CN106817853A - 夹具 - Google Patents

夹具 Download PDF

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Publication number
CN106817853A
CN106817853A CN201510857353.8A CN201510857353A CN106817853A CN 106817853 A CN106817853 A CN 106817853A CN 201510857353 A CN201510857353 A CN 201510857353A CN 106817853 A CN106817853 A CN 106817853A
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CN
China
Prior art keywords
cylindrical piece
fixture
briquetting
pressing plate
jump ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510857353.8A
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English (en)
Inventor
李西航
刘兵
吴炜
潘清磊
张士力
高远
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Electronics Zhengzhou Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Electronics Zhengzhou Co Ltd
Hon Hai Precision Industry Co Ltd
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Publication date
Application filed by Hongfujin Precision Electronics Zhengzhou Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Electronics Zhengzhou Co Ltd
Priority to CN201510857353.8A priority Critical patent/CN106817853A/zh
Priority to TW104143938A priority patent/TWI668070B/zh
Priority to US15/336,826 priority patent/US10335903B2/en
Publication of CN106817853A publication Critical patent/CN106817853A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426—Fixtures for other work
    • B23K37/0435—Clamps
    • B23K37/0443—Jigs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0169—Using a temporary frame during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/159—Using gravitational force; Processing against the gravity direction; Using centrifugal force
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明涉及一种夹具，尤其涉及一种用于按压焊接部件的自重式夹具。该夹具包括一压板，至少一安装在该压板上并可相对该压板上下活动的压块，该压块在相对压板向下运动时下压电路板上的待焊接物件。本发明用于在将焊接部件焊接在电路板上时按压该焊接部件，可以减少焊接部件焊接在电路板上时的空焊及变形的问题，提高了对焊接部件进行焊接的良品率，降低了企业的生产成本。

Description

夹具
技术领域
本发明涉及一种夹具，尤其涉及一种用于按压焊接部件的自重式夹具。
背景技术
现有技术中，往往通过表面贴膜技术（SMT， Surface Mount Technology ）将SIM卡焊接到电路板上。然而，在将SIM卡焊接到电路板上的过程中，SIM卡往往会出现焊接浮高、空焊及SIM卡形变的问题，这样，大大增加了SIM卡焊接的不良率。较高的SIM卡不良率，不仅浪费了生产资源，而且提高了企业的生产成本。
发明内容
有鉴于此，有必要提供一种夹具，用于在将SIM卡焊接在电路板上时压住SIM卡以提高SIM卡焊接的良品率。
一种夹具，用于下压一待焊接的物件，该夹具包括一压板，至少一安装在该压板上并可相对该压板上下活动的压块，该压块在相对压板向下运动时下压电路板上的待焊接的物件。
进一步地，该压块包括第一圆柱块及与第一圆柱块同轴的第二圆柱块，该压板上开设有与压块数量相同的第一通孔，该夹具还包括有与压块数量相同的卡簧，每一卡簧对应一压块，该压块的第二圆柱块上远离第一圆柱块的一端穿过与该压块对应的第一通孔并且一卡簧卡合在该第二圆柱块上距第一圆柱块的预设距离处，而使卡簧及第一圆柱块位于压板的两侧，进而使得第二圆柱块在压板的第一通孔中移动时会受到该第一圆柱块及卡簧的限定。
本发明用于在将SIM卡焊接在电路板上时按压SIM卡，可以减少SIM卡焊接在电路板上时的空焊及SIM变形的问题，提高了SIM焊接时的良品率，降低了企业的生产成本。
附图说明
图1为本发明一实施方式中夹具一视角的整体结构示意图。
图2为图1中夹具的部分分解图。
图3为本发明一实施方式中夹具另一角度的整体结构示意图。
主要元件符号说明
夹具 1
压板 10
压块 20
第一圆柱块 202
第二圆柱块 204
第一通孔 101
卡簧 30
环形本体 302
端口 304
环形凹槽 206
第二通孔 40
销钉 50
下表面 11
上表面 12
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面结合附图及实施方式对本发明提供的夹具作进一步详细说明。
请参考图1所示，为本发明一实施方式中夹具1一视角的整体结构示意图。该夹具1用于下压电路板(图中未示)上一待焊接的物件(图中未示)。该夹具1包括一压板10及至少一安装在该压板10上并可相对该压板10上下活动的压块20。该压块20在相对压板10向下运动时下压电路板上的待焊接的物件。本实施方式中，该待焊接的物件可以是一SIM卡或一屏蔽盖。
请一并参考图2，所示为图1中夹具1的部分分解图。在一较佳实施方式中，该压块20包括第一圆柱块202及与第一圆柱块202同轴的第二圆柱块204。其中，该第一圆柱块202的半径大于第二圆柱块204的半径，该第一圆柱块202的高度远远小于第二圆柱块204的高度。本实施方式中，该压块20为一体成型的铜柱块。该压板10上开设有与压块20数量相同的第一通孔101，该第一通孔101的半径略大于第二圆柱块204的半径，但小于第一圆柱块202的半径。该夹具1还包括有与压块20数量相同的卡簧30，每一卡簧30对应一压块20。该压块20的第二圆柱块204上远离第一圆柱块202的一端穿过与该压块20对应的第一通孔101并且卡簧30卡合在该第二圆柱块204上距第一圆柱块202的预设距离处，而使卡簧30及第一圆柱块202位于压板10的两侧。进而，第二圆柱块204在压板10的第一通孔101中移动时会受到该第一圆柱块202及卡簧30的限定，进而使得第二圆柱块204上位于第一圆柱块202及卡簧30之间的部分可以自由在压板10的第一通孔101中上下活动。
该卡簧30大致为一圆形结构，该卡簧30包括环形本体302及与环形本体302连接的两个端口304。其中，该卡簧30的内径稍小于第二圆柱块204的半径，该卡簧30的外径大于第一通孔101的半径。该第二圆柱块204的外表面上距第一圆柱块22的预设距离处设置有一环形凹槽206。该卡簧30的环形本体302卡合在该第二圆柱块204的环形凹槽206中以使该卡簧30对该第二圆柱块204在第一通孔101中移动的位置进行限定。本实施方式中，该第二圆柱块204上的环形凹槽206距离第一圆柱块202的预设距离远远大于压板10的厚度，该压块20的重量在9至9.5g之间。
本实施方式中，该压块20、第一通孔101及卡簧30的个数均为4个。该压板10上靠近第一通孔101的位置还设置有多个大小不一的第二通孔40。该多个第二通孔40用于在夹具1的压块20压住电路板上的物件时避让电路板上其他的物件，并保证焊接物件所需的热量通过该多个第二通孔40传递到待焊接的物件上。
请一并参考图3，所示为本发明一实施方式中夹具1另一角度的整体结构示意图。本实施方式中，该压板10上靠近四个边角的位置还各安装一销钉50，用于支撑该夹具1。其中，该销钉50的长度小于第二圆柱块204上的环形凹槽206距离第一圆柱块202的预设距离。
该夹具1的安装及使用步骤为：首先，将压块20的第二圆柱块204从压板10的下表面11放入第一通孔101中并从压板20的上表面12穿出；然后，将一卡簧30的环形本体302卡合在第二圆柱块204的环形凹槽206中，而使卡簧30及第一圆柱块202位于压板10的两侧进而使得压块20的第二圆柱块204通过该第一圆柱块202及卡簧30限定第二圆柱块204在第一通孔101中的移动位置；最后，将夹具1的第一圆柱块202放置在与电路板上待焊接的物件对应的位置处，通过第一圆柱块202的自重压住电路板上的待焊接的物件。
以上实施例仅用以说明本发明的技术方案而非限制，尽管参照较佳实施例对本发明进行了详细的说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换，而不脱离本发明技术方案的精神和范围。

Claims (8)

1.一种夹具，用于下压一待焊接的物件，其特征在于，该夹具包括一压板，至少一安装在该压板上并可相对该压板上下活动的压块，该压块在相对压板向下运动时下压电路板上的待焊接的物件。
2.如权利要求1所述的夹具，其特征在于，该压块包括第一圆柱块及与第一圆柱块同轴的第二圆柱块，该压板上开设有与压块数量相同的第一通孔，该夹具还包括有与压块数量相同的卡簧，每一卡簧对应一压块，该压块的第二圆柱块上远离第一圆柱块的一端穿过与该压块对应的第一通孔并且一卡簧卡合在该第二圆柱块上距第一圆柱块的预设距离处，而使卡簧及第一圆柱块位于压板的两侧，进而使得第二圆柱块在压板的第一通孔中移动时会受到该第一圆柱块及卡簧的限定。
3.如权利要求2所述的夹具，其特征在于，该第一圆柱块的半径大于第二圆柱块的半径，该第一圆柱块的高度远远小于第二圆柱块的高度 。
4.如权利要求2所述的夹具，其特征在于，该卡簧包括环形本体及与环形本体连接的两个端口，该卡簧的内径稍小于第二圆柱块的半径，该卡簧的外径大于第一通孔的半径，该第二圆柱块的外表面上距第一圆柱块的该预设距离处设置有一环形凹槽，该卡簧的环形本体卡合在该第二圆柱块的环形凹槽中。
5.如权利要求2所述的夹具，其特征在于，该压块、该第一通孔及该卡簧的个数均为4个。
6.如权利要求2所述的夹具，其特征在于，该压板上靠近第一通孔的位置还设置有多个大小不一的第二通孔。
7.如权利要求2所述的夹具，其特征在于，该压板上靠近四个边角的位置还各安装一销钉，用于支撑该夹具，其中，该销钉的长度小于第二圆柱块上的环形凹槽距离第一圆柱块的预设距离。
8.如权利要求1所述的夹具，其特征在于，该压块的重量在9至9.5g之间。
CN201510857353.8A 2015-11-30 2015-11-30 夹具 Pending CN106817853A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201510857353.8A CN106817853A (zh) 2015-11-30 2015-11-30 夹具
TW104143938A TWI668070B (zh) 2015-11-30 2015-12-28 夾具
US15/336,826 US10335903B2 (en) 2015-11-30 2016-10-28 Clamping device for soldering operations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510857353.8A CN106817853A (zh) 2015-11-30 2015-11-30 夹具

Publications (1)

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CN106817853A true CN106817853A (zh) 2017-06-09

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Country Status (3)

Country Link
US (1) US10335903B2 (zh)
CN (1) CN106817853A (zh)
TW (1) TWI668070B (zh)

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