CN106797427B - 用于车辆摄像机的成像器模块和用于其制造的方法 - Google Patents

用于车辆摄像机的成像器模块和用于其制造的方法 Download PDF

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CN106797427B
CN106797427B CN201580046770.2A CN201580046770A CN106797427B CN 106797427 B CN106797427 B CN 106797427B CN 201580046770 A CN201580046770 A CN 201580046770A CN 106797427 B CN106797427 B CN 106797427B
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flexible conductor
image sensor
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conductor arrangement
imager module
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CN106797427A (zh
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M·赖歇
U·塞格
T·布劳内
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Robert Bosch GmbH
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Abstract

本发明涉及一种用于机动车摄像机的成像器模块(1)，其中，所述成像器模块(1)至少具有：透镜保持件；被接收在该透镜保持件中的物镜(4)；具有导线(10)的柔性的导体装置(2)；和与柔性的导体装置(2)的导线(10)接触的图像传感器(5)，该图像传感器具有带传感面的前侧，其中，所述图像传感器(5)以倒装芯片技术通过设置在其前侧(5b)上的柱形焊点(6)与所述导线(10)接触。在此设置，所述透镜保持件(3)具有塑料件(17)，尤其是注塑件，该塑料件具有用于接收所述物镜(4)的镜筒区域(3a)和固定区域(3b)，该固定区域具有下侧面(3c)，并且所述柔性的导体装置(2)材料锁合地安装在所述固定区域(3b)的下侧面(3c)上，并且在所述图像传感器(5)的前侧(5b)和柔性的导体装置(2)之间围绕柱形焊点构造不导电的粘接剂区域(20)，优选用于形成拉应力。在此优选，置入件(14)被接收在塑料体中。

Description

用于车辆摄像机的成像器模块和用于其制造的方法
技术领域
本发明涉及一种用于车辆摄像机的成像器模块和用于其制造的方法。
背景技术
用于车辆摄像机的成像器模块一般例如与其他电部件和电路板一起地被接收在摄像机壳体中。成像器模块在此已具有物镜、接收该物镜的透镜保持件、用于接收和接触图像传感器的承载装置、和图像传感器自身。在倒装芯片成像器模块中，图像传感器通过设置在其具有感应面的上侧面上的接触器件、例如柱形焊点(Stud-Bumps)来进行接触并且以其感应面穿过承载装置的槽口指向物镜。
为此，例如可将透镜保持件固定在刚性的承载装置例如金属板(Stiffener)上，在该金属板上固定柔性的导体装置、例如所谓的柔性导体。
此外已知以MID(molded interconnect device)技术制成的透镜保持件，所述透镜保持件借助被动电镀具有导体轨结构。在该导体轨结构上借助倒装芯片方法机械地施加图像传感器并且通过柱形焊点接触。所述柱形焊点可借助摩擦焊方法施加在图像传感器上。
但图像传感器在MID结构上的接触有部分需要费事的技术实现方式。在NCA倒装芯片方法中，通过柱形焊点的面向导体轨支承面的端面上的应在产品的使用寿命上保证的挤压压力保证柱形焊点到MID面的导体轨的电连接。在此，尤其是由于MID塑料体的平坦度、导体轨的平坦度和粗糙度以及轨对高压的机械承受能力而产生技术挑战，此外还涉及挤压压力在有关温度范围内和在使用寿命期间的均匀度。
在注射过程之后对插到MID基座上的塑料件的再加工一般是不可能的，因为由此会面式地暴露电镀坯。在MID塑料件的平坦化的面上在此不能制造结构化的布局。
ICA方法使用导电胶来接触；但在图像传感器的微小的栅栏或例如约100μm的微小节距上在这里会直接出现由于短路风险造成的困难。ACA方法使用具有较低浓度的导电颗粒的导电胶，所述颗粒仅在压紧区域中构成电触头；但所述电触头需要接合配对件的小的表面粗糙度和高的平坦性
EP 1 081 944 B1描述了一种由具有全面地粘结上去的柔性导体的金属板以及以倒装芯片技术施加在柔性导体上的成像器(图像传感器)组成的结构。
发明内容
根据本发明的成像器模块和用于制造该成像器模块的方法使得能实现以下优点：
图像传感器以倒装芯片技术、即借助设置在其具有感应面的表面上的接触器件进行接触，其中，使图像传感器接触在柔性的导体装置上，该柔性的导体装置材料锁合地安装在一个塑料体上，该塑料体已构成透镜保持件或者说具有透镜保持件的主要部分。因此，该塑料体具有用于接收物镜的镜筒区域和一固定区域，在该固定区域上材料锁合地安装所述柔性的导体装置。
在此，所述塑料体尤其可构造为注塑件，优选具有相应于随后构造的光学轴线的注射方向。这的构思在于：成像器模块的主要的功能部分，即用于接收物镜的镜筒区域和固定区域，可构造为注塑件，在该注塑件上可直接材料锁合地安装柔性的导体装置或者说柔性导体。因此，通过注塑件和层压上去的柔性导体装置已可使得既能实现接收物镜也能实现以倒装芯片技术例如通过柱形焊点直接安装图像传感器，所述柔性的导体装置具有塑料基体或塑料薄膜和被接收在所述塑料薄膜中的金属导线。
根据本发明认识到，单独通过柱形焊点将图像传感器接触到柔性的导体装置上是困难的，尤其是由于柱形焊点在柔性的导体装置上的粘附的问题；因此在图像传感器和柔性的导体装置之间的粘接剂区域中引入尤其不导电的粘接剂(NCA；nonconductiveadhesive)，尤其是围绕柱形焊点引入。优选使用以下粘接剂，所述粘接剂之后在硬化时收缩。由此在图像传感器和柔性的导体装置之间形成拉应力，该拉应力将柱形焊点朝柔性的导体装置挤压并从而可靠地形成好的接触。在其他情况下通常不利的粘接剂收缩作用因而被有利地用于改善接触。原则上在其硬化时收缩的任意粘接剂都是可用的，例如环氧化物基的粘接剂。
因此，使得能实现具有相对少的制造步骤和高的过程可靠性的简单制造。尤其相对于具有要通过被动电镀构造的导体轨的透镜保持件的MID构造产生以下优点：
原则上可自由选择透镜保持件的塑料材料，其中，该塑料材料可通过注塑方法制造；但以注塑方法进行的制造对塑料材料并不构成重大限制。相对于为MID方法所需的(以便通过激光烧蚀或激光刻写露出金属结构并使得能实现后面的被动电镀的)特定塑料材料，一方面产生材料方面的成本优点而另一方面产生过程技术上的优点。根据本发明，尤其可选择具有高的抗压强度和/或高的刚性的塑料。
柔性的导体装置或者说柔性导体可朝其上侧面具有塑料材料或者塑料薄膜而朝下侧面具有至少局部露出的金属导线，例如由辊压的铜制成的金属导线。由此可将柔性的导体装置层压到、即通过局部软化来材料锁合地安装到塑料体的固定区域的下侧面上，由此不需要借助粘接剂来固定。层压在此在过程技术上简单并且能可靠地保证。也不会由于所述层压而影响金属导线。
柔性的导体装置在此可具有一个或多个由导体构成的层。通过多层的布局可实现各个导体的拆散。
用于以倒装芯片方法施加图像传感器的、平坦的并且压力稳定的对应面通过例如再加工或待置入的具有限定的平坦下侧面的置入件实现。
通过在硬化时收缩的粘接剂使得能在使用寿命期间在柱形焊点和柔性的导体装置之间实现好的接触。
另一优点在于能够将一个或多个置入件接收到注塑体中。这些置入件一方面可提高机械稳定性，尤其是，也具有平坦下侧面的置入件可在图像传感器的接触区域中为柔性导体提供平坦的、抗压的并且合适的基准面，使得在这里实现用于待装配的图像传感器的稳固的、平坦的倒装芯片对应支承件。
此外，注塑塑料体也使得能对其下表面进行再加工，而不会出现像在特定的MID成形体的情况下出现的问题，所述MID成形体由于其特定的层结构而不能进行机械再加工。
置入件还使得能实现构造具有围绕光学轴线的锐棱边的光圈，以便更严格地限界图像传感器的有效面的照明场。
此外，所述置入件可设置用于使得能降低图像传感器的热量。因此，置入件例如也可为金属的并且穿过塑料件向外延伸，以便在这里例如被附接在金属的摄像机壳体上。
附图说明
图1以通过光学轴线的剖视图示出根据第一实施方式的用于车辆摄像机的成像器模块；
图2根据另一实施方式的相应的图示；以及
图3图1和图2中的局部的放大图。
图4用于成像器模块的制造方法的流程。
具体实施方式
成像器模块1尤其设置用于使用在车辆摄像机中并且根据图1具有承载装置2、透镜保持件3(物镜接收部)、物镜4和图像传感器5(成像器芯片)。成像器模块1一般随后被接收到具有例如其他电的或电子的部件的摄像机壳体中以及在机动车领域优选被接收在车辆的内室中。
物镜4具有透镜座4a和被接收在该透镜座4a中的透镜4b并且为了沿着光学轴线A的方向聚焦而可纵向移动地被接收在透镜保持件3的镜筒区域3a中；成像器模块1有利地构造为固定焦点模块，其具有在完成聚焦之后被固定的物镜4，其中，所述固定例如可通过粘接剂或例如通过过盈配合实现。透镜保持件3还具有固定区域3b，承载装置2以其上侧面2a固定在该固定区域的在图1中位于下方的侧面上。
图像传感器5借助柱形焊点6装配和接触在承载装置2的下侧面2b上并且以其感应面5a穿过构造在承载装置2中的槽口8指向物镜4，即在向前的接收方向上。因此，图像传感器5以倒装芯片技术装配在承载装置2上。
承载装置2尤其在图3中详细示出并且具有优选由辊压的铜制成的金属导线10，该金属导线嵌入在塑料基体1、例如塑料薄膜或柔性的薄塑料板中。所述塑料材料例如可为聚酰亚胺。因此，承载装置2构造为柔性的导体装置或者说柔性导体。柔性的导体装置2以其上侧面2a层压在、即通过局部熔化来材料锁合地连接在透镜保持件3的固定区域3b上。图像传感器5通过柱形焊点6与柔性的导体装置2的金属导体10接触。
金属导线10、例如铜导线10有利地朝柔性的导体装置的下侧面2b露出，以便在这里使得能通过柱形焊点6实现与图像传感器5的直接接触。
围绕柱形焊点6构造有粘接剂区域20，在该粘接剂区域中置入有不导电的粘接剂21(NCA)，该粘接剂在硬化时经历收缩或者说体积减小。因此，粘接剂区域20从图像传感器的上侧面5a延伸直至柔性的导体装置2的下侧面2b，即所述粘接剂区域将图像传感器5粘接到柔性的导体装置2上。由此引起拉应力，该拉应力将柱形焊点6朝柔性的导体装置2的下侧面2b挤压。
图1的实施方式的塑料体16尤其可在下侧面3c上至少在围绕光学轴线A的区域中被再加工，以便在此构造用于柔性的导体装置2的平坦的基准面，从而在此构造倒装芯片对应支承件或者用于图像传感器5的倒装芯片装配的一方面机械稳定而另一方面被限定的平坦基准面。
而在图2的实施方式中，通过置入件14实现平坦的基准面。该置入件14优选是环形的并且与光学轴线A同心地定位。置入件14例如可由金属或固体塑料构成并且提高透镜保持件3的刚性，尤其是在图像传感器5的附接区域中提高；因此该置入件用作用于以倒装芯片方法来施加图像传感器5的对应支承件。
置入件14也可为透镜保持件3的镜筒区域3a的内部自由空间的勾子部或底切；因此通过置入件14可变地构型所述造型。
置入件14尤其也用作柔性的导体装置2在其接收图像传感器5的区域中的稳固的底座。为此，置入件14具有限定的平坦的置入件下侧面14b，该置入件下侧面例如可通过再加工被确定并且用作用于所施加的柔性导体装置2的平坦的基准面。
置入件14在此使得能实现其他构造和优点。根据图2，置入件可朝光学轴线A构造有锐棱边14c，因而用作用于严格地限界图像传感器5的感应面的有效范围的光圈。由此改善图像传感器5和整个成像器模块1的光学特性。
置入件14可如上述那样环形地围绕光学轴线布置并从而在横向上向外由塑料体17环绕。但也可能的是，将置入件14构造成具有较大的横向延伸尺度或较大的尺寸。在此，置入件14也可用作散热器或者说用于降低图像传感器5的热量。为此也有利的是，按照在图2左边以虚线示出的构造将置入件在横向上向外延伸，例如以便接触在图2中简单示出的摄像机壳体22上，使得可实现直接向外导出热量。
根据本发明的制造方法因而有利地具有根据图4的后续步骤。
在步骤St0开始之后，在步骤St1中通过将金属导线10嵌入到塑料基体11中构造柔性导体或者说柔性的导体装置2。
在步骤St3中，以注塑方法构造透镜保持件3，其中，替代地可在步骤St2中就已将置入件14一起注塑包封，即可将其放入注塑工具中并且通过透镜保持件3的塑料材料注塑包封；替代于此，置入件14可在之后如以虚线在图4中示出的那样插入到并且优选粘接到注射成型的塑料体中。在两种替代方案中，置入件14都材料锁合地被接收和被固定在透镜保持件3的塑料体中。
之后在步骤St4中将柔性的导体装置2层压到固定区域3b的下侧面3c上，即优选通过局部熔化软化并且由此焊接或者说材料锁合地连接。
之后在步骤St5中以倒装芯片技术将图像传感器5定位在柔性导体2的下侧面2b上并且借助柱形焊点6将其与金属导线10接触，其中，粘接剂21被引入到粘接剂区域20中。
之后在步骤St6中，粘接剂21在形成拉应力的情况下硬化，例如热学地或通过UV辐射硬化，或作为冷附接的粘接剂在其硬化时间之后硬化。
之后可通过已知的方式在步骤St7中将物镜4从前面(在附图中因此从上面)沿轴向A插入到透镜保持件3的镜筒区域3a中并且借助聚焦装置，例如通过测试模式的感测和对图像传感器5的图像信号的分析处理，找到焦点位置并为此将物镜4固定在镜筒区域3a中，由此制成成像器模块1。

Claims (13)

1.一种用于车辆摄像机的成像器模块(1)，其中，所述成像器模块(1)至少具有：
透镜保持件(3)，
被接收在所述透镜保持件(3)中的物镜(4)，
柔性的导体装置(2)，该柔性的导体装置具有导线(10)，和
与所述柔性的导体装置(2)的导线(10)接触的图像传感器(5)，该图像传感器具有带感应面(5a)的前侧(5b)，
其中，所述图像传感器(5)以倒装芯片技术通过设置在该图像传感器的前侧(5b)上的柱形焊点(6)与所述导线(10)接触，其中，
所述透镜保持件(3)具有塑料体(16，17)，该塑料体具有：用于接收所述物镜(4)的镜筒区域(3a)；和固定区域(3b)，该固定区域相对于镜筒区域沿径向向外延伸并且构成沿径向向外扩宽的下侧面(3c)，所述柔性的导体装置(2)材料锁合地安装在所述固定区域(3b)的下侧面(3c)上，并且，
在所述图像传感器(5)的前侧(5b)和所述柔性的导体装置(2)之间构造有不导电的粘接剂区域(20)，所述柔性的导体装置(2)具有金属导线(10)和塑料基体(11)，其中，所述柔性的导体装置(2)以其塑料基体(11)通过层压或局部软化焊接到所述固定区域(3b)的下侧面(3c)上。
2.根据权利要求1所述的成像器模块(1)，其特征在于，所述柔性的导体装置(2)具有位于塑料基体(11)中的金属导线(10)，其中，所述金属导线(10)朝所述柔性的导体装置(2)的下侧面(2b)敞开。
3.根据前述权利要求之一所述的成像器模块(1)，其特征在于，所述柱形焊点(6)布置在所述粘接剂区域(20)中。
4.根据权利要求1或2所述的成像器模块(1)，其特征在于，在所述图像传感器(5)的前侧(5b)和所述柔性的导体装置(2)之间通过所述粘接剂区域(20)形成拉应力，该拉应力将所述柱形焊点(6)朝所述柔性的导体装置(2)的导线(10)挤压。
5.根据权利要求1或2所述的成像器模块(1)，其特征在于，所述塑料体(16，17)构造为注塑件，其中，所述镜筒区域(3a)和所述固定区域(3b)是所述注塑件的区域。
6.根据权利要求1或2所述的成像器模块(1)，其特征在于，在所述塑料体中材料锁合地接收有至少一个置入件(14)，
其中，所述置入件(14)设置用于在用于接触所述图像传感器(5)的接触器件的区域中增强所述柔性的导体装置(2)。
7.根据权利要求6所述的成像器模块(1)，其特征在于，在所述柔性的导体装置(2)中构造有槽口(8)，所述图像传感器(5)的感应面(5a)穿过所述槽口指向所述物镜(4)，其中，所述置入件(14)设置在所述槽口(8)的区域中或设置成围绕所述槽口(8)。
8.根据权利要求6所述的成像器模块(1)，其特征在于，所述塑料体构造为注塑件，所述置入件(14)被注塑包封到所述注塑件中。
9.根据权利要求6所述的成像器模块(1)，其特征在于，所述置入件(14)具有在径向上指向光学轴线的棱边(14c)，该棱边用于构造用于所述图像传感器(5)的感应面(5b)的光圈。
10.根据权利要求6所述的成像器模块(1)，其特征在于，所述置入件(14)是金属的并且在所述塑料体(16，17)中在径向上穿过所述固定区域(3b)向外延伸，以附接在摄像机壳体(22)上用于导出所述图像传感器(5)的热量。
11.根据权利要求2所述的成像器模块(1)，其特征在于，所述柔性的导体装置(2)具有多个由导体构成的层。
12.一种用于制造用于车辆摄像机的成像器模块(1)的方法，该方法具有至少以下步骤：
通过塑料基体(11)和金属导线(10)制造柔性的导体装置(St1)，
通过注塑方法构造塑料体(16，17)，其中，所述塑料体(16，17)构成透镜保持件(3)并且具有镜筒区域(3a)和固定区域(3b)，该固定区域相对于镜筒区域沿径向向外延伸并且构成沿径向向外扩宽的下侧面(3c)(St3)，
将所述柔性的导体装置(2)层压到所述固定区域(3b)的下侧面(3c)上(St4)，
以倒装芯片技术借助柱形焊点(6)将图像传感器(5)在与所述柔性的导体装置(2)的金属导线(10)接触的情况下装配和接触在所述柔性的导体装置(2)的下侧面(2b)上并且在所述柔性的导体装置(2)的下侧面(2b)和所述图像传感器(5)之间引入不导电的粘接剂(21)(St5)，
使不导电的粘接剂(21)在收缩的情况下硬化并且在所述柔性的导体装置(2)的下侧面(2b)和所述图像传感器(5)之间形成拉应力(St6)，以及
将物镜(4)插入到所述透镜保持件(3)的镜筒区域(3a)中(St7)。
13.根据权利要求12所述的方法，其特征在于，
在所述塑料体中注塑包封具有平坦的置入件下侧面(14b)的置入件(14)，以及
所述柔性的导体装置(2)围绕光学轴线(A)具有槽口(8)并且在所述槽口(8)的边缘处被固定在所述置入件(14)的下侧面(14b)上。
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