JP2009265176A - Foreign matter removing method, foreign matter removing device, and method of manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a foreign matter removing method of easily removing a foreign matter on a photomask without damaging the photomask. <P>SOLUTION: The foreign matter removing method of removing the foreign matter sticking on the photomask includes a movement step of moving a nozzle 6 which discharges an energy-curing substance relatively to a position corresponding to a position of the foreign matter on the basis of position information on the foreign matter, a coating step of discharging the energy-curing substance to the foreign matter by the nozzle 6 to coat the foreign matter with the energy-curing substance, a curing step of curing the energy curing substance by imparting energy to the energy curing substance covering the foreign matter by an energy supply unit 3 which outputs prescribed energy, and a removal step of removing the cured energy-curing substance from the photomask 8. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a foreign matter removing method, a foreign matter removing device, and a method for manufacturing a semiconductor device.

  In a photomask for exposure used for manufacturing a semiconductor element, when a foreign substance adheres to a pattern surface or a blanks surface, it is transferred as a pattern defect when the semiconductor pattern is baked, and affects the quality of the semiconductor circuit pattern. For this reason, for example, after the processing of the mask pattern is completed, the foreign matter attached to the photomask is removed chemically, physically, or electrically using a cleaning liquid, ions, radicals, or the like.

  For example, in the photomask cleaning method described in Patent Document 1, the photomask is cleaned by an ozone water cleaning unit, an ice scribe cleaning unit, an ultrasonic cleaning unit, and a hot water pulling and drying unit.

  However, in the conventional cleaning method, foreign matters are removed by cleaning the entire photomask, so that a clean portion on the photomask is also exposed to cleaning. For this reason, the foreign matter removed from the photomask sometimes reattaches to the photomask surface in the cleaning liquid.

  In order to solve this problem, a method of physically removing the foreign matter by bringing a needle or the like into direct contact with the foreign matter on the photomask, or a method of removing the foreign matter by selectively irradiating the foreign matter with a particle beam has been proposed. ing. In these methods, since the mechanical, physical or electrical action is given to the foreign matter adhesion site (narrow region) on the photomask, the pattern film and the Qz (quartz) glass portion of the foreign matter adhesion region are damaged. It will be. For this reason, in the conventional photomask cleaning method, the pattern quality is deteriorated.

Japanese Patent Laid-Open No. 10-62695

  An object of the present invention is to obtain a foreign matter removing method, a foreign matter removing apparatus, and a semiconductor device manufacturing method capable of easily removing foreign matters on a photomask without damaging the photomask.

  According to one aspect of the present invention, in the foreign matter removal method for removing foreign matter attached to a photomask, an ejection unit that ejects an energy curable substance is disposed on the basis of information on the location of the foreign matter on the photomask. A moving step of relatively moving to a position corresponding to the position of the material, a covering step in which the discharge unit discharges an energy curable material onto the foreign material, and the foreign material is covered with the energy curable material, and a predetermined energy. An energy output device for outputting includes a curing step of applying energy to the energy curable material coated with the foreign matter to cure the energy curable material, and a removing step of removing the cured energy curable material from the photomask. A foreign matter removing method is provided.

  Further, according to one aspect of the present invention, in the foreign matter removing apparatus for removing the foreign matter attached to the photomask, the discharge unit that ejects the energy curable substance and the information on the position of the foreign matter on the photomask are used. A movement control unit that relatively moves the discharge unit to a position corresponding to the position of the foreign matter, and an energy output unit that outputs energy to the energy curable substance, and the discharge unit is disposed on the foreign matter. The energy curing material is ejected to coat the foreign material with the energy curing material, and the energy output unit cures the energy cured material by applying energy to the energy curing material coated with the foreign material. A foreign matter removing device is provided.

  According to the present invention, there is an effect that foreign matter on the photomask can be easily removed without damaging the photomask.

  Embodiments of a foreign matter removing method, a foreign matter removing device, and a semiconductor device manufacturing method according to the present invention will be described below in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

(First embodiment)
FIG. 1 is a diagram showing a configuration of a foreign matter removal system according to the first embodiment of the present invention. The foreign matter removal system (foreign matter removal apparatus) is a system that cleans the photomask 8 by removing foreign matter on the photomask (photomask for exposure used for manufacturing semiconductor elements) 8, and is a foreign substance made of an energy curable substance. Wrap (dust, haze, etc.) to remove foreign matter.

  The foreign substance removal system includes a control device 1, one to a plurality of energy supply units 3, energy curable substance supply units 4 </ b> A and 4 </ b> B, a pipe 5, a nozzle (discharge unit) 6, and an XY stage (XY table) 9. The XY stage 9 places the photomask 8 so that the main surface of the photomask 8 is perpendicular to the vertical direction (Z direction), and moves in the XY direction.

  The energy curable substance supply units 4 </ b> A and 4 </ b> B store the energy curable substance and supply the energy curable substance to the nozzle 6 via the pipe 5. The energy curable material supply unit 4A and the energy curable material supply unit 4B store different types of energy curable materials. In the foreign matter removal system, the energy curable material in the energy curable material supply unit 4A or the energy curable material in the energy curable material supply unit 4B is selected from the energy curable material according to the foreign material to remove the foreign material.

  The energy curable substance is a substance that cures when given energy (energy rays) is applied, and is, for example, a photocurable resin, a thermosetting resin, a pressure curable resin, or an electron beam curable resin. In the following description, the case where the energy curable material is the photocurable resin 7 will be described. As the photocurable resin (ultraviolet curable resin) 7, for example, a resin used for nanoimprinting, optical pickup adhesion, optical disk pit molding, or the like is used.

  The nozzle 6 is a needle-like member created using, for example, carbon nanotubes or silicon, and discharges the photocurable resin 7 sent via the pipe 5 onto the foreign matter of the photomask 8. The nozzle 6 has, for example, a substantially truncated cone shape, and is arranged at a position where the upper bottom surface and the lower bottom surface are parallel to the main surface of the XY stage. The nozzle 6 has a lower bottom side connected to the pipe 5 and an upper bottom side facing the photomask 8 side. The nozzle 6 is provided with a through hole in the vertical direction from the lower bottom surface to the upper bottom surface, and the photocurable resin 7 from the pipe 5 is sent from the lower bottom side of the nozzle 6 to the through hole, and the through hole It is discharged from the upper bottom side.

  The nozzle 6 is fixed at a predetermined position in the XY direction, and the nozzle 6 moves relatively in the XY plane on the photomask 8 by moving the XY stage on which the photomask 8 is placed in the XY direction. To do. The nozzle 6 has a fine movement mechanism and is configured to be movable in the vertical direction. The nozzle 6 moves downward in the vertical direction when discharging the photocurable resin 7 to the foreign matter, and after the photocurable resin 7 is cured by light energy, it is bonded to the cured photocurable resin 7. It moves to the upper side in the vertical direction together with the photocurable resin 7 in the state.

  The nozzle 6 is a functional element having a function of removing foreign matter, and uses, for example, an AFM (Atomic Force Microscope) probe. The upper bottom of the nozzle 6 is, for example, 20 to 30 μm, and the lower bottom of the nozzle 6 is, for example, 100 μm. The photocurable resin 7 discharged from the nozzle 6 is discharged onto the foreign matter on the photomask 8. This photocurable resin 7 coats to include foreign substances.

  The energy supply unit 3 is an energy output device (energy output unit) that outputs predetermined energy such as light energy or heat energy, and supplies light to the photocurable resin 7 ejected on the foreign matter to thereby generate light. The curable resin 7 is cured. Since the energy curable substance of the present embodiment is the photocurable resin 7, the energy supply unit 3 is a light source that irradiates light such as ultraviolet light. The energy supply unit 3 may irradiate the entire photomask 8 with light, or may irradiate only the vicinity of the photocurable resin 7 discharged onto the photomask 8.

  The control device 1 is configured by, for example, a PC (Personal Computer) or the like, and controls the energy supply unit 3, the energy curable substance supply units 4 </ b> A and 4 </ b> B, the pipe 5, and the XY stage 9. The control device 1 controls the energy supply unit 3, the energy curable substance supply units 4 </ b> A and 4 </ b> B, the pipe 5, and the XY stage 9 based on information on foreign matters (hereinafter referred to as foreign matter information). The foreign substance information is, for example, information such as the position where the foreign substance is attached on the photomask 8 (coordinates on the photomask 8), the size of the foreign substance, the shape of the foreign substance, and the substance constituting the foreign substance. Based on the foreign substance information, the control device 1 determines the type and output amount of the photocurable resin 7 to be supplied to the energy curable substance supply units 4A and 4B and the amount of energy to be supplied from the energy supply unit 3 (light emission time and power). The valve opening / closing amount of the pipe 5, the position of the XY stage 9, the position of the nozzle 6 and the like are controlled.

  In the foreign matter removal system, for example, the control device 1 and a defect inspection device (not shown) (device that inspects the pattern surface and detects foreign matter on the photomask 8) are connected. And the control apparatus 1 acquires foreign material information by receiving the foreign material information sent from the defect inspection apparatus. The defect inspection apparatus is an apparatus capable of grasping the size and accurate position (coordinates) of the foreign matter on the photomask 8 by optical defect inspection. The defect inspection apparatus compares the patterns on the photomask 8 (two chip patterns) to detect defects (Die-Die), and compares the pattern of the photomask 8 with the design drawing (CAD data). Then, defect inspection is performed by a method for detecting defects (Die-Database) or the like, and foreign matter information is generated.

  Next, a detailed configuration of the control device 1 will be described. FIG. 2 is a functional block diagram illustrating the configuration of the control device. The control device 1 includes a foreign matter information input unit 11, a resin type determination unit 12, a resin amount determination unit 13, a stage control unit (movement control unit) 14, a nozzle control unit 15, a discharge control unit 16, and a curing control unit 17. ing.

  The foreign matter information input unit 11 inputs foreign matter information created by the defect inspection apparatus. The foreign matter information input unit 11 sends the foreign matter information to the resin type determination unit 12, the resin amount determination unit 13, the stage control unit 14, the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17.

  The resin type determination unit 12 determines which type of photocurable resin 7 is to be ejected onto the foreign matter based on the foreign matter information. The resin type determination unit 12 sends the determination result as resin type information to the resin amount determination unit 13, the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17.

  The resin amount determination unit 13 determines the amount (discharge amount) of the photocurable resin 7 to be discharged onto the foreign matter based on the foreign matter information. The resin amount determination unit 13 determines the amount of the photocurable resin 7 to be discharged onto the foreign material based on, for example, the size and shape of the foreign material. The resin amount determination unit 13 may determine the amount of the photocurable resin 7 so that the photocurable resin 7 coated with the foreign material has a predetermined size (diameter) or more, or by a predetermined ratio rather than the size of the foreign material. You may determine the quantity of the photocurable resin 7 so that it may become large. Thereby, the resin amount determination unit 13 determines the discharge amount of the photocurable resin 7 so that the photocurable resin 7 coated with the foreign material has a predetermined size such as 1 μm or a size twice as large as the foreign material. The resin amount determination unit 13 sends the determination result to the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17 as discharge amount information. The stage control unit 14 controls the position of the XY stage in the XY plane based on the foreign substance information (the position where the foreign substance is attached on the photomask 8).

  The nozzle control unit 15 controls the position of the nozzle 6 in the vertical direction based on the foreign matter removal program and foreign matter information. The foreign matter removal program is a program for removing foreign matter on the photomask 8 using foreign matter information. In the foreign matter removal program, an operation procedure of the foreign matter removal system when removing foreign matter from the photomask 8 is set. The nozzle controller 15 moves the nozzle 6 downward when discharging the photocurable resin 7 to a foreign substance. Further, the nozzle control unit 15 moves the nozzle 6 upward after the photocurable resin 7 is cured by light energy.

  The nozzle controller 15 lowers the nozzle 6 to a position corresponding to the resin type information, the discharge amount information, and the foreign material information (such as the size of the foreign material) when discharging the photocurable resin 7. For example, the nozzle 6 descends to a high lowered position (Z coordinate) when the amount of the photocurable resin 7 ejected to the foreign material is large, and low when the amount of the photocurable resin 7 ejected to the foreign material is small. When the viscosity of the photocurable resin 7 discharged to the foreign material is high, for example, the nozzle 6 descends to a high lowered position and the viscosity of the photocurable resin 7 discharged to the foreign material is low. Descent to a lower descent position.

  The discharge control unit 16 controls the energy curable substance supply units 4A and 4B, the pipe 5, and the nozzle 6 based on the foreign matter removal program, the resin type information, and the discharge amount information. The discharge control unit 16 selects either the energy curable material supply unit 4A or the energy curable material supply unit 4B as the supply unit of the photocurable resin 7 corresponding to the resin type information. The discharge control unit 16 causes the photocurable resin 7 to be sent out from the selected energy curable material supply unit 4A or the energy curable material supply unit 4B by a delivery amount corresponding to the ejection amount information. Further, the discharge controller 16 opens and closes the valve of the pipe 5 by an amount corresponding to the resin type information and the discharge amount information.

  Further, the curing control unit 17 controls the energy supply unit 3 based on the foreign matter removal program, the resin type information, and the discharge amount information. The curing control unit 17 irradiates light from the energy supply unit 3 for a time corresponding to, for example, the type and discharge amount of the photocurable resin 7 discharged to the foreign matter.

  The control device 1 includes a CPU (control unit), a storage unit such as a ROM and a RAM, an external storage unit such as an HDD and a CD drive device, a display unit such as a liquid crystal monitor, and an input unit such as a keyboard and a mouse. It has a hardware configuration using a computer.

  The foreign substance removal program executed by the control device 1 includes the above-described units (foreign substance information input unit 11, resin type determination unit 12, resin amount determination unit 13, stage control unit 14, nozzle control unit 15, discharge control unit 16, curing The module configuration includes a control unit 17). As actual hardware, the CPU reads and executes the foreign substance removal program, so that the above-described units are loaded onto the main storage device, and the foreign substance information input unit 11, resin type A determination unit 12, a resin amount determination unit 13, a stage control unit 14, a nozzle control unit 15, a discharge control unit 16, and a curing control unit 17 are generated on the main storage device.

  Next, a foreign matter removal processing procedure of the foreign matter removal system according to the first embodiment will be described. FIG. 3 is a flowchart showing a foreign matter removal processing procedure of the foreign matter removal system according to the first embodiment.

  First, foreign matter information created by the defect inspection apparatus is input from the foreign matter information input unit 11 of the control device 1 (step S110). FIG. 4 is a diagram illustrating an example of the configuration of foreign object information. The foreign matter information 101 is information relating to the foreign matter on the photomask 8, and “foreign matter No.”, “coordinate”, “position type”, “size”, and “foreign matter type” are associated with each other.

  “Foreign matter No.” is identification information for identifying the foreign matter on the photomask 8. “Coordinates” are the coordinates of foreign matter on the photomask 8 (XY stage). “Position type” is information indicating the type of position where a foreign substance is attached. For example, “pattern edge” of “position type” indicates that the foreign matter is present on the pattern edge portion on the photomask 8. Further, “on the pattern” indicates that the foreign matter is on the pattern of the photomask 8. “Outside pattern” indicates that the foreign matter is outside the pattern of the photomask 8 (on the glass substrate). The “size” is the size (dimension) of the foreign matter, and the “foreign matter type” is the type of foreign matter. The type of foreign matter is classified by the shape, color, size, composition, etc. of the foreign matter, for example.

  In the foreign matter information 101 shown in FIG. 4, the foreign matter having “foreign matter No.” “001” has “coordinate” (x1, y1), “position type” “pattern edge”, and “size”. "" Is "50 [mu] m" and "foreign material type" is "k1".

  The foreign substance information 101 input to the foreign substance information input unit 11 is sent to the resin type determination unit 12, the resin amount determination unit 13, the stage control unit 14, the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17. The resin type determination unit 12 determines which type of photocurable resin 7 is to be ejected onto the foreign matter based on the foreign matter information 101 (step S120). The resin type determination unit 12 sends the determination result as resin type information to the resin amount determination unit 13, the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17. Hereinafter, the information that the resin type determination unit 12 designates the photo-curable resin 7 in the energy curable substance supply unit 4A as the resin type information will be referred to as the resin amount determination unit 13, the nozzle control unit 15, the discharge control unit 16, and the curing control. A case of sending to the unit 17 will be described.

  The resin amount determination unit 13 determines the discharge amount of the photocurable resin 7 discharged to the foreign material based on the resin type information and the foreign material information 101 (step S130). The resin amount determination unit 13 sends the determination result to the nozzle control unit 15, the discharge control unit 16, and the curing control unit 17 as discharge amount information.

  The stage control unit 14 moves the position of the XY stage 9 based on the “coordinates” of the foreign matter information 101 so that the nozzle 6 comes to the position (coordinates) of the first foreign matter to be removed (step S140). ). The stage controller 14 moves the position of the XY stage 9 in the XY plane so that the nozzle 6 has the coordinates of “x1, y1”, for example, when removing the foreign matter whose “foreign matter No.” is “001”. .

  The discharge control unit 16 controls the energy curable substance supply unit 4A, the pipe 5, and the nozzle 6 based on the foreign matter removal program, the resin type information, the discharge amount information, and the foreign matter information 101. Specifically, the discharge control unit 16 selects the energy curable substance supply unit 4A as the supply unit of the photocurable resin 7 corresponding to the resin type information. The discharge control unit 16 sends the photocurable resin 7 from the selected energy curable substance supply unit 4A by a sending amount corresponding to the discharging amount information. Further, the discharge controller 16 opens and closes the valve of the pipe 5 by an amount corresponding to the resin type information and the discharge amount information. Thereby, the photocurable resin 7 from the energy curable substance supply unit 4 </ b> A is sent to the nozzle 6 through the pipe 5. And the photocurable resin 7 is discharged from the front-end | tip part of the nozzle 6 (step S150). The photocurable resin 7 discharged from the nozzle 6 has a predetermined viscosity and adheres to the tip of the nozzle 6 as shown in FIG.

  5 and 6 are diagrams for explaining the foreign matter removal procedure of the foreign matter removal system according to the first embodiment. In FIGS. 5 and 6, foreign matter is present on the quartz glass surface (on the photomask 8 surface) between the mask pattern (pattern film) (photomask light-shielding film) 81 and the mask pattern 81 formed on the photomask 8. The case where P has adhered is shown. The mask pattern 81 is formed of, for example, chrome, and the distance between the mask pattern 81 and the mask pattern 81 is, for example, about 200 nm.

  After discharging the photocurable resin 7 from the tip of the nozzle 6, the nozzle controller 15 lowers the nozzle 6 to which the photocurable resin 7 is adhered downward (foreign matter P side) (step S160). . At this time, the nozzle controller 15 lowers the nozzle 6 to a position corresponding to the resin type information, the discharge amount information, the size of the foreign matter P, and the like. Thereby, the photocurable resin 7 adhered to the tip of the nozzle 6 comes into contact with the foreign matter P and the photomask 8. Then, the photocurable resin 7 adheres to the tip of the nozzle 6, the foreign matter P, and the photomask 8. At this time, as shown in FIG. 5 (b), the photocurable resin 7 is coated so as to enclose foreign matter, and is in close contact with the nozzle 6 at the top of the photocurable resin 7, and the bottom of the photocurable resin 7. Thus, it is in close contact with the surface of the photomask 8 (step S170).

  The curing control unit 17 controls the energy supply unit 3 based on the resin type information and the discharge amount information. Specifically, as illustrated in FIG. 6C, the curing control unit 17 causes the energy supply unit 3 to irradiate light for a time corresponding to, for example, the type and amount of the photocurable resin 7 that is discharged to the foreign matter. . As a result, the photocurable resin 7 in a state of adhering to the tip portion of the nozzle 6, the foreign matter, and the photomask 8 is cured (solidified) (step S180). As a result, the photocurable resin 7 is fixed (adhered) to the nozzle 6 and the photomask 8. The adhesion force between objects is determined by, for example, the material (material) of the object or surface treatment. Therefore, in the present embodiment, the fixing force (physical force) between the photocurable resin 7 and the nozzle 6 is larger than the fixing force between the photocurable resin 7 and the photomask 8. A photocurable resin 7 is used.

  The nozzle controller 15 hardens the photocurable resin 7 with light energy, and then moves the nozzle 6 upward (step S190). When the nozzle 6 is moved upward (in a direction away from the photomask 8), the portion having a strong adhesion (adhesion between the photocurable resin 7 and the nozzle 6) can be maintained, but the portion having a weak adhesion (photocurability). Adhesion between the resin 7 and the photomask 8 cannot be maintained. For this reason, the photocurable resin 7 is peeled off from the photomask 8 without leaving the photocurable resin 7 on the photomask 8.

  As a result, the photocurable resin 7 together with the foreign matter P is removed from the photomask 8 as shown in FIG. Thereafter, by moving the XY stage 9, the nozzle 6 is moved to the outside of the XY stage 9, and the photocurable resin 7 is peeled from the nozzle 6 on the outside of the XY stage 9. The foreign matter removal system repeats the processes of steps S120 to S190 for the foreign matter P to be removed next based on the foreign matter information 101 and the foreign matter removal program. When manufacturing a semiconductor device such as an LSI (Large Scale Integration), an exposure process is performed using a photomask 8 from which foreign matter has been removed.

  As described above, since the foreign matter is removed by the nozzle 6, it is possible to prevent the removed foreign matter from reattaching on the photomask 8. Further, since the foreign matter on the photomask 8 is selectively removed so as to be pulled upward, the foreign matter can be removed without damaging the pattern surface or the glass surface of the photomask 8.

  In the present embodiment, the case where the energy curable substance is the photocurable resin 7 has been described. However, when the energy curable substance is a thermosetting resin, the energy supply unit 3 transmits infrared light, Supply thermal energy such as hot air. The thermal energy in this case may be supplied to the thermosetting resin from the upper surface side of the photomask 8 or may be supplied to the thermosetting resin from the lower surface side of the photomask 8.

  When the energy curable substance is an electron beam curable resin, energy such as charged particles is supplied from the energy supply unit 3. The energy in this case is supplied to the thermosetting resin from the upper surface side of the photomask 8.

  When the energy curable substance is a pressure curable resin, the photomask 8 is placed in a sealed space and the pressure curable resin is pressurized by supplying gas from the energy supply unit 3.

  In the present embodiment, the nozzle 6 is moved to the position of the foreign matter P by moving the XY stage 9 in the XY direction. However, by fixing the XY stage 9 and moving the nozzle 6 in the XY direction. The nozzle 6 may be moved to the position of the foreign matter P.

  In the present embodiment, the case where the control device 1 receives foreign object information from the defect inspection device has been described. However, the input of foreign material information to the control device 1 is a portable recording medium (for example, a CD (Compact Disk)). Or a DVD (Digital Versatile Disk) or the like.

  In this embodiment, after the photocurable resin 7 is discharged from the nozzle 6, the nozzle 6 is lowered to the foreign substance side, but after the nozzle 6 is lowered to the foreign substance side, the photocurable resin is discharged from the nozzle 6. 7 may be discharged.

  Thus, according to 1st Embodiment, since it removes for every foreign material with the needle-shaped nozzle 6, the reattachment of the removed foreign material on the photomask 8 can be prevented. Further, since the foreign matter on the photomask 8 is removed so as to be drawn upward, the foreign matter can be easily removed without damaging the pattern surface or the glass surface of the photomask 8.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. In 2nd Embodiment, the photocurable resin 7 is dripped at a foreign material from the nozzle 6, and the photocurable resin 7 which coat | covered the foreign material is hardened after that. Then, the photocurable resin 7 having a size larger than that of the foreign material is removed from the photomask 8 with a cleaning liquid or the like.

  FIG. 7 is a flowchart showing a foreign matter removal processing procedure of the foreign matter removal system according to the second embodiment. Note that the description of the processing procedure similar to the foreign matter removal processing procedure of FIG. 3 described in the first embodiment is omitted.

  First, foreign matter information created by the defect inspection apparatus is input from the foreign matter information input unit 11 of the control device 1 (step S210). Thereafter, the foreign matter removal system performs the same process as the foreign matter removal system of the first embodiment (steps S220 to S240). The processing in steps S210 to S240 here corresponds to the processing in steps S110 to S140 shown in FIG.

  After the stage control unit 14 moves the position of the XY stage 9 so that the nozzle 6 comes to the position of the first foreign matter, the discharge control unit 16 includes a foreign matter removal program, resin type information, drop amount information, Based on the above, the energy curable substance supply unit 4A and the pipe 5 are controlled. Specifically, the discharge control unit 16 selects the energy curable substance supply unit 4A as the supply unit of the photocurable resin 7 corresponding to the resin type information. The discharge controller 16 causes the photocurable resin 7 to be sent out from the selected energy curable substance supply unit 4A by a sending amount corresponding to the drop amount information. Further, the discharge controller 16 opens and closes the valve of the pipe 5 by an amount corresponding to the resin type information and the dripping amount information. Thereby, the photocurable resin 7 from the energy curable substance supply unit 4 </ b> A is sent to the nozzle 6 through the pipe 5. Then, the photocurable resin 7 is discharged (emitted) from the tip of the nozzle 6 and dropped onto the photomask 8 (step S250). Thus, in this Embodiment, the photocurable resin 7 is dripped from the nozzle 6, without dropping the nozzle 6 to the vicinity of a foreign material. The photocurable resin 7 dropped from the nozzle 6 falls onto the foreign matter on the photomask 8 as shown in FIG.

  8 and 9 are diagrams for explaining a foreign matter removal procedure of the foreign matter removal system according to the second embodiment. FIGS. 8 and 9 show a case where foreign matter P is attached to the quartz glass surface between the mask patterns 81 formed on the photomask 8, as in FIGS. 5 and 6.

  The photocurable resin 7 that has dropped onto the photomask 8 adheres to the foreign matter P and the photomask 8. At this time, the photocurable resin 7 is coated so as to enclose the foreign matter P, and is in close contact with the surface of the photomask 8 below the photocurable resin 7.

  The curing control unit 17 controls the energy supply unit 3 based on the resin type information and the dripping amount information. Specifically, as illustrated in FIG. 8B, the curing control unit 17 irradiates light from the energy supply unit 3 for a time corresponding to, for example, the type and amount of the photocurable resin 7 dripped onto the foreign matter P. Let Thereby, the photocurable resin 7 in a state of being adhered to the tip portion of the nozzle 6, the foreign matter P, and the photomask 8 is cured (step S260). As a result, the photocurable resin 7 is fixed to the photomask 8. In the present embodiment, the photocurable resin 7 covers the foreign matter P and adheres to the foreign matter P, but the photocurable resin 7 and the photomask 8 are fixed with a weak fixing force. Use. Further, the foreign matter P is coated with a predetermined amount or more of the photocurable resin 7 so that the washed photocurable resin 7 does not re-adhere on the photomask 8, and the photocurable resin 7 having a predetermined size or more is cured. Let The foreign matter removal system repeats the processes of steps S220 to S260 for the foreign matter P to be removed next based on the foreign matter information 101 and the foreign matter removal program.

  After all the foreign matter P is wrapped and cured with the photocurable resin 7, the photomask 8 is placed in the cleaning tank 41 and the photocurable resin 7 on the photomask 8 is cleaned. The cleaning tank 41 is a tank filled with a predetermined cleaning liquid, and the photocurable resin 7 is cleaned from the photomask 8 with this cleaning liquid (step S270). Thereby, the photocurable resin 7 is peeled off from the photomask 8 without leaving the photocurable resin 7 on the photomask 8. Although the photocurable resin 7 after cleaning remains in the cleaning tank 41, the photocurable resin 7 according to the present embodiment is not less than a predetermined size and has already been cured. The viscosity is small. For this reason, the photo-curing resin 7 after curing is less likely to reattach to the photomask 8. As a result, the photocurable resin 7 is removed from the photomask 8 together with the foreign matter P as shown in FIG.

  In this way, since the photocurable resin 7 having a size larger than the foreign matter is washed in the washing tank 41, the foreign matter on the photomask 8 can be easily removed while preventing the photocurable resin 7 from reattaching to the photomask 8. It can be removed.

  In the present embodiment, the case where the photocurable resin 7 is cleaned by the cleaning tank 41 has been described. However, the cured photocurable resin 7 may be peeled off by a needle-like member such as the nozzle 6. In this case, after the photocurable resin 7 is cured, the nozzle controller 15 lowers the nozzle 6 downward (foreign matter P side). At this time, the nozzle control unit 15 lowers the nozzle 6 to a position (position corresponding to the size of the photocurable resin 7 after curing) according to the resin type information, dripping amount information, and the like.

  And after making the nozzle 6 contact the photocurable resin 7, the nozzle control part 15 is moved to the upper side, moving the nozzle 6 to a XY plane direction. 9D, the photocurable resin 7 is peeled off from the photomask 8 without leaving the photocurable resin 7 on the photomask 8, and removed from the photomask 8 together with the foreign matter P. It will be. Thereafter, by moving the XY stage 9, the nozzle 6 is moved to the outside of the XY stage 9, and the photocurable resin 7 is peeled from the nozzle 6 on the outside of the XY stage 9.

  Thus, since the photocurable resin 7 having a size larger than the foreign substance is peeled off by the nozzle 6, the photocurable resin 7 is peeled from the photomask 8 with a smaller force than when only the foreign substance P is peeled off from the photomask 8. It becomes possible to do.

  As described above, according to the second embodiment, the photocurable resin 7 having a size larger than the foreign matter P is washed in the cleaning tank 41 and the foreign matter P is removed from the photomask 8. It is possible to easily remove foreign matter on the photomask 8 while preventing reattachment to the photomask 8.

  In the first and second embodiments, the photocurable resin 7 is adhered to the tip portion of the nozzle 6 by discharging and dropping the photocurable resin 7 from the nozzle 6. The photocurable resin 7 may be adhered to the tip portion of the nozzle 6 by the above method. For example, an opened container for storing the photocurable resin 7 is provided outside the XY stage 9, the nozzle 6 is inserted into the opening of the container, and the photocurable resin 7 in the container is placed at the tip of the nozzle 6. May be adhered. In this case, when the photocurable resin 7 is adhered to the tip portion of the nozzle 6, the nozzle 6 is moved to the outside of the XY stage 9, and the photocurable resin 7 is adhered to the photomask 8 side. The nozzle 6 is moved to the inside of the XY stage 9.

  In the first and second embodiments, the case of using the frustoconical nozzle 6 has been described. However, the upper surface of the nozzle 6 (the tip on the foreign substance side) may be provided with irregularities. FIG. 10 is a diagram showing a configuration of a nozzle having a concavo-convex portion at the tip, and shows a cross-sectional view of the nozzle 6. As shown in FIG. 10, by providing an uneven portion 61 at the tip of the nozzle 6, the surface area of the nozzle 6 that comes into contact with the photocurable resin 7 when the photocurable resin 7 is peeled is increased. Thereby, the adhering force between the photocurable resin 7 and the nozzle 6 increases, the adhering force between the photocurable resin 7 and the nozzle 6, and between the photocurable resin 7 and the photomask 8. The difference between the fixing force and the fixing force increases. Therefore, it is possible to peel the photocurable resin 7 from the photomask 8 with a small force.

  In the first and second embodiments, the case where the photocurable resin 7 is discharged or dropped from the nozzle 6 and the photocurable resin 7 is removed by the nozzle 6 has been described. The function of discharging or dripping (resin liquid exiting part) and the function of removing the photocurable resin 7 (removing part) may be configured separately.

  FIG. 11 is a diagram illustrating the configuration of the resin discharge portion and the removal portion. The resin discharge portion 53 has a tubular shape with a through hole, and the removal portion 52 has a substantially needle shape. The resin discharge portion 53 is connected to the pipe 5 and emits or drops the photocurable resin 7 from the pipe 5 onto the photomask 8. Further, the removal unit 52 is configured independently of the resin liquid discharge unit 53 and is fixed by the support member 51.

  For example, when these structures (resin liquid discharge part 53 etc.) are applied to the foreign matter removal system described in the first embodiment, when the photocurable resin 7 is emitted to the foreign matter P on the photomask 8. Then, the resin discharge portion 53 and the removal portion 52 are lowered to the vicinity of the foreign matter. Then, the resin liquid discharge unit 53 causes the photocurable resin 7 to be emitted onto the foreign matter P so that the photocurable resin 7 is brought into contact with the photomask 8 and the removing unit 52. As a result, the photocurable resin 7 adheres to the tip of the removal portion 52, the foreign matter P, and the photomask 8. At this time, the photocurable resin 7 is coated so as to enclose the foreign matter P, is in close contact with the removal portion 52 at the top of the photocurable resin 7, and is in close contact with the surface of the photomask 8 at the bottom of the photocurable resin 7. To do. Thereafter, the photocurable resin 7 is cured by the procedure described in the first embodiment, and the foreign matter P is removed together with the photocurable resin 7 from the photomask 8.

  In addition, when the configuration of the resin drainage unit 53 and the like described above is applied to the foreign matter removal system described in the second embodiment, when the photocurable resin 7 is dropped onto the foreign matter on the photomask 8, the resin Without lowering the liquid discharge part 53 and the removal part 52 to the vicinity of the foreign matter, the resin liquid discharge part 53 drops the photocurable resin 7 on the foreign matter. Thereby, photocurable resin 7 will adhere to a foreign material. At this time, the photocurable resin 7 is coated so as to enclose foreign substances, and is in close contact with the surface of the photomask 8 under the photocurable resin 7. Thereafter, the photocurable resin 7 is cured by the procedure described in the second embodiment, and foreign matter is removed from the photomask 8 together with the photocurable resin 7.

  Note that the photomask 8 may be cleaned before or after removing the foreign matter described in the first and second embodiments. Accordingly, foreign matters that can be easily removed can be removed by cleaning, and only foreign matters that are difficult to remove can be removed by the method described in the first and second embodiments.

It is a figure which shows the structure of the foreign material removal system which concerns on 1st Embodiment. It is a functional block diagram which shows the structure of a control apparatus. It is a flowchart which shows the foreign material removal processing procedure of the foreign material removal system which concerns on 1st Embodiment. It is a figure which shows an example of a structure of foreign material information. FIG. 6 is a diagram (1) for explaining a foreign matter removal procedure of the foreign matter removal system according to the first embodiment. It is FIG. (2) for demonstrating the foreign material removal procedure of the foreign material removal system which concerns on Embodiment 1. FIG. It is a flowchart which shows the foreign material removal processing procedure of the foreign material removal system which concerns on 2nd Embodiment. FIG. 6 is a diagram (1) for explaining a foreign matter removal procedure of the foreign matter removal system according to the second embodiment. FIG. 10 is a diagram (2) for explaining the foreign matter removal procedure of the foreign matter removal system according to the second embodiment. It is a figure which shows the structure of the nozzle provided with the unevenness | corrugation in the front-end | tip part. It is a figure which shows the structure of the resin liquid discharge part and a removal part.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Control apparatus, 3 energy supply part, 4A, 4B energy curable substance supply part, 6 nozzle, 7 photocurable resin, 8 photomask, 41 washing tank, 52 removal part, 53 resin liquid discharge part, 81 mask pattern, P Foreign matter

Claims (5)

In the foreign matter removal method for removing foreign matter attached on the photomask,
A moving step of relatively moving an ejection unit that ejects an energy curable substance to a position corresponding to the position of the foreign matter based on information on the position of the foreign matter on a photomask;
A coating step in which the discharge unit discharges an energy curable material onto the foreign material, and the foreign material is covered with the energy curable material; and
An energy output device that outputs predetermined energy, a curing step of applying energy to the energy curable material coated with the foreign matter and curing the energy curable material;
Removing the cured energy curable material from the photomask;
A foreign matter removing method comprising: In the curing step, energy is applied to the energy curable material in a state where a needle-like member disposed on the upper surface side of the photomask is in contact with the energy curable material from the upper surface side of the photomask. Cure the curable substance,
2. The foreign matter according to claim 1, wherein the removing step removes the cured energy curable material from the photomask by peeling the cured energy curable material from the photomask by the needle-like member. Removal method.   2. The foreign matter removing method according to claim 1, wherein the removing step removes the cured energy curable material from the photomask by washing the cured energy curable material in a washing tank. In the foreign matter removal apparatus that removes the foreign matter attached on the photomask,
A discharge part for discharging an energy curing substance;
Based on information on the position of the foreign matter on the photomask, a movement control unit that relatively moves the discharge unit to a position corresponding to the position of the foreign matter;
An energy output unit for outputting energy to the energy curable material;
With
The discharge unit discharges an energy curable material onto the foreign material to cover the foreign material with the energy curable material,
The said energy output part hardens the said energy hardening substance by providing energy to the energy hardening substance which coat | covered the said foreign substance, The foreign material removal apparatus characterized by the above-mentioned.   A method for manufacturing a semiconductor device, comprising: using a photomask from which foreign matter has been removed by the foreign matter removing method according to claim 1.

Images