JPS61242389A - Method for removing foreign matter of electromagnetic storage device - Google Patents
Method for removing foreign matter of electromagnetic storage deviceInfo
- Publication number
- JPS61242389A JPS61242389A JP60082371A JP8237185A JPS61242389A JP S61242389 A JPS61242389 A JP S61242389A JP 60082371 A JP60082371 A JP 60082371A JP 8237185 A JP8237185 A JP 8237185A JP S61242389 A JPS61242389 A JP S61242389A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- plane
- foreign matter
- electromagnetic storage
- storage device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は、記憶装置等に用いられる電磁記憶デバイスの
異物除去方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a method for removing foreign matter from an electromagnetic storage device used in a storage device or the like.
電磁記憶デバイスの樹脂コート化については、r厚膜I
C化技術」 (日本マ身クロエレクト、ロニクス協会編
、 1983年12月1日発行)と題する文献のP、
278 Kバブルメモリデバイスの構造の中で述べられ
ている。しかしこの技術は、異物の付着あるいは除去の
問題については認識していない。For resin coating of electromagnetic storage devices, thick film I
P of the document titled "C conversion technology" (edited by Nippon Mashin Croelect, Ronix Association, published December 1, 1983),
278 K bubble memory device structure. However, this technique does not recognize the problem of foreign matter adhesion or removal.
本発明は電磁記憶デバイスの効果的な異物除去方法を提
供し、′wLm記憶デバイスの歩留り向上を図ることを
目的とする。An object of the present invention is to provide an effective method for removing foreign substances from electromagnetic storage devices, and to improve the yield of 'wLm storage devices.
本発明は、電磁記憶デバイスのプレーン下部に出方を配
置しプレーン上に剥離性樹脂を塗布し、電磁記憶素子あ
るいは基板上に付着している磁性異物あるいはその他の
異物を該樹脂内に吸収固定させ、しかるのち該樹脂をプ
レーンより剥離し、異物を除去するものである。In the present invention, a releasable resin is placed on the lower part of the plane of an electromagnetic memory device, and a removable resin is applied on the plane, and magnetic foreign matter or other foreign matter adhering to the electromagnetic memory element or the substrate is absorbed and fixed in the resin. The resin is then peeled off from the plane to remove foreign matter.
矛1図は、電磁記憶デバイスに用いられるプレーンの斜
視図で、鉄化合物系磁性体より成る電磁記憶素子1をア
ルミナ等より成るセラミック基板21C搭載される。、
1−2図は、才1図のプレーンにアルミナ等より成るセ
ラミックキャップ3で気密封止された気密封正体の断面
図を示す。Figure 1 is a perspective view of a plane used in an electromagnetic memory device, in which an electromagnetic memory element 1 made of an iron compound magnetic material is mounted on a ceramic substrate 21C made of alumina or the like. ,
1-2 shows a cross-sectional view of a hermetically sealed body in which the plane shown in FIG. 1 is hermetically sealed with a ceramic cap 3 made of alumina or the like.
しかるに、1’1図の電磁気温素子1上、セラミック基
板2上および矛2図のセラミックキャップ3上には、肉
眼では見えない種々のほこり。However, there are various types of dust that cannot be seen with the naked eye on the electromagnetic temperature element 1 shown in Figure 1'1, on the ceramic substrate 2, and on the ceramic cap 3 shown in Figure 2.
汚れ等の異物が存在し、特Km性異物があると、電磁記
憶デバイスの性能劣化を来たすため、異物除去方法が問
題となっていた。The presence of foreign matter such as dirt, and the presence of special Km foreign matter, causes performance deterioration of electromagnetic storage devices, so methods for removing foreign matter have been a problem.
矛3図は、本発明による異物除去方法を示す図で、才1
図で述べたプレーン上に例えばクリコン系剥離性樹脂を
塗布する。ここで重要なことは該プレーンの下側に磁石
4を配置することである。矛4図は、矛3図を詳細に説
明する図で、磁石4の磁界Hにより電磁記憶素子1上。Figure 3 is a diagram showing the foreign matter removal method according to the present invention.
For example, a crecon-based release resin is applied onto the plane shown in the figure. What is important here is to arrange the magnet 4 below the plane. Figure 4 is a diagram for explaining Figure 3 in detail, in which the magnetic field H of the magnet 4 is applied to the electromagnetic memory element 1.
セラミック基板2上の磁性異物5のほとんどは直立する
。か(してプレーン上に剥離性樹脂3を塗布すれば、磁
性異物は十分に樹脂内に埋没する。勿論その他の異物も
十分に樹脂内に吸収される。かくして剥離性樹脂3の塗
布されたプレーンは、自然放置あるいは加熱処理等によ
り該樹脂3は硬化される。Most of the magnetic foreign matter 5 on the ceramic substrate 2 stands upright. (If the releasable resin 3 is applied on the plane, the magnetic foreign matter will be sufficiently buried in the resin. Of course, other foreign matters will also be sufficiently absorbed into the resin. In the plain case, the resin 3 is cured by being left to stand naturally or by heat treatment.
才5図は、プレーン上の硬化した剥離性樹脂3を剥離し
ている図で、プレーン上のすべての異物は該樹脂6と共
に除去される。矛6図は、剥離性樹脂3の補強を目的と
して合成繊維等の布片を該樹脂3の塗布時に用いた例を
示す。Figure 5 shows the hardened removable resin 3 on the plane being peeled off, and all foreign matter on the plane is removed together with the resin 6. Figure 6 shows an example in which a piece of cloth made of synthetic fiber or the like is used for the purpose of reinforcing the removable resin 3 when the resin 3 is applied.
本発明は、プレーン上に付着した異物をほとんど完全に
除去することができかつ異物除去作業も極めて容易に行
なうことができる。よって1)電磁記憶デバイスの著し
い歩留り向上2)異物除去工数の大巾な低減
が可能となりその効果は極めて大きい。According to the present invention, it is possible to almost completely remove foreign matter adhering to a plane, and the work of removing foreign matter can be performed extremely easily. Therefore, 1) it is possible to significantly improve the yield of electromagnetic storage devices, and 2) it is possible to greatly reduce the number of steps required for removing foreign matter, and the effects are extremely large.
矛1図は電磁記憶素子を実装したプレーンの斜視図、矛
2図は才1図のプレーンを封止した電磁記憶デバイス用
気密封上体の断面図、才3図は本発明による異物除去方
法を示す図1.?4図は才3図の詳細説明図、オ5図2
オ6図は本発明による剥離性樹脂を剥離除去を説明する
図である。
1・・・電磁記憶素子、
2・・・セラミック基板、
3・・・セラミックキャップ、
4・・・磁石、
5・・・母性異物、
6・・・合成繊維の布片。Figure 1 is a perspective view of a plane on which an electromagnetic memory element is mounted, Figure 2 is a sectional view of an airtight upper body for an electromagnetic storage device that seals the plane of Figure 1, and Figure 3 is a method for removing foreign matter according to the present invention. Figure 1. ? Figure 4 is a detailed explanatory diagram of Figure 3, Figure 5 is Figure 2.
FIG. 6 is a diagram illustrating peeling and removal of the releasable resin according to the present invention. DESCRIPTION OF SYMBOLS 1... Electromagnetic memory element, 2... Ceramic substrate, 3... Ceramic cap, 4... Magnet, 5... Maternal foreign object, 6... Synthetic fiber cloth piece.
Claims (1)
ーンの下部に磁石を配置し、プレーン上を剥離性樹脂で
塗布し、電磁記憶素子上あるいは基板上に付着した磁性
異物又はその他の異物を剥離性樹脂内に吸収固定させ、
しかるのち該樹脂をプレーンより剥離し、プレーン上の
異物を除去するようになしたことを特徴とする電磁記憶
デバイスの異物除去方法。A magnet is placed at the bottom of a plane made by mounting an electromagnetic memory element on a substrate such as a ceramic, and the plane is coated with removable resin to peel off magnetic foreign matter or other foreign matter that has adhered to the electromagnetic memory element or the substrate. Absorbed and fixed in a synthetic resin,
A method for removing foreign matter from an electromagnetic storage device, characterized in that the resin is then peeled off from the plane and foreign matter on the plane is removed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60082371A JPS61242389A (en) | 1985-04-19 | 1985-04-19 | Method for removing foreign matter of electromagnetic storage device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60082371A JPS61242389A (en) | 1985-04-19 | 1985-04-19 | Method for removing foreign matter of electromagnetic storage device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61242389A true JPS61242389A (en) | 1986-10-28 |
Family
ID=13772728
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60082371A Pending JPS61242389A (en) | 1985-04-19 | 1985-04-19 | Method for removing foreign matter of electromagnetic storage device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61242389A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0395951A (en) * | 1989-09-08 | 1991-04-22 | Toshiba Corp | Substrate for cleaning semiconductor manufacturing device |
JP2016072517A (en) * | 2014-09-30 | 2016-05-09 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and substrate processing method |
-
1985
- 1985-04-19 JP JP60082371A patent/JPS61242389A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0395951A (en) * | 1989-09-08 | 1991-04-22 | Toshiba Corp | Substrate for cleaning semiconductor manufacturing device |
JP2016072517A (en) * | 2014-09-30 | 2016-05-09 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and substrate processing method |
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