JPS6451937A - Laminated sheet for multi-layer printed wiring board - Google Patents
Laminated sheet for multi-layer printed wiring boardInfo
- Publication number
- JPS6451937A JPS6451937A JP20944887A JP20944887A JPS6451937A JP S6451937 A JPS6451937 A JP S6451937A JP 20944887 A JP20944887 A JP 20944887A JP 20944887 A JP20944887 A JP 20944887A JP S6451937 A JPS6451937 A JP S6451937A
- Authority
- JP
- Japan
- Prior art keywords
- ptfe resin
- laminated sheet
- layer
- ptfe
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To obtain a laminated sheet for a multi-layer printed wiring board wherein dielectric constant is low, high-frequency characteristics are favorable, preparation of a high-frequency operational circuit and communication apparatus circuit is possible at high density, dimensional stability is excellent and yield is favorable, by arranging only PTFE resin within a laminated sheet as a continuous fluorine resin layer. CONSTITUTION:PTFE resin-impregnated base materials 2 are laminated by interposing PTFE resin 1 as a continuous fluorine resin layer, in a laminated sheet. Then the PTFE resin 1 is arranged also on the outside of the PTFE resin-impregnated base materials 2a, 2b of both the outsides as the fluorine resin layer, and a metallic foil 3 is arranged on the PTFE resin 1 layer for monolithic molding. In this instance, a matter about 100% of composition of which is comprised of the PTFE is used for the PTFE resin 1 and the PTFE resin infiltrating into a glass base material. Pressure molding of the laminated sheet is performed at a temperature of the melting point or higher of the PTFE resin, then after formation of a circuit with a metallic foil 3, the same is used as an inner layer material for a multi-layer printed wiring board, and a dimensional change can be controlled to the minimum.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20944887A JPS6451937A (en) | 1987-08-24 | 1987-08-24 | Laminated sheet for multi-layer printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20944887A JPS6451937A (en) | 1987-08-24 | 1987-08-24 | Laminated sheet for multi-layer printed wiring board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6451937A true JPS6451937A (en) | 1989-02-28 |
JPH0459137B2 JPH0459137B2 (en) | 1992-09-21 |
Family
ID=16573033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20944887A Granted JPS6451937A (en) | 1987-08-24 | 1987-08-24 | Laminated sheet for multi-layer printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451937A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
CN105058894A (en) * | 2015-07-31 | 2015-11-18 | 江苏维凯科技股份有限公司 | Making method of heat-insulation anticorrosive polytetrafluoroethylene membrane |
CN106793482A (en) * | 2016-12-30 | 2017-05-31 | 江苏金由新材料有限公司 | A kind of polytetrafluoroethylene fibre high-frequency communication circuit plate and preparation method thereof |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60199647A (en) * | 1984-03-23 | 1985-10-09 | 松下電工株式会社 | Laminated board for electricity |
-
1987
- 1987-08-24 JP JP20944887A patent/JPS6451937A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60199647A (en) * | 1984-03-23 | 1985-10-09 | 松下電工株式会社 | Laminated board for electricity |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103179808A (en) * | 2011-12-21 | 2013-06-26 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
CN105058894A (en) * | 2015-07-31 | 2015-11-18 | 江苏维凯科技股份有限公司 | Making method of heat-insulation anticorrosive polytetrafluoroethylene membrane |
CN106793482A (en) * | 2016-12-30 | 2017-05-31 | 江苏金由新材料有限公司 | A kind of polytetrafluoroethylene fibre high-frequency communication circuit plate and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH0459137B2 (en) | 1992-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |