CN201174380Y - Wafer placing and fetching construction - Google Patents
Wafer placing and fetching construction Download PDFInfo
- Publication number
- CN201174380Y CN201174380Y CNU2007203055158U CN200720305515U CN201174380Y CN 201174380 Y CN201174380 Y CN 201174380Y CN U2007203055158 U CNU2007203055158 U CN U2007203055158U CN 200720305515 U CN200720305515 U CN 200720305515U CN 201174380 Y CN201174380 Y CN 201174380Y
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- places
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Abstract
The utility model provides a wafer picking and arranging structure, mainly consisting of an interval rotating driving mechanism, a plurality of groups of wafer picking and arranging bases, a linear braker, a front electric lifting braking component and a rear electric lifting braking component. Therefore, the wafer picking and arranging structure has an action path along a circumferential path in an interval displacement state. One wafer picking and arranging action is finished by moving one preset circumferential angle route. Compared with the widely-known mechanical arm picking and arranging structure, the wafer picking and arranging structure greatly increases the wafer picking and arranging speed and effectively improves the wafer manufacture process efficiency.
Description
Technical field
The utility model relates to a kind of wafer and picks and places structure.
Background technology
Wafer is in manufacture process, the embryo material of its pre-profiling is a strip, must be processed into desired unit block-shape morphology through the process of section and then stripping and slicing, and after wafer makes described bulk, in concrete processing procedure process, usually must be by fetching device with described wafer by transferring to automatically on the machining machine and tool on another rearmounted flow process machining machine and tool, to reach the purpose that automation is carried.
In order to pick and place the dependency structure design of wafer, the known configurations design adopts common mechanical arm to finish usually, case please refer to Taiwan letters patent book number I283036 " the front absorption type wafer acquisition arm " technical scheme that patent of invention disclosed before its patent, this patent is provided with an acquisition arm with the absorption wafer, this acquisition arm is ordered about drive by a upper arm module, driver module again, makes this acquisition arm can draw wafer and breaks away from original position; Yet, this known configurations form is found in actual use, because the acquisition arm is the reciprocal action form, must just finish a wafer by sizable movement angle and distance and pick and place stroke, like this for the efficient that wafer picks and places work flow, obviously cause sizable negative effect, and make wafer pick and place work flow to be difficult to reach comparatively significant improved efficiency effect, and then can't adapt to the trend of relevant device enhancing efficiency.
The utility model content
Utility model provides a kind of high wafer of operating efficiency that is taken into to pick and place structure.
For finishing above-mentioned technical problem, the utility model is taked following technical scheme:
The utility model wafer picks and places structure, comprising:
One body frame body, tool and are put frame portion and component sets is established frame portion;
One rotating band actuation mechanism intermittently is located at the component sets of body frame body and is established frame portion desired height position, and the rotating band actuation mechanism comprised and drove a device and a rotating disk seat at a drive unit, an intermittence this at intermittence; Wherein this drive unit orders about this and intermittently drives device and produce intermittence and rotatablely move, and this rotating disk seat convexedly stretches in and intermittently drives bottom of device predetermined space place, produces intermittence synchronously and rotatablely moves along with this intermittently drives device;
Many group wafers pick and place seat, spacer ring is listed in the intermittently rotating disk seat week side of rotating band actuation mechanism, and described each wafer picks and places seat and is and can upright does elevating movement to track along one, and each wafer picks and places a bottom and is provided with nozzle section, and each wafer picks and places seat outside predetermined height and is provided with by drive portion again;
Many group linear brakes, spacer ring is listed in all sides of rotating disk seat and each wafer picks and places a corresponding section, the telescopic shaft of described linear brake and pairing wafer pick and place seat and are connected, respectively organize linear brake again and borrow a gas pressure regulator controlling the decline shutheight position of this each telescopic shaft automatically, and the decline anchor point that makes integral telescopic axle and wafer the pick and place seat set condition that has oblique height difference along its circumferential arrangement path;
At least one preposition electric up-down braking element, this group wafer that the side that group is located at rotating band actuation mechanism intermittently and decline anchor point are minimum picks and places a contraposition mutually, this preposition electric up-down braking element has the elevating bracket of liftable action, and this elevating bracket has a drive portion, and can to pick and place seat with the wafer of contraposition mutually set by the drive that matches of drive portion;
At least one rearmounted electric up-down braking element, this group wafer that the side that group is located at rotating band actuation mechanism intermittently and decline anchor point are the highest picks and places a contraposition mutually, this postposition electric up-down braking element has the elevating bracket of liftable action, and this elevating bracket has a drive portion, and can to pick and place seat with the wafer of contraposition mutually set by the drive that matches of drive portion.
The utlity model has following beneficial effect:
1, provide a kind of path of motion to pick and place structure for wafer along circumferential path displacement state at intermittence, whenever moving a predetermined circle angular travel in its running can reach a wafer and pick and place action, so pick and place structure, can significantly promote wafer and pick and place speed, effectively promote the effect and the preferable industrialization benefit of silicon wafer process efficient compared to known mechanical arm.
2, set up the technical characterstic of bidirectional-movement connecting device by corresponding rearmounted electric up-down braking element one side of this body frame body, the stable wafer of upwards drawing of two-way sucker group by this bidirectional-movement connecting device, and rotation is placed in wafer downwards on the Tray dish plummer, makes the postposition of wafer place flow process and reaches more stable advantage.
Description of drawings
Fig. 1 picks and places the depression angle combination stereogram one of structure for the utility model wafer;
Fig. 2 looks up combination of angles stereogram two for what the utility model wafer picked and placeed structure;
Fig. 3 picks and places the local member enlarged diagram of structure for the utility model wafer;
Fig. 4 picks and places an exploded perspective view for the partial wafer that the utility model wafer picks and places structure;
Fig. 5 picks and places the combined planar end view of structure for the utility model wafer;
Fig. 6 picks and places the enforcement action diagram one of structure for the utility model wafer;
Fig. 7 picks and places the enforcement action diagram two of structure for the utility model wafer;
Fig. 8 picks and places the enforcement action diagram three of structure for the utility model wafer;
Fig. 9 draws the wafer upward view for the wafer among Fig. 8 picks and places seat;
Figure 10 picks and places the enforcement action diagram four of structure for the utility model wafer;
Figure 11 draws the wafer upward view for the wafer among Figure 10 picks and places seat;
Figure 12 picks and places the enforcement action diagram five of structure for the utility model wafer;
Figure 13 picks and places the enforcement action diagram six of structure for the utility model wafer;
Figure 14 picks and places the enforcement action diagram seven of structure for the utility model wafer;
Figure 15 picks and places the enforcement action diagram eight of structure for the utility model wafer;
Figure 16 picks and places the enforcement action diagram nine of structure for the utility model wafer;
Figure 17 picks and places the enforcement action diagram ten of structure for the utility model wafer.
Embodiment
In order to make those skilled in the art person understand the utility model scheme better, and above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, the utility model is described in further detail below in conjunction with drawings and Examples.
As Fig. 1-shown in Figure 5, the utility model wafer picks and places the preferred embodiment of structure, and described wafer picks and places structure A, comprises following member:
One body frame body 10 is put frame portion 11 and component sets is established frame portion 12 for predetermined support body form has formed, and puts frame portion 11 by this body frame body 10 is positioned on the object, and described component sets is established frame portion 12 for following member installing and locating;
One rotating band actuation mechanism 20 intermittently is located at the desired height position that the component sets of body frame body 10 is established frame portion 12, and rotating band actuation mechanism 20 comprised and drove a device 22 and a rotating disk seat 23 at a drive unit 21, an intermittence this at intermittence; Wherein, this drive unit 21 can be motor, order about and intermittently drive device 22 internal structure and produce intermittence and rotatablely move, driving device 22 described intermittence can use existing angle segmenting device and finish, this rotating disk seat 23 convexedly stretches in the predetermined space height and position place, bottom that intermittently drives device 21, rotatablely moves along with this intermittently drives the device 21 synchronous intermittences that produce;
Many group wafers pick and place seat 30, spacer ring is listed in intermittently rotating disk seat 23 all sides of rotating band actuation mechanism 20, and described each wafer picks and places seat 30 and is and can upright does elevating movement to track 31 along one, the bottom that each wafer picks and places seat 30 is provided with nozzle section 32, and each wafer picks and places seat 30 outside predetermined height and is provided with by drive portion 33 again;
Many group linear brakes 40, spacer ring is listed in rotating disk seat 23 all sides and each wafer picks and places seat 30 corresponding sections, the telescopic shaft 41 and the pairing wafer of described linear brake 40 picks and places seat 30 and is connected, respectively organize linear brake 40 again and by a gas pressure regulator (drawing omission) to control the decline shutheight position that this respectively organizes linear brake 40 telescopic shafts 41 automatically, and make integral telescopic axle 41 and wafer pick and place seat 30 decline anchor point, the set condition that has oblique height difference along its circumferential arrangement path;
At least one preposition electric up-down braking element 50, this group wafer that a side that is mounted on rotating band actuation mechanism 20 intermittently and decline anchor point are minimum picks and places 30 contraposition mutually, this preposition electric up-down braking element 50 has the elevating bracket 51 of liftable action, and this elevating bracket has a drive portion 52, and can to pick and place seat 30 with the wafer of contraposition mutually set by drive portion 33 drive that matches;
At least one rearmounted electric up-down braking element 60, this group wafer that a side that is mounted on rotating band actuation mechanism 20 intermittently and decline anchor point are the highest picks and places 30 contraposition mutually, this postposition electric up-down braking element 60 has the elevating bracket 61 of liftable action, and this elevating bracket 61 has a drive portion 62, and can to pick and place seat 30 with the wafer of contraposition mutually set by drive portion 33 drive that matches.
Wherein, as shown in Figure 3, described wafer picks and places seat 30 set rollers 330 that be can be the state of being convexly equipped with by drive portion 33 and constitutes; Make this forward and backward set drive of electric up-down braking element 50,60 portion 52,62 of putting be made as a horizontal chase form and just can import and cooperate, form the effect that lifting drives for this roller 330.
Wherein, as Fig. 4, shown in Figure 5, but describedly organize respectively that wafer picks and places seat 30 top and the pivot group has free wheel 34; So that this bottom that intermittently drives device 22 is provided with the rotating ring face 70 of leading of a ring-type and tool gradient, whereby, each is organized wafer and picks and places seat 30 during along the circumferential path displacement, can present default oblique difference of height metachromatic state exactly by this inclined-plane guiding of leading rotating ring face 70.
Wherein, please as Fig. 1, shown in Figure 5, this side position place of these body frame body 10 corresponding rearmounted electric up-down braking elements 60 more can organize and be provided with a two-way action connecting device 80, this bidirectional-movement connecting device 80 comprises a braking element 81 and constituted by the two-way sucker group 82 that this intermittence, braking element was driven intermittently, and the drawing section 820 of this two-way sucker group 82 can pick and place 30 set nozzle section 32 contraposition mutually with the highest this group wafer of decline anchor point.
Wherein, this bidirectional-movement connecting device 80 also can make this bidirectional-movement connecting device 80 can reach horizontal slippage and upright operate condition to lifting by horizontal slide rail 83 and upright assembly to slide rail 84.
The utility model operating state is described as follows:
As shown in Figure 6, described wafer picks and places structure A and specifically uses, can organize and be located between a wafer carrying platform 91 and the Tray dish plummer 92, so that being sent to wafer by this wafer carrying platform 91 earlier, wafer workpiece B picks and places structure A, the action that picks and places that picks and places structure A by this wafer transfers to this Tray dish plummer 92 with wafer workpiece B again, and wherein this wafer thin portion motion flow of picking and placeing structure A is respectively described below.
As shown in Figure 7, when a wherein wafer workpiece B of described wafer carrying platform 91 is moved to wafer and picks and places preposition electric up-down braking element 50 opposite positions of structure A, the wafer that picks and places the contraposition of structure A phase by these preposition electric up-down braking element 50 drive wafers picks and places seat 30 declines, and then will place the wafer workpiece B on the wafer carrying platform 91 to draw.
As Fig. 8, shown in Figure 9, described wafer picks and places seat 30 and draws after the wafer workpiece B, rise to desired height position by preposition electric up-down braking element 50 drives, then, by rotatablely moving the intermittence that intermittently drives device 22, the wafer of aforementioned absorption wafer workpiece B is picked and placeed the preposition electric up-down braking element 50 of seat 30 drive disengagings, and this absorption wafer workpiece B carries out in the circumferential displacement motion process along with the rotating disk seat 23 that intermittently drives device 22, vapour-pressure type suspension support control by pairing linear brake 40 telescopic shafts 41 has different lift in height when making it arrive different all position and changes.
As Figure 10, shown in Figure 11, for the wafer of aforementioned absorption wafer workpiece B picks and places the state that seat 30 is moved to corresponding rearmounted electric up-down braking element 60 positions, at this moment, this wafer picks and places seat 30 180 ° of displacements, and rises to predetermined extreme higher position.
As shown in figure 12, rearmounted electric up-down braking element 60 picks and places seat 30 with wafer and drives decline.
As shown in figure 13, bidirectional-movement connecting device 80 will make its two-way sucker group 82 drawing section 820 up can accurately accept the wafer workpiece B that aforementioned wafer picks and places seat 30 along its horizontal slide rail 83 slippages.
As shown in figure 14, wafer picks and places seat 30 and upwards gos up, and 82 of the two-way sucker groups of bidirectional-movement connecting device 80 are upright to slide rail 84 declines along it.
As shown in figure 15, the two-way sucker group 82 of bidirectional-movement connecting device 80 can produce 180 ° the action that spins upside down, and the drawing section 820 of drawing wafer workpiece B is turned to down.
As shown in figure 16, the drawing section 820 of two-way sucker group 82 discharges wafer workpiece B and falls within on the Tray dish plummer 92.
As shown in figure 17, bidirectional-movement connecting device 80 will return back to original position.
What remark additionally is, the above motion flow picks and places seat 30 actions that pick and place wafer workpiece at single group of wafer wherein and is illustrated, yet, with regard to the molar behavior that wafer described in the utility model picks and places structure A, when one group of circle wherein picks and places seat 30 when drawing the action of wafer workpiece, its another relative 180 ° group wafer picks and places the action that seat 30 discharges wafer workpiece simultaneously, so eight groups of wafers that disclose with present embodiment pick and place seat 30 structural forms, it intermittently drives device 22, rotating disk seat 23 revolutions move the 45 ° of actions that pick and place that can reach a wafer workpiece, therefore compared to known configurations, can obtain quite significantly improved efficiency.
In addition, wafer that the utility model discloses picks and places in the preferred embodiment of structure A, though it is before intermittence, rotating band actuation mechanism 20 relative two side groups were established, rearmounted electric up-down braking element 50,60 structural form, carry out the operating efficiency that wafer workpiece picks and places action to reach relative 180 ° of two positions, yet, the personage who is familiar with this technical field should change after understanding spirit of the present utility model and principle easily, for example with before described, rearmounted electric up-down braking element 50,60 the quantity that is provided with increases, advance to reach multiple spot to draw, multiple spot is placed the effect and the user demand of wafer, and this change shape obviously can be finished according to the utility model technical characterstic easily.
The beneficial effect explanation:
1, the utility model mainly by described intermittence the rotating band actuation mechanism, organize wafer more and pick and place seat, linear brake and the forward and backward innovation structure of putting the electric up-down braking element and form, can provide a kind of path of motion to pick and place structure for wafer along circumferential path displacement state at intermittence, whenever mobile predetermined circle angular travel can be finished a wafer and pick and place action in its running, so pick and place structure compared to the arm-type wafer of known manipulator, can realize that the wafer speed that picks and places significantly promotes, effectively promotes the effect and the preferable industrialization benefit of silicon wafer process efficient.
2, the utility model also can have additional the technical characterstic of bidirectional-movement connecting device by corresponding rearmounted electric up-down braking element one side of this body frame body, can stablize by the two-way sucker group of this bidirectional-movement connecting device and upwards draw wafer, and rotation is placed in wafer downwards on the Tray dish plummer, makes the postposition of wafer place flow process and reaches more stable advantage.
The above; it only is the preferable embodiment of the utility model; but protection range of the present utility model is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement, all should be encompassed in protection range of the present utility model in.Therefore, protection range of the present utility model should be as the criterion with the protection range of claim.
Claims (5)
1, a kind of wafer picks and places structure, it is characterized in that, comprising:
One body frame body, tool and are put frame portion and component sets is established frame portion;
One rotating band actuation mechanism intermittently is located at the component sets of body frame body and is established frame portion desired height position, and the rotating band actuation mechanism comprised and drove a device and a rotating disk seat at a drive unit, an intermittence this at intermittence; Wherein this drive unit orders about this and intermittently drives device and produce intermittence and rotatablely move, and this rotating disk seat convexedly stretches in and intermittently drives bottom of device predetermined space place, produces intermittence synchronously and rotatablely moves along with this intermittently drives device;
Many group wafers pick and place seat, spacer ring is listed in the intermittently rotating disk seat week side of rotating band actuation mechanism, and described each wafer picks and places seat and is and can upright does elevating movement to track along one, and each wafer picks and places a bottom and is provided with nozzle section, and each wafer picks and places seat outside predetermined height and is provided with by drive portion again;
Many group linear brakes, spacer ring is listed in all sides of rotating disk seat and each wafer picks and places a corresponding section, the telescopic shaft of described linear brake and pairing wafer pick and place seat and are connected, respectively organize linear brake again and borrow a gas pressure regulator controlling the decline shutheight position of this each telescopic shaft automatically, and the decline anchor point that makes integral telescopic axle and wafer the pick and place seat set condition that has oblique height difference along its circumferential arrangement path;
At least one preposition electric up-down braking element, this group wafer that the side that group is located at rotating band actuation mechanism intermittently and decline anchor point are minimum picks and places a contraposition mutually, this preposition electric up-down braking element has the elevating bracket of liftable action, and this elevating bracket has a drive portion, and can to pick and place seat with the wafer of contraposition mutually set by the drive that matches of drive portion;
At least one rearmounted electric up-down braking element, this group wafer that the side that group is located at rotating band actuation mechanism intermittently and decline anchor point are the highest picks and places a contraposition mutually, this postposition electric up-down braking element has the elevating bracket of liftable action, and this elevating bracket has a drive portion, and can to pick and place seat with the wafer of contraposition mutually set by the drive that matches of drive portion.
2, wafer according to claim 1 picks and places structure, it is characterized in that: described wafer picks and places set being constituted by a roller of the state of being convexly equipped with by drive portion of seat; This forward and backward set drive of electric up-down braking element portion of putting is made as a horizontal chase form for described roller importing.
3, wafer according to claim 1 picks and places structure, it is characterized in that: described respectively organize wafer pick and place the seat top pivot group free wheel is arranged; This bottom that intermittently drives device is provided with the rotating ring face of leading of a ring-type and tool gradient.
4, wafer according to claim 1 picks and places structure, it is characterized in that: this side position place group of the corresponding rearmounted electric up-down braking element of described body frame body is provided with a two-way action connecting device, this bidirectional-movement connecting device comprises a braking element and by this two-way sucker group that intermittence, braking element drove intermittently, and this highest group wafer of this two-way sucker group and decline anchor point picks and places a set nozzle section contraposition mutually.
5, wafer according to claim 4 picks and places structure, it is characterized in that: the assembly of described bidirectional-movement connecting device has horizontal slide rail and upright to slide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203055158U CN201174380Y (en) | 2007-11-20 | 2007-11-20 | Wafer placing and fetching construction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007203055158U CN201174380Y (en) | 2007-11-20 | 2007-11-20 | Wafer placing and fetching construction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201174380Y true CN201174380Y (en) | 2008-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007203055158U Expired - Fee Related CN201174380Y (en) | 2007-11-20 | 2007-11-20 | Wafer placing and fetching construction |
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| Country | Link |
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| CN (1) | CN201174380Y (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546723B (en) * | 2009-04-15 | 2012-07-04 | 台达电子（东莞）有限公司 | Rotary IC rack |
| CN101714502B (en) * | 2009-10-28 | 2013-01-02 | 崇贸科技股份有限公司 | Taking and placing device of integrated circuit chip |
| CN103187345A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Taking and placing device |
| CN104210847A (en) * | 2013-05-30 | 2014-12-17 | 三星钻石工业股份有限公司 | Conveying head of brittle-material substrate |
| CN105083982A (en) * | 2015-08-26 | 2015-11-25 | 苏州金牛精密机械有限公司 | Mechanism for achieving automatic material moving based on single power source |
| CN106601469A (en) * | 2013-05-16 | 2017-04-26 | 万润科技股份有限公司 | Pick and place mechanism |
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN106876307A (en) * | 2017-04-07 | 2017-06-20 | 江苏艾科瑞思封装自动化设备有限公司 | It is vertical to take brilliant, die bond mechanism and its use its vertical bonder |
| CN110444498A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of long range precisely quickly takes cored sheet devices |
| CN110797294A (en) * | 2019-10-16 | 2020-02-14 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Continuous extraction element of silicon wafer |
| CN117945148A (en) * | 2024-03-27 | 2024-04-30 | 拉普拉斯(无锡)半导体科技有限公司 | Transport mechanism and laser-induced metallization apparatus |
-
2007
- 2007-11-20 CN CNU2007203055158U patent/CN201174380Y/en not_active Expired - Fee Related
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101546723B (en) * | 2009-04-15 | 2012-07-04 | 台达电子（东莞）有限公司 | Rotary IC rack |
| CN101714502B (en) * | 2009-10-28 | 2013-01-02 | 崇贸科技股份有限公司 | Taking and placing device of integrated circuit chip |
| CN103187345A (en) * | 2011-12-28 | 2013-07-03 | 鸿富锦精密工业（深圳）有限公司 | Taking and placing device |
| CN106601469A (en) * | 2013-05-16 | 2017-04-26 | 万润科技股份有限公司 | Pick and place mechanism |
| CN106601469B (en) * | 2013-05-16 | 2018-07-31 | 万润科技股份有限公司 | Pick and place mechanism |
| CN104210847B (en) * | 2013-05-30 | 2017-08-25 | 三星钻石工业股份有限公司 | The conveyance head of brittle substrate |
| CN104210847A (en) * | 2013-05-30 | 2014-12-17 | 三星钻石工业股份有限公司 | Conveying head of brittle-material substrate |
| CN105083982A (en) * | 2015-08-26 | 2015-11-25 | 苏州金牛精密机械有限公司 | Mechanism for achieving automatic material moving based on single power source |
| CN106711079A (en) * | 2017-02-24 | 2017-05-24 | 爱立发自动化设备（上海）有限公司 | Picking and placing device |
| CN106711079B (en) * | 2017-02-24 | 2020-06-26 | 爱立发自动化设备（上海）有限公司 | Taking and placing device |
| CN106876307A (en) * | 2017-04-07 | 2017-06-20 | 江苏艾科瑞思封装自动化设备有限公司 | It is vertical to take brilliant, die bond mechanism and its use its vertical bonder |
| CN106876307B (en) * | 2017-04-07 | 2023-11-17 | 苏州艾科瑞思智能装备股份有限公司 | Vertical crystal taking and fixing mechanism and vertical crystal fixing machine adopting same |
| CN110444498A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of long range precisely quickly takes cored sheet devices |
| CN110797294A (en) * | 2019-10-16 | 2020-02-14 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Continuous extraction element of silicon wafer |
| CN110797294B (en) * | 2019-10-16 | 2022-02-18 | 苏师大半导体材料与设备研究院(邳州)有限公司 | Continuous extraction element of silicon wafer |
| CN117945148A (en) * | 2024-03-27 | 2024-04-30 | 拉普拉斯(无锡)半导体科技有限公司 | Transport mechanism and laser-induced metallization apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20101120 |