises the following raw materials in parts by weight: 0-5000 parts of organic filler, 0-10000 parts of inorganic filler, 0-10000 parts of thermosetting resin and 0-10000 parts of organic solvent;
preferably, the resin composition further comprises the following raw materials in parts by weight: 0-1000 parts of organic filler, 0-5000 parts of inorganic filler, 0-10000 parts of thermosetting resin and 0-10000 parts of organic solvent.
Further, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-6 parts of ruthenium carbene catalysts;
preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-4 parts of ruthenium carbene catalysts;
more preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 2 parts of ruthenium carbene catalyst.
Further, the cyclic olefin compound containing one or two double bonds and at least one bridged ring is one or a composition of more of dicyclopentadiene, cyclopentadiene trimer, cyclopentadiene tetramer and norbornene; the content of the dicyclopentadiene is 30-100%.
Further, the cyclic olefin compound containing one or two double bonds and at least one bridged ring is dicyclopentadiene;
or the cyclic olefin compound containing one or two double bonds and at least one bridge ring consists of dicyclopentadiene and norbornene; the mass ratio of dicyclopentadiene to norbornene is (5-10): 1;
preferably, the dicyclopentadiene and norbornene contain one or two functional groups; the functional group is one or more of methyl, methoxy, hydroxyl, carboxylic acid group, acrylate group and methacrylate group;
more preferably, the mass ratio of dicyclopentadiene to norbornene is 9: 1.
further, the structural formula of the ruthenium carbene catalyst is shown as formula I:
Figure BDA0002541893880000031
wherein L is1、L2、L3Is an independently selected electron donating group;
n is 0 or 1;
m is 0, 1 or 2;
k is 0 or 1;
X1and X2Are independently selected anionic ligands;
R1and R2Are respectively selected from H atom, hydrocarbon group and heteroatom-containing hydrocarbon group;
preferably, the first and second electrodes are formed of a metal,
the structural formula of the ruthenium carbene catalyst is shown in the specification
Figure BDA0002541893880000032
Figure BDA0002541893880000033
Further, the inorganic filler is one or more of calcium carbonate, aluminum oxide, magnesium oxide, boron nitride, silica glass beads and silica hollow glass beads;
the thermosetting resin is one or more of epoxy resin, benzoxazine resin, cyanate ester resin, bismaleimide resin, polyphenyl ether resin and phenolic resin;
the organic filler is one or more of polystyrene, styrene-butadiene-styrene block copolymer, acrylonitrile-butadiene-styrene plastic, styrene-ethylene-butylene-styrene block copolymer, light stabilizer, antioxidant and flame retardant;
the organic solvent is toluene, methyl ethyl ketone, butanone, tetrahydrofuran or N, N-dimethylformamide;
preferably, the first and second electrodes are formed of a metal,
the inorganic filler is composed of alumina and silica glass beads, and the mass ratio of the alumina to the silica glass beads is (1-5): (1-5);
the light stabilizer is one or more of bis (1,2,2,6, 6-pentamethylpiperidinol) sebacate, succinic acid, 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol polymer, 3- [3- (2-H-benzotriazole-2-yl) -4-hydroxy-5-tert-butylphenyl ] -propionic acid-polyethylene glycol ester, bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate and 1-methyl-8- (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate;
the antioxidant is antioxidant TPP, antioxidant 164, antioxidant 1010, antioxidant BHT or antioxidant CA;
one or more of ammonium polyphosphate, red phosphorus, decabromodiphenylethane, hexabromocyclododecane, DOPO, DiDOPO and triphenyl phosphate serving as a flame retardant;
the organic solvent is toluene or butanone;
more preferably still, the first and second liquid crystal compositions are,
the mass ratio of the alumina to the silica glass beads is 3: 2.
further, the preparation method of the resin composition comprises the following steps: mixing the raw materials in the weight ratio to obtain the product.
Further, the reinforcing material is glass fiber cloth.
The invention also provides a preparation method of the insulating substrate, which comprises the following steps: coating or impregnating the reinforcing material with the resin composition, and heating and curing to obtain the composite material;
preferably, the temperature for heating and curing is 60-180 ℃ and the time is 1-20 minutes;
more preferably, the temperature for heating and curing is 60-100 ℃ and the time is 5-10 minutes.
The invention also provides the application of the insulating substrate in preparing the copper foil-clad laminated board; preferably, the copper clad laminate is a high-frequency high-speed copper clad laminate; more preferably, the copper clad laminate is a 5G communication high-frequency high-speed copper clad laminate.
The invention also provides a copper clad laminate which is obtained by pasting copper foil on the insulating substrate.
The invention also provides a preparation method of the copper clad laminate, which comprises the following steps: pasting a copper foil on the surface of the insulating substrate, and carrying out hot pressing to obtain the copper foil; the copper foil is adhered to one side or two sides of the insulating substrate.
Further, when the copper foil is pasted, an adhesive is coated on the surface of the insulating substrate or the surface of the copper foil;
preferably, the adhesive is one or more of epoxy resin, phenolic resin, polyphenyl ether resin and cyanate resin;
and/or the hot pressing is vacuum hot pressing or composite roller hot pressing.
Further, the temperature of the vacuum hot pressing is 60-150 ℃, and the time is 5-10 minutes;
and/or, the hot pressing of the composite roller is carried out after the normal temperature composite roller is hot pressed, and then curing is carried out;
preferably, hot pressing is carried out on the compound roller after 3-5 minutes of normal temperature compound, and the hot pressing of the compound roller is carried out for 2-5 minutes at the temperature of 60-100 ℃; the curing is carried out at 150-200 ℃ for 2-5 minutes.
The invention also provides application of the copper clad laminate in preparation of a printed circuit board.
In the invention, the normal temperature refers to room temperature, 25 +/-5 ℃; the overnight refers to 12. + -. 2 h.
The invention adopts the cycloolefine compounds containing one or two double bonds and at least one bridged ring as raw materials (such as dicyclopentadiene and norbornene) to obtain large-size materials (such as large-size polydicyclopentadiene) under the action of a specific ruthenium carbene catalyst. The material has no implosion bubbles, the mechanical property and the thermal stability are also obviously improved, the dielectric property is very excellent, and the material is suitable for manufacturing a high-frequency high-speed communication base material-Copper Clad Laminate (CCL) board and has very good application prospect.
The invention adopts the specific resin composition to prepare the insulating substrate and further prepare the copper-clad plate, thereby not only effectively improving the glass transition temperature of the copper-clad plate or the insulating substrate, but also obviously reducing the dielectric constant and the dielectric loss of the copper-clad plate or the insulating substrate compared with the prior art, effectively reducing the dielectric loss when in use, meeting the requirements of the current high-frequency high-speed communication application, in particular meeting the requirements of the high-frequency high-speed copper-clad plate such as 5G communication and the like. Meanwhile, the insulating substrate or the copper-clad plate prepared from the resin composition has good combustion resistance and dip soldering resistance, is not easy to absorb water, is more suitable for the technical field of electronics, and is further used for preparing printed circuit boards or other electronic materials. In addition, the preparation method does not need to use an organic solvent, reduces the pollution to operators and atmosphere to the minimum degree, and is safer and more environment-friendly; the cyclic olefin compound can be cured within minutes or even seconds by ring-opening shift polymerization, and compared with epoxy resin which requires several hours of curing time, the efficiency is improved, and the energy consumption is reduced. The resin composition is used for preparing the insulating substrate, and the prepared high-frequency high-speed copper-clad plate can be used for communication, particularly 5G communication, can realize the processing of a novel copper-clad plate with low dielectric constant and low dielectric loss and no solvent, and has good application prospect.
Obviously, many modifications, substitutions, and variations are possible in light of the above teachings of the invention, without departing from the basic technical spirit of the invention, as defined by the following claims.
The present invention will be described in further detail with reference to the following examples. This should not be understood as limiting the scope of the above-described subject matter of the present invention to the following examples. All the technologies realized based on the above contents of the present invention belong to the scope of the present invention.
Detailed Description
The raw materials and equipment used in the embodiment of the present invention are known products and obtained by purchasing commercially available products.
Embodiment 1 preparation of high-frequency high-speed copper-clad plate
The dicyclopentadiene and ruthenium carbene catalyst is prepared by mixing the following components in a weight ratio of 10000: 2, stirring and mixing uniformly to obtain glue solution, selecting 200 x 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. Coating phenolic resin adhesive on the surface of a copper foil with the thickness of 35 microns (or coating the phenolic resin adhesive on two sides of an insulating substrate), then respectively placing two copper foils on two sides of the insulating substrate, placing the two copper foils in a vacuum hot press and pressing the two copper foils to obtain a copper-clad plate, wherein the temperature and time of vacuum hot pressing are 150 ℃ for 10 minutes.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000061
Embodiment 2 preparation of high-frequency high-speed flame-retardant copper-clad plate
Dicyclopentadiene, a ruthenium carbene catalyst, silica glass microspheres and decabromodiphenylethane are mixed according to the weight ratio of 10000: 2: 5000: 1000, stirring and mixing uniformly to obtain glue solution, selecting 200X 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. Coating phenolic resin adhesive on the surface of a copper foil with the thickness of 35 microns (or coating the phenolic resin adhesive on two sides of an insulating substrate), then respectively placing two copper foils on two sides of the insulating substrate, placing the two copper foils in a vacuum hot press and pressing the two copper foils to obtain a copper-clad plate, wherein the temperature and time of vacuum hot pressing are 150 ℃ for 10 minutes.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000062
Embodiment 3 preparation of high-frequency high-speed copper-clad plate of the invention
Cycloolefin compound (composed of dicyclopentadiene and norbornene, the weight ratio of dicyclopentadiene to norbornene is 9: 1), ruthenium carbene catalyst, silica glass beads and hexabromocyclododecane according to the weight ratio of 10000: 2: 5000: 1000, stirring and mixing uniformly to obtain glue solution, selecting 200X 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. Coating phenolic resin adhesive on the surface of a copper foil with the thickness of 35 microns (or coating the phenolic resin adhesive on two sides of an insulating substrate), then respectively placing two copper foils on two sides of the insulating substrate, placing the two copper foils in a vacuum hot press and pressing the two copper foils to obtain a copper-clad plate, wherein the temperature and time of vacuum hot pressing are 150 ℃ for 10 minutes.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000063
Embodiment 4 preparation of the high-temperature-resistant high-frequency high-speed copper-clad plate
Dicyclopentadiene, a ruthenium carbene catalyst, silica glass microspheres and hexabromocyclododecane are mixed according to the weight ratio of 10000: 4: 5000: 1000, stirring and mixing uniformly to obtain glue solution, selecting 200X 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. Coating phenolic resin adhesive on the surface of a copper foil with the thickness of 35 microns (or coating the phenolic resin adhesive on two sides of an insulating substrate), then respectively placing two copper foils on two sides of the insulating substrate, placing the two copper foils in a vacuum hot press and pressing the two copper foils to obtain a copper-clad plate, wherein the temperature and time of vacuum hot pressing are 150 ℃ for 10 minutes.
This implementationThe ruthenium carbene catalyst used in the examples is
Figure BDA0002541893880000071
Embodiment 5 preparation of high-frequency high-speed flame-retardant epoxy resin copper-clad plate
Dicyclopentadiene, a ruthenium carbene catalyst, epoxy resin, silica glass microspheres and hexabromocyclododecane are mixed according to the weight ratio of 10000: 6: 10000: 5000: 1000, stirring and mixing uniformly to obtain glue solution, selecting 200X 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. And respectively placing copper foils with the thickness of 35 microns on two surfaces of an insulating substrate, placing the insulating substrate in a vacuum hot press, and pressing the insulating substrate in the vacuum hot press to obtain the copper-clad plate, wherein the temperature and time of the vacuum hot press are 150 ℃ for 10 minutes.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000072
Embodiment 6 preparation of high-frequency high-speed flame-retardant phenolic resin copper-clad plate
Dicyclopentadiene, a ruthenium carbene catalyst, phenolic resin, an inorganic filler (the inorganic filler is composed of alumina powder and silica glass beads, the weight ratio of the alumina powder to the silica glass beads is 300: 200), hexabromocyclododecane according to the weight ratio of 10000: 4: 10000: 5000: 1000, stirring and mixing uniformly to obtain glue solution, selecting 200X 200mm E-glass fiber cloth, uniformly coating the glue solution, and curing at 60 ℃ for 10 minutes to obtain the insulating substrate. And respectively placing copper foils with the thickness of 35 microns on two surfaces of an insulating substrate, placing the insulating substrate in a vacuum hot press, and pressing the insulating substrate in the vacuum hot press to obtain the copper-clad plate, wherein the temperature and time of the vacuum hot press are 150 ℃ for 10 minutes.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000081
Embodiment 7 continuous preparation of high-frequency high-speed copper-clad plate
Dicyclopentadiene, a ruthenium carbene catalyst, silica glass microspheres and decabromodiphenylethane are mixed according to the weight ratio of 10000: 2: 5000: 1000, stirring and mixing uniformly to obtain a glue solution, placing the glue solution in a gluing tank, passing E-glass fiber cloth through the gluing tank, uniformly coating the glue solution, coating a phenolic resin adhesive on the surface of a copper foil with the thickness of 35 microns, passing two copper foils and the glass fiber cloth coated with the glue solution through a normal-temperature compounding roller (3 minutes) and a hot-pressing compounding roller (60 ℃ for 2 minutes), respectively passing the two copper foils on two sides of the glass fiber cloth when passing through the compounding rollers, then passing through a curing furnace (150 ℃ for 2 minutes), and shearing to obtain the copper-clad plate.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000082
Example 8 continuous preparation of phenolic resin high-frequency high-speed copper-clad plate without solvent
Dicyclopentadiene, a ruthenium carbene catalyst, phenolic resin, silica glass microspheres and hexabromocyclododecane are mixed according to the weight ratio of 10000: 4: 10000: 5000: 1000, stirring and mixing uniformly to obtain a glue solution, placing the glue solution in a gluing tank, passing E-glass fiber cloth through the gluing tank, uniformly coating the glue solution, passing 35-micron-thick copper foils and the glass fiber cloth coated with the glue solution through a normal-temperature compounding roller (3 minutes) and a hot-pressing compounding roller (60 ℃,2 minutes), passing through the compounding rollers, respectively placing two copper foils on two sides of the glass fiber cloth, then passing through a curing oven (180 ℃, 5 minutes), and shearing to obtain the copper-clad plate.
The ruthenium carbene catalyst used in this example was
Figure BDA0002541893880000083
Embodiment 9 preparation of high-frequency high-speed copper-clad plate of the invention
Replacement of only the ruthenium carbene catalyst in example 1 by
Figure BDA0002541893880000091
The remaining conditions were unchanged.
Embodiment 10 preparation of high-frequency high-speed copper-clad plate of the invention
Replacement of only the ruthenium carbene catalyst in example 1 by
Figure BDA0002541893880000092
The remaining conditions were unchanged.
Embodiment 11 preparation of high-frequency high-speed copper-clad plate of the invention
Replacement of only the ruthenium carbene catalyst in example 1 by
Figure BDA0002541893880000093
The remaining conditions were unchanged.
Comparative example 1 preparation of solvent type epoxy resin copper-clad plate
Butanone, epoxy resin, a curing agent, silica glass microspheres and hexabromocyclododecane are mixed according to the weight ratio of 100: 100: 10: 50: 10 to obtain a glue solution, putting the glue solution into a gluing tank, passing the E-glass fiber cloth through the gluing tank, uniformly coating the glue solution, passing through a thermal curing furnace (155 ℃, 10 minutes), and removing an organic solvent butanone to obtain the insulating substrate. Then attaching 35 micron copper foil on the upper and lower sides of the insulating substrate, placing the insulating substrate in a vacuum hot press for pressing to obtain the copper-clad plate, wherein the temperature rise procedure is as follows: the temperature is raised from room temperature to 150 ℃ for 15 minutes and maintained for 30 minutes, then raised to 190 ℃ for 5 minutes and maintained for 2 hours, and finally cooled for 30 minutes. And obtaining the copper-clad plate.
The advantageous effects of the present invention are demonstrated by specific test examples below.
Test example 1 detection of Performance of copper clad laminate
The copper-clad plates prepared in examples 1 to 11 and comparative example 1 were compared in terms of performance, and the performance test items and results are shown in table 1. The test method used for each performance test item is as follows:
glass transition temperature test method: testing according to GB/T1033.1-2008;
the dielectric constant test method comprises the following steps: testing by ASTM D150(10 GHz);
the dielectric loss test method comprises the following steps: testing by ASTM D150(10 GHz);
the peel strength test method comprises the following steps: measured according to IPC-TM-650 method;
the combustion resistance test method comprises the following steps: measured according to the UL94 method;
dip-soldering resistance (delamination) test method: immersing a sample (100X 100mm substrate) kept in a pressure cooker at 121 ℃ and 105kPa for 2 hours in a solder bath heated to 260 ℃ for 20 seconds to visually observe whether or not delamination occurs and whether or not white spots or wrinkles occur;
water absorption test method: the measurement was carried out according to the IPC-TM-6502.6.2.1 method.
TABLE 1 comparison of the Properties of the copper-clad plates
Figure BDA0002541893880000101
As can be seen from the test results of table 1: compared with the copper-clad plate prepared by the prior art, the copper-clad plate prepared by the insulating substrate prepared by the special resin composition has higher glass transition temperature, smaller dielectric constant and less dielectric loss, and has excellent performances; the dielectric constant of the copper clad laminate is lower than 4, the dielectric loss is not higher than 0.009, even lower than 0.003, the loss in the circuit use process can be effectively reduced, the requirements of the current high-frequency high-speed communication application are met, and particularly the requirements of the copper clad laminate serving as the high-frequency high-speed copper clad laminate in the current 5G communication are met. Meanwhile, the copper-clad plate prepared by the insulating substrate has good combustion resistance and dip soldering resistance, is not easy to absorb water, is more suitable for the technical field of electronics, and is further used for preparing printed circuit boards or other electronic materials.
In conclusion, the insulating substrate is prepared by adopting the specific resin composition, the copper-clad plate is further prepared, the glass transition temperature of the copper-clad plate or the insulating substrate is effectively improved, the dielectric constant and the dielectric loss of the copper-clad plate or the insulating substrate are obviously reduced compared with the prior art, the dielectric loss can be effectively reduced when the copper-clad plate or the insulating substrate is used, the requirements of the current high-frequency high-speed communication application can be met, and particularly the requirements of the high-frequency high-speed copper-clad plate such as 5G communication and the like can be met. Meanwhile, the insulating substrate or the copper-clad plate prepared from the resin composition has good combustion resistance and dip soldering resistance, is not easy to absorb water, is more suitable for the technical field of electronics, and is further used for preparing printed circuit boards or other electronic materials. In addition, the preparation method does not need to use an organic solvent, reduces the pollution to operators and atmosphere to the minimum degree, and is safer and more environment-friendly; the cyclic olefin compound can be cured within minutes or even seconds by ring-opening shift polymerization, and compared with epoxy resin which requires several hours of curing time, the efficiency is improved, and the energy consumption is reduced. The resin composition is used for preparing the insulating substrate, and the prepared high-frequency high-speed copper-clad plate can be used for communication, particularly 5G communication, can realize the processing of a novel copper-clad plate with low dielectric constant and low dielectric loss and no solvent, and has good application prospect.

Claims (17)

1. An insulating substrate, characterized in that: it is obtained by coating or impregnating a reinforcing material with a resin composition; the resin composition is prepared from the following raw materials in parts by weight: 9000-10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 0.1-10 parts of ruthenium carbene catalyst.
2. The insulating substrate according to claim 1, wherein: the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-6 parts of ruthenium carbene catalysts;
preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-4 parts of ruthenium carbene catalysts;
more preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 2 parts of ruthenium carbene catalyst.
3. The insulating substrate according to claim 1 or 2, wherein: the resin composition also comprises the following raw materials in parts by weight: 0-5000 parts of organic filler, 0-10000 parts of inorganic filler, 0-10000 parts of thermosetting resin and 0-10000 parts of organic solvent;
preferably, the resin composition further comprises the following raw materials in parts by weight: 0-1000 parts of organic filler, 0-5000 parts of inorganic filler, 0-10000 parts of thermosetting resin and 0-10000 parts of organic solvent.
4. The insulating substrate according to claim 1 or 2, wherein: the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-6 parts of ruthenium carbene catalysts;
preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cycloolefin compounds containing one or two double bonds and at least one bridged ring, and 1-4 parts of ruthenium carbene catalysts;
more preferably, the resin composition is prepared from the following raw materials in parts by weight: 10000 parts of cyclic olefin compound containing one or two double bonds and at least one bridged ring, and 2 parts of ruthenium carbene catalyst.
5. The insulating substrate according to claim 1 or 2, wherein: the cyclic olefin compound containing one or two double bonds and at least one bridged ring is one or a composition of more of dicyclopentadiene, cyclopentadiene trimer, cyclopentadiene tetramer and norbornene; the content of the dicyclopentadiene is 30-100%.
6. The insulating substrate according to claim 5, wherein: the cyclic olefin compound containing one or two double bonds and at least one bridged ring is dicyclopentadiene;
or the cyclic olefin compound containing one or two double bonds and at least one bridge ring consists of dicyclopentadiene and norbornene; the mass ratio of dicyclopentadiene to norbornene is (5-10): 1;
preferably, the dicyclopentadiene and norbornene contain one or two functional groups; the functional group is one or more of methyl, methoxy, hydroxyl, carboxylic acid group, acrylate group and methacrylate group;
more preferably, the mass ratio of dicyclopentadiene to norbornene is 9: 1.
7. the insulating substrate according to claim 1 or 2, wherein: the structural formula of the ruthenium carbene catalyst is shown as a formula I:
Figure FDA0002541893870000021
wherein L is1、L2、L3Is an independently selected electron donating group;
n is 0 or 1;
m is 0, 1 or 2;
k is 0 or 1;
X1and X2Are independently selected anionic ligands;
R1and R2Are respectively selected from H atom, hydrocarbon group and heteroatom-containing hydrocarbon group;
preferably, the first and second electrodes are formed of a metal,
the structural formula of the ruthenium carbene catalyst is shown in the specification
Figure FDA0002541893870000022
Figure FDA0002541893870000023
8. The insulating substrate according to claim 1 or 2, wherein: the inorganic filler is one or more of calcium carbonate, aluminum oxide, magnesium oxide, boron nitride, silica glass beads and silica hollow glass beads;
the thermosetting resin is one or more of epoxy resin, benzoxazine resin, cyanate ester resin, bismaleimide resin, polyphenyl ether resin and phenolic resin;
the organic filler is one or more of polystyrene, styrene-butadiene-styrene block copolymer, acrylonitrile-butadiene-styrene plastic, styrene-ethylene-butylene-styrene block copolymer, light stabilizer, antioxidant and flame retardant;
the organic solvent is toluene, methyl ethyl ketone, butanone, tetrahydrofuran or N, N-dimethylformamide;
preferably, the first and second electrodes are formed of a metal,
the inorganic filler is composed of alumina and silica glass beads, and the mass ratio of the alumina to the silica glass beads is (1-5): (1-5);
the light stabilizer is one or more of bis (1,2,2,6, 6-pentamethylpiperidinol) sebacate, succinic acid, 4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol polymer, 3- [3- (2-H-benzotriazole-2-yl) -4-hydroxy-5-tert-butylphenyl ] -propionic acid-polyethylene glycol ester, bis (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate and 1-methyl-8- (1,2,2,6, 6-pentamethyl-4-piperidine) sebacate;
the antioxidant is antioxidant TPP, antioxidant 164, antioxidant 1010, antioxidant BHT or antioxidant CA;
one or more of ammonium polyphosphate, red phosphorus, decabromodiphenylethane, hexabromocyclododecane, DOPO, DiDOPO and triphenyl phosphate serving as a flame retardant;
the organic solvent is toluene or butanone;
more preferably still, the first and second liquid crystal compositions are,
the mass ratio of the alumina to the silica glass beads is 3: 2.
9. the insulating substrate according to claim 1 or 2, wherein: the preparation method of the resin composition comprises the following steps: mixing the raw materials in the weight ratio to obtain the product.
10. The insulating substrate according to claim 1 or 2, wherein: the reinforced material is glass fiber cloth.
11. A method for producing an insulating substrate according to any one of claims 1 to 10, characterized in that: it comprises the following steps: coating or impregnating the reinforcing material with the resin composition, and heating and curing to obtain the composite material;
preferably, the temperature for heating and curing is 60-180 ℃ and the time is 1-20 minutes;
more preferably, the temperature for heating and curing is 60-100 ℃ and the time is 5-10 minutes.
12. Use of the insulating substrate according to any one of claims 1 to 10 for the preparation of a copper clad laminate; preferably, the copper clad laminate is a high-frequency high-speed copper clad laminate; more preferably, the copper clad laminate is a 5G communication high-frequency high-speed copper clad laminate.
13. A copper clad laminate characterized in that: the insulating substrate is obtained by attaching a copper foil to the insulating substrate according to any one of claims 1 to 10.
14. A method for producing the copper clad laminate as claimed in claim 13, characterized in that: it comprises the following steps: pasting a copper foil on the surface of the insulating substrate, and carrying out hot pressing to obtain the copper foil; the copper foil is adhered to one side or two sides of the insulating substrate.
15. The method of claim 14, wherein: coating an adhesive on the surface of the insulating substrate or the surface of the copper foil during copper foil pasting;
preferably, the adhesive is one or more of epoxy resin, phenolic resin, polyphenyl ether resin and cyanate resin;
and/or the hot pressing is vacuum hot pressing or composite roller hot pressing.
16. The method of claim 15, wherein: the temperature of the vacuum hot pressing is 60-150 ℃, and the time is 5-10 minutes;
and/or, the hot pressing of the composite roller is carried out after the normal temperature composite roller is hot pressed, and then curing is carried out;
preferably, hot pressing is carried out on the compound roller after 3-5 minutes of normal temperature compound, and the hot pressing of the compound roller is carried out for 2-5 minutes at the temperature of 60-100 ℃; the curing is carried out at 150-200 ℃ for 2-5 minutes.
17. Use of the copper clad laminate of claim 13 in the preparation of a printed circuit board.
CN202010549211.6A 2020-06-16 2020-06-16 Insulating substrate and preparation method and application thereof Pending CN111662435A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113061395A (en) * 2021-03-24 2021-07-02 深圳市纽菲斯新材料科技有限公司 Thermosetting resin composition and preparation method and application thereof
CN115216101A (en) * 2021-08-06 2022-10-21 派迈新材料(成都)有限责任公司 Heat-insulating material and application thereof in preparation of heat-insulating pipeline and pipeline coating

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1675278A (en) * 2002-06-28 2005-09-28 日本瑞翁株式会社 Processes for producing thermoplastic resins, crosslinked resins and crosslinked resin composite materials
JP2008143956A (en) * 2006-12-06 2008-06-26 Nippon Zeon Co Ltd Polymerizable composition, crosslinkable resin and method for producing the same
CN105229040A (en) * 2013-02-27 2016-01-06 马特里亚公司 Metal carbene olefin metathesis dual catalyst composition
CN107417864A (en) * 2016-05-24 2017-12-01 台光电子材料股份有限公司 Polyphenylene oxide prepolymer, its preparation method, resin combination and its product
CN112662129A (en) * 2020-12-21 2021-04-16 上海中化科技有限公司 Resin composition, composite material and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1675278A (en) * 2002-06-28 2005-09-28 日本瑞翁株式会社 Processes for producing thermoplastic resins, crosslinked resins and crosslinked resin composite materials
JP2008143956A (en) * 2006-12-06 2008-06-26 Nippon Zeon Co Ltd Polymerizable composition, crosslinkable resin and method for producing the same
CN105229040A (en) * 2013-02-27 2016-01-06 马特里亚公司 Metal carbene olefin metathesis dual catalyst composition
CN107417864A (en) * 2016-05-24 2017-12-01 台光电子材料股份有限公司 Polyphenylene oxide prepolymer, its preparation method, resin combination and its product
CN112662129A (en) * 2020-12-21 2021-04-16 上海中化科技有限公司 Resin composition, composite material and preparation method thereof

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
WYREBEK P: "Looking for the Noncyclic(amino)(alkyl)carbene Ruthenium Catalyst for Ethenolysis of Ethyl Oleate: Selectivity Is on Target", 《ACS OMEGA》 *
刘勇: "《材料物理性能》", 30 September 2015, 北京航空航天大学出版社 *
刘瑞雪等: "《高分子材料》", 30 April 2018, 河南大学出版社 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113061395A (en) * 2021-03-24 2021-07-02 深圳市纽菲斯新材料科技有限公司 Thermosetting resin composition and preparation method and application thereof
CN115216101A (en) * 2021-08-06 2022-10-21 派迈新材料(成都)有限责任公司 Heat-insulating material and application thereof in preparation of heat-insulating pipeline and pipeline coating

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