CN106851509B - Mems麦克风 - Google Patents
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- B81B7/0061—Packages or encapsulation suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
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- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B2201/00—Specific applications of microelectromechanical systems
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- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
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- B81—MICROSTRUCTURAL TECHNOLOGY
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- B81B2203/00—Basic microelectromechanical structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
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- H—ELECTRICITY
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Abstract
本发明公开了一种MEMS麦克风,其包括具有收容腔的外壳及开设于所述外壳上的声孔,所述收容腔内设有具有空腔的壳体、具有背腔的MEMS芯片以及ASIC芯片,所述壳体安装于所述外壳,所述MEMS芯片安装于所述壳体,所述壳体设有连通所述空腔和所述背腔的通孔,所述壳体还设有连通所述空腔和所述收容腔的泄气孔,所述MEMS麦克风还包括设置于所述壳体关闭所述泄气孔的膜瓣,所述膜瓣受气流作用发生形变打开所述泄气孔。本发明的MEMS麦克风可以避免MEMS芯片的振膜受气流冲击损坏。
Description
【技术领域】
本发明涉及麦克风领域,尤其涉及一种MEMS麦克风。
【背景技术】
相关技术的MEMS麦克风包括具有收容腔的外壳、开设于所述外壳上的声孔以及收容于所述收容腔内的MEMS芯片和ASIC芯片。
MEMS芯片的振膜常常会被因吹气、跌落或温度变化产生的气流冲击损坏,通常的解决方式是在振膜上开设贯穿振膜的槽或孔平衡振膜两侧的气压,然而,在振膜上开设槽或孔又会降低振膜的自身强度。
因此,实有必要提供一种新的MEMS麦克风以解决上述问题。
【发明内容】
本发明的目的是提供一种可以避免MEMS芯片的振膜受气流冲击损坏,同时又可以保证振膜自身强度的MEMS麦克风。
为实现上述目的,本发明提供一种MEMS麦克风,其包括具有收容腔的外壳及开设于所述外壳上的声孔,所述收容腔内设有具有空腔的壳体、具有背腔的MEMS芯片以及ASIC芯片,所述壳体安装于所述外壳,所述MEMS芯片安装于所述壳体,所述壳体设有连通所述空腔和所述背腔的通孔,所述壳体还设有连通所述空腔和所述收容腔的泄气孔,所述MEMS麦克风还包括设置于所述壳体关闭所述泄气孔的膜瓣,所述膜瓣受气流作用发生形变打开所述泄气孔。
优选的,所述声孔与所述收容腔连通。
优选的,所述声孔与所述空腔连通。
优选的,所述声孔与所述通孔相互错开。
优选的,所述ASIC芯片安装于所述壳体。
优选的,所述壳体由硅材料制成。
优选的,所述膜瓣处于临界阻尼状态。
优选的,所述膜瓣的外周缘固接于所述壳体,所述膜瓣设有缝隙将所述膜瓣分隔成若干子膜瓣,所述子膜瓣受气流作用发生形变打开所述泄气孔。
优选的,所述外壳包括电路板和盖接于所述电路板的盖体,所述电路板与所述盖体形成所述收容腔,所述壳体安装于所述电路板或所述盖体。
本发明的有益效果是:膜瓣受气流作用发生形变打开泄气孔,可以平衡MEMS芯片的振膜两侧的气压,避免了MEMS芯片的振膜受气流冲击损坏,同时无需在振膜上开槽或孔,又可以保证振膜的自身强度。
【附图说明】
图1为本发明提供的MEMS麦克风的结构剖视图;
图2为本发明提供的MEMS麦克风的膜瓣和泄气孔的结构示意图;
图3为本发明提供的MEMS麦克风的膜瓣的结构示意图;
图4为图1所示的MEMS麦克风的气流走向示意图;
图5为本发明提供的另一MEMS麦克风的结构剖视图。
【具体实施方式】
下面结合附图和实施方式对本发明作详细描述。
如图1至图4所示,为本发明提供的MEMS麦克风100,其包括具有收容腔10的外壳1,开设于所述外壳1上的声孔2,在本实施方式中,所述外壳1包括电路板11和盖接于所述电路板11上的盖体12,所述电路板11和所述盖体12围成所述收容腔10。所述盖体12由金属材料制成。
所述收容腔10内设有具有空腔30的壳体3、具有背腔40的MEMS芯片4以及ASIC芯片5,所述MEMS芯片4包括振膜41。在本实施方式中,所述壳体3安装于所述电路板11上,当然,除此之外所述壳体3的位置还可以是安装于所述盖体12上。所述壳体3优选由硅材料制成。
所述MEMS芯片4安装于所述壳体3上,所述壳体3设有连通所述空腔30和所述背腔40的通孔31,所述壳体3还设有连通所述空腔30和所述收容腔10的泄气孔32。所述ASIC芯片5的安装位置可以任意选择,优选的,所述ASIC芯片5安装于所述壳体3上,选择这样的安装方式所述ASIC芯片5不会占用壳体3的空间位置,壳体3可以具有更大的空腔30体积。空腔30可以大大释放封装应力,减少封装以及后期SMT贴装对产品性能的影响。
所述MEMS麦克风100还包括设置于所述壳体3上的膜瓣6,在正常状态下,所述膜瓣6关闭所述泄气孔32,所述膜瓣6可以受气流作用发生形变打开所述泄气孔32。优选的,所述膜瓣6处于临界阻尼状态,即在轻微气流作用下瓣膜6便可打开,这样可以实现快速响应。当然,还可以通过设计所述泄气孔32的大小、形状以及所述膜瓣6的阻尼来控制调节不同的泄气效果。所述膜瓣6可以是硅胶薄膜或是塑料膜片。
在本实施方式中,所述膜瓣6的外周缘固接于所述壳体3上,所述膜瓣6设有缝隙60将所述膜瓣6分隔成若干子膜瓣,结合图3,所述缝隙60将所述膜瓣6分隔成4个,分别为子膜瓣61、子膜瓣62、子膜瓣63和子膜瓣64,当然,缝隙60的形式不局限“十”字型,也可以是如“一”字型,“Y”型等其他方式,分隔出的子膜瓣的个数也不局限为4个。另外,所述膜瓣6打开所述泄气孔32的方式也不局限于形成子膜瓣的方式,也可以是将所述膜瓣6的一部分固定,另一部分不固定的方式,当然也可以是其他可以将所述泄气孔32打开的方式。
在本实施方式中,所述声孔2开设于所述电路板11上,所述声孔2与所述空腔30连通,可以配合合适的空腔30设计实现超声麦克风。优选的,将所述声孔2设置与所述通孔31相互错开,可以有效降低颗粒物的进入风险。
结合图4,为MEMS麦克风100的气流走向示意图,图中的箭头用来示意气流,所述膜瓣6受气流作用发生形变打开所述泄气孔32,可以平衡MEMS芯片4的振膜41两侧的气压,避免了MEMS芯片4的振膜41受气流冲击损坏,同时无需在振膜41上开槽或孔,又可以保证振膜41的自身强度。
参照图5,为本发明提供的另一MEMS麦克风200,其与上述MEMS麦克风100的不同在于:所述声孔2’开设于所述盖体12’上,所述声孔2’与所述收容腔10’连通。所述空腔30’可以扩大所述背腔40’的体积,提升灵敏度和信噪比。
以上所述的仅是本发明的实施方式,在此应当指出,对于本领域的普通技术人员来说,在不脱离本发明创造构思的前提下,还可以做出改进,但这些均属于本发明的保护范围。
Claims (8)
1.一种MEMS麦克风,其包括具有收容腔的外壳及开设于所述外壳上的声孔,其特征在于,所述收容腔内设有具有空腔的壳体、具有背腔的MEMS芯片以及ASIC芯片,所述壳体安装于所述外壳,所述MEMS芯片安装于所述壳体,所述壳体设有连通所述空腔和所述背腔的通孔,所述壳体还设有连通所述空腔和所述收容腔的泄气孔,所述MEMS麦克风还包括设置于所述壳体关闭所述泄气孔的膜瓣,所述膜瓣的外周缘固接于所述壳体,所述膜瓣设有缝隙将所述膜瓣分隔成若干子膜瓣,所述子膜瓣受气流作用发生形变能够双向打开所述泄气孔。
2.根据权利要求1所述的MEMS麦克风,其特征在于,所述声孔与所述收容腔连通。
3.根据权利要求1所述的MEMS麦克风,其特征在于,所述声孔与所述空腔连通。
4.根据权利要求3所述的MEMS麦克风,其特征在于,所述声孔与所述通孔相互错开。
5.根据权利要求1所述的MEMS麦克风,其特征在于,所述ASIC芯片安装于所述壳体。
6.根据权利要求1所述的MEMS麦克风,其特征在于,所述壳体由硅材料制成。
7.根据权利要求1所述的MEMS麦克风,其特征在于,所述膜瓣处于临界阻尼状态。
8.根据权利要求1所述的MEMS麦克风,其特征在于,所述外壳包括电路板和盖接于所述电路板的盖体,所述电路板与所述盖体形成所述收容腔,所述壳体安装于所述电路板或所述盖体。
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US10715924B2 (en) * | 2018-06-25 | 2020-07-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | MEMS microphone having diaphragm |
WO2020258172A1 (zh) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | 振动传感器、音频设备和振动传感器的组装方法 |
CN110545512A (zh) * | 2019-09-05 | 2019-12-06 | 朝阳聚声泰(信丰)科技有限公司 | 一种mems麦克风及其抗吹气结构 |
CN110708621B (zh) * | 2019-10-31 | 2021-01-08 | 维沃移动通信有限公司 | 电子设备 |
CN111314830B (zh) * | 2019-12-07 | 2021-02-19 | 朝阳聚声泰(信丰)科技有限公司 | 一种信噪比高的mems麦克风及其生产方法 |
US11350220B2 (en) * | 2020-01-17 | 2022-05-31 | Sae Magnetics (H.K.) Ltd. | MEMS package, MEMS microphone and method of manufacturing the MEMS package |
DE102020102493A1 (de) * | 2020-01-31 | 2021-08-05 | Tdk Corporation | Die mit Gehäuse und Montageverfahren |
CN115211137A (zh) * | 2020-02-27 | 2022-10-18 | 理想工业公司 | 带入口保护的mems麦克风 |
JP7441132B2 (ja) * | 2020-07-16 | 2024-02-29 | ホシデン株式会社 | 防水マイクロホン |
CN113259795B (zh) * | 2021-04-26 | 2022-11-29 | 歌尔微电子股份有限公司 | 骨声纹传感器及其制作方法以及电子设备 |
CN115426596A (zh) * | 2022-09-20 | 2022-12-02 | 歌尔微电子股份有限公司 | 换能器及电子设备 |
CN116208878B (zh) * | 2023-05-05 | 2024-04-12 | 荣耀终端有限公司 | 麦克风结构、麦克风及电子设备 |
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CN102348155A (zh) * | 2010-07-30 | 2012-02-08 | 江苏丽恒电子有限公司 | 微机电麦克风及其制造方法 |
CN104053104A (zh) * | 2013-03-12 | 2014-09-17 | 北京卓锐微技术有限公司 | 一种硅电容麦克风及其制造方法 |
CN104284290A (zh) * | 2013-07-12 | 2015-01-14 | 英飞凌科技股份有限公司 | 具有mems结构和在支撑结构中的通风路径的装置 |
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US8577063B2 (en) * | 2010-02-18 | 2013-11-05 | Analog Devices, Inc. | Packages and methods for packaging MEMS microphone devices |
US8779535B2 (en) * | 2012-03-14 | 2014-07-15 | Analog Devices, Inc. | Packaged integrated device die between an external and internal housing |
US9521499B2 (en) * | 2013-06-26 | 2016-12-13 | Infineon Technologies Ag | Electronic device with large back volume for electromechanical transducer |
CN204425633U (zh) * | 2014-11-28 | 2015-06-24 | 歌尔声学股份有限公司 | 一种mems麦克风、mems电容传感器和一种振膜 |
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CN101048840A (zh) * | 2004-10-27 | 2007-10-03 | 皇家飞利浦电子股份有限公司 | Mems设备用的弹簧结构 |
CN102348155A (zh) * | 2010-07-30 | 2012-02-08 | 江苏丽恒电子有限公司 | 微机电麦克风及其制造方法 |
CN104053104A (zh) * | 2013-03-12 | 2014-09-17 | 北京卓锐微技术有限公司 | 一种硅电容麦克风及其制造方法 |
CN104284290A (zh) * | 2013-07-12 | 2015-01-14 | 英飞凌科技股份有限公司 | 具有mems结构和在支撑结构中的通风路径的装置 |
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