CN106793482A - 一种聚四氟乙烯纤维高频通信线路板及其制备方法 - Google Patents
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Abstract
在本发明公开了一种聚四氟乙烯纤维高频通信线路板及其制备方法,采用多层PTFE网布和PTFE膜相互间隔叠置而成,不但具有PTFE介电常数低、绝缘性好、信号损失少、耐腐蚀性能好,而且具有较佳的刚性和强度,稳定性好,在‑50°~250°的温度下长度变化率≤5%,完全能够满足诸如航天等高频通信的应用场合。
Description
技术领域
本发明涉及线路板,更具体地是指一种聚四氟乙烯纤维高频通信线路板及其制备方法。
背景技术
目前,常见的通信用的印刷线路板一般为环氧材料线路板或者玻璃纤维材料线路板,随着通信技术的不断发展,一些例如通信卫星高精端领域对高频通信用线路板的性能提出了更高的要求,由于环氧材料和玻璃纤维材料的介电常数较高,环氧材料在3~3.5,玻璃纤维材料在3.5~4,信号损耗较大,并且有些高频通信线路板的应用场合温度在-50°~250°(如太空)之间,需要具备极佳的稳定性,而目前上述两类材料制作的线路板显然已无法能够很好的适用于高端高频通信领域。
发明内容
本发明的目的是针对上述缺陷,提出一种聚四氟乙烯纤维高频通信线路板,具有信号损耗小、强度高等优点,满足高频通信的印刷线路板的应用需求。
为了实现上述目的,本发明采用以下技术方案。
一方面,一种聚四氟乙烯纤维高频通信线路板,由数层PTFE网布和数层PTFE膜相互间隔叠置,并通过烧结复合而成。
所述的PTFE网布由90~300旦的PTFE长纤维织成。
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜的厚度为0.03~0.1mm。
另一方面,一种聚四氟乙烯纤维高频通信线路板的制备方法,将数层PTFE网布和数层PTFE膜相互叠置,再烧结复合在一起,烧结温度在300~400℃。
所述的PTFE网布由90~300旦的PTFE长纤维织成。
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜的厚度为0.03~0.1mm。
第三方面,一种聚四氟乙烯纤维高频通信线路板的制备方法,将PTFE网布通过浸置于PTFE涂层液内,在PTFE网布上形成PTFE膜涂层后,进行烘干,300~400℃烧结,将多层烧结后的带有PTFE膜涂层的PTFE网布进行复合在一起。
所述的PTFE网布由90~300旦的PTFE长纤维织成。
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜的厚度为0.03~0.1mm。
在本发明的上述技术方案中,本发明的聚四氟乙烯纤维高频通信线路板,采用多层PTFE网布和PTFE膜相互间隔叠置而成,不但具有PTFE介电常数低、绝缘性好、信号损失少、耐腐蚀性能好,而且具有较佳的刚性和强度,稳定性好,在-50°~250°的温度下长度变化率≤5%,完全能够满足诸如航天等高频通信的应用场合。
附图说明
图1是本发明的聚四氟乙烯纤维高频通信线路板的结构剖视示意图;
图2是本发明的聚四氟乙烯纤维高频通信线路板的结构分解侧视图。
具体实施方式
下面结合附图进一步说明本发明的技术方案。
PTFE材料(聚四氟乙烯)具有耐高温、耐低温、耐腐蚀、耐气候、介电常数(2.1左右)和介电损耗低、电绝缘性佳(可以抵抗1500伏高压电)等优点,用于制作线路板能够有效克服现有技术中的环氧材料和玻璃纤维材料无法适用于聚四氟乙烯纤维高频通信线路板的缺陷。但是,由于PTFE制版的刚性、强度较差,无法直接制板。因此,本发明设计了一种聚四氟乙烯纤维高频通信线路板,如图1~2所示,其是由数层PTFE网布1和数层PTFE膜2相互间隔叠置,并通过烧结复合而成。该线路板不但具有了有耐高温、耐低温、耐腐蚀、耐气候、介电常数和介电损耗低、电绝缘性佳等优点,而且还具有刚性、强度和稳定性较佳的优点,抗拉强度大于30MPa,适于线路板上打孔,可保证线路板上打孔的间距,避免受温度等影响而造成打孔发生拉伸、变形等缺陷,且在-50°~250°的温度下长度变化率≤5%,适合太空等极端温度环境下的使用,因此完全能够满足高端的高频通信线路板应用场合的需求。另外,由于其耐腐蚀性佳,在检测印刷线路板是否焊接到位时,可通过酸洗等方式就能够发现是否有虚焊,十分方便快捷。
作为一个实施例,所述的PTFE网布1可由90~300旦的PTFE长纤维(如专利号为ZL200610026648.1,但不仅限于此)织成,能够进一步提高该线路板的刚性、强度和稳定性。
经过反复计算和试验,将所述的PTFE网布1的厚度设计为0.05~0.3mm,PTFE膜2的厚度设计为0.03~0.1mm,获得的高频通信线路板效果更佳。
上述聚四氟乙烯纤维高频通信线路板可采用以下两种方式进行制备:
1、将上述的数层PTFE网布1和数层PTFE膜2相互叠置,再烧结复合在一起,烧结温度在300~400℃。
2、将上述的PTFE网布1通过浸置于PTFE涂层液内,在PTFE网布1上形成PTFE膜2涂层后,进行烘干,300~400℃烧结,并作哑光处理,最后将多层烧结后的带有PTFE膜2涂层的PTFE网布1进行复合在一起。
本技术领域中的普通技术人员应当认识到,以上的实施例仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围内,对以上所述实施例的变化、变型都将落在本发明的权利要求书范围内。
Claims (9)
1.一种聚四氟乙烯纤维高频通信线路板,其特征在于:由数层PTFE网布和数层PTFE膜相互间隔叠置,并通过烧结复合而成。
2.如权利要求1所述的聚四氟乙烯纤维高频通信线路板,其特征在于:
所述的PTFE网布由90~300旦的PTFE长纤维织成。
3.如权利要求1所述的聚四氟乙烯纤维高频通信线路板,其特征在于:
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜的厚度为0.03~0.1mm。
4.一种聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
将数层PTFE网布和数层PTFE膜相互叠置,再烧结复合在一起,烧结温度在300~400℃。
5.如权利要求4所述的聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
所述的PTFE网布由90~300旦的PTFE长纤维织成。
6.如权利要求4所述的聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜的厚度为0.03~0.1mm。
7.一种聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
将PTFE网布通过浸置于PTFE涂层液内,在PTFE网布上形成PTFE膜涂层后,进行烘干,300~400℃烧结,将多层烧结后的带有PTFE膜涂层的PTFE网布进行复合在一起。
8.如权利要求7所述的聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
所述的PTFE网布由90~300旦的PTFE长纤维织成。
9.如权利要求7所述的聚四氟乙烯纤维高频通信线路板的制备方法,其特征在于:
所述的PTFE网布的厚度为0.05~0.3mm,PTFE膜涂层的厚度为0.03~0.1mm。
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CN109379834A (zh) * | 2018-09-21 | 2019-02-22 | 维沃移动通信有限公司 | 一种信号传输器件、信号传输器件的加工方法及移动终端 |
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JPS6451937A (en) * | 1987-08-24 | 1989-02-28 | Matsushita Electric Works Ltd | Laminated sheet for multi-layer printed wiring board |
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