CN106922104A - Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system - Google Patents
Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system Download PDFInfo
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- CN106922104A CN106922104A CN201510992528.6A CN201510992528A CN106922104A CN 106922104 A CN106922104 A CN 106922104A CN 201510992528 A CN201510992528 A CN 201510992528A CN 106922104 A CN106922104 A CN 106922104A
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- Prior art keywords
- heat conduction
- release
- conduction phase
- layer
- phase transformation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of heat conduction phase transformation pad of easy to clean, including lower protective layer, heat conduction phase-change material layer and the release layer for arranging from the bottom to top；Release layer is evenly affixed to the heat conduction phase-change material layer upper surface by mould release and is formed.The present invention is made that improvement to the structure of traditional heat conduction phase transformation pad, heat conduction phase-change material layer the increased release layer in upper surface and component between will not occur it is be bonded, so assembling do over again or detachable maintaining during very easily component can be separated；And due to the release layer very thin thickness, the influence to heat-transfer effect is minimum.Obtained after being tested the sample as obtained in technical solution of the present invention according to thermal conductance electrically insulating material heat transfer characteristic standard test method ASTM-D5470, material conducts heat rate waste is no more than 5%.The invention also discloses a kind of preparation method and system of heat conduction phase transformation pad.
Description
Technical field
The present invention relates to thermal interfacial material technical field, more particularly to a kind of easy to clean heat conduction phase transformation pad
And preparation method thereof and system.
Background technology
With the fast development of the field such as contemporary IT, communication electronic information technology, the integrated journey of electronic product
Degree and packing density improve constantly, while there is provided powerful use function, also result in its power consumption and
Caloric value is increased dramatically.Component can be made to heat up if product heating can not be distributed in time, high temperature will be right
The stability of component, reliability and life-span produce infringement, thereby it is ensured that heat dissipation problem oneself through turning into micro-
One significant concern aspect of electronic product system assembling is all higher for degree of integration and packing density
Portable type electronic product (such as notebook computer, panel computer, mobile phone), radiating even becomes whole
The technical bottleneck problem of individual product.
When being directly connected between heater members and radiating element, contact area is bigger, and its thermal conduction effect is better.
But, due to the limitation of device surface roughness, device surface is not completely attached to, because on microcosmic,
Device surface is rough, thus has many spaces and hole between its contact surface.Space and sky
It is the larger air of thermal resistance between hole, result in that interface resistance between contact surface is big, heat transfer efficiency is low.Ability
The solution in domain is that thermal interfacial material is introduced between heater element and heat dissipation element, is connect for filling
Space and hole between contacting surface, improve thermal conductivity.It is main using more thermal interfacial material in the market
Have, thermally conductive gel, heat-conducting pad, thermal grease conduction and heat conduction phase-change material etc.,
Wherein, heat conduction phase-change material has the characteristic for being capable of phase transformation, i.e.,：Material is solid at room temperature,
Installation operation treatment is convenient；And when when device works, temperature reaches material phase transformation softening point, material will become
Soft is smectic, and can fit two mating surfaces easily, reach good surface effect of impregnation.This is finished
The ability in space between full packing interfacial air gap and device and fin so that phase-change material interface resistance is far excellent
In thermally conductive gel or silicon systems heat-conducting pad, and acquisition is similar to the performance of the low interface thermal resistance of heat-conducting silicone grease,
Its application reliability, service life are but much better than heat-conducting silicone grease simultaneously, and performance is very excellent.
Phase-change material has very strong advantage in actual application, but but there is a problem of certain.
Meeting complete wetting enters device surface, meeting after having certain tack, and softening in itself due to phase-change material
Heater element is caused firmly to be bonded as one with heat dissipation element, then can be very if necessary to dismounting element
Difficulty, this just does over again to product and subsequent maintenance brings great trouble, to relevant manufacturers bring compared with
Many puzzlements.
Done over again for the assembling of phase-change heat conductive material later stage and the difficult problem of product repairing, it is main in current industry
To seek solution in application end, such as improvement assembling is done over again and repair dismounting process, i.e., pre- thermal softening is led
Hot material is reducing the cohesive force between device, then is dismantled；The method trivial operations and need extra
Heating component, time and cost of labor are all higher.Or using phase-change heat conductive material one side cladded aluminum foil or
The scheme of graphite avoids adhesion, but program complex manufacturing, and aluminium foil or graphite flake surface are inadequate
Smooth, it is also larger with the thermal contact resistance of device；And requirement of the program to assembling pressure is also higher, dress
With insufficient pressure laminating can be caused incomplete, substantially reduce heat transfer efficiency.
Thus, for above-mentioned technological deficiency, acquisition is a kind of easily to assemble the quick detachable phase-change material be easy to and repair
Product is those skilled in the art's problem demanding prompt solution.
The content of the invention
The invention provides a kind of heat conduction phase transformation pad of easy to clean, phase-change material heat conduction can not influenceed
Reduced and the separating difficulty between the thermally-conductive interface for being contacted on the premise of performance.
The invention provides a kind of heat conduction phase transformation pad of easy to clean, it is characterised in that including from the bottom to top
The lower protective layer of arrangement, heat conduction phase-change material layer and release layer；The release layer is uniformly adhered to by mould release
Formed in heat conduction phase-change material layer upper surface.
Preferably, also including release overcoat, the release overcoat is the sticking film layer of tool, described
Release overcoat is attached to the release layer upper surface.
Preferably, the mould release is fluorine modeling mould release, silicon systems mould release, fluoropolymer resin class releasing agent
In one kind.
The preparation method of the heat conduction phase transformation pad of a kind of easy to clean, it is characterised in that comprise the steps of：
S1：Obtain heat conduction phase transformation pad semi-finished product：The heat conduction phase transformation pad semi-finished product include it is above-mentioned under
Protective layer and heat conduction phase-change material layer, the lower protective layer are arranged on the heat conduction phase-change material layer,
The heat conduction phase-change material layer upper surface is in naked state；
S2：The release layer is formed in heat conduction phase-change material layer upper surface：The release layer is above-mentioned
Release layer in scheme described in any one；
S3：The release overcoat is covered in the release layer upper surface：The release overcoat is above-mentioned
Release overcoat in scheme described in any one.
Preferably, the step S2 is specially:
In the upper surface sprinkling of heat conduction phase-change material layer or coating release agent solution, mould release is formed molten
Liquid layer；
Solvent in the mold release agent solution layer is removed by drying process, the release layer is obtained.
Preferably, the temperature of the drying process is 40 DEG C~300 DEG C, a length of 5s~2h when drying.
Preferably, the temperature of the drying process be 80 DEG C~200 DEG C, a length of 1min~20min when drying.
It is prepared by a kind of preparation system of the heat conduction phase transformation pad of easy to clean, including heat conduction phase transformation pad semi-finished product
Device, mould release spraying or coating unit, mould release drying device and release overcoat laying apparatus；Institute
State heat conduction phase transformation pad semi-finished product preparation facilities and be arranged at the system beginning, for producing described in such scheme
Heat conduction phase transformation pad semi-finished product；The mould release spraying or coating unit are arranged at the heat conduction phase transformation pad
After piece semi-finished product preparation facilities, for being sprayed to the layer of heat conduction phase-change material described in such scheme upper surface
Or coating release agent solution, the mould release drying device is arranged at mould release spraying or coating unit
Afterwards, for removing the solvent in the mold release agent solution layer of heat conduction phase-change material layer upper surface, it is described from
Type overcoat laying apparatus are arranged at after the mould release drying device, in the release layer upper table
Lay the release overcoat in face.
Preferably, it is characterised in that the heat conduction phase transformation pad semi-finished product preparation facilities is filled for calendering formation
Put and up-protective layer removal device.
Preferably, the mould release drying device is preheating drying tunnel, the release overcoat laying apparatus bag
Release overcoat discharging device and coiled material coiling machine are included, the up-protective layer removal device is wrap-up.
From such scheme, the present invention is made that improvement to the structure of traditional heat conduction phase transformation pad, by
Under supreme arrangement lower protective layer, heat conduction phase-change material layer, release layer and release overcoat；Release layer is
Mould release spray-up or coat, will not occur between the release layer and component it is be bonded, so being returned in assembling
Very easily component can be separated during work or detachable maintaining；And due to the release thickness
Degree is very thin, and the influence to heat-transfer effect is minimum.Tried according to thermal conductance electrically insulating material heat transfer characteristic standard
Proved recipe method ASTM-D5470 is obtained after testing the sample as obtained in technical solution of the present invention, material
Thermal conductivity waste is no more than 5%.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to reality
The accompanying drawing to be used needed for example or description of the prior art is applied to be briefly described, it should be apparent that, below
Accompanying drawing in description is only some embodiments of the present invention, for those of ordinary skill in the art,
On the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of the heat conduction phase transformation pad of easy to clean disclosed in the embodiment of the present invention；
Fig. 2 illustrates for a kind of preparation system of the heat conduction phase transformation pad of easy to clean disclosed in the embodiment of the present invention
Figure.
Fig. 3 is the composition schematic diagram of heat conduction phase transformation pad in the prior art.
In Fig. 1 and Fig. 2,
The release overcoats of a-, b- release layers, c- heat conduction phase-change materials layer, d- lower protective layers；1- calendering formations
Device, 2- heating drying tunnels, 3- coiled material coiling machines, 4- lower protective layers, 5- heat conduction phase transformation pad semi-finished product, 6-
Up-protective layer removal device, the spraying of 7- mould releases or coating unit, the release overcoat discharging devices of 8-；
In Fig. 3,
1a- up-protective layers, 2a- heat conduction phase-change materials layer, 3a- lower protective layers.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the invention, and
It is not all, of embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing
Go out the every other embodiment obtained under the premise of creative work, belong to the scope of protection of the invention.
Fig. 1 is a kind of structural representation of the heat conduction phase transformation pad of easy to clean disclosed in the embodiment of the present invention,
Fig. 3 is the composition schematic diagram of heat conduction phase transformation pad in the prior art.
The heat conduction phase transformation pad that the present invention is provided includes the lower protective layer d, the heat conduction phase transformation material that arrange from the bottom to top
Bed of material c, release layer b and release overcoat a；The heat conduction phase transformation pad for providing in the prior art be configured to by
Under supreme arrangement lower protective layer 3a, heat conduction phase-change material layer 2a and up-protective layer 1a.
This area is used for the technical measures mostly mould release membrance for preventing adhesion, and mould release membrance is that film matrix surface is entered
Row mould release coating processing, it is adaptable to simple surface.Because its thickness is larger, if being directly applied to
In the technical problem to be solved in the present invention, then two problems are had, one is the meeting shadow because its thickness is too big
Ring the heat-conducting effect of heat-conducting pad；But overlay film operation can increase the complexity of technique.Invention of the invention
Surface of the people then creatively directly to heat conduction phase-change material layer c carries out mould release coating, is allowed in heat conduction
The surface of phase-change material layers c forms very thin release layer b, has both played the original anti-sticking effect of mould release,
The heat conduction phase-change material layer original heat-conducting effects of c are in turn ensure that, new technique effect is achieved.
Compared with heat conduction phase transformation pad compare, in structure, something in common is to be respectively provided with lower protective layer
With heat conduction phase-change material layer.Difference is, existing heat conduction phase transformation pad, on heat conduction phase-change material layer
Lower surface is identical protective layer, and heat conduction phase-change material layer upper and lower surface is equal after removing two protective layers
It is exposed, can be directly be bonded with component；And the heat conduction phase transformation pad that the present invention is provided, heat conduction phase-change material
The upper surface of layer c is provided with the very thin release layer b and release overcoat a being attached on release layer b.
In order to protect release layer b, a release overcoat a is set thereon, release overcoat a has one in itself
Fixed viscosity, for being attached to inviscid release layer b.
The core layer of heat conduction phase transformation pad is heat conduction phase-change material layer c, and the layer material has good wellability
And thermal conductivity, it may have viscosity.The upper and lower surface of the material layer and component surface or the table of common material
Can be sticked together after the contact of face, therefore, it is unnecessary in order to avoid occurring in processing, transport and storage
Adhesion, the upper and lower surface of heat conduction phase-change material layer c needs to set protective layer, lower as shown in Figure 1 to protect
Lower protective layer 3a and up-protective layer 1a shown in sheath d and Fig. 3.The protective layer and heat conduction phase-change material
There is slight adhesion strength between layer, it is usually difficult for drop-off, normally make by being taken off when installation operation is carried out
With.
Wherein, it is covering as shown in figure 1, release layer b is formed after being dried by mould release spray-up or coating
A very thin film layer on heat conduction phase-change material layer c, release layer b has the characteristic of conventional mould release membrance,
I.e.：Mould release membrance does not have viscosity, or slight viscosity after being contacted under limited conditions with specific material.
Thus there is the heat conduction phase transformation pad of release layer b, the surface with heating or heat dissipation element can be easy to
Separate, and residual will not be produced by element surface again.Solve heat conduction phase-change material in the prior art and first device
The bonding on part surface is difficult to the problem that separation and remained on surface are difficult to clear up.
Release layer b is the one layer of uniform film layer formed after the mold release agent solution for spraying or coating is dried, together
Conventional mould release membrance is compared, and the thicknesses of layers is smaller, thus its effect of impregnation shadow to pad and hot interface
Sound is also very small, and the influence to its heat-conducting effect is also very small certainly.To the technology provided according to the present invention
Heat conduction phase transformation pad sample carries out Determination of conductive coefficients obtained in scheme, its thermal conductivity factor loss 5% with
Under.According to Determination of conductive coefficients standard ASTM-D5470, three samples are carried out with release layer coating front and rear
Thermal conductivity test result：
Wherein, when preparing mold release agent solution, mould release solvent optional fluorine modeling mould release, silicon systems mould release,
Fluoropolymer resin class releasing agent.
It is above-mentioned for producing present invention also offers a kind of heat conduction phase transformation pad preparation method of easy to clean
The heat conduction phase transformation pad cleared up, the preparation method is comprised the steps of：
S1：Obtain heat conduction phase transformation pad semi-finished product.Above-mentioned heat conduction phase transformation pad semi-finished product include lower protection
Layer d and heat conduction phase-change material layer c, lower protective layer d be arranged at heat conduction phase-change material layer c on.Gained
Heat conduction phase transformation pad semi-finished product, the upper surface of heat conduction phase-change material layer c therein is exposed, in order to follow-up
Processing step can be processed directly its upper surface.
The semi-finished product can by heat conduction phase-change material layer c and lower protective layer d laminating be obtained, also can to similar to
Existing heat-conducting pad shown in Fig. 3 carries out treatment acquisition, that is, the protective layer of its upper surface is taken off
Obtained by going.
Wherein, above-mentioned latter obtains heat conduction phase transformation pad process of semi-finished and only needs to make existing technique
It is suitably modified and is capable of achieving, it is not necessary to redesigns whole new technique, easily realize, strong adaptability.
S2：Release layer a is formed in heat conduction phase-change material layer c upper surfaces.
Step S2 is specifically, molten in the upper surface sprinkling of heat conduction phase-change material layer c or coating release agent first
Liquid, removes solvent composition by drying process afterwards, and mould release can be in heat conduction phase after mold release agent solution volatilization
Change material layer c upper surfaces form very thin release layer b.
The temperature of above-mentioned drying process is 40 DEG C~300 DEG C, a length of 5s~2h when drying.Preferably, dry
The temperature of technique may be configured as 80 DEG C~200 DEG C, dries duration and is set to 1min~20min.
S3：Release overcoat is covered in the release layer upper surface.
The release layer b formed in step S2 is inviscid in itself, will not be sticked together with other materials, its life
Adhesion is not susceptible in producing, transport and storing.But, because release layer b thickness is minimum, it is easier to receive
Physical damnification or pollution are impaired, it is therefore desirable to set a protection film layer above it, be in the present invention
Release overcoat a.
Because release layer b is that mould release dries acquisition, itself do not possess viscosity, therefore in order to release anti-
Sheath a can stablize attachment, and release overcoat a should have the release of certain sticky or heavy off-type force
Film.
Cover the heat-conducting pad structure after release overcoat a completely, can wind be easily storage web-like.
Release overcoat overlapping operation and wind-up operation can be carried out together, and as shown in Figure 2, Fig. 2 is the present invention
A kind of preparation system schematic diagram of the heat conduction phase transformation pad of easy to clean disclosed in embodiment.Release overcoat a
Web-like can be in advance set to, in the top of heat-conducting pad sheet material 5, be together wound by coiled material coiling machine 3, both
Finished product can be wound, it is also possible to apply certain pressure between release overcoat a and release layer b, protected
Demonstrate,proving release overcoat a stably can be attached on release layer b.
In order to realize technique made above, present invention also offers a kind of heat conduction phase transformation pad of easy to clean
Preparation system, as shown in Fig. 2 heat conduction phase transformations of the Fig. 2 for a kind of easy to clean disclosed in the embodiment of the present invention
The preparation system schematic diagram of pad.
Above-mentioned preparation system includes also including calendering formation device 1 that up-protective layer removal device 6 is release
Agent spraying or coating unit 7, mould release drying device and release overcoat laying apparatus, mould release dry dress
Putting can be using equipment commonly used in the art, such as heating drying tunnel 2, and release overcoat laying apparatus include release anti-
Sheath discharging device 8 and coiled material coiling machine 3.
Calendering formation device 1 is used for the heat conduction phase transformation pad described in common acquisition with up-protective layer removal device 6
Piece semi-finished product 5, mould release spraying or coating unit 7 be used for heat conduction phase-change material layers c upper surfaces sprinkling or
Coating release agent solution, mould release drying device is used to remove heat conduction phase-change material layer c upper surfaces mould release
Solvent in solution layer, release overcoat discharging device 8 and coiled material coiling machine 3 are used in release layer b
Lay release overcoat a and be web-like by finished product storage in surface.
Wherein, above-mentioned calendering formation device 1, up-protective layer removal device 6, heating drying tunnel 2, coiled material
Winder 3, the spraying of up-protective layer removal device 6, mould release or coating unit 7 and release overcoat blowing
Device 8 is equipment commonly used in the art, and technical scheme is not directed to a certain device and carries out
Improve, thus no longer above-mentioned each device is repeated herein.
Preparation system is explained with reference to preparation method.
Obtain heat conduction phase transformation pad semi-finished product.
Method according to heat conduction phase-change material layer c and lower protective layer d laminatings is obtained heat conduction phase transformation pad half
Finished product 5, then only need calendering formation device, and heat conduction phase-change material and protective layer can be rolled into bar by the device
Shape sheet material；
According to second method, i.e., with the method for removing existing sheet material up-protective layer, then also need to guarantor
Sheath removal device 6.Up-protective layer removal device 6 is used to remove up-protective layer, makes heat conduction phase-change material
The upper surface of layer exposes to be come, in order to follow-up equipment can surface be sprayed or coating release agent is molten thereon
Liquid.
Specifically, up-protective layer removal device 6 is wrap-up, the rotating speed of wrap-up may be configured as with
The gait of march of heat conduction phase transformation pad semi-finished product 5 quite, continues that up-protective layer is uncovered and is wound to its winding
On axle.
Release layer is formed in heat conduction phase-change material layer upper surface.
The step for can jointly be completed by mould release spraying or coating unit 7 and heating drying tunnel 2, mould release
Spraying or coating unit 7 are used for molten to the sprinkling of the upper surface of heat conduction phase transformation pad semi-finished product 5 or coating release agent
Liquid, heating drying tunnel 2 is used to remove the solvent in mold release agent solution, afterwards can be in heat conduction phase-change material layer c
Upper surface forms release layer b.
Release overcoat is covered in release layer upper surface.
The step can be realized that release overcoat laying apparatus include release anti-by release overcoat laying apparatus
Sheath discharging device 8 and coiled material coiling machine 3.Coiled material coiling machine 3 is when rotating by heat conduction phase transformation shims sheet
It is rolled into easily stored and transport web-like；Release protection is pre-set on release overcoat discharging device 8
Layer a material volumes, during the layer material can be involved in heat conduction phase transformation shims sheet, are covering and are being attached to
On release layer b.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or use
The present invention.Various modifications to these embodiments will be for those skilled in the art aobvious and easy
See, generic principles defined herein can without departing from the spirit or scope of the present invention,
Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein,
And it is to fit to the most wide scope consistent with principles disclosed herein and features of novelty.
Claims (10)
1. the heat conduction phase transformation pad of a kind of easy to clean, it is characterised in that including the lower guarantor for arranging from the bottom to top
Sheath, heat conduction phase-change material layer and release layer；The release layer is evenly affixed to the heat conduction by mould release
Phase-change material layers upper surface and formed.
2. the heat conduction phase transformation pad of easy to clean according to claim 1, it is characterised in that also include
Release overcoat, the release overcoat is the sticking film layer of tool, and the release overcoat is attached to institute
State release layer upper surface.
3. the heat conduction phase transformation pad of easy to clean according to claim 1 and 2, it is characterised in that institute
It is the one kind in fluorine modeling mould release, silicon systems mould release, fluoropolymer resin class releasing agent to state mould release.
4. the preparation method of the heat conduction phase transformation pad of a kind of easy to clean, it is characterised in that by following steps group
Into：
S1：Obtain heat conduction phase transformation pad semi-finished product：The heat conduction phase transformation pad semi-finished product include claim 1
Lower protective layer and heat conduction phase-change material layer into 3 described in any one, the lower protective layer is arranged at institute
State on heat conduction phase-change material layer, the heat conduction phase-change material layer upper surface is in naked state；
S2：The release layer is formed in heat conduction phase-change material layer upper surface：The release layer is right
It is required that the release layer in 1 to 3 described in any one；
S3：The release overcoat is covered in the release layer upper surface：The release overcoat is right
It is required that the release overcoat in 1 to 3 described in any one.
5. the heat conduction phase transformation pad preparation method of easy to clean according to claim 4, it is characterised in that
The step S2 is specially:
In the upper surface sprinkling of heat conduction phase-change material layer or coating release agent solution, mould release is formed molten
Liquid layer；
Solvent in the mold release agent solution layer is removed by drying process, the release layer is obtained.
6. the heat conduction phase transformation pad preparation method of easy to clean according to claim 5, it is characterised in that
The temperature of the drying process is 40 DEG C~300 DEG C, a length of 5s~2h when drying.
7. the heat conduction phase transformation pad preparation method of easy to clean according to claim 6, it is characterised in that
The temperature of the drying process is 80 DEG C~200 DEG C, a length of 1min~20min when drying.
8. the preparation system of the heat conduction phase transformation pad of a kind of easy to clean, it is characterised in that including heat conduction phase transformation
Pad semi-finished product preparation facilities, mould release spraying or coating unit, mould release drying device and release protection
Layer laying apparatus；The heat conduction phase transformation pad semi-finished product preparation facilities is arranged at the system beginning, for producing
Heat conduction phase transformation pad semi-finished product described in claim 4；The mould release spraying or coating unit are set
After the heat conduction phase transformation pad semi-finished product preparation facilities, for heat conduction phase described in claim 4
Change material layer upper surface is sprayed or coating release agent solution, the mould release drying device be arranged at it is described from
After type agent spraying or coating unit, for removing the heat conduction phase-change material layer upper surface mold release agent solution
Solvent in layer, the release overcoat laying apparatus are arranged at after the mould release drying device, are used
In in the release layer upper surface laying release overcoat.
9. the preparation system of the heat conduction phase transformation pad of a kind of easy to clean according to claim 8, it is special
Levy and be, the heat conduction phase transformation pad semi-finished product preparation facilities is that calendering formation device and up-protective layer are removed
Device.
10. the preparation system of the heat conduction phase transformation pad of a kind of easy to clean according to claim 8 or claim 9,
Characterized in that, the mould release drying device is preheating drying tunnel, the release overcoat laying apparatus bag
Release overcoat discharging device and coiled material coiling machine are included, the up-protective layer removal device is wrap-up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510992528.6A CN106922104A (en) | 2015-12-24 | 2015-12-24 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510992528.6A CN106922104A (en) | 2015-12-24 | 2015-12-24 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
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|---|---|
| CN106922104A true CN106922104A (en) | 2017-07-04 |
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| CN201510992528.6A Pending CN106922104A (en) | 2015-12-24 | 2015-12-24 | Heat conduction phase transformation pad of a kind of easy to clean and preparation method thereof and system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611800A (en) * | 2015-12-24 | 2016-05-25 | 平湖阿莱德实业有限公司 | Easy-to-clean heat-conducting phase-changing gasket, and preparation method and preparation system therefor |
| CN112635454A (en) * | 2020-12-25 | 2021-04-09 | 厦门久宏鑫光电有限公司 | Optical coupler and production process thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030039825A1 (en) * | 1999-07-08 | 2003-02-27 | Duvall James H. | Method of forming a phase change thermal interface |
| US20030194537A1 (en) * | 2002-04-12 | 2003-10-16 | Bhagwagar Dorab Edul | Thermally conductive phase change materials and methods for their preparation and use |
| US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
| US6835453B2 (en) * | 2001-01-22 | 2004-12-28 | Parker-Hannifin Corporation | Clean release, phase change thermal interface |
| KR100827725B1 (en) * | 2007-05-02 | 2008-05-08 | 티티엠주식회사 | Pcm attachment method and automatic machine thereof |
| CN101848808A (en) * | 2007-11-05 | 2010-09-29 | 天津莱尔德电子材料有限公司 | Thermal interfacial material with thin transfer film or metal layer |
| US20130265721A1 (en) * | 2007-11-05 | 2013-10-10 | Laird Technologies, Inc. | Thermal Interface Materials with Thin Film or Metallization |
| CN204362492U (en) * | 2015-01-27 | 2015-05-27 | 衡山县佳诚新材料有限公司 | A kind of Novel heat-conducting insulation two-sided tape |
| US20150334871A1 (en) * | 2014-05-19 | 2015-11-19 | Laird Technologies, Inc. | Thermal interface materials with thin film sealants |
-
2015
- 2015-12-24 CN CN201510992528.6A patent/CN106922104A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030039825A1 (en) * | 1999-07-08 | 2003-02-27 | Duvall James H. | Method of forming a phase change thermal interface |
| US6644395B1 (en) * | 1999-11-17 | 2003-11-11 | Parker-Hannifin Corporation | Thermal interface material having a zone-coated release linear |
| US6835453B2 (en) * | 2001-01-22 | 2004-12-28 | Parker-Hannifin Corporation | Clean release, phase change thermal interface |
| US20030194537A1 (en) * | 2002-04-12 | 2003-10-16 | Bhagwagar Dorab Edul | Thermally conductive phase change materials and methods for their preparation and use |
| KR100827725B1 (en) * | 2007-05-02 | 2008-05-08 | 티티엠주식회사 | Pcm attachment method and automatic machine thereof |
| CN101848808A (en) * | 2007-11-05 | 2010-09-29 | 天津莱尔德电子材料有限公司 | Thermal interfacial material with thin transfer film or metal layer |
| US20130265721A1 (en) * | 2007-11-05 | 2013-10-10 | Laird Technologies, Inc. | Thermal Interface Materials with Thin Film or Metallization |
| US20150334871A1 (en) * | 2014-05-19 | 2015-11-19 | Laird Technologies, Inc. | Thermal interface materials with thin film sealants |
| CN204362492U (en) * | 2015-01-27 | 2015-05-27 | 衡山县佳诚新材料有限公司 | A kind of Novel heat-conducting insulation two-sided tape |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105611800A (en) * | 2015-12-24 | 2016-05-25 | 平湖阿莱德实业有限公司 | Easy-to-clean heat-conducting phase-changing gasket, and preparation method and preparation system therefor |
| CN112635454A (en) * | 2020-12-25 | 2021-04-09 | 厦门久宏鑫光电有限公司 | Optical coupler and production process thereof |
| CN112635454B (en) * | 2020-12-25 | 2024-04-02 | 厦门久宏鑫光电有限公司 | Optical coupler and production process thereof |
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