CN106813591A - For the sample preparation methods of buckling deformation test - Google Patents
For the sample preparation methods of buckling deformation test Download PDFInfo
- Publication number
- CN106813591A CN106813591A CN201611258886.5A CN201611258886A CN106813591A CN 106813591 A CN106813591 A CN 106813591A CN 201611258886 A CN201611258886 A CN 201611258886A CN 106813591 A CN106813591 A CN 106813591A
- Authority
- CN
- China
- Prior art keywords
- sample
- glued membrane
- white
- boss
- testing sample
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/16—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge
- G01B11/161—Measuring arrangements characterised by the use of optical techniques for measuring the deformation in a solid, e.g. optical strain gauge by interferometric means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
Abstract
The present invention relates to a kind of sample preparation methods for buckling deformation test, it is characterized in that, comprise the following steps：（1）Testing sample is placed on sample stage, to place the placement region of testing sample in the middle of sample stage, boss is set around placement region；（2）White glued membrane is placed in the top of testing sample, the edge of white glued membrane is propped up on boss；（3）Pressure roller above sample stage is pressed down against, and pressure roller makes white glued membrane closely be pasted with testing sample from a lateral opposite side rolling；（4）Testing sample is removed from sample stage, and the unnecessary white glued membrane in testing sample edge is cut into removal.The present invention coats one layer of white glued membrane in sample surfaces, and the thickness control of the white glued membrane is more uniform；Being completed rear glued membrane can be easy to removal, and sample surfaces will not be polluted；Glued membrane is not volatile in temperature-rise period, and grating and sample tests will not be impacted.
Description
Technical field
The present invention relates to a kind of sample preparation methods for buckling deformation test, belong to technical field of semiconductor encapsulation.
Background technology
In semiconductor fabrication techniques and semiconductor packaging, the surface topography of the component such as chip, substrate and warpage control
System is extremely important.A kind of contactless, equipment that warpage detection is carried out using moire interference principle（Such as shadow moire）With
Detection method is widely used in the field, it is advantageous that reflux technique curve can be simulated, detection sample flowed back entirely
Deformation in journey under each temperature spot.The testing equipment generally is equipped with camera lens, for catching sample surface morphology information；Carve
There are certain length and the glass raster of spacing striped that collimated light beam is radiated at into sample surfaces, its reflection strip and grating fringe phase
Mutually interference, forms the interference fringe comprising sample surfaces deformation.Detection method requirement sample surfaces are white, so
Can be captured by the camera lens above sample, and record its deformation.Therefore, in Sample Preparation Procedure, generally will be on surface
One layer of white film of coating.In test process, it is desirable to which the film surface deformation data that camera lens is captured can be waited and be all sample
Surface deformation information, and film easily removes, pollution-free to sample surfaces, this proposes requirement very high to film.
Current sample preparation methods, typically spray one layer of paint of white on its surface.Tiny liquid during sprinkling
Drop uniformly falls in sample surfaces, forms one layer of white film.But this sample making technology can cause severe contamination to sample surfaces, survey
Examination finishes rear sample can only pass into disuse, therefore the test cannot be used for the on-line checking of manufacture of semiconductor, and this is to test sample
Cause considerable restraint；In addition in temperature-rise period, there is part and volatilize in white paint, and the material of its volatilization covers the light above sample
On grid, interference and the sample deformations testing result of grating fringe are influenceed.
The content of the invention
The purpose of the present invention is to overcome the deficiencies in the prior art, there is provided a kind of sample for buckling deformation test
Preparation method, one layer of white glued membrane is coated in sample surfaces, and the thickness control of the white glued membrane is more uniform；It is completed rear glue
Film can be easy to removal, and sample surfaces will not be polluted；Glued membrane is not volatile in temperature-rise period, will not be to grating and sample
Product test result is impacted.
According to the present invention provide technical scheme, it is described for buckling deformation test sample preparation methods, it is characterized in that,
Comprise the following steps：
（1）Testing sample is placed on sample stage, to place the placement region of testing sample in the middle of sample stage, in placement region
Around boss is set；
（2）White glued membrane is placed in the top of testing sample, the edge of white glued membrane is propped up on boss；
（3）Pressure roller above sample stage is pressed down against, and pressure roller makes white size from a lateral opposite side rolling
Film is closely pasted with testing sample；
（4）Testing sample is removed from sample stage, and the unnecessary white glued membrane in testing sample edge is cut into removal.
Further, the composition of the white glued membrane is Teflon.
Further, the thickness of the white glued membrane is no more than 5 microns.
Further, the boss is set in the boss of closed, or around sample around the placement region of sample stage
Multiple boss that the placement region of platform is arranged in interruption shape.
Further, thickness of the height of the boss higher than testing sample so that step（2）The edge support of white glued membrane
After being placed on boss, there is certain interval between white glued membrane and testing sample.
Further, the step（3）Middle pressure roller rolls one or many by a lateral opposite side of placement region.
The present invention cancels the method for making sample in sample surfaces spray painting, is changed to coat one layer of white glued membrane in sample surfaces, should
White glued membrane is compared with the film of spray painting droplet formation, and thickness is controllable more uniform；Being completed rear glued membrane can be very
Easily remove, sample surfaces will not be polluted；In temperature-rise period, the resinous principle in glued membrane is more stablized, not volatile,
Grating and sample tests will not be impacted.Due to not resulting in sample surfaces pollution, using the sample of this method for making sample
Product can be continuing with after warpage test is completed without wasting extra sample, thus be applicable to manufacture of semiconductor
Line is detected.
Brief description of the drawings
Fig. 1~Fig. 4 is the flow chart of the sample preparation methods for buckling deformation test of the present invention.Wherein,
Fig. 1 is the schematic diagram being placed on testing sample on sample stage.
Fig. 2 is the schematic diagram that white glued membrane is placed above testing sample.
Fig. 3 is the schematic diagram for being brought into close contact white glued membrane and testing sample by pressure roller.
Fig. 4 is by the schematic diagram of the unnecessary white glued membrane cutting removal in testing sample edge.
Fig. 5 is the schematic diagram that the testing sample of white glued membrane of fitting is carried out warpage test.
Fig. 6 is to remove the sample schematic diagram after glued membrane.
Specific embodiment
With reference to specific the drawings and specific embodiments, the invention will be further described.
Sample preparation methods for buckling deformation test of the present invention, comprise the following steps：
（1）It is the placement of placement testing sample 1 in the middle of sample stage 2 as shown in figure 1, testing sample 1 is placed on sample stage 2
Region, sets boss 3 around placement region；The boss 3 is set in the convex of closed around the placement region of sample stage 2
Platform, or around sample stage 2 placement region in interruption shape arrangement multiple boss；
（2）As shown in Fig. 2 placing white glued membrane 4 in the top of testing sample 1, the edge of white glued membrane 4 is propped up on boss 3；
Thickness of the height of the boss 3 higher than testing sample 1 so that there is certain interval between white glued membrane 4 and testing sample 1；
（3）As shown in figure 3, be pressed down against by pressure roller 5 in the top of sample stage 2, and pressure roller 5 is lateral another from one
Side rolls one or many, white glued membrane 4 is brought into close contact with testing sample 1, it is ensured that between white glued membrane and testing sample
Bubble-free, without layering；
（4）As shown in figure 4, testing sample 1 is removed from sample stage 2, and by the unnecessary white glued membrane 4 in the edge of testing sample 1
Cutting removal；After end to be tested, the white glued membrane of sample surfaces is removed, can be by film stripping machine, chemolysis or illumination etc.
Mode makes its adhesion failure.
The white glued membrane used in said process is Teflon, and thickness is usually no more than 5 microns.
Testing sample after white glued membrane of fitting is placed in warpage test equipment and is tested, as shown in figure 5, to be measured
Sample 1 is positioned on the sample stage 7 of test equipment, and glass raster 6 is placed in the top of testing sample 1, and light passes through the shape of glass raster 6
Into interference fringe, so as to obtain sample surfaces deformation information；Testing sample 1 can be heated by heating module 8 in test process,
Maximum heating temperature is no more than 300 DEG C.After test terminates, white glued membrane is removed from sample surfaces, white glued membrane minimizing technology
May include to be removed by taking off film device, sample can be also immersed in and film be removed and is gone in Chemical cleaning liquid or by illumination method
Remove.Sample after removal glued membrane is as shown in Figure 6.
The present invention in the sample preparation tested for warpage, sample surfaces coat one layer of glued membrane, its need meet with
Lower requirement：The film thickness is uniform, is brought into close contact with sample surfaces after laminating, it is ensured that film surface deformation data and sample surfaces
Deformation data is identical；300 DEG C of high temperature can be born, heat and simulate rework profile test process in it is non-volatile and
Sample is without layering, stripping；The size of thickness direction is sufficiently small；After the completion of test, glued membrane can by take off film device, chemolysis or
The modes such as illumination are removed；Glued membrane does not result in pollution to sample surfaces in sample surfaces noresidue after removal.
Claims (6)
1. it is a kind of for buckling deformation test sample preparation methods, it is characterized in that, comprise the following steps：
（1）By testing sample（1）It is placed on sample stage（2）On, sample stage（2）Centre is placement testing sample（1）Rest area
Domain, sets boss around placement region（3）；
（2）In testing sample（1）Top place white glued membrane（4）, white glued membrane（4）Edge prop up in boss（3）On；
（3）In sample stage（2）The pressure roller of top（5）It is pressed down against, and pressure roller（5）From a lateral opposite side rolling
Pressure, makes white glued membrane（4）With testing sample（1）Closely paste；
（4）By testing sample（1）From sample stage（2）On remove, and by testing sample（1）The unnecessary white glued membrane in edge（4）Cut
Prescind and remove.
2. it is as claimed in claim 1 to be used for the sample preparation methods that buckling deformation is tested, it is characterized in that：The white glued membrane
Composition is Teflon.
3. it is as claimed in claim 1 to be used for the sample preparation methods that buckling deformation is tested, it is characterized in that：The white glued membrane
Thickness is no more than 5 microns.
4. it is as claimed in claim 1 to be used for the sample preparation methods that buckling deformation is tested, it is characterized in that：The boss（3）Enclose
Around sample stage（2）Placement region set in the boss of closed, or around sample stage（2）Placement region in interruption shape cloth
The multiple boss put.
5. it is as claimed in claim 1 to be used for the sample preparation methods that buckling deformation is tested, it is characterized in that：The boss（3）'s
Highly it is higher than testing sample（1）Thickness so that step（2）White glued membrane（4）Edge prop up in boss（3）After upper, white
Glued membrane（4）With testing sample（1）Between there is certain interval.
6. it is as claimed in claim 1 to be used for the sample preparation methods that buckling deformation is tested, it is characterized in that：The step（3）In
Pressure roller（5）By a lateral opposite side rolling one or many of placement region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611258886.5A CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611258886.5A CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106813591A true CN106813591A (en) | 2017-06-09 |
Family
ID=59110544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611258886.5A Pending CN106813591A (en) | 2016-12-30 | 2016-12-30 | For the sample preparation methods of buckling deformation test |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101837335A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Platform for coating epoxy resin thin film for wafer-level chip package |
| CN201841094U (en) * | 2010-10-29 | 2011-05-25 | 刘希文 | Mesh belt conveying device for coating equipment |
| CN102173316A (en) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | Film sticking method and equipment |
| CN102275650A (en) * | 2011-05-24 | 2011-12-14 | 冠捷显示科技（厦门）有限公司 | Device and method for automatically coating film on surface of electrical product |
| CN104230184A (en) * | 2014-09-07 | 2014-12-24 | 合肥嘉伟装饰工程有限责任公司 | Glass laminating device |
| US20160013221A1 (en) * | 2006-09-29 | 2016-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
-
2016
- 2016-12-30 CN CN201611258886.5A patent/CN106813591A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160013221A1 (en) * | 2006-09-29 | 2016-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Peeling apparatus and manufacturing apparatus of semiconductor device |
| CN101837335A (en) * | 2009-03-20 | 2010-09-22 | 昆山西钛微电子科技有限公司 | Platform for coating epoxy resin thin film for wafer-level chip package |
| CN201841094U (en) * | 2010-10-29 | 2011-05-25 | 刘希文 | Mesh belt conveying device for coating equipment |
| CN102173316A (en) * | 2010-12-21 | 2011-09-07 | 上海技美电子科技有限公司 | Film sticking method and equipment |
| CN102275650A (en) * | 2011-05-24 | 2011-12-14 | 冠捷显示科技（厦门）有限公司 | Device and method for automatically coating film on surface of electrical product |
| CN104230184A (en) * | 2014-09-07 | 2014-12-24 | 合肥嘉伟装饰工程有限责任公司 | Glass laminating device |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170609 |
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