JPS6451937A - Laminated sheet for multi-layer printed wiring board - Google Patents

Laminated sheet for multi-layer printed wiring board

Info

Publication number
JPS6451937A
JPS6451937A JP20944887A JP20944887A JPS6451937A JP S6451937 A JPS6451937 A JP S6451937A JP 20944887 A JP20944887 A JP 20944887A JP 20944887 A JP20944887 A JP 20944887A JP S6451937 A JPS6451937 A JP S6451937A
Authority
JP
Japan
Prior art keywords
ptfe resin
laminated sheet
layer
ptfe
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20944887A
Other languages
Japanese (ja)
Other versions
JPH0459137B2 (en
Inventor
Hideto Misawa
Shoji Fujikawa
Katsutoshi Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP20944887A priority Critical patent/JPS6451937A/en
Publication of JPS6451937A publication Critical patent/JPS6451937A/en
Publication of JPH0459137B2 publication Critical patent/JPH0459137B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To obtain a laminated sheet for a multi-layer printed wiring board wherein dielectric constant is low, high-frequency characteristics are favorable, preparation of a high-frequency operational circuit and communication apparatus circuit is possible at high density, dimensional stability is excellent and yield is favorable, by arranging only PTFE resin within a laminated sheet as a continuous fluorine resin layer. CONSTITUTION:PTFE resin-impregnated base materials 2 are laminated by interposing PTFE resin 1 as a continuous fluorine resin layer, in a laminated sheet. Then the PTFE resin 1 is arranged also on the outside of the PTFE resin-impregnated base materials 2a, 2b of both the outsides as the fluorine resin layer, and a metallic foil 3 is arranged on the PTFE resin 1 layer for monolithic molding. In this instance, a matter about 100% of composition of which is comprised of the PTFE is used for the PTFE resin 1 and the PTFE resin infiltrating into a glass base material. Pressure molding of the laminated sheet is performed at a temperature of the melting point or higher of the PTFE resin, then after formation of a circuit with a metallic foil 3, the same is used as an inner layer material for a multi-layer printed wiring board, and a dimensional change can be controlled to the minimum.
JP20944887A 1987-08-24 1987-08-24 Laminated sheet for multi-layer printed wiring board Granted JPS6451937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20944887A JPS6451937A (en) 1987-08-24 1987-08-24 Laminated sheet for multi-layer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20944887A JPS6451937A (en) 1987-08-24 1987-08-24 Laminated sheet for multi-layer printed wiring board

Publications (2)

Publication Number Publication Date
JPS6451937A true JPS6451937A (en) 1989-02-28
JPH0459137B2 JPH0459137B2 (en) 1992-09-21

Family

ID=16573033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20944887A Granted JPS6451937A (en) 1987-08-24 1987-08-24 Laminated sheet for multi-layer printed wiring board

Country Status (1)

Country Link
JP (1) JPS6451937A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179808A (en) * 2011-12-21 2013-06-26 北大方正集团有限公司 Multilayer printed circuit board and manufacturing method thereof
CN105058894A (en) * 2015-07-31 2015-11-18 江苏维凯科技股份有限公司 Making method of heat-insulation anticorrosive polytetrafluoroethylene membrane
CN106793482A (en) * 2016-12-30 2017-05-31 江苏金由新材料有限公司 A kind of polytetrafluoroethylene fibre high-frequency communication circuit plate and preparation method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199647A (en) * 1984-03-23 1985-10-09 松下電工株式会社 Laminated board for electricity

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60199647A (en) * 1984-03-23 1985-10-09 松下電工株式会社 Laminated board for electricity

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179808A (en) * 2011-12-21 2013-06-26 北大方正集团有限公司 Multilayer printed circuit board and manufacturing method thereof
CN105058894A (en) * 2015-07-31 2015-11-18 江苏维凯科技股份有限公司 Making method of heat-insulation anticorrosive polytetrafluoroethylene membrane
CN106793482A (en) * 2016-12-30 2017-05-31 江苏金由新材料有限公司 A kind of polytetrafluoroethylene fibre high-frequency communication circuit plate and preparation method thereof

Also Published As

Publication number Publication date
JPH0459137B2 (en) 1992-09-21

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees