CN102173316A - Film sticking method and equipment - Google Patents
Film sticking method and equipment Download PDFInfo
- Publication number
- CN102173316A CN102173316A CN 201010604002 CN201010604002A CN102173316A CN 102173316 A CN102173316 A CN 102173316A CN 201010604002 CN201010604002 CN 201010604002 CN 201010604002 A CN201010604002 A CN 201010604002A CN 102173316 A CN102173316 A CN 102173316A
- Authority
- CN
- China
- Prior art keywords
- glued membrane
- roller
- film
- supporting plate
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a film sticking method which is characterized in that an adhesive film roll is driven by an idler wheel for rolling an adhesive film to rotate. By using the film sticking method disclosed by the invention, the adhesive film only needs to overcome the viscous force among the layers of the adhesive film without the need of overcoming the rotating resistance of a roller in the film sticking process, and the viscous force is extremely small, thus compared with the tradition method, through the film sticking method and the film sticking equipment disclosed by the invention, the tensile force to the adhesive film is greatly reduced, the deformation of the adhesive film in the length direction is extremely small, and the tensile force after sticking is also extremely small.
Description
Technical field
The present invention relates to a kind of method for adhering film and film sticking equipment.Relate in particular to a kind of method for adhering film and film sticking equipment that uses in the semiconductor production field.
Background technology
After finishing, wafer production needs to carry out packaging and testing.Wafer production is often carried out in different factories with packaging and testing, therefore, need transport transfer between different places.To the consideration of security wafer, the wafer thickness that wafer factory makes is usually more than 700um, to break in the transfer process that prevents to turn round when mobile.And along with the increase of wafer size, its thickness is increasing gradually.
In the use occasion of wafer, the development tendency of chip is more and more thinner.Therefore, before carrying out packaging and testing, need carry out reduction processing to wafer.Usually with the wafer circuit face, the side of promptly finishing chip functions is called the front, and one side is the back side in addition.Wafer rear mainly is made up of silicon materials, plays the supporting wafer effect.The wafer attenuate is exactly that the silicon materials of wafer rear are removed, and at present, the thickness of wafer can drop to more than the 700um when dispatching from the factory below the 50um behind the attenuate.
The method of wafer attenuate is that wafer frontside court is placed down on the wafer bearing device, adopts diamond wheel polishing wafer rear, makes its attenuation.In order to protect wafer frontside, before attenuate, need paste one deck glued membrane in wafer frontside.The one side that this layer glued membrane contacts with wafer has certain viscosity, pastes the back and sticks together with wafer, and the glued membrane edge is concordant with crystal round fringes.Because this layer glued membrane aims at protection wafer attenuate and uses, and also can be called the attenuate film.
Along with the reduction of wafer thickness, the wafer self rigidity reduces thereupon gradually.Be reduced to 200um when following in wafer thickness, the wafer self rigidity has been not enough to bear the weight of self, if unsettled laying, wafer will occur crooked.The bending of wafer is disadvantageous for subsequent handling.Therefore, especially for thin wafer, the attenuate film that requirement pastes is as far as possible little to the influence that wafer applies, and the tension force of himself was as far as possible little after this just required glued membrane to be attached on the wafer.If the glued membrane overtension of pad pasting on wafer, it can make the wafer bending, when serious even the wafer that may fracture.
Be illustrated in figure 1 as a kind of film sticking apparatus, comprise pedestal 101, pedestal 101 middle parts are provided with the platform dish (not shown) that is used for supporting wafer, and wafer 102 is placed on the platform dish of pedestal 101.Glued membrane 103 is rolled into the hollow cylinder shape, is called for short the glued membrane volume.The glued membrane volume is sleeved on the rotating cylinder 1031.Cylinder 1031 is placed on a side of pedestal 101.At cylinder 1031 and the pedestal 101 middle clips 104 that are equipped with.Clip 104 principle of work are similar to the clip that daily life is used.Roller 105 is installed, but roller 105 moves with clip 104 level of synchronization directions above glued membrane 103.Roller 105 can move along guide rail with clip 104, and the shift motion of horizontal direction makes clip 104 make it cover pedestal 101 by clamping glued membrane 103.
When the beginning pad pasting, clip 104 closures are clamped the edge of glued membrane 103, move along guide rail, and glued membrane 103 pairs are covered on wafer 102, and 105 times general who has surrendered's glued membranes 103 of roller are pressed on wafer 102 and the platform dish 1011.Roller 105 moves back and forth before and after guide rail, pushes glued membrane 103, and glued membrane 103 is closely sticked on the wafer 102, finishes pad pasting one time.Clip 104 is opened, and removes the Clamping force to glued membrane 103.Clip 104 is retracted into the position before the pad pasting shown in Figure 1, and clip 104 closure is again clamped glued membrane 103, prepares pad pasting next time.Cutting 106 is moved along glued membrane 103 Widths, and glued membrane 103 is cut off.One time the pad pasting process finishes.
Based on above analysis as seen, the glued membrane that pastes of actual needs in length with Width as long as identical with diameter wafer.And above film sticking apparatus and method, because the constructional feature of clip 104, the length and the width that cover the glued membrane on the wafer 102 must be complementary with pedestal, rather than mate with diameter wafer.So just certainly will cause at glued membrane length direction and the Width glued membrane greater than diameter wafer and can't use, can only excise in the subsequent treatment program, wastage is very big, has increased productive costs.
Another shortcoming of prior art is, is difficult to overcome that glued membrane in the pad pasting process is subjected to tension and the problem that distortion brought that produces.Glued membrane was installed on the glued membrane spool with web-like before being pasted wafer.During pad pasting, glued membrane need be pulled out from the glued membrane volume.In the process that glued membrane is drawn out, need make the glued membrane volume rotate and constantly glued membrane to be pulled out to the pulling force of glued membrane.Viscous force and pulling glued membrane that this pulling force need overcome between adhesive film and the layer are rolled up the resistance that rotates.Therefore tend to make the glued membrane end wise tensile deformation to occur to the pulling force of glued membrane and produce stress, this stress can make the state before glued membrane recovers not to be stretched.Because glued membrane is a flexible material, when being elongated, length direction must also can cause on Width, occurring fold simultaneously.
Because glued membrane is elastomeric material, pasted on the wafer and after cutting off, the pulling force that glued membrane is subjected to disappears at glued membrane, the inevitable reversing sense according to distortion before of glued membrane recovers self original form.Because this moment, glued membrane was attached on wafer, and wafer can't radially directly stretch or dwindle, the stress that is produced that is stretched of glued membrane will cause wafer bending to occur.
Summary of the invention
The method for adhering film that provides a kind of glued membrane that reduces in the pad pasting process to be stretched distortion is provided in order to overcome deficiency of the prior art.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Method for adhering film is characterized in that, utilizes the roller of roll extrusion glued membrane to drive the rotation of glued membrane volume.
Preferably, utilize rotating roller to be pressed against on the glued membrane and move, the glued membrane that roll extrusion covers crystal column surface makes it closely be attached on the wafer; Roller is pressed against on the glued membrane when mobile, is subjected to the friction force effect and rotates; Roller is rolled up with moved further with glued membrane and is continued to contact, and roller drives the glued membrane volume and rotates; Glued membrane twists in to rotate simultaneously and moves above wafer, constantly emits glued membrane when the glued membrane volume rotates, and the glued membrane volume moves the glued membrane of emitting is covered on the wafer.
Another object of the present invention is in order to overcome deficiency of the prior art, the film sticking equipment that provides a kind of glued membrane that reduces in the pad pasting process to be stretched distortion.
For realizing above purpose, the present invention is achieved through the following technical solutions:
Film sticking equipment is characterized in that, comprises the supporting plate and first actuating device; Rotating roller is installed on the supporting plate and is used to place the pivot shaft that glued membrane is rolled up; The first actuating device driving arm plate moves.
Preferably, brake equipment is installed on the supporting plate, brake equipment is used to stop roller to rotate.
Preferably, described brake equipment is a cylinder, and cylinder is provided with take-off lever extended or withdrawal, and roller is positioned on the moving direction of take-off lever; Can contact with roller during the take-off lever elongation, stop roller to rotate.
Preferably, also comprise the folder film device, described folder film device is installed on the supporting plate movably, and the folder film device can match with roller and clamp glued membrane.
Preferably, described folder film device is an arc, and arc drives by second actuating device and moves, and roller is positioned on the mobile alignment of arc.
Preferably, described second actuating device is a cylinder, and arc is connected with the take-off lever of cylinder.
Preferably, film-receiving axis is installed also on the described supporting plate, described film-receiving axis is connected with roller by second wheel word, and roller rotates and can drive the film-receiving axis rotation.
Preferably, described supporting plate number is two, be arranged in parallel; Be provided with guide groove on two supporting plates, pivot shaft can move along guide groove.
Preferably, described actuating device is a motor; Motor is connected with supporting plate by first driving device.
Preferably, described first driving device is a screw mandrel, and supporting plate cooperates with threads of lead screw.
Preferably, also comprise bed plate, motor is installed on the bed plate lower surface, and supporting plate is provided with nut, and nut cooperates with wire rod thread.
Preferably, described bed plate upper surface is provided with guide rail, and supporting plate is provided with slide block and matches with guide rail.
Method for adhering film among the present invention and film sticking apparatus, thereby changed and traditional driven the glued membrane volume by folder film device pulling glued membrane and rotate to emit glued membrane and spur glued membrane and cover way on the wafer, change glued membrane into and twist in wafer top when moving, utilize roller to drive the glued membrane volume and rotate and constantly emit glued membrane.
Because glued membrane twists in wafer top and emits glued membrane when mobile, the glued membrane of emitting just in time can cover on the wafer, and therefore, glued membrane is not subjected to pulling force and stretches.In the pad pasting process, glued membrane need not to overcome the resistance that cylinder rotates, only need overcome the viscous force between adhesive film and the layer, and viscous force is very little, therefore the inventive method and equipment greatly reduce than traditional method the pulling force of glued membrane, the distortion of glued membrane end wise is very little, and the tension force after pasting is also very little.
Adopt the method and apparatus among the present invention, glued membrane is very short in the time of air exposure after emitting from the glued membrane volume, has avoided glued membrane to be stained with dust, has improved the pad pasting quality.
The present invention also has following beneficial effect:
1, solved that the folder film device can't be opened directly over pedestal and the problem that causes wasting makes that each pad pasting does not need film is pulled to above base position, on length, can save glued membrane.
With wafer attenuate pad pasting is that example explanation glued membrane is saved situation.At present when pasting the attenuate film, use many sizes of cover wafer fixed equipment can be used for fixing the wafer pad pasting of different size, as the wafer of 8 inches, 6 inches and 4 inches.The wafer fixed equipment adopt 8 inches platform dishes successively the mode of 6 inches platform dishes of suit and 4 inches platform dishes design, 8 inches platform dish is installed in the centre of pedestal.Like this, the platform dish of the size of pedestal than 4 inches is big a lot.If the film sticking apparatus described in the use background technology, cooperate many sizes wafer fixed equipment, when being 4 inches wafer pad pastings, the folder film device also needs to clamp just can be opened after glued membrane covers pedestal, and the glued membrane that actual needs uses only needs 4 inches parts of diameter, and glued membrane waste ratio surpasses 100%.Even and 8 inches wafer pad pastings, glued membrane waste ratio also will surpass 20%.Use method and apparatus of the present invention, need not to press from both sides the operation of film device stretching glued membrane, only need when the beginning pad pasting glued membrane to be located, the glued membrane crimping moves the limit and emits glued membrane, as long as glued membrane width and wafer size adapt, therefore, can save glued membrane.
2, when carrying out the substrate pad pasting, substrate need be sticked together with framework.Substrate and framework are generally rectangle.When the described device pad pasting of background technology, the glued membrane of use must surpass the scope of framework, and after finishing pad pasting, the glued membrane that needs to exceed frame part excises again, has both wasted glued membrane, has increased operation again, and efficient is low.After using the inventive method and device, be complementary just by the glued membrane length selecting the suitable glued membrane of width, can make to paste and width and framework, paste and need not carry out secondary cut to glued membrane after finishing.After finishing pad pasting, there is not unnecessary glued membrane.Therefore not only can save glued membrane, and save operation, improve pad pasting efficient.
Description of drawings
Fig. 1 is a kind of film sticking apparatus scheme drawing.
Fig. 2 is folder film device structural representation and the use principle analysis chart among Fig. 1.
Fig. 3 is the film sticking equipment structural representation among the present invention.
Fig. 4 is the film sticking equipment structural representation of the present invention from another angle signal.
Fig. 5 is a film sticking equipment part-structure scheme drawing of the present invention.
Fig. 6 looks up structural representation for film sticking equipment of the present invention.
Fig. 7 is a film sticking equipment use principle scheme drawing of the present invention.
Fig. 8 is the film sticking equipment first running condition scheme drawing of the present invention.
Fig. 9 is the film sticking equipment second running condition scheme drawing of the present invention.
The specific embodiment
Below in conjunction with accompanying drawing the present invention is described in detail:
As Fig. 3, Fig. 4, shown in Figure 5, film sticking equipment comprises bed plate 20.Bed plate 20 upper surfaces are provided with two parallel guide rails (201,202).
Supporting plate 31 is arranged on the bed plate 20 abreast with supporting plate 32.Supporting plate 31 bottoms are equipped with two slide blocks 311.Two slide blocks 311 are respectively arranged with the groove (not shown) and match with guide rail 201, make and can only move along guide rail 201 when supporting plate 31 moves.The mounting means of supporting plate 32 is identical with the mounting means of supporting plate 31.Supporting plate 31 all is connected with cover plate 33 with supporting plate 32 upper ends.Supporting plate 31, supporting plate 32 are formed a movably gantry with cover plate 33.
Supporting plate 31 is provided with guide groove 312; Supporting plate 32 is provided with guide groove 322.Guide groove 312 be arranged in parallel with guide groove 322.
First cylinder, 72, the first cylinders 72 are installed on the supporting plate 32 are provided with first take-off lever 721 extending or that shorten.During 721 elongations of first take-off lever, can hold out against roller 70, roller 70 can't be rotated.When first take-off lever 721 shortens, can remove the braking of pair roller 70, this moment, roller 70 was rotatable.
Second cylinder 61 is installed on the supporting plate 32, one second cylinder (not shown) also is installed on the supporting plate 31.The take-off lever of two second cylinders 61 connects respectively at arc 60 both ends.When the elongation of the take-off lever of two second cylinders 61, can promote arc 60 towards roller 70 move until with roller 70 closed contacts.The arc of arc 60 matches with the periphery of roller 70, when arc 60 and roller 70 closed contacts, glued membrane closely can be clamped.Be after a wafer has pasted film, cutting off glued membrane, gantry returns back to reference position.Return back in the reference position process at gantry,, be difficult to that then the glued membrane edge is positioned at and begin the reference position that attaches for next wafer, cause to finish pad pasting next time if there is not holding device to clamp the glued membrane edge.Among the present invention, after cutting off glued membrane, arc 60 moves towards roller 70, clamps the glued membrane edge until both, and gantry returns back to reference position more then.After arriving reference position, arc 60 can carry out pad pasting work next time away from roller 70.Also can make arc 60 and roller 70 clamp glued membrane and cut off glued membrane again.
As shown in Figure 6, bed plate 20 lower surfaces are equipped with motor 90.Motor 90 output shafts are connected with screw mandrel 91.Motor 90 can drive screw mandrel 91 and rotate.Supporting plate 32 lower ends are equipped with nut 321.Bed plate 20 is provided with groove 21.Nut 321 passes groove 21 and can move in groove 21.Nut 321 is sleeved on the screw mandrel 91, and with screw mandrel 91 screws thread fit.When motor 90 drove screw mandrel 91 rotations, nut 921 drove supporting plates 32 and moves.The type of drive of supporting plate 31 is identical with the type of drive of supporting plate 32.
Rotating film-receiving axis 80 also is installed on the supporting plate 32.Film-receiving axis 80 ends are equipped with belt pulley 81.Drive belt 73 is in transmission connection belt pulley 71 and belt pulley 81.When roller 70 rotates 71 rotations of drive belt pulley, can drive belt pulley 81 and rotate, and then drive film-receiving axis 80 rotates.Realized the synchronous rotation of roller 60 with film-receiving axis 80.Some glued membrane surface is provided with the strippable protective film of one deck.When pad pasting, protective film need not to be attached on the wafer, therefore, protective film need be collected when emitting glued membrane along with glued membrane volume 52.Roller 70 drives glued membrane volume 52 and rotates when emitting glued membrane, drives film-receiving axis 80 and rotates and protective film can be wrapped on the film-receiving axis 80.
Glued membrane volume 52, roller 70 and film-receiving axis 80 drive by gantry and move.
Fig. 7 is use principle figure of the present invention.As shown in Figure 7, cover earlier on the wafer 63 from glued membrane volume 52 glued membranes of emitting 62 parts.Roller 70 is pressed against on the glued membrane 62.When roller 70 moved right with glued membrane volume 52, roller 70 was subjected to the friction force effect of glued membrane 62 and clockwise rotates.Roller 70 contacts with glued membrane volume 52, can utilize frictional force drives glued membrane volume 52 to rotate counterclockwise.The glued membrane volume 52 that rotates counterclockwise is constantly emitted glued membrane.Like this, glued membrane volume 52 is when glued membrane is emitted in rotation, and the glued membrane of will emit that moves right covers on the wafer 63.Roller 70 is when moving right, and roll extrusion glued membrane 62 makes it closely be attached to wafer 63.Roller 70 can drive glued membrane volume 52 and rotate when rotating.Therefore, the film sticking equipment among the present invention, when constantly emitting glued membrane, the resistance that need overcome is little, and is also just little to the pulling force of glued membrane 62, can avoid the glued membrane distortion that is stretched effectively, pad pasting quality height.
Fig. 8 is the film sticking equipment first running condition figure among the present invention, and before not beginning pad pasting, gantry is positioned at the reference position in platform dish 401 left sides, on the wafer (not shown) mounting table dish 401.During pad pasting, gantry moves right, until the state that moves to as shown in Figure 9.Glued membrane closely is attached on the wafer.Utilize cutting equipment to cut off glued membrane then.
Embodiment among the present invention only is used for that the present invention will be described, does not constitute the restriction to the claim scope, and other substituting of being equal in fact that those skilled in that art can expect are all in protection domain of the present invention.
Claims (14)
1. method for adhering film is characterized in that, utilizes the roller of roll extrusion glued membrane to drive the rotation of glued membrane volume.
2. method for adhering film according to claim 1 is characterized in that, utilizes rotating roller to be pressed against on the glued membrane and moves, and the glued membrane that roll extrusion covers crystal column surface makes it closely be attached on the wafer; Roller is pressed against on the glued membrane when mobile, is subjected to the friction force effect and rotates; Roller is rolled up with moved further with glued membrane and is continued to contact, and roller drives the glued membrane volume and rotates; Glued membrane twists in to rotate simultaneously and moves above wafer, constantly emits glued membrane when the glued membrane volume rotates, and the glued membrane volume moves the glued membrane of emitting is covered on the wafer.
3. film sticking equipment is characterized in that, comprises the supporting plate and first actuating device; Rotating roller is installed on the supporting plate and is used to place the pivot shaft that glued membrane is rolled up; The first actuating device driving arm plate moves.
4. film sticking equipment according to claim 3 is characterized in that, brake equipment is installed on the supporting plate, and brake equipment is used to stop roller to rotate.
5. film sticking equipment according to claim 4 is characterized in that, described brake equipment is a cylinder, and cylinder is provided with take-off lever extended or withdrawal, and roller is positioned on the moving direction of take-off lever; Can contact with roller during the take-off lever elongation, stop roller to rotate.
6. film sticking equipment according to claim 3 is characterized in that, also comprises the folder film device, and described folder film device is installed on the supporting plate movably, and the folder film device can match with roller and clamp glued membrane.
7. film sticking equipment according to claim 6 is characterized in that, described folder film device is an arc, and arc drives by second actuating device and moves, and roller is positioned on the mobile alignment of arc.
8. film sticking equipment according to claim 7 is characterized in that, described second actuating device is a cylinder, and arc is connected with the take-off lever of cylinder.
9. film sticking equipment according to claim 3 is characterized in that, film-receiving axis also is installed on the described supporting plate, and described film-receiving axis is connected with roller by second wheel word, and roller rotates and can drive the film-receiving axis rotation.
10. film sticking equipment according to claim 3 is characterized in that, described supporting plate number is two, be arranged in parallel; Be provided with guide groove on two supporting plates, pivot shaft can move along guide groove.
11. film sticking equipment according to claim 3 is characterized in that, described actuating device is a motor; Motor is connected with supporting plate by first driving device.
12. film sticking equipment according to claim 11 is characterized in that, described first driving device is a screw mandrel, and supporting plate cooperates with threads of lead screw.
13. film sticking equipment according to claim 12 is characterized in that, comprises that also bed plate, motor are installed on the bed plate lower surface, supporting plate is provided with nut, and nut cooperates with wire rod thread.
14., it is characterized in that described bed plate upper surface is provided with guide rail according to claim 11,12 or 13 described film sticking equipments, supporting plate is provided with slide block and matches with guide rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010604002 CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010604002 CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102173316A true CN102173316A (en) | 2011-09-07 |
| CN102173316B CN102173316B (en) | 2013-06-19 |
Family
ID=44516635
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010604002 Expired - Fee Related CN102173316B (en) | 2010-12-21 | 2010-12-21 | Film sticking method and equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102173316B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104150011A (en) * | 2014-08-25 | 2014-11-19 | 昆山迈致治具科技有限公司 | Automatic sticking film machine |
| CN104340407A (en) * | 2013-08-06 | 2015-02-11 | 富鼎电子科技(嘉善)有限公司 | Automatic film laminating equipment |
| CN106698037A (en) * | 2017-02-28 | 2017-05-24 | 江苏冠达通电子科技有限公司 | Automatic film winding structure |
| CN106813591A (en) * | 2016-12-30 | 2017-06-09 | 华进半导体封装先导技术研发中心有限公司 | For the sample preparation methods of buckling deformation test |
| CN108527833A (en) * | 2018-04-28 | 2018-09-14 | 奥克斯空调股份有限公司 | Film-covering mechanism and laminating machine |
| CN110265349A (en) * | 2019-06-20 | 2019-09-20 | 深圳市华腾半导体设备有限公司 | The laminating machine of semiconductor chip pad pasting |
| CN110723348A (en) * | 2019-11-03 | 2020-01-24 | 邵倩倩 | Two-sided pad pasting device |
| CN110723347A (en) * | 2019-11-03 | 2020-01-24 | 邵倩倩 | Single-side film pasting device |
| CN113140491A (en) * | 2021-05-26 | 2021-07-20 | 吉林华微电子股份有限公司 | Film sticking machine and semiconductor device production system |
| CN115285420A (en) * | 2022-08-30 | 2022-11-04 | 华天科技（西安）有限公司 | Automatic film sticking machine |
| CN115339093A (en) * | 2022-06-30 | 2022-11-15 | 河南通用智能装备有限公司 | Full-automatic wafer laminating machine |
| CN118472780A (en) * | 2024-07-15 | 2024-08-09 | 长春中科长光时空光电技术有限公司 | Laser chip processing device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| US20080023133A1 (en) * | 2006-07-31 | 2008-01-31 | Nitto Denko Corporation | Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods |
| JP2009088357A (en) * | 2007-10-01 | 2009-04-23 | Toyota Motor Corp | Removing device and removing method for protective tape |
| CN101870371A (en) * | 2009-04-22 | 2010-10-27 | 昆达电脑科技(昆山)有限公司 | Jig for pasting protective film of electronic product |
| CN101891025A (en) * | 2009-05-21 | 2010-11-24 | 昆达电脑科技(昆山)有限公司 | Protective film packaging device |
-
2010
- 2010-12-21 CN CN 201010604002 patent/CN102173316B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1208946A (en) * | 1997-05-30 | 1999-02-24 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| US20080023133A1 (en) * | 2006-07-31 | 2008-01-31 | Nitto Denko Corporation | Method for joining adhesive tape to semiconductor wafer, method for separating protective tape from semiconductor wafer, and apparatuses using the methods |
| JP2009088357A (en) * | 2007-10-01 | 2009-04-23 | Toyota Motor Corp | Removing device and removing method for protective tape |
| CN101870371A (en) * | 2009-04-22 | 2010-10-27 | 昆达电脑科技(昆山)有限公司 | Jig for pasting protective film of electronic product |
| CN101891025A (en) * | 2009-05-21 | 2010-11-24 | 昆达电脑科技(昆山)有限公司 | Protective film packaging device |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104340407A (en) * | 2013-08-06 | 2015-02-11 | 富鼎电子科技(嘉善)有限公司 | Automatic film laminating equipment |
| CN104340407B (en) * | 2013-08-06 | 2016-08-10 | 富鼎电子科技(嘉善)有限公司 | Automatic coating equipment |
| CN104150011A (en) * | 2014-08-25 | 2014-11-19 | 昆山迈致治具科技有限公司 | Automatic sticking film machine |
| CN106813591A (en) * | 2016-12-30 | 2017-06-09 | 华进半导体封装先导技术研发中心有限公司 | For the sample preparation methods of buckling deformation test |
| CN106698037A (en) * | 2017-02-28 | 2017-05-24 | 江苏冠达通电子科技有限公司 | Automatic film winding structure |
| CN108527833A (en) * | 2018-04-28 | 2018-09-14 | 奥克斯空调股份有限公司 | Film-covering mechanism and laminating machine |
| CN108527833B (en) * | 2018-04-28 | 2024-03-15 | 奥克斯空调股份有限公司 | Film laminating mechanism and film laminating machine |
| CN110265349B (en) * | 2019-06-20 | 2021-11-19 | 深圳市华腾半导体设备有限公司 | Film laminating machine for laminating semiconductor substrate |
| CN110265349A (en) * | 2019-06-20 | 2019-09-20 | 深圳市华腾半导体设备有限公司 | The laminating machine of semiconductor chip pad pasting |
| CN110723347A (en) * | 2019-11-03 | 2020-01-24 | 邵倩倩 | Single-side film pasting device |
| CN110723348B (en) * | 2019-11-03 | 2021-03-30 | 邵倩倩 | Two-sided pad pasting device |
| CN110723347B (en) * | 2019-11-03 | 2021-10-29 | 邵勇奋 | Single-side film pasting device |
| CN110723348A (en) * | 2019-11-03 | 2020-01-24 | 邵倩倩 | Two-sided pad pasting device |
| CN113140491A (en) * | 2021-05-26 | 2021-07-20 | 吉林华微电子股份有限公司 | Film sticking machine and semiconductor device production system |
| CN115339093A (en) * | 2022-06-30 | 2022-11-15 | 河南通用智能装备有限公司 | Full-automatic wafer laminating machine |
| CN115285420A (en) * | 2022-08-30 | 2022-11-04 | 华天科技（西安）有限公司 | Automatic film sticking machine |
| CN118472780A (en) * | 2024-07-15 | 2024-08-09 | 长春中科长光时空光电技术有限公司 | Laser chip processing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102173316B (en) | 2013-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102173316B (en) | Film sticking method and equipment | |
| CN102120380B (en) | Film attaching method and device | |
| US7631832B1 (en) | Packing film stretching and rewinding machine | |
| CN103978759B (en) | A kind of automatic film applicator | |
| CN102148177B (en) | Film adhesion device for film active release | |
| JP2006278927A5 (en) | ||
| CN105489833A (en) | Novel adhesive tape sticking device | |
| CN106163953A (en) | The attachment means of nethike embrane | |
| CN108163610B (en) | Three-wheel automatic rubber coating mechanism and rubber coating method thereof | |
| JPH03147833A (en) | Method for sticking thin film and executing device thereof | |
| CN209814393U (en) | Automatic laminating device of compound aluminium sideband | |
| CN109228295A (en) | A kind of automatic film pasting system | |
| CN108032588A (en) | The compound overall transverse cutting unit of sponge | |
| WO2020211210A1 (en) | Turnover-type film application machine | |
| CN209096011U (en) | Monolithic dura mater film sticking apparatus | |
| JP5869453B2 (en) | Sheet sticking device and sticking method | |
| JP7512445B2 (en) | Film wrapping equipment | |
| JP2007106569A (en) | Interleaf peeling-off device | |
| CN104441934B (en) | Shaftless friction type energy-saving roll bending winding/unwinding device | |
| CN211591306U (en) | From type membrane separation and tectorial membrane mechanism | |
| CN113997559A (en) | Surface coating device for plastic profile processing | |
| CN210052804U (en) | Rubberizing equipment | |
| CN112591243A (en) | Trilateral integrative special-shaped bottle automatic feeding pastes mark equipment | |
| JP3767488B2 (en) | Sheet winding device | |
| JP2007210265A (en) | Apparatus for sticking optical film, method for sticking optical film and manufacturing method of display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130619 Termination date: 20201221 |