CN106876307A - It is vertical to take brilliant, die bond mechanism and its use its vertical bonder - Google Patents
It is vertical to take brilliant, die bond mechanism and its use its vertical bonder Download PDFInfo
- Publication number
- CN106876307A CN106876307A CN201710223165.9A CN201710223165A CN106876307A CN 106876307 A CN106876307 A CN 106876307A CN 201710223165 A CN201710223165 A CN 201710223165A CN 106876307 A CN106876307 A CN 106876307A
- Authority
- CN
- China
- Prior art keywords
- soldering tip
- die bond
- brilliant
- wafer platform
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims abstract description 110
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 abstract description 15
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 239000000126 substance Substances 0.000 abstract description 9
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 241000486406 Trachea Species 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Abstract
Brilliant, die bond mechanism, including wafer platform are taken the invention discloses vertical, it is characterised in that also include：First driving means, the first driving means are used to drive following soldering tip components to do vertical circumference rotation relative to the wafer platform；Soldering tip component, the soldering tip component includes at least one soldering tip, and the soldering tip is used to take brilliant and die bond, and the rotation axis of the soldering tip component is parallel with the wafer platform.Beneficial effect of the present invention：Soldering tip does along the vertical circular motion of wafer platform above or below wafer platform, when taking crystalline substance, die bond, soldering tip is circular arc relative to the movement locus of wafer platform, by the vertical circular-rotation of soldering tip, the horizontal displacement distance of soldering tip can be shortened, various sizes of substrate is adapted to, the horizontal movement time is very short when taking brilliant and die bond, production efficiency is substantially increased, production cost is reduced.
Description
Technical field
The present invention relates to bonder field, and in particular to vertical to take brilliant, die bond mechanism and its use its vertical bonder.
Background technology
In the encapsulation process of semiconductor devices such as IC and LED, die bond is extremely important link.The process of die bond
It is：First by glue applying mechanism (the also referred to as dispensing module) dispensing on the die bond station of substrate, then by die bond mechanism (also referred to as die bond
Nation's head) semiconductor grain is taken out from wafer, and then be transferred on the die bond station for having put glue.In identical die bond yields
Under the conditions of (quality), the die bond efficiency of bonder is to evaluate the important indicator of bonder performance.
The existing main soldering tip of bonder does along wafer platform horizontal circular movement, such as Chinese patent above wafer platform
Application publication number is：A kind of bonder of CN102543801A, from Figure of description 5, and such as Chinese patent application mandate is public
Accuse and number be：One kind of CN203774253U covers glue die bond equipment, when crystalline substance, die bond is taken, as shown in figure 1, swing arm 21 is in wafer platform
Upper horizontal motion completion takes brilliant and die bond operation, and crystal grain 22 is taken out, and then crystal grain 22 be placed into the substrate 23 after dispensing
On, but because substrate size differs, some substrate sizes are larger, and after soldering tip takes crystalline substance, farther out, this is resulted in horizontal displacement distance
The horizontal movement time is more long when soldering tip takes brilliant and die bond, and production efficiency is low, and production cost is high.
Therefore need a kind of the vertical of operating efficiency that can improve badly and take brilliant, die bond mechanism.
The content of the invention
In order to overcome the above-mentioned deficiencies of the prior art, taken the invention provides a kind of the vertical of operating efficiency that can improve
Brilliant, die bond mechanism.
To reach above-mentioned purpose, the technical solution adopted for the present invention to solve the technical problems is：
It is vertical to take brilliant, die bond mechanism, including wafer platform, it is characterised in that also to include：
First driving means, the first driving means are used to drive following soldering tip components to do vertical relative to the wafer platform
Straight circumference rotation；
Soldering tip component, the soldering tip component includes at least one soldering tip, and the soldering tip is used to take brilliant and die bond, the soldering tip
The rotation axis of component is parallel with the wafer platform.
Beneficial effect using above-mentioned technical proposal is：Soldering tip does above or below wafer platform vertically to be justified along wafer platform
Zhou Yundong, when taking crystalline substance, die bond, soldering tip is circular arc relative to the movement locus of wafer platform, when soldering tip reaches wafer platform closest approach, weldering
Head can be with very little with the vertical range of wafer platform, and the vertical movement time is very short when soldering tip takes brilliant and die bond, substantially increases life
Efficiency is produced, production cost is reduced.
Further, the soldering tip is flexibly connected with the soldering tip component, one or more described soldering tip independence edges
Moved back and forth perpendicular to the rotation axis direction.
Beneficial effect using above-mentioned technical proposal is：By the self-movement of soldering tip component, realization takes brilliant and die bond, carries
High efficiency.
Further, the weld assembly is provided with the linking arm that section is " Z " font, and the soldering tip connects with the linking arm
Connect, the soldering tip and linking arm are uniformly distributed along the circumference of the rotation axis.
Beneficial effect using above-mentioned technical proposal is：The section of linking arm is " Z " font, is easy to vision positioning device
Positioning, by multiple linking arms and soldering tip, it is possible to achieve multiple soldering tips operation simultaneously, greatly improves production efficiency.
Further, the wafer platform is inverted in the soldering tip component top.
Further, the soldering tip is connected with the soldering tip component by cam structure, and the cam structure is used to drive
The soldering tip moves up and down in the surface or underface of the wafer platform relative to the wafer platform.
Beneficial effect using above-mentioned technical proposal is：Soldering tip is driven to move back and forth by cam structure, simple structure, fortune
It is dynamic to be easy to control rapidly.
Further, the cam structure include the first semicircle and the second semicircle, first semicircle with diameter greater than institute
State the second half diameter of a circles, the line and the rotation axis phase in the center of circle of first semicircle and the center of circle of second semicircle
Vertically.
Beneficial effect using above-mentioned technical proposal is：It is specific that cam structure is set, driven on soldering tip by two semicircles
Lower motion, the center of circle of the first semicircle is perpendicular with the line and rotation axis in the center of circle of the second semicircle, it is ensured that on soldering tip is stable
Lower motion.
Further, the outer surface of the cam structure or soldering tip is provided with one layer of wearing layer.
Beneficial effect using above-mentioned technical proposal is：The service life of extension cam structure or soldering tip.
Further, the soldering tip is a telescopic structure, and the soldering tip includes head rod, sleeve, the second connection
Bar, stage clip and suction nozzle, the head rod are slidably connected with the sleeve, and second connecting rod is arranged in the sleeve
And be fixedly connected with the sleeve, one end of the stage clip is connected with the head rod, the other end of the stage clip and institute
One end connection of the second connecting rod is stated, is connected in tracheae insertion head rod and the second connecting rod and with the suction nozzle, tracheae
It is connected with vacuum extractor, the head rod is circumferentially with groove, and the sleeve lining is provided with guide protrusions, described recessed
Groove coordinates with the guide protrusions.
Beneficial effect using above-mentioned technical proposal is：Hard collision when preventing from taking crystalline substance between soldering tip and wafer.
Further, also including vision positioning device, the vision positioning device is positioned at the surface of the soldering tip and just
Lower section.
Beneficial effect using above-mentioned technical proposal is：Realize that position positions, so that further improving production efficiency, reduces
Production cost.
The invention also discloses a kind of vertical bonder, including substrate feeding device, point glue equipment and wafer decoupling device,
Characterized in that, also vertically taking brilliant, die bond mechanism including above-mentioned.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is the structural representation of existing bonder motion of the invention.
Fig. 2 is structural representation of the invention.
Fig. 3 is the structural representation that one soldering tip of the present invention takes brilliant and die bond.
Fig. 4 is the structural representation that 3 soldering tips of the present invention take brilliant and die bond.
Fig. 5 is the structural representation that 4 soldering tips of the present invention take brilliant and die bond.
Fig. 6 is the structural representation of telescopic soldering tip of the invention.
The title of the corresponding component in figure represented by digital and letter：
1- wafer platforms；2- linking arms；3- first driving means；5- soldering tip components；6- supports；7- soldering tips；8- vision positionings
Device；10- substrates；31- head rods；32- sleeves；The connecting rods of 33- second；34- stage clips；35- suction nozzles；36- tracheaes；37-
Cam；311- grooves；321- guide protrusions；21- swing arms；22- crystal grain；23- substrates.
Specific embodiment
With reference to specific embodiment, present disclosure is described in further detail：It is of the invention in order to reach
Purpose, as illustrated, being in one embodiment of the present invention：It is vertical to take brilliant, die bond mechanism, including wafer platform 1, also include：
First driving means 3 and soldering tip component 5, soldering tip component 5 are fixed on support 6, and wafer platform 1 is inverted in the top of soldering tip component 5, the
One drive device 3 is used to drive soldering tip component 5 to do vertical circumference rotation relative to wafer platform 1, and soldering tip component 5 includes at least one
Soldering tip 7, soldering tip 7 is used to take brilliant and die bond, and the rotation axis of soldering tip component 5 is parallel with wafer platform 1, and weld assembly 5 is provided with section
It is the linking arm 2 of " Z " font, soldering tip 7 is connected with linking arm 2, soldering tip 7 and linking arm 2 are uniformly distributed along the circumference of rotation axis.
The operation principle of present embodiment is as follows：First driving means drive the rotation of soldering tip component, are just gone up when soldering tip rotates to wafer platform
When side or underface, crystalline substance is taken, then proceed to rotate, when turning to the underface of substrate 10 or surface, die bond completes whole
Die bond operation.
Beneficial effect using above-mentioned technical proposal is：Soldering tip does above or below wafer platform vertically to be justified along wafer platform
Zhou Yundong, when taking brilliant, die bond, soldering tip is circular arc relative to the movement locus of wafer platform, by the vertical circular-rotation of soldering tip, can be with
Shorten the horizontal displacement distance of soldering tip, be adapted to various sizes of substrate, the horizontal movement time is very short when taking brilliant and die bond,
Production efficiency is substantially increased, production cost is reduced.
In other implementation methods of the invention, brilliant, die bond mechanism, including wafer platform 1 are vertically taken, also included：First
Drive device 3 and soldering tip component 5, first driving means 3 are used to drive soldering tip component 5 to do vertical circumference rotation relative to wafer platform 1
Turn, soldering tip component 5 includes at least one soldering tip 7, soldering tip 7 is used to take brilliant and die bond, the rotation axis and wafer platform of soldering tip component 5
1 is parallel, and soldering tip 7 is flexibly connected with soldering tip component 5, one or 3 or 4 soldering tips 7 are independent comes along perpendicular to rotation axis direction
Backhaul it is dynamic, as in Figure 3-5.
Beneficial effect using above-mentioned technical proposal is：By the self-movement of soldering tip component, realization takes brilliant and die bond, carries
High efficiency.
In other implementation methods of the invention, soldering tip 7 is connected with soldering tip component 5 by cam structure 37, cam knot
Structure 37 is used to drive soldering tip 7 to be moved up and down relative to wafer platform 1 in the surface or underface of wafer platform, and cam structure 37 is wrapped
Include the first semicircle and the second semicircle, the first semicircle with diameter greater than the second half diameter of a circles, the center of circle of the first semicircle and the second half
The line and rotation axis in the round center of circle are perpendicular, and the outer surface of cam structure or soldering tip is provided with one layer of wearing layer.
Beneficial effect using above-mentioned technical proposal is：Soldering tip is driven to move up and down by two cam structures of semicircle,
The center of circle of the first semicircle is perpendicular with the line and rotation axis in the center of circle of the second semicircle, it is ensured that soldering tip smoothly moves up and down,
Simple structure, the rapid service life be easy to control, extend cam structure or soldering tip of motion.
In other implementation methods of the invention, soldering tip 7 be a telescopic structure, soldering tip 7 include head rod 31,
Sleeve 32, the second connecting rod 33, stage clip 34 and suction nozzle 35, head rod 31 are slidably connected with sleeve 32, the second connecting rod 33
Be arranged in sleeve 32 and be fixedly connected with sleeve 32, one end of stage clip 34 is connected with head rod 31, stage clip 34 it is another
End is connected with one end of the second connecting rod 33, connects in the insertion connecting rod 33 of head rod 31 and second of tracheae 36 and with suction nozzle 35
Connect, tracheae 36 is connected with vacuum extractor, head rod 31 is circumferentially with groove 311, and it is convex that the inwall of sleeve 32 is provided with guiding
321 are played, groove 311 coordinates with guide protrusions 321, and groove 311 both can slide up and down guide protrusions 321, can play again
Slide spacing effect, stage clip in suction, hard collision when preventing from taking crystalline substance between soldering tip and wafer, it is to avoid wafer is damaged
It is bad.
Beneficial effect using above-mentioned technical proposal is：Hard collision when preventing from taking crystalline substance between soldering tip and wafer.
In another embodiment of the invention, stage clip 34 may be replaced by electric pushrod.Using above-mentioned technical side
The beneficial effect of case is：Soldering tip unequal arm when brilliant and die bond is taken can be made to work, such as when brilliant station is taken, pushed away by electronic
Bar promotes head rod stretching motion, and the stroke that control head rod stretches out can make soldering tip try one's best close to wafer platform, complete
Take crystalline substance into moment, when die bond works, soldering tip can be made close proximity to welding substrate, greatly reduce take brilliant and die bond when
Between, improve production efficiency, while when weld assembly can be avoided to rotate, soldering tip is interfered with peripheral element.
In other implementation methods of the invention, also including vision positioning device 8, vision positioning device 8 is located at soldering tip 7
Surface and underface.
Beneficial effect using above-mentioned technical proposal is：Realize that position positions, so that further improving production efficiency, reduces
Production cost.
The invention also discloses a kind of vertical bonder, including substrate feeding device, point glue equipment and wafer decoupling device,
Characterized in that, also vertically taking brilliant, die bond mechanism including above-mentioned.
The above embodiments merely illustrate the technical concept and features of the present invention, its object is to allow person skilled in the art
Scholar will appreciate that present disclosure and be carried out that it is not intended to limit the scope of the present invention, all according to the present invention
The equivalent change or modification that Spirit Essence is made, should all cover within the scope of the present invention.
Claims (10)
1. it is vertical to take brilliant, die bond mechanism, including wafer platform, it is characterised in that also to include：
First driving means, the first driving means are used to drive following soldering tip components to do vertical circle relative to the wafer platform
Zhou Xuanzhuan；
Soldering tip component, the soldering tip component includes at least one soldering tip, and the soldering tip is used to take brilliant and die bond, the soldering tip component
Rotation axis it is parallel with the wafer platform.
2. it is according to claim 1 vertically to take brilliant, die bond mechanism, it is characterised in that the soldering tip and the soldering tip component
It is flexibly connected, the independent edge of one or more described soldering tips moves back and forth perpendicular to the rotation axis direction.
3. it is according to claim 2 vertically to take brilliant, die bond mechanism, it is characterised in that the weld assembly is provided with section and is
The linking arm of " Z " font, the soldering tip is connected with the linking arm, the soldering tip and linking arm along the rotation axis circumference
It is uniformly distributed.
4. it is according to claim 3 vertically to take brilliant, die bond mechanism, it is characterised in that the wafer platform is inverted in the weldering
Head assembly top.
5. it is according to claim 4 vertically to take brilliant, die bond mechanism, it is characterised in that the soldering tip and the soldering tip component
Connected by cam structure, the cam structure is used to drive the soldering tip in the surface of the wafer platform or underface phase
Moved up and down for the wafer platform.
6. it is according to claim 5 vertical to take brilliant, die bond mechanism, it is characterised in that the cam structure includes the first half
Circle and the second semicircle, first semicircle with diameter greater than the second half diameter of a circle, the center of circle of first semicircle and the institute
The line and the rotation axis for stating the center of circle of the second semicircle are perpendicular.
7. it is according to claim 6 vertical to take brilliant, die bond mechanism, it is characterised in that the cam structure or soldering tip
Outer surface is provided with one layer of wearing layer.
8. many cantilever levels according to claim 7 take brilliant, die bond mechanism, it is characterised in that the soldering tip is one flexible
Formula structure, the soldering tip include head rod, sleeve, the second connecting rod, stage clip and suction nozzle, the head rod with it is described
Sleeve is slidably connected, and second connecting rod is arranged in the sleeve and is fixedly connected with the sleeve, the one of the stage clip
End be connected with the head rod, and the other end of the stage clip is connected with one end of second connecting rod, and tracheae inserts the
It is connected in one connecting rod and the second connecting rod and with the suction nozzle, tracheae is connected with vacuum extractor, the head rod
Groove is circumferentially with, the sleeve lining is provided with guide protrusions, and the groove coordinates with the guide protrusions.
9. many cantilever levels according to claim 8 take brilliant, die bond mechanism, it is characterised in that also filled including vision positioning
Put, the vision positioning device is located at the surface and underface of the soldering tip.
10. vertical bonder, including substrate feeding device, point glue equipment and wafer decoupling device, it is characterised in that also including such as
Brilliant, die bond mechanism is vertically taken described in claims 1-9 is any.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710223165.9A CN106876307B (en) | 2017-04-07 | 2017-04-07 | Vertical crystal taking and fixing mechanism and vertical crystal fixing machine adopting same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710223165.9A CN106876307B (en) | 2017-04-07 | 2017-04-07 | Vertical crystal taking and fixing mechanism and vertical crystal fixing machine adopting same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106876307A true CN106876307A (en) | 2017-06-20 |
| CN106876307B CN106876307B (en) | 2023-11-17 |
Family
ID=59160108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710223165.9A Active CN106876307B (en) | 2017-04-07 | 2017-04-07 | Vertical crystal taking and fixing mechanism and vertical crystal fixing machine adopting same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106876307B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107248500A (en) * | 2017-07-21 | 2017-10-13 | 江苏艾科瑞思封装自动化设备有限公司 | It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder |
| CN107248501A (en) * | 2017-07-21 | 2017-10-13 | 江苏艾科瑞思封装自动化设备有限公司 | A kind of relay-type quickly takes piece, loading device and its uses its loader |
| CN107403749A (en) * | 2017-08-03 | 2017-11-28 | 宁波知了智能科技有限公司 | Direct driving motor takes brilliant device |
| CN110197810A (en) * | 2019-07-08 | 2019-09-03 | 深圳源明杰科技股份有限公司 | Wafer handler and packaging mechanism |
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| CN207038488U (en) * | 2017-04-07 | 2018-02-23 | 江苏艾科瑞思封装自动化设备有限公司 | It is vertical to take brilliant, die bond mechanism and its use its vertical bonder |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107248500A (en) * | 2017-07-21 | 2017-10-13 | 江苏艾科瑞思封装自动化设备有限公司 | It is a kind of to take brilliant, crystal solidifying apparatus and its use its bonder |
| CN107248501A (en) * | 2017-07-21 | 2017-10-13 | 江苏艾科瑞思封装自动化设备有限公司 | A kind of relay-type quickly takes piece, loading device and its uses its loader |
| CN107248501B (en) * | 2017-07-21 | 2023-09-08 | 苏州艾科瑞思智能装备股份有限公司 | Relay type rapid sheet taking and loading device and sheet loading machine adopting same |
| CN107403749A (en) * | 2017-08-03 | 2017-11-28 | 宁波知了智能科技有限公司 | Direct driving motor takes brilliant device |
| CN107403749B (en) * | 2017-08-03 | 2023-04-25 | 宁波知了智能科技有限公司 | Crystal taking device of direct-drive motor |
| CN110197810A (en) * | 2019-07-08 | 2019-09-03 | 深圳源明杰科技股份有限公司 | Wafer handler and packaging mechanism |
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| Publication number | Publication date |
|---|---|
| CN106876307B (en) | 2023-11-17 |
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