JP2016072517A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method, which can remove particles lying on a particle removal target surface separately with high efficiency and simply and successfully when there is less need for cleaning of a whole area of the surface to remove the particles.SOLUTION: A substrate processing apparatus comprises: a coating part 13 for coating each of particles P with a resin R which entangles the particles P on a particle removal target surface B1 where the particles P lie; a hardening part 14 for hardening the coated resin R; and a removal part 15 for removing the hardened resin R from the particle removal target surface B1 to separately remove the particles P.SELECTED DRAWING: Figure 1

Description

  Embodiments described herein relate generally to a substrate processing apparatus and a substrate processing method.

  For example, when forming a fine pattern in a semiconductor element, a photocurable resin is applied on a substrate to be transferred, a template (original) is directly pressed against the photocurable resin and cured, and then the template is photocured. Nanoimprint technology is known in which it is separated from the functional resin. In the technique, if the template is directly pressed against the photocurable resin described above with dust (particles) attached to the template, particles remain on the template when the template is separated from the photocurable resin. As a result, a pattern defect occurs.

  Therefore, Patent Document 1 below discloses a technique for avoiding the occurrence of pattern defects by including a step of removing particles using an adhesive member in the nanoimprint technique.

Japanese Patent No. 5121549

  However, the invention disclosed in Patent Document 1 does not give consideration to the following points.

  In other words, a process of removing particles adhering to the template using an adhesive member is shown, but the entire surface of the template is targeted in this removal process. Further, for example, it is conceivable to remove particles using cleaning using a liquid or the like without using an adhesive member. Such a method is an effective means when a large number of particles are present around the template.

  On the other hand, there are cases where particles are not necessarily present on the entire surface of the template or in a wide range, for example, only in a very small area of the template or when the number of particles is very small. Even in such a state, it is considered that it is not appropriate to perform the processing for removing particles on the entire surface of the template in consideration of the time required for all processing steps or the cost. Rather, in such a case, a method of removing particles individually can be considered.

  The present invention has been made to solve the above problems, and the object of the present invention is to provide individual efficiency when there is little need to remove particles present on the surface of the particle removal target by cleaning the entire surface. An object of the present invention is to provide a substrate processing apparatus and a substrate processing method which can be removed easily and reliably.

  The substrate processing apparatus according to the embodiment includes a coating unit that individually applies a resin that entangles particles to a particle removal target surface where particles exist, and a curing that cures the applied resin. And a removing unit that individually removes the particles by removing the cured resin from the particle removal target surface.

  The substrate processing apparatus according to the embodiment cures the applied resin and the application unit that individually applies the resin that entangles the particles to the particle removal target surface where the particles exist, and the particles. And a roller that individually removes the particles by removing the cured resin from the particle removal target surface.

  In the substrate processing method according to the embodiment, the step in which the application unit individually applies the resin that entangles the particles to the particle removal target surface where the particles exist, and the curing unit is applied. A step of curing the resin, and a step of individually removing the particles by removing the resin cured by the removing unit from the particle removal target surface together with the particles.

  The substrate processing method according to the embodiment includes a step in which an application unit individually applies a resin that entangles particles to the particle removal target surface where particles are present, and the applied resin. And a step of individually removing the particles by removing the cured resin from the particle removal target surface.

  According to the present invention, when there is a low need to remove particles present on the surface of the particle removal target by cleaning the entire surface, a substrate processing apparatus capable of removing the particles individually and efficiently and simply and reliably. A substrate processing method can be provided.

1 is a block diagram showing an overall configuration of a substrate processing apparatus according to a first embodiment. It is a flowchart which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is a schematic diagram which shows the particle which exists in the particle removal object surface which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows another flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows another flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows another flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows another flow of the removal of the particle which concerns on 1st Embodiment. It is process drawing which shows another flow of the removal of the particle which concerns on 1st Embodiment. It is a flowchart which shows the flow of the removal of the particle | grains using the dispenser which concerns on 1st Embodiment. It is a flowchart which shows the flow of the removal of the particle | grains using the dispenser which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle using the dispenser which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle using the dispenser which concerns on 1st Embodiment. It is process drawing which shows the flow of the removal of the particle using the dispenser which concerns on 1st Embodiment. It is a block diagram which shows the whole structure of the substrate processing apparatus which concerns on 2nd Embodiment. It is a flowchart which shows the flow of the removal of the particle which uses the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of the removal of the particle using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of another particle removal using the roller which concerns on 2nd Embodiment. It is process drawing which shows the flow of another particle removal using the roller which concerns on 2nd Embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is a block diagram showing an overall configuration of a substrate processing apparatus 1 according to the first embodiment. The substrate processing apparatus 1 includes an information acquisition unit 11, a determination unit 12, an application unit 13, a curing unit 14, and a removal unit 15.

  In addition, in the substrate processing apparatus 1 shown in FIG. 1, only the structure required in order to demonstrate embodiment in this invention is extracted and shown. Therefore, for example, a substrate having a particle removal target surface is transported by a transport device such as a belt conveyor or a transport robot. The transport apparatus is provided in the substrate processing apparatus 1, but is not shown in FIG. For example, a control unit for controlling the operation of each unit is also provided, but it is not shown in the same manner.

  The detailed functions and functions of the above-described units shown in FIG. 1 with respect to the substrate processing apparatus 1 will be described as appropriate when the substrate processing method is described below. The substrate processing method will be described for each method.

  First, the basic substrate processing method for the flow of removing particles from the particle removal target surface will be described. FIG. 2 is a flowchart showing a flow of particle removal according to the embodiment. Here, the flow from step ST1 to step ST11 will be described as a basic substrate processing method. In the description, FIG. 3 and FIGS. 4 to 8 are used as appropriate.

  FIG. 3 is a schematic diagram showing particles present on the particle removal target surface according to the embodiment. As shown in FIG. 3, the particles P are attached to the particle removal target surface B1. If such particles P adhere to the particle removal target surface B1, as described above, for example, the occurrence of pattern defects will cause various inconveniences in the future substrate processing, so it is necessary to remove them. There is.

  The “particle P” here includes, for example, a resist attached to the substrate, an organic substance such as an adhesive residue, or a part of a film formed on the substrate.

  Here, instead of removing the particles P by cleaning the entire surface of the particle removal target surface B1, etc., the individual particles P are removed individually, so that the particles P are finally removed from the particle removal target surface B1. Trying to eliminate the existence of.

  By the way, the “particle removal target surface” is a so-called substrate surface. In addition, as the “substrate” here, for example, various substrates such as a wafer, a mask substrate, and a liquid crystal substrate are conceivable and are not particularly limited. Therefore, in the following, the plate-like object to be processed on which the particles P are present is appropriately referred to as “substrate B” for convenience, and the surface thereof is referred to as “particle removal target surface B1”. Further, the “particle removal target surface B1” may be in a flat state or may be formed with any pattern, and it does not matter.

  FIG. 3 shows a state where the substrate B is viewed from above, and there are three particles P on the particle removal target surface B1. As described above, in the embodiment of the present invention, the flow of particle removal will be described by giving a case where individual particles P can be individually removed.

  In FIG. 3, three particles P are drawn on the particle removal target surface B1, but it is needless to say that it is not necessary to remove the particles P by cleaning the entire surface of the substrate B by any method. As long as it is in a state, the number of particles P does not matter.

  Next, the flow of removing the particles P on the particle removal target surface B1 as shown in FIG. 3 will be described using the flowchart shown in FIG. First, in the substrate processing apparatus 1, when removing the particles P, the position information indicating whether or not the particles P to be removed are present on the substrate B, that is, on the particle removal target surface B1. Obtain (ST1).

  The position information of the particles P to be removed can be grasped by, for example, image processing using a camera or the like provided outside the substrate processing apparatus 1. The position information is grasped by, for example, a position grasping device (not shown in FIG. 1). Accordingly, the position information of the particles P is transmitted from the position grasping device to the substrate processing apparatus 1 when the substrate B is transported to the substrate processing apparatus 1 for performing the removal process.

  As described above, in the embodiment of the present invention, the position information of the particles P is grasped by an apparatus other than the substrate processing apparatus 1. For example, the substrate processing apparatus 1 itself may include the mechanism. Absent.

  In the substrate processing apparatus 1, the information acquisition unit 11 grasps the transmitted position information of the particles P to be removed. In the embodiment of the present invention, unlike the case of removing the particles P by cleaning the entire surface of the substrate B, the individual particles P are individually removed, so that the positions of the particles P to be removed are determined. Understanding of information is very important.

  The position information of the particles P to be removed, acquired by the information acquisition unit 11, is sent to the determination unit 12. The determination unit 12 confirms whether or not the particles P are present in a region having a predetermined area or more on the particle removal target surface B1 (ST2).

  For example, as shown in FIG. 3, when the particles P are separately present on the particle removal target surface B1, they can be removed individually, which is efficient.

  On the other hand, although not shown, for example, there may be a case where the particles P are linearly present on the particle removal target surface B1, or a case where the particles P are present in a certain region. For example, when the vericle is adhered to the mask substrate with an adhesive, a linear adhesive mark (residue) remains on the mask substrate surface along the frame of the vericle. In this case, it is not necessary to clean the entire surface of the substrate B. However, if the particles P can be removed together as much as possible, the tact time can be shortened, for example.

  Therefore, here, the determination unit 12 determines whether the individual particles P are individually removed or can be removed collectively based on the degree of aggregation of the particles P. That is, the determination is made based on the distribution of the particles P on the particle removal target surface B1. Note that a method of removing the particles P collectively will be described later.

  When the determination unit 12 determines based on the position information of the particles P from the information acquisition unit 11 and determines that the particles P exist in a discrete state on the particle removal target surface B1 ( It is assumed that the particles P are individually removed (ST3).

  Therefore, the determination unit 12 acquires and confirms information on the particles P to be removed and information on the particle removal target surface B1 from the information acquisition unit 11 for individual removal of the particles P (ST4). Here, the information regarding the particle P is, for example, the size, shape, material, and the like of the particle P. Further, the information on the particle removal target surface B1 is information such as the state of the particle removal target surface B1 and the material of the substrate B. These pieces of information are information necessary for determining what kind of resin is used to entangle the particles P.

  Based on these pieces of information, the determination unit 12 determines how to remove the particles P. This determination is made, for example, by storing a list of resins suitable for the material of the particles P and the substrate B in the storage unit, which is stored in a storage unit not shown in the overall configuration of the substrate processing apparatus 1 in FIG. It is stored and may be performed based on the list. Alternatively, an inquiry may be made to the operator of the substrate processing apparatus 1 and a determination may be made based on an instruction from the operator.

  This determination includes a determination (ST5) regarding whether or not the removal complement is used. Here, the “removal complement” is an item used for easy and reliable removal when removing the particles P. For example, a vinyl chloride plate having high adhesion to the resin R or the like A metal plate having a surface coated with a material having high adhesiveness to the resin R.

  That is, as will be described later, when removing the particles P, the resin R is applied to the particles P and cured, and the removing unit removes the resin R containing the cured particles P. However, when the removal unit 15 is configured with a mechanism for gripping the cured resin, for example, if the applied resin R is cured in a state of being thinly spread on the particle removal target surface B1, the resin R It becomes difficult to grip.

  In such a case, if the removal complement is used, when the resin R is cured, the particles P and the removal complement are integrated with the cured resin R. Thereafter, the removal unit 15 grasps the removal complement, and as a result, the resin R and the particles P can be grasped and removed. Therefore, the determination unit 12 determines whether to use the removal complement. A method for removing the particles P using the removal complement will be described later.

  As a result of the determination by the determination unit 12, if the removal complement is not necessary (NO in ST5), the resin R used for removing the particles P is selected (ST6), and the particles P to be removed are selected. Based on the information, the application amount and application range of the resin R are confirmed (ST7).

  When the resin R is selected in advance, step ST6 may be omitted and the application amount and application range may be confirmed.

  4 to 8 are process diagrams showing a flow of removing the particles P according to the embodiment. In the process charts of FIG. 4 and subsequent figures, the substrate B is shown horizontally so that the particle removal target surface B1 faces upward. Therefore, the resin R is applied and removed from above the particles P on the particle removal target surface B1 shown in this way.

  In FIG. 4, the application part 13 which apply | coats resin R above the particle P is shown. As the application unit 13, for example, an inkjet discharge mechanism can be used. The nozzles N constituting the application unit 13 are arranged at positions facing the particle removal target surface B1 with the particles P interposed therebetween based on the position information of the particles P. The nozzle N is filled with a resin R to be applied to the particles P, and the resin R is applied toward the particles P based on an instruction from the substrate processing apparatus 1 (ST8).

  FIG. 5 shows a state in which the resin R is applied to the particles P. In addition, in FIG. 5, arrows from the lateral direction with respect to the applied resin R are shown. This shows a process of curing the resin R applied so as to enclose the particles P by the curing unit 14.

  As the resin R, for example, an ultraviolet curable resin that is cured by irradiating ultraviolet rays may be selected, or a thermosetting resin that is cured by heating may be selected. As described above, the resin R is selected in accordance with the properties of the particle P to be removed and the particle removal target surface B1 on which the particle P exists.

  Therefore, if an ultraviolet curable resin is selected as the resin R, the arrow shown in FIG. 5 represents the ultraviolet rays emitted from the light source. Further, when a thermosetting resin is selected as the resin R, the arrow shown in FIG. 5 represents the heat irradiated from the heat source.

  As described above, the cured portion 14 matching the properties of the selected resin R is selected for the resin R applied to the particles P, and the resin R is cured (ST9). Since the resin R is applied so as to entangle the particles P, the resin R is cured together with the particles P through a curing process by the curing unit 14.

  FIG. 6 shows the cured resin R and particles P. The coating unit 13 finishes the coating process of the resin R on the particles P and also completes the curing process, and then moves in the direction of the arrow shown in FIG. This is to retreat from the upper side of the target particle P so that the resin R and the particle P can be smoothly removed by the removal unit 15 as the next step.

  Here, the application unit 13 starts moving after the curing process of the resin R by the curing unit 14 is completed, but the application unit 13 is controlled to move simultaneously with the curing process by the curing unit 14. Also good.

  In addition, since the curing process by the curing unit 14 has already been completed, the resin R is present including the particles P on the particle removal target surface B1. In particular, in FIG. 6, the cured resin R is shown in the form of a column, but the shape of the cured resin R is not limited to the illustrated shape. Further, the nozzle N constituting the application unit 13 is made of, for example, a metal that does not transmit ultraviolet rays, for example, in order to prevent the resin R in the nozzle N from being cured during the curing process by the curing unit 14. It is formed with the material.

  FIG. 7 shows a state in which the removing unit 15 holds the cured resin R in order to remove the particles P (ST10). The removing unit 15 removes the cured resin R, thereby removing particles P entangled with the resin R and similarly cured.

  Here, the removing unit 15 is configured as a crane that holds and lifts the cured resin R (particle P). For the convenience of description, the crane shown in FIG. 7 is used as an example for the configuration of the removing unit 15. For example, the mechanism for gripping the resin R is limited to the mechanism shown in FIG. 7. Is not to be done. For example, the “gripping” is not limited to the gripping mechanism, and the removing unit 15 has a hole connected to the decompression unit on the surface facing the particle P, and the resin R (particle P) by sucking air. A mechanism for sucking and holding can also be considered.

  That is, it can be said that the particles P are hardened by the resin R in order to make it easy to remove the individual particles P individually by the removing unit 15. In this way, by curing the particles P using the resin R, it is possible to remove the particles P more easily and reliably than removing them individually without performing any processing.

  FIG. 8 shows a state where the resin R gripped by the removing unit 15 is lifted upward together with the particles P as indicated by arrows. The removal unit 15 pulls up the resin R and the particles P together, moves them to a disposal location, and separates the resin R, thereby discarding the particles P on the particle removal target surface B1. The mechanism by which the removing unit 15 separates the resin R is, for example, that the removing unit 15 has a hole connected to the pressurizing unit on the surface facing the particle P, and releases the air to release the resin R (particle P). A mechanism for separating them can be considered.

  This completes the removal of one particle P (ST11).

  However, the process of removing the particle P described above is repeated as long as the particle P to be removed exists on the particle removal target surface B1.

  After the removal unit 15 discards the particles P together with the resin R, the determination unit 12 confirms whether or not there are particles P to be removed on the particle removal target surface B1 based on the position information of the particles P ( ST12). As a result, when the particles P are present (YES in ST12), the process returns to step ST4, and the processing steps described above are repeated again to remove the particles P. On the other hand, as a result of the determination, if it is confirmed that the particle P does not exist on the particle removal target surface B1 (NO in ST12), the particle P removal process is completed.

  The basic flow for removing the particles P on the particle removal target surface B1 has been described above. Next, the above-described method for removing particles P using the removal complement E will be described with reference to the flowchart shown in FIG. 2 and FIGS. 9 to 13 as appropriate. 9 to 13 are process diagrams showing another flow of removing the particles P according to the first embodiment.

  As shown in the flowchart of FIG. 2, as a result of the determination unit 12 determining whether or not it is necessary to use the removal complement E, the use of the removal complement E is determined based on the state of the particles P and the state of the particle removal target surface B1. Is required (YES in ST5), first, the resin R is selected on the assumption that the removal complement E is used (ST21). In addition, the application amount of resin R and the application range are also confirmed (ST22).

  Here, in performing the process of removing the particles P using the removal complement E described below, the determination unit 12 determines that the particle removal target surface B1 is more than the removal complement E with respect to the cured resin R. However, it is necessary to select a resin R having the property of easily peeling off.

  This is because if the adhesion of the resin R to the particle removal target surface B1 is higher than the adhesion to the removal complement E, the resin R and particles together with the removal complement E after curing the resin R will be described later. This is because when the P is pulled up from the particle removal target surface B1, the resin R is not peeled off from the particle removal target surface B1, and as a result, the particles P cannot be removed.

  Therefore, by selecting the resin R having the above-described properties, it is possible to achieve both suppression of damage to the particle removal target surface B1 during removal and separation of the resin R and the particles P.

  Then, as shown in FIG. 9, the removal unit 15 moves the removal complement E and places it so as to cover the particle P from above the particle P toward the particle removal target surface B1 (ST23). As described above, the role of the removal complement E is to assist the removal of the particles P that are considered difficult to remove even when cured with the resin R. Here, when the particles P are removed, the cured resin R and the particles P are not directly removed by the removing unit 15, but the removing unit 15 grasps the removal complement E to easily remove the particles P. It is to make.

  In addition, although the plate-shaped thing is used as the removal complement E here, as long as it can play the role as the removal complement E, the shape is not limited to plate shape. In addition, the placement of the removal complement E on the particles P is here before the resin R is applied, but the placement timing of the removal complement E is, for example, after the application of the resin R and before curing. It may be.

  FIG. 10 shows a process of applying the resin R between the placed removal complement E and the particle removal target surface B1. That is, the resin R is applied between the removal complement E in which the particles P exist and the particle removal target surface B1 from the nozzle N of the application unit 13 (ST24). After the set application amount has been applied, the curing unit 14 irradiates the applied resin R with ultraviolet rays or the like to perform a curing process on the resin R (ST25). In FIG. 11, the curing process by the curing unit 14 is indicated by an arrow.

  When the curing of the resin R is completed, the removal unit 15 then holds the removal complement E as shown in FIG. 12 (ST26). After that, the removal portion 15 pulls the grasped removal complement E upward, and the resin R and the particles P are also removed upward from the particle removal target surface B1 (ST27). FIG. 13 shows this state. The removal complement E, the resin R, and the particles P pulled upward are carried to a predetermined region by the removal unit 15 and discarded. As a result, the particles P on the substrate B (particle removal target surface B1) are removed.

  After that, after the removal unit 15 discards the particles P together with the resin R, the determination unit 12 further determines whether there is a particle P to be removed on the particle removal target surface B1 based on the position information of the particle P. Whether to confirm (ST12) is as described above.

  Next, the flow of removing the particles P using the dispenser F will be described. 14 and 15 are flowcharts showing the flow of removing particles P using the dispenser F according to the first embodiment. FIGS. 16 to 18 are process diagrams showing the flow of removing the particles P using the dispenser F according to the first embodiment.

  First, the dispenser F is mounted on the application part 13A for applying the resin R to the particles P (ST31). Here, the “dispenser F” is a member that plays a role of applying the resin R to the particles P like the nozzle N described above. Therefore, one end of the dispenser F is attached to the application part 13A so as to apply the resin R to the particles P. In addition, a known technique can be utilized about the mounting method of the dispenser F to the application part 13A.

  On the other hand, the dispenser F can remove the dispenser F by eliminating the mounting relationship with the application part 13A and separating one end from the application part 13A. That is, application part 13A and dispenser F are connected so that attachment or detachment is possible.

  Since the application part 13A and the dispenser F are detachable in this way, for example, if the dispenser F can pull up the particles P and the resin R from the particle removal target surface B2 together, then the dispenser F is applied. The particles P can be removed (discarded) together with the dispenser F by separating from the portion 13A. If such a process becomes possible, the dispenser F can be made disposable, for example.

  For this purpose, when the resin R applied to the particles P is cured, even the resin R held in the dispenser F can be cured together. Can be raised.

  Therefore, in the embodiment of the present invention, when the resin R entangled with the particles P is cured, the resin R held in the dispenser F is also cured. For this purpose, the dispenser F is formed of a material that transmits ultraviolet rays, for example, used in the curing process performed by the curing unit 14.

  The nozzle N in the application unit 13 is formed of a material that does not transmit ultraviolet rays, such as metal, so that even the resin R held inside by the curing process performed by the curing unit 14 is not cured. On the other hand, the dispenser F here needs not only to apply the resin R to the particles P but also to cure not only the resin R entangled with the particles P but also the resin R held in the dispenser F in the curing process. Therefore, the dispenser F is formed of a material that transmits ultraviolet rays.

  In addition, when the resin R is a thermosetting resin, it is held in the dispenser F as well as the resin R entangled with the particles P in the curing process by adopting a material having excellent heat conduction. It is also possible to cure the resin R to be cured.

  As described above, one end portion of the dispenser F has a shape that can be attached to the application portion 13A. On the other hand, a discharge port is formed at the other end of the dispenser F, and the resin R is discharged toward the particles P from the discharge port. In addition, a surface F1 facing the particle removal target surface B2 is provided at the other end portion outside the discharge port.

  Such a surface F1 is provided in the process of removing the particles P using the dispenser F, in which the resin R in the dispenser F is also cured and removed together with the resin R entangled with the particles P. It is to become. Therefore, when the resin R applied from the dispenser F toward the particles P is cured, the resin R existing from the particles P to the inside of the dispenser F is integrated by curing. Because of this state, pulling up the dispenser F causes the particles P and the resin R to be pulled up integrally.

  Therefore, in order to pull up the particles P and the resin R as the dispenser F is pulled up, a corresponding strength is required for the cured resin R. In this case, as described above, when the surface F1 facing the particle removal target surface B2 is provided outside the discharge port at the other end of the dispenser F, the contact area of the resin R with the surface F1 is large. Thus, when cured, the strength for pulling up more integrally increases. For this reason, when the surface F1 is formed outside the discharge port which is the other end, and the resin R is applied to the particles P, a sufficient amount of the resin R to contact the surface F1 is provided. We are going to apply.

  In addition, about the shape of this surface F1, if it is the exterior of a discharge outlet, it may be provided over the perimeter of a discharge outlet, for example. Moreover, when provided over the entire circumference, the shape of the surface facing the particle removal target surface B2 may be any shape such as a circle or a polygon.

  About the flow of removal of the particle P using the dispenser F, after installing the dispenser F in the application part 13A, it begins the preparation for actually apply | coating resin R with respect to the particle P. FIG.

  That is, as described so far, the position information on which position of the particle P to be removed exists in the substrate processing apparatus 1 on the particle removal target surface B2 is grasped (ST32).

  The position information of the particles P to be removed, acquired by the information acquisition unit 11, is sent to the determination unit 12. The determination unit 12 confirms whether or not the particles P are present in a region having a predetermined area or more on the particle removal target surface B2 (ST33). Note that a method of removing the particles P collectively will be described later.

  As a result of the determination by the determination unit 12 based on the position information of the particles P from the information acquisition unit 11, when it is determined that the particles P exist in a discrete state on the particle removal target surface B <b> 2 ( It is assumed that the particles P are individually removed (ST34).

  The determination unit 12 further acquires and confirms information about the particles P to be removed and information about the particle removal target surface B2 from the information acquisition unit 11 (ST35). The determination unit 12 determines how to perform the particle P removal processing based on the information on the particles P and the information on the particle removal target surface B2.

  In addition, the determination unit 12 further selects the resin R used when removing the particles P (ST36), and confirms the application amount and application range of the resin R based on the information of the particles P to be removed. (ST37).

  Substrate processing apparatus 1 will apply resin R to particle P which becomes the candidate for removal via dispenser F, if each check mentioned above is completed (ST38).

  FIG. 16 is a process diagram showing a flow of removing particles P using the dispenser F according to the embodiment. FIG. 16 shows a state immediately before the resin R is applied to the particles P. That is, the dispenser F is attached to the application portion 13A, and the resin R is held inside the dispenser F. On the other hand, particles P to be removed are present directly under the dispenser F and the resin R.

  In FIG. 16 to FIG. 18, unlike the process diagrams used for the explanation so far, a pattern is formed on the particle removal target surface B <b> 2 of the substrate B. And the particle P which should be removed exists in the recessed part formed with this pattern. Even in the flow of removing the particles P using the dispenser F described here, even if the particles P are present on the flat particle removal target surface B1 shown in the process diagrams used so far. good.

  In FIG. 17, the state of step ST38 mentioned above, ie, the state in which the resin R is applied to the particles P via the dispenser F, is shown. The resin R is discharged from the discharge port at the other end of the dispenser F.

  Here, the resin R is sufficiently entangled with the particles P existing in the pattern, and the inside of the pattern is filled with the resin R. Further, the resin R is applied so as to contact the surface F1 and the groove forming the pattern so that the resin R continues from the inside of the pattern to the resin R held inside the dispenser F. Yes.

  Under such a state, the curing unit 14 irradiates the resin R with, for example, ultraviolet rays. As described above, the dispenser F is formed of, for example, a material having a property of transmitting ultraviolet rays. Therefore, the dispenser F is held inside the dispenser F as well as the resin R in which the irradiated ultraviolet rays are entangled with the particles P. The resin R being cured is also cured.

  That is, as shown in FIG. 17, the resin R is entangled with the particles P existing inside the pattern groove, and is formed above the upper part of the groove forming the pattern and the other end of the dispenser F. Between the surface F1 and the resin R held on the inside of the dispenser F from the other end of the dispenser F from which the resin R is discharged to one end attached to the application unit 13A, It is cured by receiving ultraviolet rays.

  Since the resin R in contact with the surface F1 is also cured in this way, as shown in FIG. 18, when the application portion 13A is pulled upward from this state, the cured resin R is also integrally lifted upward (FIG. 15). ST40). Since the resin R is also filled inside the groove of the pattern and hardened, the particles P existing inside the groove are also entangled in the hardened resin R and pulled upward.

  In addition, in particular, when the pattern is formed on the particle removal target surface B2 and the particle P to be removed exists in the concave portion, if the concave portion is filled with the resin R, the resin R is now replaced with the resin R. It may be difficult to pull up after curing. That is, the resin R existing from the concave portion including the particles P to the inside of the dispenser F can be integrally pulled up, but is cured when the resin R is applied to fill the concave portion. In this case, the adhesion between the surface of the recess and the resin R becomes too high, and a large force is required to pull up the cured resin R.

  Forcibly pulling up in such a case, for example, the cured resin R is broken during the pulling up, and the particles P cannot be pulled up, or with the high adhesion between the resin R and the recess, It is not unimaginable that even the pattern is pulled. Such a situation can lead to pattern defects.

  Therefore, for example, as described here, when the pattern is formed on the particle removal target surface B2 and the particle P is present in the concave portion, when cured after coating, When the resin R having the property that the volume upon curing is reduced rather than the volume is selected and used, the above-described adverse effects can be avoided.

  As described above, the particles P are removed from the particle removal target surface B2. Then, the application unit 13A moves together with the dispenser F including the cured resin R (particles P) to discard the particles P lifted from the particle removal target surface B2 (ST41). Since one end of the dispenser F is detachably attached to the application unit 13A, the dispenser F is separated from the application unit 13A after the application unit 13A has moved to a place where the particles P are discarded.

  Regarding the separation of the dispenser F from the application part 13A, the dispenser F is attached to the application part 13A by, for example, a screw type. Therefore, when the dispenser F is attached to the application part 13 in this way, the dispenser F can be separated from the application part 13A by a detachment mechanism (not shown) or manually twisted.

  By adopting such a configuration, the cured resin R including the dispenser F and the particles P can be discarded together. Thus, the particles P can be removed from the particle removal target surface B2.

  As described above, the dispenser F is separated from the application unit 13A and discarded together with the cured resin R, but can be reused by removing the resin R from the dispenser F. Therefore, the substrate processing apparatus 1 confirms whether or not to reuse the separated dispenser F (ST43).

  When the dispenser F is reused (YES in ST43), for example, the resin R and the particles P are removed from the dispenser F by washing at a place where the dispenser F is separated and discarded, or at another place (ST44). . The cleaned dispenser F is stored at a storage location (ST45). As described in step ST31, when the removal process of the particles P using the dispenser F is performed, the particle P is mounted on the coating unit 13A in advance, and thus is stored until it is mounted on the coating unit 13A again. Is done.

  On the other hand, when the reuse of the dispenser F is not performed (NO in ST43), the dispenser F is discarded in a state where it is integrated with the particles P and the resin R.

  After that, the determination unit 12 checks whether or not there are particles P that still need to be removed on the particle removal target surface B2 (ST46). When the particle P exists (YES in ST46), the process returns to step ST35 again to confirm information on the particle P to be removed. Here, the process returns to this step. However, for example, the process may return to the step of attaching the dispenser F to the application unit 13A again, and the particle P removal process may be started again from there.

  If the particle P does not exist as a result of the confirmation (NO in ST46), the particle P removal process using the dispenser F is completed.

  By adopting the above configuration and process, when there is a low need to remove particles existing on the surface of the particle removal target by cleaning the entire surface, it can be removed efficiently and simply individually and reliably. It is possible to provide a substrate processing apparatus and a substrate processing method.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. In the second embodiment, the same components as those described in the first embodiment are denoted by the same reference numerals, and the description of the same components is omitted because it is duplicated.

  In the first embodiment described so far, the particles P are removed by pulling them up from the particle removal target surfaces B1 and B2 using the removal unit 15 together with the resin R in which the particles P are cured. In the second embodiment, a roller is employed as the removing unit 15A, and the cured resin R including the particles P is removed using the roller (hereinafter, referred to as “roller 15A” as appropriate).

  FIG. 19 is a block diagram showing an overall configuration of a substrate processing apparatus 1A according to the second embodiment. In the substrate processing apparatus 1A, a roller 15A is employed as the removing unit 15A. FIG. 20 is a flowchart showing a flow of removing particles P using the roller 15A according to the second embodiment. Hereinafter, a method for removing the particles P using the roller 15A will be described with reference to FIGS. 21 to 26 as appropriate.

  First, as a premise, the information acquisition unit 11 of the substrate processing apparatus 1A grasps position information of particles P to be removed, which are specified on the particle removal target surface B3 (ST1 in FIG. 2). Then, the determination unit 12 determines whether or not the particle P is present in a region having a predetermined area or more (ST2). For example, this is more efficient if the particles P are linearly present on the particle removal target surface B3, or if the particles P are collectively present in a certain region, and the particles P can be removed as much as possible. Based on the idea that

  Therefore, the case where the determination by the determination unit 12 individually removes the individual particles P (NO in ST2) has been described in the first embodiment. In the second embodiment, a case where particles P are removed together will be described.

  For example, when the determination unit 12 determines that the particles P are present in a certain region (YES in ST2), the particles P are removed using the roller 15A (ST51).

  Therefore, the determination unit 12 further acquires and confirms information on the particles P to be removed and information on the particle removal target surface B3 from the information acquisition unit 11 (ST52). The determination unit 12 determines how to perform the particle P removal processing based on the information on the particle P and the information on the particle removal target surface B3. In addition, the determination unit 12 further selects the resin R used when removing the particles P (ST53) and confirms the application amount and application range of the resin R based on the information of the particles P to be removed. (ST54).

  FIG. 21 shows a state in which the confirmation before applying the resin R is completed. That is, the application unit 13 is moved above the particles P to be removed. In this state, the nozzle N of the application unit 13 is filled with the resin R to be applied. The roller 15A is also prepared to remove the resin R containing the particles P after the resin R is applied to the particles P and cured. When the roller 15A is brought into close contact with the particle removal target surface B3, for example, when the pattern is formed on the particle removal target surface B3, the pattern is broken. Therefore, the roller 15A is in a state of being separated from the particle removal target surface B3 by several μm to several 100 μm.

  Next, as shown in FIG. 22, the resin R is discharged toward the particle P from the nozzle N of the application unit 13 (ST55). Then, as shown in FIG. 23, after the application unit 13 applies the resin R toward the particles P, the application unit 13 moves upward. At the same time, the roller 15A also starts moving in the direction of the arrow toward the resin R (ST56).

  For example, the applied resin R is irradiated with ultraviolet rays from the curing unit 14 and cured (ST57, see FIG. 24). During this time as well, the roller 15A moves in the direction of the arrow shown in FIG. 24 and continues to move toward the cured resin R.

  In addition, when using ultraviolet irradiation as the hardening part 14, the roller 15A is formed of a highly transmissive material such as quartz so that it can transmit ultraviolet light. Therefore, the curing unit 14 can continue to irradiate the resin R with ultraviolet rays without being blocked by the roller 15A.

  When the roller 15A moves in the direction of the arrow as it is, it comes into contact with the cured resin R including the particles P. The resin R applied here has a property of being more closely attached to the rotating surface of the roller 15A than the particle removal target surface B3. Alternatively, a material having high adhesion with the resin R may be applied in advance to the surface of the roller 15A.

  Therefore, when the roller 15A rotates on the particle removal target surface B3, the cured resin R adheres to the rotating surface of the roller 15A (ST58). Therefore, as shown in FIG. 25, the roller 15A moves while rotating so that the resin R adheres to the rotating surface and is removed so as to be peeled off from the particle removal target surface B3. Since the resin R is entangled and hardened with the particles P to be removed, the particles P are also peeled off from the particle removal target surface B3 in accordance with the resin R that is in close contact with the rotating surface as the roller 15A rotates.

  Further, as the roller 15A continues to rotate, as shown in FIG. 26, the particles P and the resin R existing on the particle removal target surface B3 are completely peeled off from the particle removal target surface B3 and are in close contact with the surface of the roller 15A. To do. In this way, the particles P and the resin R are removed from the particle removal target surface B3 (ST59).

  In this state, the particles P are removed from the particle removal target surface B3, but the resin R and the particles P are in close contact with the roller 15A. Therefore, the resin R and the particles P adhering to the surface of the roller 15A are cleaned and removed by a cleaning mechanism (not shown) (ST60).

  After that, the determination unit 12 of the substrate processing apparatus 1A checks whether or not the particles P to be removed still exist on the particle removal target surface B3 (ST61). Returning to ST52, the removal process of the particle P is performed.

  On the other hand, when it is determined that there is no particle P to be removed and all the particles P are removed from the particle removal target surface B3 and the presence of the particle P cannot be confirmed (NO in ST61), the particle P here. The removal process is completed.

  In addition, when the roller rotates on the particle removal target surface B3, the following method can also be employed as a method of bringing the cured resin R into close contact with the rotating surface of the roller or removing it.

  27 and 28 are process diagrams showing a flow of removing another particle P using the roller 15B according to the second embodiment. The roller 15B is provided with a hole 21 penetrating to the center of rotation of the roller 15B. The number of the holes 21 may be singular or plural. Further, the hole 21 may be formed in a tapered shape from the rotation center of the roller 15B toward the surface thereof. In FIG. 27 or FIG. 28, the hole 21 is formed in a tapered shape for convenience of explanation.

  Further, the hole 21 is connected to a pressure reducing unit 22 or a pressure unit 23 provided at the rotation center of the roller 15B.

  As shown in FIG. 27, when the roller 15B rotates in the direction of the arrow to remove the particles P existing on the particle removal target surface B3, the decompression unit 22 operates and is provided on the surface of the roller 15B. By sucking air through the holes 21, the resin R that is entangled and hardened by the particles P is adsorbed to the surface of the roller 15B (ST58). In this way, the particles P and the resin R are removed from the particle removal target surface B3 (ST59).

  In addition, about the force of attraction | suction in the pressure reduction part 22, it can change suitably with the close_contact | adherence degree of resin R and particle removal object surface B3.

  Even if the resin R is peeled off from the particle removal target surface B3, the decompression unit 22 continues to suck air, so that even if the resin R is about to peel off from the surface of the roller 15B, the resin R is removed from the surface of the roller 15B. Can remain in the adsorbed state.

  Thereafter, after the resin R is completely peeled off from the particle removal target surface B3, as shown in FIG. 28, air is released from the surface of the roller 15B through the hole 21 by operating the pressurizing unit 23 this time. The The resin R containing the particles P peeled off from the particle removal target surface B3 is adsorbed on the surface of the roller 15B, but the air pressurized by the pressurizing unit 23 is released from the hole 21, thereby the roller 15B. The resin R is peeled off from 15B and removed (ST60).

  Here, the description has been given by taking as an example the case where the decompression unit 22 and the pressurization unit 23 are provided at the rotation center of the roller 15B and the resin R is sucked and peeled off, but it is also possible to provide only one of them. is there. For example, only the pressure unit 23 can be provided. In this case, when the resin R is brought into close contact with the particle removal target surface B3, the resin R itself is brought into close contact with the surface of the roller 15B, and when the resin R is peeled off, the pressure unit 23 is moved. It is also conceivable to remove the resin R from the roller 15B.

  By adopting the above configuration and process, when there is a low need to remove particles existing on the surface of the particle removal target by cleaning the entire surface, it can be removed efficiently and simply individually and reliably. It is possible to provide a substrate processing apparatus and a substrate processing method.

  In particular, when multiple particles are present in a certain area on the surface where the particles are to be removed, these particles are not removed individually one by one, but the particles existing in a certain area are collected using a roller. Can be removed. Therefore, it is possible to remove particles efficiently and reliably.

  In the second embodiment, the roller has been described as one aspect of the removing unit that removes the cured resin containing particles. However, the roller may have not only a function of removing the resin (particles) but also a function of a curing unit that cures the resin, for example. For example, by irradiating ultraviolet rays from the roller in advance in the direction in which the roller rotates, the resin can be cured before the resin adheres to the roller and particles are removed together.

  Alternatively, a heating unit may be provided in the roller, and when the roller comes into contact with the resin, the heated roller rotates and moves on the resin to cure and remove the resin.

  By configuring the roller in this way, it is not necessary to provide the curing portion independently. Therefore, the apparatus configuration of the substrate processing apparatus is simplified, and the installation cost and the like can be reduced. Moreover, since it becomes possible to remove immediately after hardening resin, it contributes also to shortening of processing time.

  Although an embodiment of the present invention has been described, this embodiment is presented as an example and is not intended to limit the scope of the invention. This embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  For example, the step of acquiring and confirming information on the particle P and the information on the particle removal target surface B1 (ST4 in FIG. 2) and the information acquisition unit 11 are omitted if such information is known in advance. Can do. In that case, the kind of resin used for the removal process of the particle P and the hardened part can be determined in advance.

  In addition, for example, the necessity of the removal complement can be determined in advance. In that case, the step (ST5 in FIG. 2) for confirming whether or not the removal complement is necessary can be omitted, and the process can proceed to the step ST6 or ST21 based on a predetermined determination.

  Also, for example, if it is known in advance that the particles P are solidified in a region having a predetermined area or more at a predetermined position, the step ST2 in FIG. 2 is omitted, and the roller 15A is employed as the removing unit. May be. In this case, the determination unit 12 can be omitted.

  Further, for example, whether or not to reuse the dispenser can be determined in advance before the processing is started. In that case, the dispenser can be reused or discarded based on a predetermined determination without branching the determination in step ST43 in FIG.

  For example, FIG. 21 shows an example in which the application unit 13 is moved above the particles P to be removed, but the resin may be applied while moving the application unit 13 in the horizontal direction. In that case, the resin R is applied continuously or intermittently to the region where the particles exist while the application unit 13 moves in the horizontal direction. After starting the application of the resin R, the curing unit 14 cures the resin R by performing the curing described in the above-described embodiment. Thereafter, the resin can be removed by rotating the roller 15A. In this case, the curing unit 14 and the roller 15A can be moved while the application unit 13 is moved and the relative speed is controlled.

1, 1A Substrate Processing Device 11 Information Acquisition Unit 12 Determination Unit 13 Application Unit 14 Curing Unit 15 Removal Unit 15A Roller B Substrate B1 to B3 Particle Removal Target Surface P Particle R Resin

Claims (20)

An application unit that individually applies to the particles a resin that entangles the particles with respect to the particle removal target surface where the particles exist,
A curing part for curing the applied resin;
A removing unit that individually removes the particles by removing the cured resin from the particle removal target surface;
A substrate processing apparatus comprising:   The said application part is provided with the information acquisition part which acquires the information regarding the position of the said particle in the said particle removal object surface at the time of apply | coating the said resin with respect to the said particle removal object surface containing the said particle. Item 2. The substrate processing apparatus according to Item 1.   2. The application unit according to claim 1, wherein the application unit is disposed at a position facing the particle removal target surface with the particles sandwiched based on information on the position of the particles acquired by the information acquisition unit. The substrate processing apparatus according to claim 2.   The resin applied to the particle removal target surface including the particles by the application unit is an ultraviolet curable resin, and the cured unit is a light source that irradiates the resin with ultraviolet rays. The substrate processing apparatus according to claim 1.   The resin applied to the particle removal target surface including the particles by the application unit is a thermosetting resin, and the curing unit is a heat source that applies heat to the resin. The substrate processing apparatus according to claim 1.   6. The substrate processing apparatus according to claim 1, wherein the removing unit grips and removes the cured resin containing the particles from the particle removal target surface.   The removal unit is a dispenser having one end connected to the application unit, and after applying the resin to the particles and curing the resin, together with the cured resin containing the particles The substrate processing apparatus according to claim 1, wherein the particles are removed by pulling up the dispenser and separating the dispenser from the application unit.   8. The substrate processing apparatus according to claim 7, wherein the other end of the dispenser that discharges the resin with respect to the particles has a surface facing the particle removal target surface outside the discharge port. .   The removal unit is a roller, and rotates the roller so that the cured resin containing the particles comes into contact with a rotating surface of the roller and is removed from the particle removal target surface. The substrate processing apparatus according to claim 1. An application unit that individually applies to the particles a resin that entangles the particles with respect to the particle removal target surface where the particles exist,
A roller for individually removing the particles by curing the applied resin and removing the cured resin from the particle removal target surface;
A substrate processing apparatus comprising:   When applying the resin to the particle removal target surface including the particles, the application unit selects at least the resin to be applied based on information about the particles that the resin contacts and the particle removal target surface; The substrate processing apparatus according to claim 1, further comprising a determination unit that determines any one of the coating amounts. A step of individually applying to the particles a resin in which the application unit entangles the particles with respect to the particle removal target surface where particles exist;
Curing the resin coated with a cured portion;
Removing the particles individually by removing the resin cured by the removal unit from the particle removal target surface together with the particles;
A substrate processing method comprising:   The information acquisition unit includes, before the step of applying the resin, a step of acquiring position information of the particles to be removed, information about the particles, and information about the surface of the particle removal target. 12. The substrate processing method according to 12.   In applying the resin, the determination unit includes a step of determining at least selection of the resin to be applied and an application amount based on information on the particles that are in contact with the resin and the particle removal target surface. The substrate processing method according to claim 12 or claim 13.   13. The step of curing the resin is a step of irradiating the resin with ultraviolet rays from a light source when the resin has a property of being cured by irradiation of ultraviolet rays. Item 15. The substrate processing method according to any one of Items 14 to 14.   13. The step of curing the resin is a step of applying heat from a heat source to the resin when the resin has a property of being cured by applying heat. Item 15. The substrate processing method according to any one of Items 14 to 14.   17. The substrate according to claim 12, wherein in the step of removing the particles from the particle removal target surface, the removing unit removes the resin containing the particles by gripping the resin. Processing method.   In the step of removing the particles from the particle removal target surface, the removal unit is a dispenser having one end connected to the application unit, and applies the resin to the particles and cures the resin. 17. The method according to claim 12, wherein after the step of causing the particles, the particles are removed by pulling up the dispenser together with the cured resin containing the particles and separating the dispenser from the application unit. A substrate processing method according to claim 1.   In the step of removing the particles from the particle removal target surface, the removal unit is a roller, and by rotating the roller, the cured resin containing the particles is brought into contact with the rotation surface of the roller, and The substrate processing method according to any one of claims 12 to 16, wherein the substrate is removed from the particle removal target surface. A step in which the application unit individually applies the resin that entangles the particles to the particles on the particle removal target surface where the particles exist;
Curing the applied resin, and the roller individually removing the particles by removing the cured resin from the particle removal target surface;
A substrate processing method comprising:

Images